Xiaomi’s next foldable is rumored to break new ground on price. A recent post from the well-known leaker DCS suggests the Xiaomi 18 Fold will start at more than 10,000 yuan, making it the first Xiaomi smartphone across all versions to cross that threshold.

According to reports, every configuration will land above 10,000 yuan, with the base model expected to sit around 12,000 yuan. Even as a leak, the number is significant enough to signal a clear shift toward ultra-premium positioning.

For context, the Xiaomi MIX Fold 4 launched in China back in 2024 starting at 8,999 yuan with 12GB of RAM and 256GB of storage. The ongoing memory shortage is also likely playing a role in the higher price tag this time around.

The 18 Fold is scheduled for an official launch on September 7 in China. It is expected to be the first device powered by Xiaomi’s in-house Xring O3 chipset. It includes a Leica-tuned triple camera setup: a 200MP main sensor with a 1/1.56″ sensor, a 50MP periscope telephoto offering 3.5x optical zoom, and a 50MP ultra-wide. Check out the camera samples here to get an idea of how the phone handles exposure, white balance, and contrast. Battery capacity is also confirmed to be 6,000mAh with support for 67W wired and 50W wireless charging.

On the design side, the 18 Fold is described as a mid-fold with a 5.38″ outer display and a 7.58-inch inner screen. It introduces a new color called “West Wild Red,” features a horizontal rear camera module, and leans into a clean aesthetic with symmetrical bezels, large rounded corners, a track-shaped Deco, and a completely flat wraparound mid-frame. Higher configurations, including the 16GB + 1TB version, are expected to use Changxin LPDDR6 memory.

If the leaked pricing holds, Xiaomi is clearly aiming higher with this foldable than it has with previous models.

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(Source: Digital Chat Station on Weibo)

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Xiaomi is continuing to reveal details about its upcoming 18 Fold ahead of its September 7 launch, and the latest announcement focuses on something that could make a noticeable difference in everyday use. The company is putting a surprisingly large battery inside its wide, book-style foldable while still emphasizing a slim and lightweight design.

The brand has confirmed that the upcoming foldable will feature a 6000mAh Xiaomi Jinshajiang battery. The battery uses an innovative stacking process designed to fit its large capacity into the foldable’s relatively compact body. Xiaomi also says the battery has a 20% silicon content and reaches an energy density of up to 920Wh/L.

Charging should be reasonably quick as well. The Xiaomi 18 Fold supports 67W wired charging and 50W wireless charging, giving users both a fast wired option and the convenience of charging without a cable.

The battery announcement adds to a growing list of hardware details Xiaomi has confirmed for the device. The 18 Fold will launch alongside the Xiaomi Pad 9 Pro Max and will be powered by Xiaomi’s in-house Xring O3 chipset. It is also set to be the first smartphone to use LPDDR6 memory from ChangXin Memory Technologies.

On the camera side, Xiaomi has confirmed a triple-camera setup consisting of a 200MP main camera, a 50MP 3.5x periscope telephoto camera, and a 50MP ultra-wide camera. The rear cameras also use Leica’s Summilux lenses. Check out the official camera samples here to see how the Leica-tuned image processing performs.

The battery capacity is particularly notable because large batteries are difficult to accommodate in foldables, where manufacturers have to balance capacity against thickness and weight. Xiaomi’s use of high silicon content and a stacked battery design appears aimed at addressing that challenge without making the phone bulkier.

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(Source: Xiaomi on Weibo)

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The Xiaomi 18 Fold is launching on September 7 with the new in-house-developed Xring O3 chipset, alongside the Pad 9 Pro Max. The company has already revealed quite a few details about the short-and-wide book-style foldable, including its camera specifications. And the latest leak includes several high-resolution image samples from the phone.

The camera system includes a 200MP 1/1.56″ main camera, a 50MP 3.5x periscope telephoto, and another 50MP sensor for the ultra-wide. And, of course, the entire imaging system is tuned in collaboration with Leica, as expected.

The very first image sample highlights the phone’s ability to handle white balance. It kept the warmer tone intact, the darker corners don’t look noisy, and there are no major artifacts anywhere in the photo. In terms of detail, we can see the individual bricks on the wall, and even the bright outdoor light coming through the open area isn’t entirely overexposed. So, the overall dynamic range isn’t too bad.

Of course, the imaging system could brighten up the darker parts of the photo, making it look flat. It seems Xiaomi‘s imaging system is focusing on the mood, or the aesthetic look, rather than just flexing the dynamic range, which is a good thing.

