Unisoc has quietly launched its new T9300 5G mobile chipset for smartphones. The company describes the chip as a high-performance 5G SoC designed to deliver enhanced video and gaming experiences. Continue reading ahead to learn more in detail about the new chipset.

Unisoc T9300 specifications

The Unisoc T9300 is designed as a high-performance 5G SoC aimed at strengthening both imaging and gaming experiences. Built on a 6nm process, it features an octa-core CPU with two Cortex A78 cores at 2.4GHz and six Cortex A55 cores at 2.2GHz.

Unisoc claims a notable efficiency improvement of around 38 percent compared to the previous generation. Graphics are handled by the Mali G57 dual-core GPU, and storage support includes LPDDR4X memory and UFS 2.2 flash. Benchmark scores reportedly reach around 550,000 on AnTuTu V10.

Connectivity receives a substantial boost with 3GPP Release 17 support, integration of 5G NR NTN satellite communication and 5G MBS broadcast. The chipset features AI-driven network management and improved power efficiency in typical 5G conditions. It supports SA and NSA modes, dual VoNR, VoWiFi and full multi-band compatibility from 2G to 5G.

The T9300 introduces the seventh-generation Vivimagic imaging engine with a quad-core ISP, support for up to 200-megapixel sensors, 32-megapixel at 25fps ZSL output and 20-megapixel dual camera configurations. It includes improved multi-frame and time domain noise reduction, upgraded 3A algorithms, and AI-backed night mode, along with refined portrait segmentation and HDR photography improvements.

Audio capabilities include advanced noise reduction, enhanced echo control, upgraded stereo playback and HiFi grade output powered by a dedicated DSP. Display support covers FHD+ at 144Hz, 1.5K at 90Hz, HDR10+ and Netflix certification, along with VRR and multiple eye protection modes.

The gaming experience is strengthened by the Unisoc Miracle Gaming engine, which focuses on frame stability, network optimisation and enhanced visual processing with AI codec support for better voice clarity in poor network conditions.

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Unisoc has announced the successful upgrade of its 5G and 4G mobile platforms to Android 15. This update covers platforms such as the T820, T770, T765, T760, T750 for 5G, and T620, T619, T616, T615, T612, and T606 for 4G. As per the chip maker, the upgrade aims to enhance performance, boost security, and introduce new features to improve user experiences.

Android 15 key features

Android 15 has been designed to streamline productivity while offering enhanced media capabilities, superior adaptability to various device form factors, and reduced battery consumption. With improved app performance and strengthened privacy and security protocols, Unisoc’s chipsets are set to provide a refined and secure user experience across a range of devices.

One of the key features of this upgrade is the introduction of a frame rate stabilization scheme tailored specifically for gaming, integrated into both software and hardware. This ensures a smoother gaming experience. Additionally, Unisoc has incorporated a resource management center within its framework, optimizing CPU performance, algorithms, audio, video, and AI Codec technologies to deliver seamless and powerful performance across a variety of applications.

According to Unisoc, it has made several technology optimizations to address local climate conditions and user preferences. These innovations include advanced temperature management, improved gaming performance, and enhanced AI capabilities, ensuring stable and energy-efficient operations.

Furthermore, Unisoc has significantly upgraded its photographic features, supporting 100MP photography, continuous shooting, photo watermarking, and dual video recording. These enhancements are aimed at enriching the experience for Indian consumers.

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Unisoc has recently unveiled a new 5G-enabled SoC called the Unisoc T760 for budget-range devices.

Unisoc T760 specs:

The T760 uses a 6nm EUV manufacturing process, featuring an octa-core CPU with four Cortex-A76 cores for performance and four Cortex-A55 cores for efficiency. An ARM Mali-G57 MC4 GPU supports smooth graphics and gaming.

The T760 includes a Neural Processing Unit (NPU) with 3.2 TOPS processing power, enhancing AI features like facial recognition and camera functions. Unisoc reports an average AnTuTu V10 score of 510,000.

The T760 supports displays up to Full HD+ resolution at a 120Hz refresh rate and QHD+ displays at 60Hz. Camera support includes sensors up to 64MP and quad-camera setups, enhanced by Unisoc’s Vivimagic 6.0 imaging engine and Acutelogic 3A technology for better photo and video quality.

Battery efficiency is a key feature, with Unisoc claiming a 37% reduction in power consumption during 5G data use and an 18% reduction in 5G standby, leading to longer battery life.

Connectivity options for the T760 include support for NSA/SA 5G networks, GSM, WCDMA, TDD-LTE, FDD-LTE, and advanced navigation systems like GPS, Glonass, Beidou, and Galileo. It also offers Wi-Fi 802.11ac, Bluetooth 5.0, FM radio support, and memory configurations up to 32GB of LPDDR4X RAM with storage options of EMMC 5.1 and UFS 3.1.

Availability

Unisoc’s new chipset will power upcoming budget smartphones in India, providing more options for consumers looking for cost-effective 5G devices. This SoC is already onboard many Chinese smartphones like the Nubia Mavericks 5G and Coolpad COOL 60, and is expected to power the upcoming HMD smartphones.

(Source)

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Chinese smartphone giants Xiaomi and Unisoc are reportedly making strides towards developing their own 4nm mobile processors, potentially reducing reliance on foreign chipmakers like Qualcomm and MediaTek. This news comes as China pushes for greater self-sufficiency in the semiconductor industry, backed by strong government support.

