[Update] MediaTek has reportedly contacted NotebookCheck, asserting that the mentioned report is “completely false and has no source or basis in fact”. The original story continues….

Rumors suggest that MediaTek is set to unveil its Dimensity 9300 SoC in October. This cutting-edge chip will utilize TSMC’s N4P process and is poised to compete with the upcoming Snapdragon 8 Gen 3 and Apple A17 Bionic. However, it appears that the new chip has encountered some challenges along the way.

MediaTek-Dimensity

Known leaker Evan Blass (via Android Headlines) has stated that the upcoming Dimensity 9300 SoC is apparently overheating when running at its expected clock speeds. To recall, the Dimensity 9300 made waves by opting to forgo efficiency cores, instead featuring a configuration of 4x Cortex-X4 and 4x Cortex-A720 cores, arranged in a 3+1 layout. This inclusion of only high-performance cores is most likely the reason for the SoC overheating.

A lose-lose situation

Looking at what happened with the Snapdragon 8 Gen 1 chip, it’s clear that phone makers are really focused on keeping phones from getting too hot. They quickly switched to the cooler Snapdragon 8+ Gen 1 when it came out. So now, MediaTek is in a tough spot. If they send out the chips as they are, most phone companies might not want to use them. But if they slow down the chip’s performance, it won’t be as attractive either. Additionally, it throws a wrench into MediaTek’s plans to surpass the competition.

Previous reports have mentioned that the upcoming Dimensity 9300 is rumored to have a 3 GHz minimum clock speed. It was also said to be 50% more power-efficient than the Dimensity 9200.

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