Samsung may finally have an answer to one of the biggest criticisms of its Exynos chips: overheating. The company is reportedly working on a new thermal solution for its upcoming Exynos 2600, which is expected to debut with the Galaxy S26 series. Called Heat Path Block (HPB), this new technology could mark a major step forward in Exynos 2600’s thermal control.
The HPB design uses a tiny copper-based heatsink integrated directly above the processor and memory within the chip’s package-on-package structure. By leveraging copper’s excellent thermal conductivity, it aims to dissipate heat more effectively than the chip packaging material on the Exynos 2500. It’s a technique that borrows from the cooling designs commonly used in PCs and servers.
The result? Better sustained performance during heavy workloads — something Samsung’s in-house chips have struggled with for years.
Samsung plans to wrap up testing by October, and if things go well, mass production could begin shortly after—just in time for the Galaxy S26 lineup. The Exynos 2600 itself is being built on a 2nm Gate-All-Around (GAA) process and is expected to feature a deca-core CPU (1+3+6 layout) along with the new Xclipse 960 GPU, which may be an in-house design.
Compared to its predecessor, the Exynos 2500, the 2600 reportedly aims to deliver a significant improvement in performance, especially in demanding AI tasks. The Galaxy S26 Ultra is likely to feature the Snapdragon 8 Elite 2 worldwide, but with this new cooling tech, the Exynos-powered base model might finally close the performance gap. Exynos 2600 is expected to power the base model in most markets worldwide, excluding the US and China.
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