According to Liberty Times and Commercial Times, both Xiaomi and Unisoc have successfully completed the “tape-out” process for their domestic 4nm chips. This signifies a significant milestone in the development cycle, where the design is finalized and sent to a foundry for manufacturing. However, the reports clarify that these chips utilize foreign intellectual property (IP) cores from ARM and IMG.

Xiaomi has emerged as a major force in smartphone production, ranking third globally behind Apple and Samsung in Q1 2024. Their ambitions extend beyond phones, with rumors suggesting a competitive 4nm chip to rival Huawei’s Kirin 9000s, potentially launching later this year.

The Kirin chip is based on a 7nm process by SMIC, another major Chinese chipmaker. Xiaomi’s past collaborations with Qualcomm position them well for long-term success in the chip development arena.

On the other hand, Unisoc, a Shanghai-based fabless chip designer specializing in mobile communication and connectivity technologies, is also reportedly on the 4nm bandwagon. Their chip is said to have already completed the tape-out stage and achieved performance comparable to Qualcomm’s Snapdragon 888.

However, analysts caution that widespread adoption of domestically produced 4nm SoCs in Chinese smartphones might not happen until 2026. Currently, established players like MediaTek and Qualcomm hold a dominant position in the Chinese market.

This advancement may mark a pivotal moment for China’s semiconductor industry. Led by Huawei, and now with Xiaomi and Unisoc also entering the arena, domestic chipmakers are poised to potentially challenge international competitors. This shift could diminish China’s dependence on foreign technology, while also promoting innovation and competition globally within the semiconductor sector.

(Via)

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The Teclast T50 HD tablet has been launched in China. The T50 HD is an affordable tablet packing some decent features including an illuminating display. The tablet is powered by the Unisoc T606 processor backed by up to 256GB of internal storage.

Features

The T50 HD tablet features an 11-inch IPS high-definition screen with a 60Hz refresh rate and 1920 x 1200 pixels resolution. The tablet offers an exciting picture quality whether watching a high-definition movie or browsing pictures. The maximum brightness of the slate is 400 nits and it equally supports the T-Colour 3.0 screen display technology. The embedded technology delivers fuller and vivid images for an immersive viewing experience.

The Teclast T50 HD tablet has TUV low blue light certification to protect your eyes even for extended periods. The Unisoc T606 chipset has an octa-core setup. It has two A75 high-performance cores with a frequency of 1.8GHz and six energy-efficient A55 cores. The processor is capable of delivering a decent performance when using the tablet. The thickness of the T50 HD tablet is 7.8mm while its weight is 530g.

The T50 HD tablet has an 8,000mAh polymer lithium battery and offers extended usage. The tablet has a USB-C interface for quick charging and energy replenishment. It also has an AI dual camera adorned with a watch ring and dual speakers.

Pricing & Avialability

The new Teclast tablet is priced at 799 yuan ($110) and is available on retail platforms in China.

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China is gradually reducing its dependency on foreign technology. In this context, companies like Huawei and BYD are frequently mentioned, while companies like UNISOC emerge as unsung heroes. The company, which has long been producing chipsets for mobile devices, had recently made headlines with its T765 5G chip. Now, UNISOC unveils the 7861 chip for POS machines.

UNISOC 7861 for Secure, Multi-Functional Payment Terminals

When you are shopping it’s often easier to pay with cards instead of cash. Many people, including myself, hardly ever use cash anymore. This means more businesses need machines to take card payments. Recognizing this, Unisoc has announced the launch of the UNISOC 7861 chip, created for these card payment machines.

Based on the 12nm process technology, the UNISOC 786, adopts a dual high-performance big core Arm Cortex-A75 at 1.6GHz and six energy-efficient cores Cortex-A55 at 1.6GHz, and is equipped with a Mali G57 GPU core. The processor also supports dual-band Wi-Fi 5, Bluetooth 5.0, GNSS positioning services, USB Hub and other features.

It supports LPDDR4x memory and provides UFS 2.2 and eMMC5.1 storage interfaces, and FHD+ display output. The UNISOC 7861 processor currently supports the Android 12 Go system and Android 14 system optimized for small memory (1GB + 8GB).

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Unisoc might not be a household name in chipsets like Qualcomm or MediaTek, but they’re no newcomer. They’re known for building affordable platforms for smartphones, especially popular in South Asia. And today, they’ve quietly released their latest offering: the Unisoc T765 5G. This 5G chip is likely to power the mid-range smartphones of 2024. So let’s get into the details here.

Unisoc T765 5G Overview

The T765 is built on a 6nm EUV (TSMC) process and features two A76 cores clocked at 2.3GHz and six A55 cores at 2.1GHz. There’s LPDDR4x memory support up to 2133 MHz and can use eMMC5.1 / UFS 3.1 / UFS 2.2 standards for storage. This combination should ensure smooth performance for everyday tasks and even some light gaming.

The graphics department is handled by an Arm Mali-G57 MC2 GPU running at 850MHz. The chip also supports FHD+ displays with a 120Hz refresh rate and there is even support for HDR 10+ and VRR (Variable Refresh Rate) technology. 

As for the optics, The T765 is equipped with Unisoc’s latest Vivimagic 6.0 image engine and a 4-core ISP  (2 main + 2 auxiliary) architecture. This translates to support for high-resolution cameras, up to 108MP main sensor, or a versatile triple-camera setup with 64MP, 20MP, and 13MP sensors.

Unisoc has also thrown in some impressive camera features like multi-frame noise reduction, HDR camera technology, and AI-powered scene recognition and portrait mode. 