The watermark reveals that the photo was taken at a 23mm focal length (main camera) with an f/1.7 aperture, a shutter speed of 1/50 second, and ISO 80, which confirms it was a fairly low-light situation. And again, it’s impressive how the phone handled the overall mood of this image instead of ruining it.

The second shot is also similar. It kept most of the frame underexposed, prioritizing the mood rather than proper exposure. The third one is taken at 46mm, which means it’s a 2x digital crop on the main sensor. Upon closer inspection, we can see plenty of detail with no major noise or artifacts.

The 100mm portrait is also impressive. It has plenty of detail, seemingly accurate skin tones, and looks clean overall.

That said, these are image samples shared by the brand right before the release, so they are expected to be handpicked and showcase the phone at its best. It will still be worth checking the imaging performance ourselves once we get access to the device.

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(Source: Lu Weibing on Weibo)

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Xiaomi has set September 7 for its autumn flagship event, where it will officially unveil the Xiaomi 18 Fold. The company has now shared a first look at the foldable after several leaked photos surfaced last week. Xiaomi is also giving its design a name: “mid-fold.”

The company’s video confirms that the Xiaomi 18 Fold will have a 5.38-inch cover display and a 7.58-inch main display. Xiaomi showed the phone in red, with a horizontal camera strip on the back that houses three cameras and an LED flash. 

The company has also shared a look at the phone’s internal design on its website and confirmed that Leica was involved in developing the camera system.

Lu Weibing, who heads Xiaomi’s smartphone business, says the 18 Fold is more than just another foldable. He describes it as the most advanced flagship in Xiaomi’s lineup, designed to compete with the company’s regular numbered flagships. He also believes the mid-fold design could become a common direction for future foldable phones.

Xiaomi’s idea behind the mid-fold design

Xiaomi says its mid-fold design addresses a problem that has existed since large-screen foldables first appeared. Large foldables offer a big display when opened, but users often spend most of their time on the smaller outer screen. Smaller foldables are easier to carry, but usually make more compromises on the overall experience.

The Xiaomi 18 Fold is designed to sit just between them. When folded, Xiaomi says it is roughly the size of a passport and light enough to use with one hand. Open it up, and the 7.58-inch display uses a new aspect ratio designed for multitasking and watching videos.

Inside, the phone will run on Xiaomi’s Xring O3 chip, which recently appeared on Geekbench ahead of the launch. It will also ship with Surge OS 4 and Xiaomi’s MiMo on-device AI model.

Xiaomi has also introduced a new “dragon bone” hinge and a new simulation-based testing system for the foldable. The company previously confirmed that the 18 Fold will be one of the first phones to use CXMT’s new LPDDR6 memory.

The Xiaomi 18 Fold will launch alongside the Xiaomi N70 Pro, N70 Max, N90 Max, and the Xiaomi Pad 9 Pro Max at the September 7 event. The tablet also uses the Xring O3 chip.

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(Source 1, 2)

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The wait for Xiaomi’s next major flagship products is almost over. The company has confirmed the launch date for the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max. Both devices will arrive with Xiaomi’s latest Xring O3 AI flagship processor.

Xiaomi 18 Fold and Pad 9 Pro Max launch date confirmed

Xiaomi has scheduled its autumn flagship product launch event for Sept 7 at 7pm local time in China. Alongside the two devices, the company will also launch its N70 Pro, N70 Max and N90 Max electric vehicles under the Xiaomi Pengcheng brand.

The Xiaomi 18 Fold will be the company’s first inward-folding foldable with a wide aspect ratio. It will also be the first smartphone to feature the Xring O3 processor. The foldable will pair Xiaomi’s in-house SoC with ChangXin Memory Technologies’ LPDDR6 memory, creating a combination of two Chinese-developed core components.

Xring O3 is built on a 3nm process and features a 10-core all-large-core CPU configuration with six super-large cores and four large cores. The processor reaches a maximum clock speed of 4.35GHz and features a 16-core G2-Ultra NX GPU. Xiaomi says the GPU delivers an 85% improvement in graphics performance while reducing power consumption by 64% compared with its predecessor.

The Xiaomi Pad 9 Pro Max will also use the Xring O3 and has already appeared on Geekbench under model number M367FC. The tablet recorded 3,710 points in the single-core test and 14,319 points in the multi-core test.

