Samsung’s upcoming Galaxy Z Flip FE, the anticipated budget-friendly foldable, might not get the latest Exynos 2500 chip as previously rumored. Instead, new evidence suggests it could launch with the Exynos 2400e—a slightly downgraded version of the Exynos 2400 of the Galaxy S24 and S24 Plus.
It’s totally acceptable for an FE model
According to code analysis from reliable sources, the device (codenamed “B7R”) is set to feature the “S5e9945” processor, which corresponds to the Exynos 2400/2400e. The Exynos 2400e, which was used in the Galaxy S24 FE, has a lower-clocked prime Cortex-X4 core but is otherwise similar to the standard 2400. Reports also indicate that Samsung may use IPoP (Integrated Package on Package) packaging for this chip, which is cheaper but reportedly has inferior heat dissipation—a trade-off that could help keep costs down.

Notably, this new information contradicts recent leaks suggesting Samsung might delay the Flip FE’s launch to equip it with the newer Exynos 2500. However, production challenges with Samsung’s 3nm process node obliged Samsung to power even the base models of the S25 series with the expensive Snapdragon 8 Elite. According to some previous reports, the Exynos 2500 failed to meet the performance standards Samsung MX set for the S25 series.

It seems that Samsung Foundry has yet to overcome the yield rate issue or related production challenges. Google has also shifted the fabrication of the upcoming Tensor G5 from Samsung to TSMC, and is also handling the designing part on its own.
Moving back to the Galaxy Z Flip FE, it’s expected to be Samsung’s most accessible foldable. In fact, Samsung is targeting users who want the flip-style experience without breaking the bank. While the Exynos 2400e isn’t the latest silicon, it should still deliver a reasonably good user experience—given Samsung focuses on heat dissipation or optimizes power usage.
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