The T765 is also future-proof with support for all 2G to 5G network modes. It also boasts 5G dual-carrier aggregation technology for faster data speeds, up to 130MHz bandwidth. Additionally, it supports both SA and NSA 5G modes, dual-SIM dual-VoNR for seamless voice calls, and VoWiFi for clear calls over Wi-Fi.

Specifications

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If you’ve used an Android smartphone before, high chances are that your smartphone is either powered by a Qualcomm Snapdragon or MediaTek Dimensity processor. But recently, there’s a third player slowing growing into the smartphone space, and their name is UNISOC, with their UNISOC 5G SoC (System-on-a-Chip) for Android smartphones.

UNISOC, formerly known as Spreadtrum, is a Chinese fabless semiconductor company headquartered in Shanghai which produces chipsets for Android smartphones. UNISOC chipsets have passed the validation of more than 260 carriers from 133 countries worldwide. Some of their high-profile customers for purchasing their processors include HONOR, realme, vivo, Samsung, Motorola, Hisense and ZTE for their smartphones.

Out of their entire lineup currently available, in this article, we’ll be comparing whether UNISOC’s four 5G smartphone processors can compete with the big boys in the market, which are known as MediaTek and Qualcomm respectively. 

UNISOC has four notable 5G smartphone processors, which are the UNISOC T750, T760, T770, and T820. One of these 4 processors can be listed as a Tier C performing processors, whereas the other remaining 3 can be viewed as C+ performing processors.

Tier C: Low Performance Processors

Starting off with the only Tier C processor from UNISOC is the UNISOC T750. It comes with 5G connectivity,  2 ARM Cortex A76 CPU performance cores and 6 ARM Cortex A55 CPU efficiency cores. The GPU under the hood is the ARM Mali-G57 MP2 which is equivalent in performance to the ARM Mali G57 MC2, and the Qualcomm Adreno 618. 

As seen above, the UNISOC T750 is approximately equivalent to the Qualcomm Snapdragon 730 found on the Samsung Galaxy A71 (2019) or the MediaTek Dimensity 6080 found on devices like the Redmi Note 13 5G and Redmi Note 11S 5G. However, manufactured on the newer TSMC 6nm process, the UNISOC T750 has several benefits over the Snapdragon such as better performance and better power efficiency.

The UNISOC T750 was released in May 2023 and is expected to arrive in Android devices by 2023 Q4.

Tier C+: Better Low Performance Processors

Next are the 3 Tier C+ processors from UNISOC, which are respectively the UNISOC T760, T770, and T820. All 3 feature the same CPU core configuration which 4 ARM Cortex A76 CPU performance cores, and 4 ARM Cortex A55 CPU efficiency cores, which is actually the same core configuration as the flagship Qualcomm Snapdragon 855 mobile processor found on the OnePlus 7 Pro, and Xiaomi Mi 9T Pro (Redmi K20 Pro). 

However, where these 3 UNISOC processors differ from the Snapdragon 855 is their GPU. Powering the T760, T770 and T820 is the ARM Mali G57 MP4 GPU, which is much behind the Adreno 640 on the Snapdragon 855, and closer to the Adreno 620 on the Snapdragon 765. Still the 4+4 CPU configuration allows the UNISOC processors to be ahead of its competitors by providing a flagship-type CPU core configuration at an affordable price despite the underpowered GPU.

The UNISOC T760, T770 and T820 can be found in devices like the Hisense P50 5G, ZTE Blade A73 5G, and the recently released ZTE Nubia Neo 5G, the company’s budget gaming smartphone from Nubia.

In conclusion, UNISOC processors are not useless, and in fact, they are quite underrated at the price that they are offered. UNISOC’s small portfolio of 5G smartphone processors is not competitive with the high-end processors from MediaTek and Qualcomm. However, at an affordable price, the UNISOC processors still have a place for “better than expected” performance in low-end Android smartphones.

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When we think of mobile processors, Qualcomm is often the first company that comes to mind. This is because their chips are widely used in high-end and mid-range devices. However, it may come as a surprise to many that MediaTek, a Taiwanese manufacturer, is actually the world’s top-selling chip producer, surpassing even Qualcomm. With a wide range of chips produced for all kinds of devices, MediaTek has secured a significant market share. Following in their footsteps, Chinese company Unisoc is also adopting a similar strategy to expand their market share, particularly in the low-end smartphone chip market. Here are the details…

At Unisoc’s Shanghai showroom, China’s chip ambitions remain strong in the mature technology arena

Chinese chip firm Unisoc is expanding its market share in low-end smartphone chips, The company’s success lies in its focus on less advanced chips, allowing it to remain relatively unscathed by US sanctions to date. In fact, Unisoc’s share of the global smartphone chip market was 10% in Q3 2022, according to market research firm Counterpoint, ahead of Samsung Electronics.

Unisoc’s success with 5G chips is notable, including the launch of the T820 chip in November 2022 and the subsequent launch of a 5G communication solution at the Mobile World Conference in Barcelona in March 2023. Unisoc’s T820 chip was made possible by a team of more than 200 engineers who slept at the office for nearly three months during Covid lockdowns last year.

Unisoc has not elaborated on plans for mass production of the chip, but the company has launched three 5G chips using a 6-nanometre extreme ultraviolet lithography process, with the other two chips achieving mass production and being adopted by low-end smartphone brands in China. Despite Unisoc’s success, the company remains exposed to US sanctions because China still lacks advanced fabrication plants of its own.