The tablet is expected to feature a battery exceeding 10,000mAh alongside 120W wired charging. Its large display and flagship processor are aimed at demanding workloads such as video editing, drawing and multitasking.

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Xiaomi is all set to unveil the Xiaomi 18 Fold later this month in China. The device will be powered by Xiaomi’s all-new Xring O3 chip, built with a 3nm manufacturing process. Ahead of the expected launch, it has emerged on Geekbench, revealing its AI capabilities. 

Xiaomi 18 Fold Geekbench AI listing spotted

As can be seen above, Xiaomi’s upcoming foldable phone has now made another appearance on Geekbench, but this time the listing focuses on its AI performance. The device is identified as the Xiaomi 2608BPX34C, which is believed to be the upcoming Xiaomi 18 Fold, and the listing provides a closer look at its underlying hardware.

The Xiaomi 18 Fold scored 629 in the Single Precision test, 799 in Half Precision, and 634 in the Quantized test on Geekbench AI 1.7.0. The listing shows it has the O3 motherboard, further pointing towards Xiaomi’s upcoming Xring O3 flagship chipset. The chip is listed with a 10-core CPU, comprising four cores at 3.15GHz, four at 3.69GHz, and two performance cores reaching 4.36GHz. The listing also reveals that the device has 16GB of RAM and Android 17.

These results add another piece to the picture around Xiaomi’s next foldable, particularly as the Xring O3 is expected to bring major CPU, GPU and AI improvements. The same chipset is also showing promising numbers on the upcoming Xiaomi Pad 9 Pro Max, which has crossed the 14,000-point mark in Geekbench’s multi-core test. The tablet, listed under model number M367FC, recorded a peak score of 14,319, while another run reached 14,153 points.

The Xiaomi 18 Fold and Pad 9 Pro Max are expected to debut together. Rumors suggest that these devices will launch in the first half of this month, whereas the Xiaomi 18 lineup powered by the Snapdragon 8 Elite Gen 6 may break cover by the end of this montn.

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(via)

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Rumors suggest that Xiaomi will unveil the Xiaomi 18 Fold by early September in China. Ahead of the launch, the brand has already confirmed that it will be equipped with the all-new 3nm Xring O3 chip and will be the first device to feature the next-generation LPDDR6 RAM. It appears that in the days leading up to the launch, the brand is expected to reveal more details about it. Meanwhile, tipster Bald Panda has revealed the battery size and charging capabilities of the device.

Xiaomi 18 Fold battery, charging details leaked

According to the tipster, the Xiaomi 18 Fold will house a massive 6,000mAh battery, making it bigger than other wide-foldable phones available in the market. In comparison, the Galaxy Z Fold 8 has a smaller 4,880mAh battery, whereas the Huawei Pura X View has a slightly bigger 5,300mAh battery. The tipster also revealed that the device will support 67W wired and 50W wireless charging.

As per other leaks, the Xiaomi 18 Fold will arrive with a 7.6-inch foldable screen and will run on HyperOS 4-based Android 17. For photography, it is expected to feature a 200-megapixel primary camera. For security, it will have a side-facing fingerprint sensor.

Alongside the Xiaomi 18 Fold, the company will announce a new tablet called the Xiaomi Pad 9 Pro Max, which will also feature the Xring O3 chip. The other details of this device are under wraps.

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Xiaomi confirmed today that the Xiaomi 18 Fold will be the world’s first phone to ship with CXMT’s new LPDDR6 memory. The foldable is set to launch in September alongside the new SkyNomad SUV.

Xiaomi founder, chairman, and CEO Lei Jun announced the news on Weibo while congratulating CXMT on reaching mass production of LPDDR6. He called the achievement “remarkable” and said Xiaomi’s XRING O3 is the first chip to support the new memory standard. The Xiaomi 18 Fold will be the first device to use the technology.

Lei also said he expects more Chinese tech companies to work together on projects like this in the future. The XRING O3 itself only came out on August 24. Xiaomi unveiled it as the first chip in the industry built to work with LPDDR6. 

What can you expect

According to IT Home, CXMT detailed the new memory in its 2026 semi-annual report. The company says LPDDR6 is a major upgrade over its previous LPDDR5X memory, with improvements to its architecture and data transfer system.

LPDDR6 can reach transfer speeds of up to 12,800Mbps and is available with up to 16GB of memory per chip. CXMT has already sent samples to key customers for testing and is now working to increase mass production.

