Samsung’s Exynos processors have spent years under the spotlight for the wrong reasons, especially when it comes to heat. But the company hasn’t stood still. New details suggest Samsung is now testing another packaging change aimed at keeping its chips cooler — and devices thinner.
Recent Exynos chips, including the upcoming Exynos 2600, already use Fan-Out Wafer Level Packaging (FOWLP). This moves key connections outside the main die, helping reduce heat concentration. Samsung also adds a thin copper Heat Path Block (HPB) layer to speed up heat dissipation from the processor itself.
There’s still a catch, though. In current designs, both the RAM and the HPB sit on top of the processor. That means the HPB mainly helps cool the CPU and GPU, while the memory — which also heats up under load — doesn’t benefit as much.
Samsung’s reported next step is a side-by-side (SbS) package layout. Instead of stacking components vertically, the processor and RAM would sit next to each other. The HPB layer would then cover both, allowing heat to escape more evenly across the package.
This setup could improve thermal performance overall. It also reduces the vertical height of the chip package, which may help device makers build thinner phones.
The downside is space. A side-by-side layout needs more horizontal room, meaning the PCB may have to be reworked to make space for camera modules.
That said, Samsung’s foldable phones could be an early fit. These devices already prioritize thinness, and they tend to have more internal width to work with.
If things fall into place, the SbS approach could show up in Galaxy flagships before long. It’s another sign that Samsung is still trying to narrow the gap with competing chips.
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