For example, Huawei’s chip design unit, HiSilicon, was hobbled by US trade sanctions on exports of advanced chips, which required Taiwan Semiconductor Manufacturing Co to stop doing business with it. Unisoc has ramped up efforts to diversify its operations, extending the application of 5G chips beyond consumer electronic products to industrial solutions such as medical services, logistics, electricity, and mining, among others. The company’s shipments of 5G Internet of Things (IoT) chips and modules also increased 146% last year.

Unisoc is conducting a new 10 billion yuan (US$1.45 billion) fundraising round, according to Reuters, and its business covers more than 133 countries, with 80% of its products sold to overseas markets. Unisoc’s success underscores the life in the domestic semiconductor industry, particularly the section that focuses on more mature chip technologies.

According to China’s chip design industry association, the country had 3,243 chip design firms by the end of 2022, with their combined sales up 16% from a year ago. While risks remain, Unisoc is a shining example of how Chinese semiconductor companies can survive and even thrive under US trade sanctions.

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(via)

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Unisoc, a China-based chip manufacturer, has been able to take advantage of the opportunity presented by the global chip shortage and is now aiming to replace MediaTek in the budget smartphones segment as the Taiwan-based company is focusing on capturing the premium market.

With such a rise, the company also goes through stricter scrutiny. While some of the company’s older chips were marked as a threat vector, now another vulnerability has been found that explicitly affects a Unisoc chip found in three Motorola devices.

According to the report from Checkpoint Research, the Unisoc Tiger T700 chip, which powers the Motorola Moto G20, E30, and E40 smartphones, has been found to have a vulnerability when the cellular modem attempts to connect to an LTE network.

It basically omits the check to make sure that the modem’s connection handler is reading a valid IMSI or similar subscriber ID. When the handler reads a zero-digit field, a stack overflow occurs which can be exploited for a denial of service attack or for remote code execution, blocking the user from the LTE network.

Checkpoint Research notified Unisoc about this last month and the company evaluated it to be of critical risk with a 9.4 out of 10 ratings and promptly patched the issue. Google may pass the patch onto users soon, likely with the new Android security bulletin.

There haven’t been any reports of this flaw getting exploited but this is still a large problem, especially because most Unisoc processors are used in budget smartphones that rarely get new software updates.

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China-based semiconductor firm Unisoc has recently come to prominence with multiple major manufacturers using its SoCs in their budget range devices. Now, Check Point Research has revealed that the Unisoc smartphone chips have a critical security vulnerability.

According to the firm, The issue exists in the modem firmware and affects 4G and 5G Unisoc chipsets. The issue, tracked as CVE-2022-20210, was discovered while scanning Non-Access Stratum (NAS) message handlers. This vulnerability could be exploited to neutralize or block the cellular communication capabilities of the device.

Slava Makkaveev,  Reverse Engineering and Security Research attorney at Check Point Software said “An attacker could have used a radio station to send a malformed packet that would reset the modem, depriving the user of the possibility of communication. Left unpatched, cellular communication can be blocked by an attacker.”

The vulnerability was detected on a Motorola Moto G20 running the Unisoc T700 chipset and Android January 2022 security patch. The vulnerability, however, exists on other devices using Unisoc chipsets too. Check Point Research disclosed its findings to Unisoc in May. The China-based chipmaker acknowledged the vulnerability upon the receipt of disclosure and issued a patch.

Makkaveev also stated that “There is nothing for Android users to do right now, though we strongly recommend applying a patch that will be released by Google in their upcoming Android Security Bulletin.” So, it is advisable to update your Unisoc SoC smartphones to the latest software version when the next patch arrives.

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As one of the world’s largest smartphone markets, China with its population of over 1 billion reflects several of the future trends that we may see in the smartphone industry, with one of them being the brand of the SoC (System on a Chip) used in our smartphones.

As we are almost halfway into 2022, data analytics firm, CINNO Research, has recently published a report on the Top 5 Smartphone SoC Vendors in the China market for Q1 2022, and it seems that MediaTek is the popular SoC brand used in smartphones for the quarter.

According to the report (via ITHome), smartphone SoC shipments in Q1 2022 were 74.39 million units, down 14.4% year-on-year, and down 0.7% quarter-on-quarter. And the top 5 vendors for the smartphone SoC vendors are MediaTek in the first place, Qualcomm in second, Apple in third, with Huawei’s HiSilicon and UNISOC in fourth and fifth respectively.

Let’s start from top to bottom, MediaTek saw 30.7 million smartphone chipsets shipped out in Q1 2022, which was higher than its 25 million shipments from last quarter, and 30.1 million shipments from Q1 2022. The rise in smartphone SoC shipments MediaTek can be mainly attributed to the semiconductor firm’s strategy and chipset catalogue that it had offered in the last 6 months, which included the brand’s popular Dimensity 920 5G chipset found on the Redmi Note 11 Pro+, Realme 9 Pro+ and Xiaomi 11i Hypercharge.

For Qualcomm, the brand remained relatively stable at second with 26.7 million smartphone SoC shipments in Q1 2022, higher than the 23.6 million figure from last quarter, but lower than the 27.9 million shipments from Q1 of last year. Coupled with the ongoing chip shortage, Qualcomm had earlier announced that it will gradually shift its focus to flagship chipsets instead of entry-level and mid-range chipsets due to flagship chipsets providing higher profit margins. However, the one caveat of this strategy is losing market share in mid-range and entry-level markets, which leads to lower shipments overall but higher revenues for the company.