Faster memory helps a phone handle multiple apps more smoothly, open apps faster, and deal with demanding AI features more efficiently. The move is also an important step for CXMT, which has been working to compete with major memory makers such as Samsung and SK Hynix. By supplying the first phone with LPDDR6, CXMT has secured an early lead in the new memory standard.

Xiaomi has not revealed the full specifications of the Xiaomi 18 Fold yet. However, with the foldable confirmed to launch in September, we should learn more about the phone soon.

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(Source | Via)

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Xiaomi CEO Lei Jun says September will be a “big month” for the company as new products are lined up one after another. 

According to Lei, the month will begin with the launch of Xiaomi SkyNomad, a family-focused SUV lineup built on the Kunlun platform. The Xiaomi 18 Fold is confirmed to tag along, too. And while Lei doesn’t mention it, it’s likely that we will also see the Xiaomi Pad 9 Pro Max launching at the same event. The latter two are powered by Xiaomi’s new XRING O3 chip.

The XRING O3 has already made some big claims. It reportedly scored 5.22 million points on AnTuTu, making it the first smartphone chip to cross the 5 million mark. The chip uses a 3nm process and packs 24 billion transistors into a 133mm² design, which is 26% larger than the previous XRING O1.

Its 10-core CPU also scored more than 15,000 points in multi-core testing. And Xiaomi’s new G2-Ultra NX GPU is said to deliver 85% better graphics performance while using 64% less power.

Xiaomi 18 Pro Brings a New Snapdragon Chip

The Xiaomi 18 Pro series will arrive toward the end of September. Its biggest upgrade is expected to be the sixth-generation Snapdragon 8 Elite Gen 6 chip. Unlike O3, the Gen 6 will use a newer 2nm process.

The previous generation used a 3nm process, so the move to 2nm is expected to increase transistor density by around 30%. That could bring better performance, lower power use, and more stable performance during longer periods of heavy use.

The Xiaomi 18 Pro series is also expected to support 100W wired charging, the N79 5G band, and UWB connectivity. 

With the Sky Nomad SUVs, Xiaomi’s first foldable phone, and the Xiaomi 18 Pro series all arriving in the same month, September is sure to be the company’s busiest launch period this year.

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(Source)

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Xiaomi has unveiled three new in-house chipsets for different parts of its technology ecosystem. The lineup includes the flagship Xring O3, AI-focused Xring O100, and intelligent-driving Xring D100. The Xring O3 stands out with a claimed AnTuTu score of 5.22 million, making it the first mobile SoC to cross the 5-million mark.

Xring O3 brings a major performance boost

Built on a 3nm process, the Xring O3 features a 10-core CPU that delivers up to a 60% performance improvement. It also introduces the 16-core G2-Ultra NX GPU, with graphics performance claimed to be up to 85% higher and power efficiency improved by 64%. Xiaomi says the chipset scored 5.22 million points on AnTuTu, making it the first mobile SoC to cross the 5-million mark.

The Xring O3 is also Xiaomi’s first mobile chip with LPDDR6 memory support, offering bandwidth of up to 113.8GB/s. For AI workloads, it delivers 200 TOPS of tensor performance and 3.13 TFLOPS of vector performance, while NPU performance has increased by 45%. AI acceleration is distributed across the CPU, GPU, ISP, DPU, and ADSP, with static latency rated at 82ns. Xiaomi says development took 459 days.

Xiaomi has also confirmed that the Xring O3 will power the Xiaomi 18 Fold and Pad 9 Pro Max, both of which are scheduled to launch in September in China. Readers can visit this post to know more about these devices. Ahead of the launch, the company has already started receiving pre-orders of the 18 Fold, which will sport a wide foldable design.

Xring O100 and D100 target AI and cars

The Xring O100 is built on a 6nm process and uses a near-memory AI architecture designed to reduce memory bottlenecks. It combines vertical chip and memory stacking with millions of high-speed vertical channels to provide bandwidth of up to 1.22Tbps. Xiaomi expects the chipset to be used for on-device AI across phones, cars, and robots.

The Xring D100 focuses on intelligent driving. It is Xiaomi’s first domestic 3nm intelligent-driving AI chip, featuring a 20-core CPU and 16-core NPU. It supports up to 160GB of unified memory and can run AI models with up to 200 billion parameters locally. Development is complete, with commercial availability planned for 2027.

What do you think about Xiaomi’s new chip lineup, especially the Xring O3’s claimed performance?

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