According to Digital Chat Station, the upcoming flagship processor from MediaTek will be named the Dimensity 9300 and will be manufactured using TSMC’s N4P process. The chip is expected to be co-developed by Vivo and MediaTek and could debut on the Vivo X100.

MediaTek

The N4P process used in the Dimensity 9300, promises significant performance improvements over the original 5nm technology (N5). This includes an 11% increase in performance compared to N5, a 6% improvement compared to N4, a 22% improvement in power efficiency, and a 6% increase in transistor density. These improvements make the Dimensity 9300 a major player in the mobile SoC market.

The chip is designed with an ultra-large core + big core + small core layout, with the ultra-large core expected to be the Cortex X4, the big core likely being Cortex A715, and the small core possibly being A515. This design enables efficient and optimized processing of different workloads, providing users with a smooth and seamless experience.

What’s more, the N4P process allows for easy migration of products based on the 5nm platform, reducing customer R&D costs and providing faster and more energy-efficient updates for 5nm platform products.

The Dimensity 9300 is scheduled to debut in the second half of 2023 and will compete with Qualcomm’s Snapdragon 8 Gen 3, which is also set to launch during the same period.

This competition promises to bring even better mobile devices to consumers, with both chips offering significant performance improvements and optimizations. It will be interesting to see how they stack up against each other, but one thing is for sure – the mobile SoC market is heating up, and users can look forward to even more powerful and efficient devices in the near future.

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