Apple on the other hand, had only shipped 12 million smartphone SoCs in Q1 2022, down 15.8% from its 18.4 million figure from Q4 2021. As the iPhone nears the end of its release cycle, shipments are also expected to go down as well, because consumers are already expecting a new iPhone release soon, and therefore would hold off buying the current model and wait for the next iteration instead.

Huawei’s HiSilicon continues its gradual exit from the China smartphone SoC market as the firm had only shipped out 2.5 million units this quarter, down from 13.8 million in Q1 2021. As stocks for HiSilicon Kirin are not replenished due to the still ongoing supply sanctions against the company, the brand is expected to drop out of the top 5 as late as next year or as soon as the next quarter.

Squeezing just into the Top 5 is the rapidly growing UNISOC semiconductor company. UNISOC saw shipments of 1.9 million smartphones SoCs in Q1 2022, up 1760% from 0.1 million in Q1 2021. The main cause for the exponential growth behind UNISOC is the entry-level smartphone market. As the bigger players like Qualcomm and Apple’s main focus area is in the high-end, UNISOC aims to tackle the low end with its relatively much more affordable chipsets sold off to Realme, Motorola and Samsung to sell in their sub 100 dollar device market.

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(Via)

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A new report has suggested that Unisoc will see its shipments for smartphone application processors rise by a whopping 152 percent year on year, reaching 68.2 million units in 2021. This also implies that it would be able to overtake Huawei HiSilicon as the third largest smartphone AP supplier.

According to a DigiTimes report, these smartphone APs from the chipmaker were made for use by Chinese handset manufacturers. The report added that the company only shipped 27.1 million smartphone APs for these Chinese brands back in 2020. Furthermore, it has also managed to expand its client list, which now includes the likes of Honor, Realme, and Lenovo. In other words, this would likely lead to a notable boost in the shipments of its smartphone application processors this year.

At the moment, Unisoc is also one of the primary beneficiary of 4G smartphone AP supply constraints. This is due to most of the larger smartphone chipmakers like Qualcomm and MediaTek have shifted their focus to better cater to 5G smartphones. Thus, Unisoc has even benefited from a rise in shipments for 4G smartphones that are still quite common in the world’s second largest handset market, India, along with other Southeast Asian regions and more.

Notably, the company is also expected to see its share for the total smartphone APs shipped for China based smartphone makers to cross 10 percent in the second half of this year. This boost in shipments is also expected to carry forward till the first half of next year, due to the ongoing 4G smartphone AP supply constraints. For those unaware, the chipmaker primarily relies on TSMC to manufacture its 4G smartphone APs.

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UNISOC, the Chinese semiconductor company, has revamped its line of 5G chipsets. Going forward, its 5G chipsets will be announced under a new line called Tanggula. The manufacturer revealed the name was adopted from the name of the source of the Yangtze River.

The new line is classified into four series – the Tanggula 6, Tanggula 7, Tanggula 8, and the Tanggula 9 series which will take on Qualcomm’s Snapdragon 800 series.

According to UNISOC, the Tanggula 6 series are entry-level chipsets, the Tanggula 7 series brings a user upgrading experience, the Tanggula 8 series brings leading performance, and the Tanggula 9 series brings cutting-edge technology.

At the moment, UNISOC has only unveiled chipsets under the Tanggula 7 series. We expect new chipsets under the other series will be unveiled later.

Tanggula 7 series

The Tanggula 7 series includes three chipsets – the UNISOC T770 (formerly known as UNISOC T7520), UNISOC T740 (formerly known as UNISOC T7510), and the UNISOC T760. Below are their specifications:

UNISOC T770	UNISOC T740	UNISOC T760
6nm EUV process	6nm EUV process	12nm process
2.5GHz 1 x Cortex-A76 + 3 x Cortex-A76 + 4 x Cortex-A55	2.2GHz 1x Cortex-A76 + 4x Cortex-A55	2.0GHz 4x Cortex-A75 + 4x Cortex-A55
Arm Mali G57 FHD+ at 120fps, QHD+ at 60fps	Arm Mali G57 FHD+ at 90fps	IMG9446 FHD+ at 60fps, QHD+ at 60fps
LPDDR4, LPDDR4X (2133 MHz) eMMC 5.1 + UFS 3.1	LPDDR4, LPDDR4X (2133 MHz) eMMC 5.1 + UFS 3.1	LPDDR4, LPDDR4x, LPDDR4y (1866MHz) eMMC 5.1, UFS 2.1
Vivimagic 6.0 Image Engine 4-core ISP architecture Up to 108MP camera	Vivimagic 6.0 Image Engine Up to 64MP quad camera	Up to 64MP
4.8 TOPS	2.4 TOPS	3.2 TOPS
NSA, SA b/g/n/11ac Bluetooth 5.0 GPS, GLONASS, Beidou, and Galileo	NSA, SA b/g/n/11ac Bluetooth 5.0 GPS, GLONASS, Beidou, and Galileo	NSA, SA b/g/n/11ac Bluetooth 5.0 GPS, GLONASS, Beidou, and Galileo

UNISOC has also announced that the UNISOC T770 will enter mass production and be launched in July 2021.

The semiconductor company also announced its plans for AR. It said it will co-develop a pair of 5G AR smart glasses with the Chinese company Hiscene (HiAR). However, it didn’t say when the smart glasses will hit the market.

