The much-awaited Qualcomm Snapdragon X Elite is expectedly the company’s high-end chipset tailored for the PC market. Amid some previous leaks, a new report by Windows Report revealed the full specifications of Qualcomm’s upcoming chipset. Bundling the custom Oryon cores, the new chipset aims to offer 2x improved CPU and GPU performance than the present x86 processors.
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Snapdragon X Elite Features
With the focus on generative AI, the new Snapdragon X Elite will bundle Hexagon NPU which offers 45 trillion operations per second – TOPS. It is a 55% improved performance than the predecessor Snapdragon 8cx Gen3 SoC. Thanks to the Snapdragon Oryon CPU, that makes it is more power efficient, powerful, and productive with its generative AI models.
Qualcomm is expected to announce the new chipset at the Snapdragon Summit 2023. Based on 4nm architecture, the processor bundles 12 high-performance cores clocked at 3.8GHz and a dual-core boost of 4.3GHz. It bundles Qualcomm Adreno GPU with 4.6 TFLOPs and DX12 API support. Its LPDDR5x RAM offers 42MB of total cache and 136 GB/s memory bandwidth for its capacity to support 64 GB memory. Considering the competition, the chipset would offer 50% better performance.
Snapdragon X Elite Specifications
In connectivity, the new chip integrates support for WiFi 7 and Bluetooth 5.4, which is a considerable development over its predecessor that lends support for up to WiFi 6 and Bluetooth 5.1. Interestingly, the Video Processing Unit now supports AV11 encoding and decoding.
Below are the full Specifications for the Snapdragon X Elite:
| CPU | Qualcomm® Oryon™ CPU 64-bit Architecture 12 cores, up to 3.8 GHz Single and Dual-Core Boost, up to 4.3 GHz |
| GPU | Qualcomm® Adreno™ GPU Up to 4.6 TFLOPs API Support: DX12 |
| Memory | Memory Type: LPDDR5x Transfer rate: 8533 MT/s Capacity: Up to 64 GB Bandwidth: 136 GB/s Bit Width: 16-bit Number of Channels: 8 |
| Storage | SD: SD v3.0 SSD/NVMe Interface: NVMe SSD over PCIe Gen 4 UFS: UFS 4.0 |
| Display | Display Processing Unit (DPU) Name: Qualcomm® Adreno™ DPU Max. On-Device Display Resolution: eDP v1.4b, up to UHD120 HDR10 Max. External Display Resolution: DP v1.4 – 3 displays, up to UHD60 HDR10, 2 displays 5K60 |
| VPU | Video Processing Unit (VPU) Name: Qualcomm® Adreno™ VPU Encode: 4K60 10-bit encode – H.264, HEVC (H.265), AV1 Decode: 4K120 10-bit decode – H.264, HEVC (H.265), VP9, AV1 Concurrency: 4K60 decode – H.264, HEVC (H.265), VP9, AV1 / 2x 4K30 encode – H.264, HEVC (H.265), AV1 |
| Camera | Image Signal Processor Name: Qualcomm Spectra™ ISP Dual 18-bit ISPs Always-sensing ISP Dual Camera: 2x 36 MP Single Camera: Up to 64 MP Video Capture: 4K HDR |
| Wi-Fi/Bluetooth | Wi-Fi/Bluetooth System: Qualcomm® FastConnect™ 7800 System Generations: Wi-Fi 7, Wi-Fi 6E, Wi-Fi 6 Standards: 802.11be, 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a Spectral Bands: 6 GHz, 5 GHz, 2.4 GHz Spatial Streams: Up to 4 Peak QAM: 4K QAM Features: Passpoint, 8×8 Sounding, TDLS, Wi-Fi QoS Management, Wi-Fi Optimized Connectivity, Wi-Fi Location, OFDMA (UL/DL), Miracast, Target Wake Time, Voice-Enterprise, MU-MIMO (UL/ DL), Multi-Link Operation (MLO), High-band Simultaneous (HBS) Bluetooth Specification Version: Bluetooth 5.4 Bluetooth Connection Technology: Bluetooth LE M.2. Interface: WiFi M.2. card over PCIe Gen 3 |
| USB | USB Specification Version: USB 4.0 Interface Type: 3x USB-C 3x USB4, 2x USB3.2 Gen2, 1x eUSB2 |
Qualcomm’s new processor will offer better power efficiency with a similar performance. There will be DirectX 12 support as like its predecessor – Snapdragon 8cx Gen3. It can offer better computational features than the Xbox Series S which houses AMD RDNA2 architecture. The Chispet’s AI capabilities also have enormous potential which can be used to enhance user experience.
It would be worth waiting for Qualcomm’s summit which is scheduled for October 24 before jumping to conclusions about the Qualcomm Snapdragon X Elite.
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