Huawei is expected to launch the Mate 70 series smartphones later this month, likely powered by the new Kirin 9100 chip. Although we don’t know much about this SoC, a Telegram user named @spektykles may have leaked some key information about it. 

Notebookcheck recently discovered a Telegram post featuring a screenshot from the Device Info HW app, likely taken from an upcoming Mate 70 series device. This screenshot appears to reveal the official specifications of the Kirin 9100 chip.

Kirin 9100 still has ARM v8 cores

The chip is shown to have codenamed HiSilicon Baltimore and features an 8-core CPU setup. It includes a single high-performance Cortex-X1 core clocked at 2.67 GHz, likely for handling demanding tasks, along with three Cortex-A78 cores at 2.32 GHz for a balance of power and efficiency in daily use. Completing the CPU are four energy-efficient Cortex-A55 cores clocked at 2.02 GHz.

However, due to ongoing US sanctions against Huawei, the Kirin 9100 is restricted to cores based on the older Arm v8 architecture. In contrast, competing chips like MediaTek’s Dimensity 9400 utilize the latest Arm v9 cores.

The leak also suggests that the Kirin 9100 will rely on Huawei’s in-house Maleoon 910 GPU, likely carried over from the Kirin 9010. Although this GPU isn’t the most advanced, it should still deliver solid performance for everyday tasks and casual gaming.

Moreover, the report mentions that the production of the Kirin 9100 will reportedly utilize SMIC’s N+3 node, a 6nm process. Though this doesn’t match the previously rumored 5nm fabrication, it should offer slightly better efficiency than the 7nm process used for the Kirin 9000S in the Mate 60.

The performance of Kirin 9100 is expected to fall between the Snapdragon 8 Gen 2 and 8+ Gen 1. While there are no specific benchmarks to confirm this, an earlier leak suggested an approximate AnTuTu score of around 1.1 million.

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Huawei‘s upcoming Mate 70 series phones are expected to be powered by Kirin 9100 chip. A previous report suggests that this chip might outperform Qualcomm’s Snapdragon 8 Gen 2 in terms of performance. Now, it looks like the SoC price will also be similar to Snapdragon processors.

According to a tipster on China’s Weibo platform, the Kirin 9100 could cost manufacturers around 1100 yuan to 1300 yuan (roughly $157 to $186). While verifying component costs is notoriously difficult – chip manufacturers rarely share such details – this leak suggests the Kirin 9100 might fall within the same price range as upcoming flagship processors from Qualcomm and MediaTek.

Qualcomm’s Snapdragon 8 Gen 4 is reportedly priced at $190 for phone makers, while MediaTek’s Dimensity 9400 sits at a slightly lower $155. If the Kirin 9100 rumor holds true, it aligns closely with these competitors in terms of cost.

Kirin 9100: What we know so far

A previous report suggests that Huawei is planning to use a “domestically developed n+2/3 process” to manufacture its next Kirin chip, which translates to a 5nm node. The chip will be produced using Deep Ultraviolet (DUV) lithography with multiple patterning.

China-based chipmaker SMIC is reportedly developing a 5nm process using DUV lithography and is expected to manufacture Huawei’s next-gen Kirin 9100 chip. 

However, a report from July also suggests the company is facing yield and production cost issues with 5nm DUV lithography, so the Kirin 9100 could still be a 7nm chip. 

Even if SMIC successfully achieves a decent yield from its 5nm process, it will not still match the leading-edge EUV (extreme ultraviolet) lithography used by TSMC and Samsung. 

As a result, it would be hard for the Kirin 9100 to match the performance or efficiency of the latest offering from Qualcomm or MediaTek. However, as mentioned earlier, its performance will reportedly be on par with the Snapdragon 8 Gen 2.

(Source)

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Earlier this week, a leak from prominent tech tipster Digital Chat Station (DCS) hinted at a new Kirin chip in the works at Huawei. Today, DCS made a follow-up on Weibo, China’s social media platform, revealing some additional details.

The leak suggests Huawei will likely adopt a “domestically developed n+2/3 process” to manufacture its next Kirin chip, likely dubbed the Kirin 9100. This translates to a 5nm node with DCS explaining that it will use Deep Ultraviolet (DUV) lithography with multiple patterning for manufacturing. 

While Huawei will be able to achieve 5nm-like transistor sizes via this approach, it will not be identical to the leading-edge EUV (extreme ultraviolet) lithography used by TSMC and Samsung.

Additionally, since DUV lithography requires multiple exposures to achieve the desired pattern on the chip, it can lead to higher production costs and potentially lower chip yield compared to EUV, which can print out more intricate designs even with a single exposure.

Regardless of this, DCS notes that the new chip will offer “quite obvious” improvements in energy efficiency compared to the previous Kirin chip. 

However, it may not quite match the efficiency of Qualcomm’s latest offerings as it is set to be on par with the Snapdragon 8 Gen 2, as per tipster. If not, DCS says the new Kirin chip would definitely be more efficient than the Snapdragon 8+ Gen 1.

It’s important to note that these are still leaks, and details like the specific Kirin model number, core configuration, and targeted release date are still unknown. 

Moreover, the leak does not clarify which foundry will manufacture the chip. While DCS mentions that it will be domestically produced since TSMC and Samsung are not options due to US restrictions, it’s unclear which Chinese foundry has the capability for a 5nm DUV process. SMIC is a potential candidate, but it is under scrutiny from the US government regarding its ability to produce advanced chips.

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Reports suggest Huawei‘s upcoming Mate 70 flagship will stick with the 7nm Kirin chips (potentially the Kirin 9100 with improved transistor density using SMIC’s N+3 technology) due to the high cost and potential yield issues associated with SMIC’s attempt at 5nm production using DUV. SMIC is China’s leading chipmaker, and it is facing limitations due to US sanctions and Dutch export restrictions. Unable to access cutting-edge EUV technology, SMIC relies on older DUV machines, putting them behind rivals TSMC and Samsung Foundry.