RELATED:

• Motorola Moto G20 launched with UNISOC T700 SoC, IP53 rating, and 90Hz display
• “Snapdragon 888 Pro” already being tested by Chinese manufacturers, should hit the market in Q3
• MediaTek seeks to shift to advanced 4nm chipmaking process ahead of Qualcomm
• TSMC secures 5nm & 6nm orders from Qualcomm, new chips to launch in H2 2021

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It is a known fact that Qualcomm and MediaTek are the leading mobile chip companies in the world. Apart from HUAWEI HiSilicon, Apple, and Samsung, there’s also another player called UNISOC. This company’s chipsets are mostly found in entry-level smartphones sold in developing countries.

But earlier this year in February, the Chinese chipmaker UNISOC (formerly Spreadtrum) announced Tiger T7520 as the world’s first 6nm EUV 5G SoC for smartphones. Later in June, news broke out this chipset will enter mass-production in 2020 itself, and handsets powered by it will release in early 2021.

Now, months later, Zhou Chen, the Executive Vice President of UNISOC revealed in an interview (via Sina Tech) that smartphones featuring Tiger T7520 chipset will be mass-produced next year. But he did not say when and hence, we are not sure if these devices will release in the first half or second half of 2021.

Having said that, we can expect Hisense to be the first brand to use this chip. That’s because it was the first company to launch a smartphone called F50 5G with UNISOC Tiger T7510, the chipmaker’s first 5G mobile SoC.

Anyway, to know the complete specs and features of UNISOC Tiger T7520, do read our announcement coverage from nearly seven months ago.

Everything you need to know about UNISOC T7520 6nm 5G chipset

UP NEXT: MediaTek teases new 6nm premium 5G mobile processor; unveils new Chromebook chips too

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Smartphones are nothing without the chipsets powering them. This type of silicons are known as application processors (AP). According to the latest report by Counterpoint Research, the Global Application Processor Market declined 26% in Q2 2020.

As expected, Qualcomm led the market with a 29% share, closely followed by MediaTek with a 26% share. Whereas, Huawei’s HiSilicon came at third position with a 16% share while Apple and Samsung tied in fourth place with 13% share each. Lastly, Unisoc obtained the fifth position with a 4% share.

Out of the above-mentioned top players, Qualcomm, Samsung and Unisoc witnessed a decline in their market share compared to the previous year. On the other hand, MediaTek, Huawei, and Apple showed improvements.

Neil Shah, VP of Research at Counterpoint says that Qualcomm’s decline was partly because of the increased usage of HiSilicon chips by Huawei, in addition to the overall drop of the global smartphone market as a result of the pandemic. Although HiSilicon’s market share improved a lot compared to others in the second quarter, its future is uncertain as Huawei can no longer manufacture them.

EDITOR’S PICK: IDC: Global Smartphone Market will recover in 2022; 5G handsets will account for 50% in 2023

The executive also added that 5G smartphone sales more than doubled in Q2 2020 than the previous quarter. Hence, this trend will try to offset the overall decline in H1 2020 and will play an important factor for growth in 2021.

Strict US restrictions on Huawei and 5G will help Qualcomm, MediaTek and Unisoc to gain more market share.  Research Analyst Shobhit Srivastava mentioned that OPPO, realme, vivo and Xiaomi will use chipsets from the former two companies to fill the void that Huawei may leave behind.

Qualcomm could be more beneficial in the $400+ (wholesale) price segment, especially in China where Huawei currently dominates with over 40% market share. The American chipmaker could also gain share in the mid to high-end segment in Europe.

On the other hand, MediaTek will become popular with the help of its affordable 4G and 5G offerings in markets like China. Russia, and Middle East & Africa (MEA) as realme and Xiaomi will try to eat up Huawei’s share in these regions.

Last but not least, 5G will also increase the number of affordable gaming smartphones with features like high refresh rate displays powered by Qualcomm Snapdragon G and MediaTek helio G series of chips.

UP NEXT: US smartphone market sales plunged by 25% in Q2 2020, Samsung was the least affected

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Just when everyone was giving up on the tablet market, the COIV 19-induced lockdown triggered a surge in the market. Teclast has remained a decent player in the market with its affordable lineup of products. The Chinese company has just launched the Teclast M40 tablet having an impressive specs lineup.

The biggest feature on a tablet is usually the screen and the M40 doesn’t disappoint in that regard. The device packs a 10.1-inch FHD+ display with a resolution of 1920×1200 pixels and 2.5D curved glass on top. The display brings a more immersive and detailed experience to gaming and movies. Similarly, the Teclast M40 still continues the all-metal body design of the previous generation.

The tablet runs on the latest Android 10 operating system and comes with features such as gesture control, dark mode and other amazing features.

The Teclast M40 is powered by a UNISOC Tiger T618 chip which is built with a 12nm process technology and has lower power consumption. The processor is equipped with 2 ARM Cortex-A75 processors for applications that require power and 6 Cortex-A55 chips that have low power consumption but excellent performance. The processor pairs with 6GB of RAM and there is 128GB storage onboard.

Although tablets are not known for good cameras, the M40 isn’t like that. It features an 8MP sensor at the front and rear aspects. Under the hood, there is a built-in 6000mAh high-capacity battery which is enough for daily usage.

Further, the built-in five-mode GPS system can help users achieve higher-precision positioning and achieve faster azimuth guidance.

The tablet may likely be sold for 899 yuan (~$131) but Teclast is yet to announce the pricing and availability details.

