Just yesterday we spotted the Meizu Pro 6 flagship with the brand new Helio X25 chip on the benchmarking website, Geekbench. Now, the same phone has reached another benchmarking app, namely AnTuTu. So, apart from the impressive scores posted by the phone, we also have a good idea about the specs of the device.
According to the first AnTuTu benchmark results of the Helio X25 inside the Pro 6 flagship, the phone managed a score of nearly 100K points. That’s pretty impressive. To be exact, Meizu Pro 6 posted 99,948 points on AnTuTu.
Now, if we are to compare the scores of the Helio X25 with other rival chipsets like Kirin 950, Snapdragon 820 and Exynos 8890, there are mixed results. For example, the Helio X25 seems to be better than the octa-core Kirin chipset, which was also evident from its Geekbench scores. In the AnTuTu test, the best scores we have seen from Kirin 950 is only about 95K. So, for now, it looks like the deca-core Helio X25 is better than Huawei’s Kirin 950 chip.
Coming to the Snapdragon 820 and Exynos 8890 chips, when we compare the scores, Helio X25 is still quite far behind. Both the chips score anywhere between 120K to 135K, which is far higher than the 100K score posted by the Helio X25. The difference could be mainly because of the slower GPU in the Mediatek chip.
Now, coming back to the Meizu Pro 6, the phone will reportedly feature MediaTek’s MT6797T octa-core processor with 3GB of RAM and 32GB of internal storage. The screen size is unknown but the resolution will be 1080p. As for the cameras, there will be a 21MP sensor at the back and a 5MP shooter up front. The phone will be running on Android 6.0 Marshmallow OS.
In case you missed, the latest Geekbench score of the Pro 6 flagship is quite impressive, even comparable to Exynos 8890. While we see a drop in the single-core score to 1981, the multi-core score has increased to 6401, thanks to the increased clock speed to 2GHz.
So, it looks like the Helio X25 will indeed be a capable chipset for flagship level smartphones.