SMIC is reportedly actively working on a 5nm process using DUV lithography

Despite the challenges, rumors indicate SMIC is actively working on a 5nm process using DUV lithography. While the energy efficiency of this approach seems promising, significant cost reduction is necessary for it to be commercially viable for Huawei.

The Mate 70’s chipset choice remains unclear. Sticking with 7nm offers a safe path, while venturing into DUV-based 5nm promises advancement but carries significant risks. SMIC’s success in refining its 5nm process will ultimately determine Huawei’s chip strategy for future flagships.

(Via)

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Huawei is expected to unveil a new Kirin chipset, the Kirin 9100, later this year. This chip is rumored to power the upcoming Mate 70 series which will also be the first Huawei phone to come pre-installed with HarmonyOS NEXT.

There are rumors that the Kirin 9100 could mark a significant performance leap for the Chinese tech giant. However, there are doubts about this since Huawei and its chip manufacturer, SMIC, lack the latest chip manufacturing infrastructure due to the US trade ban.

As a result, Kirin chips have so far struggled to compete with offerings from Qualcomm and MediaTek. The Kirin 9100, however, might be different. A fresh new rumor suggests it could outperform Qualcomm’s flagship Snapdragon 8 Gen 2 chipset.

The news comes from an X tipster, jasonwill, who seems confident that the upcoming Kirin chip will surpass the performance of the Snapdragon 8 Gen 2. If Huawei’s next-gen Kirin SoC is indeed faster, this would be a monumental gain compared to the current-best Kirin 9010, which struggles to compete even with mid-range chips like the Snapdragon 7+ Gen 2.

Additionally, the tipster claims that the Kirin 9100’s performance could lead to an improved user experience, even if its on-paper specifications “may not match those of the 8gen3”.

How could Huawei achieve this? The answer likely lies in software optimization. Huawei is expected to launch HarmonyOS NEXT alongside the Kirin 9100, completely severing ties with Google’s Android platform. 

According to Huawei, HarmonyOS NEXT is three times more efficient in memory utilization compared to Android. This translates to smoother UI performance on Huawei devices, even those powered by older Kirin chipsets.

Another factor is the Kirin 9100’s manufacturing process. The chip will reportedly be mass-produced using SMIC’s 5nm node. While this technology isn’t the most cutting-edge, it should still offer improved performance and power efficiency compared to previous Kirin chipsets.

While it would be exciting to see Huawei’s upcoming chip match the performance of its competitors, it’s wise to remain skeptical as this leap forward seems almost too good to be true for Huawei to achieve in one go.

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Huawei is soon expanding its Mate 60 lineup. Last week, the company announced the Mate 60 and Mate 60 Pro, both of which are powered by the Kirin 9000s chipset. Reports have claimed that two more Mate 60 models, the Mate 60 Pro+ and the Mate 60 RS Ultimate Design, could be released in September. A Chinese tipster shared the image below to reveal the model number and variants of the Mate 60 Pro+ ahead of its launch.

Huawei Mate 60 Pro+ variants (rumored)

The upcoming Huawei Mate 60 Pro+ has the ALN-AL10 model number. The leak suggests that the device will be available in 512GB and 1TB storage variants. Both models will be equipped with 16GB of RAM.

Reports claim that the Mate 60 Pro+ could be powered by the Kirin 9100 chipset. For photography, the device may come with a quad-camera system. However, the core specifications of the device are not yet known.

The Mate 60 Pro+ is also rumored to have a premium version called the Huawei Mate 60 RS Ultimate Design. This Ultimate-branded model is expected to replace the previously launched “Porsche Design” models. The Mate 60 Pro+ and its Ultimate Design variant are likely to have identical specs, but the special edition variant may have a premium build.

The Mate 60 Pro comes in variants, such as 12 GB RAM + 256 GB storage, 12 GB RAM + 512 GB storage, and 12 GB RAM + 1 TB storage. These variants are priced at 6,499 Yuan (~$887), 6,999 Yuan (~$956), and 7,999 Yuan (~$1,092), respectively. Hence, it seems that the Mate 60 Pro+ could be priced at around 8,999 Yuan (~$1,228).

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(source)

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Ever since Huawei faced various sanctions from the US, it saw a massive decline in its smartphone business operations. But, a new report has revealed some interesting details regarding the brand’s next gen flagship smartphone.

For those unaware, the US had placed sanctions on the Chinese tech giant, which had it lose access to its primary chip supplier TSMC. The company typically used its proprietary HiSilicon Kirin chipsets, especially for its flagship smartphone models. But now, a new report from HuaweiCentral has offered us more information regarding the upcoming Huawei P60 model. Apparently, the new flagship phone will feature a new Kirin chipset that is based on the 14nm process and will be dubbed as the Kirin 9100 SoC.

The news arrives from a tipster who shared the information on Weibo (a Chinese microblogging website). In the social media post, the tipster reveled that despite being based on the 14nm process, the new chip’s performance will be comparable to a current gen 5nm process. Furthermore, this also signifies the company’s attempts at reviving its chipmaking subsidiary, HiSilicon, as well as production of its own integrated circuits. It is rumored that the premium P60 smartphone model will launch sometime in 2023.

For comparison, flagship processor from Qualcomm or Apple are based on the 5nm process, which houses 15 billion transistors. On the other hand, the 14nm process can only house around 2 billion transistors, and was used by Apple for its iPhone 6s back in 2015, which featured the A9 chipset. Keep in mind that this is still unconfirmed news at the moment, so stick around for more updates.

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