UP NEXT: Xiaomi Mi 10 Ultra beats Huawei P40 Pro in Camera Performance with a DxOMark score of 130

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Chinese phone maker Coolpad today held a strategic partnership conference alongside China Telecom and UNISOC group where it officially unveiled one of the cheapest 5G phones in China. The Coolpad X10 5G brings 5G connectivity to the budget segment with a starting price tag of 1,388 yan (~$199).

The affordable 5G phone is powered by a UNISOC T7510 chipset which supports SA/NSA dual-band 5G network mode. The chipset also supports all the mainstream 5G frequency bands in China as well as full Netcom 4G. It adopts HD voice EVS over 5G NR technology, 2T4R transmission technology, Wi-Fi MIMO dual-antenna technology. The phone also supports physical fingerprint and face recognition unlock methods.

The Coolpad X10 5G is equipped with a 6.5-inch high-definition LCD waterdrop screen with a screen-to-body ratio of 93.07%. The waterdrop notch houses a 13MP selfie camera. At the rear aspect, there is 21MP main camera with an f1.8 aperture in a triple camera arrangement.  The other imaging sensors include a 5MP depth sensor and a 2MPAI lens.  The camera setup also includes a high-sensitivity color temperature flash. The phone is also equipped with an enhanced camera optimization technology which includes super night scene mode.

The X10 5G is available in two memory configurations and these include a 4GB RAM + 128GB storage combo and the top-end 6GB RAM + 128GB storage option. The 5G mobile phone will get power from a 4600mAh battery and is said to utilise a PC-level liquid cooling technology.

In addition, the machine adopts a 3D curved body made of glass and will be available in three colour options: Black, White, and Blue.

In terms of the prices and availability, the Coolpad X10 5G 4GB+128GB version is priced at 1,388 yuan(~$199) and the 6GB+128GB version is priced at 1,588 yuan (~$228). The phone will officially be on pre-sale from August 20.

UP NEXT: Xiaomi Mi 10 Ultra beats Huawei P40 Pro in Camera Performance with a DxOMark score of 130

The post Coolpad X10 5G sporting a UNISOC T7510 chip launched for ¥1,388 (~$199) appeared first on Gizmochina.

UNISOC has announced a new chipset for smartwatches. The UNISOC W307 was unveiled yesterday and it comes with a bunch of features including an integrated 4G multi-mode modem.

Built on TSMC’s 28nm HPC+ process, the UNISOC W307 is said to be based on an “ultra-low-power architecture design”. The chipmaker says the package area is 30% smaller than that of the last generation, which brings an improvement in performance, connectivity, intelligence, and power consumption.

UNISOC is excited to introduce our upgraded 4G smartwatch platform — #UNISOCW307. Based on ultra-low-power architecture design, the W307 adopts the high-precision positioning scheme and highly integrated 4G full-network, bringing users a richer intelligent experience. pic.twitter.com/ItO26LeaOe

— UNISOC (@UNISOCTech) July 14, 2020

Other features of the processor include HD video calling, sub-meter high precision positioning, and a highly-integrated 4G full-network.

There is no info on when the processor will appear in a commercial device neither is there any news of which brands have signed up for it.

UNISOC’s chipsets are used in various products from brands including Nokia, Xiaomi, Hisense, and Lava. For example, its UNISOC 8521W chipset is found in the Xiaomi Mi Kids Watch 4C that was announced last month.

UP NEXT: UNISOC’s Tiger T7520 6nm chipset to enter mass-production this year

(Source)

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Back in late February, UNISOC announced the Tiger T7520 mobile processor as the world’s first 6nm EUV processor. The 5G chipset is the successor to the Tiger T7510 that was announced last year and that powers the Hisense F50 5G.

Almost four months after the announcement, the chipset is yet to appear in any mobile device. The latest news from China says the Tiger T7520 will be mass-produced this year. The source also said the chipset should appear in devices in early 2021; practically a year after launch.

That seems like a long time for a chipset to enter the market and it remains to be seen which manufacturers will launch products powered by it.

The Tiger T7520 is an octa-core chipset with 4x Cortex-A76 cores and 4x Cortex-A55 cores. It packs a Mali-G57 GPU whose clockspeed, like that of the CPU, is unknown. UNISOC says that the built-in modem supports coverage enhancement and also supports dual-SIM dual-5G.

Other features of the processor include support for displays with a 120Hz refresh rate, 4K resolutions, and HDR10+. It also has an integrated financial-level Secure Element that provides higher security than embedded SE.

UP NEXT: Huami unveils the Huangshan 2 chip, a self-developed processor for its wearables

(Source)

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Indian smartphone manufacturer Lava is a known name in the mobile handset industry, especially in India. The brand which was founded in 2009 has a penchant for budget smartphones with decent specs offering and affordable prices. A new Lava model could be in the works dubbed Lava Z66. The model was recently spotted on the database of benchmarking outfit GeekBench.

The GeekBench listing shows the model will be powered by a UNISOC chipset which from the single-core and multi-core tests looks like a entry-level SoC. The device scores 153 on the single-core test and 809 on the multicore. This places the SoC in the same range as the Snapdragon 625 and Helio P10. This should be the first Lava phone that would feature Unisoc chipset. So, we may likely see more high-end models as time goes on.

The device is listed with 3GB of RAM and will run on Android 10 OS out of the box which is pretty impressive. There are no other details about the Z66 but we expect more details to emerge from Lava soon.

