Hisilicon Kirin 970 Archives - Gizmochina

Huawei’s Kirin 670 Details Leaked: Integrated NPU, Cortex A72 & Mali G72 GPU

Jed John Ikoba — Wed, 07 Mar 2018 08:23:51 +0000

Huawei‘s midrange models including the Honor 7X, Nova 3 and even the Honor Note 9 are all rumoured to utilize a yet-to-be-announced Hisilicon Kirin 670 chipset. Huawei’s smartphones have lately been focused on using Kirin processors and with massive improvements in its chip business, they stand at par and sometimes even ahead of their contemporaries. The Kirin 670 chip isn’t going to be an exception, considering the details of the chip as featured in a new leak.

Information from industry sources highlights the Kirin 970 as coming with an integrated AI architecture with its own Neural Processing Unit (NPU). This is the same architecture featured on the flagship Kirn 970 and it is interesting to see that Huawei is keeping to its promise to bring the AI chip to its midrange models. In addition, the midrange chipset is also said to have a CPU design housing two Cortex-A72 cores and four Cortex A-53 cores which is the same with the Kirin 950. As we already revealed several months back, the chipset will be built on a 12nm TSMC FinFet process. The chipset will also be integrated with the ARM Mali-G72 MP12 GPU which first made its debut on the Kirin 970-powered Mate 10.

Presently, Kirin 659 is the latest chip in the Kirin 6xx series and it utilizes an octa-core Cortex-A53 architecture as well as a Mali T830 MP2 GPU. Thus, there is a strong indication that this new chipset would come with a significant improvement in performance compared to its predecessor. We don’t have any idea as to when the new chipset would find its way into a launched smartphone but that won’t be too far away, going by Huawei’s leaked product roadmap

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Huawei Unveils The Kirin 970, The World’s First Processor With A Dedicated NPU

Habeeb Onawole — Sat, 02 Sep 2017 23:01:44 +0000

The Kirin 970 is official and Huawei has set a record with the new flagship chip. The 10nm chip is the first mobile computing unit with a built-in AI computing Neural Processing Unit NPU.

Before we dive into the configuration of the Kirin 970, lets talk about its AI NPU. Instead of letting the CPU carry out AI computing tasks, the NPU is assigned the tasks and it does it better and faster. According to the figures provided, the Kirin 970’s NPU delivers performance that is 25 times more than the CPU’s, and efficiency that is 50 times greater. That means lesser time and power required for AI tasks.

The TSMC-built Kirin 970 is an 8-core CPU with a clockspeed of uP to 2.4GHz i.e. 4 x Cortex A73 at 2.4GHz + 4 x Cortex 53 at 1.8GHz. It has a 12-core Mali G72MP12 GPU, making it the first commercially available chip to use ARM’s latest GPU. The GPU provides a 20% performance increase over the previous generation as well as a 50% increase in efficiency. Its Kirin NPU can perform 1.92 Teraflops when using 16-bit floating point numbers.

Huawei CEO RIchard Yu Announcing The Kirin 970

The Kirin 970 has 4.5G Cat.18 LTE and offers gigabit LTE speeds of 1.2Gbps. It also features an advanced dual ISP with face and motion detection, 4-hybrid focus, low-light and motion shooting. Since the Kirin 970 will be appearing in the Huawei Mate 10 series first, expect them to have an impressive camera performance.

The chip also has HDR10 support and 4K video encode and decode. It supports LPPDR 4X RAM (1883MHz) and UFS 2.1 storage. It also features an i7 sensor processor, iNSE and TEE security engines and support for HiFi audio.

Huawei says it has built an open AI ecosystem so apps can access NPU capabilities directly and via 3rd party AI frameworks. The Mate 10 and Mate 10 Pro are the first two devices that will be powered by the new chipset and they will be announced in Munich on October 16.

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Fresh Kirin 970 & Snapdragon 845 Details & Launch Dates Leaked

Jed John Ikoba — Fri, 19 May 2017 15:43:41 +0000

Barely a few months after Qualcomm‘s latest Snapdragon 835 chip was announced and subsequently became available on smartphones, news filtered in that the leading chipmaker was already working on a next-gen flagship chip which would be called Snapdragon 845. In the same vein, Huawei is said to be working on its next-generation flagship chip which is actually meant to take on the Snapdragon 835. The Huawei chip is likely going to be known as Hisilicon Kirin 970 chip.

We have had a couple of leaked details of the Snapdragon 845 and Kirin 970 which emerged on several occasions. now, a specs sheet containing the key specifications of the SD 845 and Kirin 970 SoC has appeared online. The list shows both the Snapdragon 845 and Kirin 970 will be built on a 10nm process but while the Kirin 970 will be manufactured TSMC’s FinFET process, Qualcomm’s next flagship chip will be manufactured on Samsung’s LPE process. The SD 845 was previously rumoured as being built on a new TSMC 7nm process but that is turning out to be false.

On their core specifications, the Snapdragon 845 is shown to be an octa-core CPU made up of four Cortex-A75 cores and four Cortex-A53 cores. It will come with the Adreno 630 GPU as well as an X20 baseband and 5X20MHz carrier aggregation. The processor is scheduled to ship in the first quarter of 2018. On the other hand, the Kirin 970’s CPU core is said to have been upgraded to a new generation of ARM Cortex-A73 core and will be the first to use the ARM Heimdallr MP (Heimdal) GPU. The Kirin 970 will ship with the third and fourth quarter of this year.

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Huawei Kirin 970 Rumored to Feature TSCM 10nm Process, Cat. 12 LTE Support

Jed John Ikoba — Wed, 23 Nov 2016 04:36:53 +0000

Smartphone chip makers are always on the move, improving their chipset with more powerful offering and reduced size in the face of demands for smartphones that consume less power and are are capable of seamlessly fast performance. Huawei recently released the Kirin 960 flagship processor that benchmark tests have shown to be superior in performance to its present contemporaries, yet the company is rumored to be working on a Kirin 970 chipset.

According to latest media reports in Taiwan, the next generation Kirin 970 will be Huawei’s first to be built on the TSMC 10nm process. The Kirin 970 is said to likely still be on an octa-core architecture but will integrate a baseband with support for Cat. 12 global LTE. The present Kirin 960 chip is composed of a quad-core Cortex-A73 chip, another quad-core Cortex-A53 chip and an octa-core Mali-G71 GPU. The Kirin 960 was however built on TSMC 16nm process and it comes with a wonderful CPU performance but the GPU cannot perform at full capacity. So a switch to the 10nm process is said to greatly reduce the heat and allow full extraction of the GPU performance.

In building the Kirin 970 on the 10nm process, Huawei is following the trend, catching up with would-be early starters like Qualcomm which just announced the Snapdragon 835 processor built on Samsung’s 10nm manufacturing process and to debut in the first quarter of next year on the Galaxy S8. MediaTek is also out with its Helio X30 chip built on TSMC 10nm process and to debut in the first quarter of next year also. MediaTek is also billed to release an Helio X35 chip within the first half of 2017 which would upgrade to provide Cat. 12 LTE band support.

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