MediaTek has recently announced the Dimensity 9000 chipset, and it will be holding a dedicated event for it on Dec. 16 in China. The Taiwanese company is expected to reveal some more information on the D9000 chip on the said date. Recent reports have revealed that the company is also working on another chip called the Dimensity 7000. Today, reliable tipster Digital Chat Station shared the key details of the SoC.
The Dimensity 9000 is the world’s first 4nm chip. Recent reports have revealed that the upcoming Dimensity 7000 will be built with TSMC’s 5nm processing technology. New information reveals that the octa-core chip will include four Cortex-A78 cores working at 2.75GHz and four Cortex-A55 cores clocking at 2.0GHz.
The Dimensity 7000 will include Mali-G510 MC6 graphics. It is speculated that the SoC will rival Qualcomm’s Snapdragon 870 mobile platform. Recently, the same tipster had recently claimed that the Dimensity 7000 will come with support for 75W fast charging.
The above-mentioned rumored specs indicates that the Dimensity 7000 will be placed between the Dimensity 1200 SoC and the Dimensity 9000 chip. A recent Weibo post by Redmi General Manager Lu Weibing suggested that Redmi could be one of the first brands to launch a Dimensity 7000 SoC powered phone.
The testing phase of the Dimensity 7000 has reportedly started. Hence, it is speculated that the SoC may go official in December 2021 or January 2022. The first phones powered by the D7000 may break cover by Q1 2022.
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