UP NEXT: Download Google Camera Ultra CVM MOD for all Android devices

(source, via)

The post Lava Z66 with a Unisoc processor, 3GB RAM & Android 10 spotted on Geekbench appeared first on Gizmochina.

As the world is seeing growth in 5G infrastructure deployment, smartphone manufacturers seems to have made 5G connectivity a standard feature on most of the new mid-range and premium smartphones.

While the market for 5G chipset for mobiles is mostly dominated by Qualcomm, MediaTek, Huawei, and Samsung, another company from China has joined the list of suppliers for 5G chipsets for the mid-range devices — UNISOC.

As per the reports, China-based chipset maker UNISOC is taking a leap into the mid-range 5G chipset market after the company provided the T7510 SoC for HiSense F50 5G smartphone in China.

EDITOR’S PICK: 5G chips capture 2% market share in 2019, Qualcomm and HiSilicon are major contributors: Report

The UNISOC T7520 is touted to be one of the world’s first chips to be made using TSMC’s 6 nm process technology using extreme ultraviolet lithography (EUVL). It packs four high-performance Arm Cortex-A76 cores, four energy-efficient Arm Cortex-A55 cores, and Arm Mali-G57 GPU.

It also comes with a new NPU that is said to offer 50 percent higher TOPS-per-Watt rate than the company’s previous-generation NPU. It features a four-core ISP that supports up to 100MP sensors and multi-camera processing capability. It also supports 5G NR TDD+FDD carrier aggregation, and is designed to offer peak uplink speed of 3.25 Gbps.

The pricing for the 5G chipsets are currently on the higher side and thus the pricing of 5G smartphones are also not as aggressive as what we’ve seen some of the companies offer on their phones. However, with more competition in the chipset market, we expect the pricing to go down soon.

Qualcomm and MediaTek are the leading suppliers for the 5G SoC in the market for mid-range devices. Huawei has also recently launched its mid-range chipset Kirin 820 with 5G support but it’ll most likely be limited to Huawei and Honor phones. Samsung doesn’t have a good presence in the Chinese market but the company has started supplying its Exynos chipset to other brands, like Vivo.

UP NEXT: Xiaomi will reportedly launch an ultra-cheap 999 Yuan (~$141) 5G smartphone by the end of this year

(Via)

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Hisense’s new best friend seems to be UNISOC. On Monday, the manufacturer announced the Hisense F50 5G phone powered by UNISOC’s Tiger T7510 5G processor. Today, the official UNISOC Twitter account has revealed Hisense has a new tablet that is also powered by their chipset.

The Hisense E22 is a 10.1-inch learning tablet with an FHD+ resolution with pretty thick bezels. The tablet is powered by the T610 octa-core chipset. Sadly, there is no mention of the RAM and storage capacity. We tried looking for more details but found nothing on Hisense’s own website or social media pages.

The new #HisenseE22 learning tablet is your kid's good partner for learning and playing.

Powered by #UNISOC's Octa-core chipset #T610, the E22 tablet is equipped with a 10.1-inch FHD display and a 32MP quad-camera. It supports dual 4G SIM, VoLTE, ViLTE, HD voice/video calls. pic.twitter.com/ufTtgJsQee

— UNISOC (@UNISOCTech) April 22, 2020

One surprising feature of the Hisense E22 is its 32MP quad-camera setup which is unusual for a tablet. Unfortunately, there is no image showing the rear of the tablet, so we do not know what the camera setup looks like.

Other features mentioned include support for dual 4G SIM, VoLTE, ViLTE, and HD video and voice calls.

We believe Hisense is yet to officially announce the tablet as there is no mention of the tablet anywhere else other than the tweets by UNISOC. Once we have more details, we will update the post.

UP NEXT: UNISOC’s Tiger T7520 5G processor is the world’s first 6nm EUV processor

(Source)

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At a press conference held today, UNISOC announced its second-gen 5G chipset. The Tiger T7520 is its latest 5G SoC for mobile devices following the launch of the Tiger T7510 last year. This is also the first 6nm processor in the world.

The T7520 is built on a 6nm EUV process and we are pretty sure it is manufactured by TSMC. The processor has 8 cores ( 4x Cortex-A76 cores + 4x Cortex-A55 cores) but the clockspeed is unknown. There is a Mali G57 GPU onboard too. The switch to a 6nm node means the processor has an 18% improvement in the density of transistors and reduces power consumption by 8%.

The Tiger T7520 has a built-in 5G modem and UNISOC says that gives it the upper hand when it comes to power consumption compared to other processors paired with a separate 5G modem.

The processor uses an in-house modem that UNISOC claims is the world’s first 5G modem to support coverage enhancement. It supports NSA and SA networks as well as 2G, 3G, and 4G. It can reach uplink speeds of up to 3.25Gbps on SA networks. The chip also supports dual-SIM dual-5G and VoNR high-resolution audio and video calls.

There is a new generation NPU inside that brings improvement in performance and energy efficiency. The press release says the NPU in the Tiger T7520 increases power efficiency by more than 50% compared to the previous generation.

The processor supports displays with refresh rates up to 120Hz, 4K resolutions, and HDR10+. It features UNISOC’s 6th generation Vivimagic solution, a second-generation Full Dynamic Range technology, a dedicated AI accelerator, and a 4-core ISP with support for resolutions up to 100MP.

UNISOC is yet to disclose which manufacturers have signed up for the processor and when we should expect it to appear in devices.

UP NEXT: Hisense F50 5G phone launches with UNISOC T7510 chipset

(Source)

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