Huawei may be experimenting with a different approach to front cameras, and it could quietly solve a few everyday annoyances in the process. According to a new tip shared by Digital Chat Station on Weibo, the company is exploring the use of a 1:1 square sensor for selfie cameras in future smartphones.
On the surface, a square sensor doesn’t sound dramatic. But the idea behind it is fairly practical. Unlike traditional rectangular sensors, a 1:1 sensor captures a more balanced image area, giving software more room to crop, reframe, or rotate shots without cutting too much out of the frame. That could be especially useful for group selfies, video calls, and social content where orientation changes often lead to awkward framing or lost detail.
The idea isn’t entirely new. Apple moved in a similar direction with the iPhone 17 series, where its updated Center Stage front camera relies on a square sensor to enable features like auto-framing, smooth orientation switching, and subject tracking during video calls. The hardware allows the software to do more without forcing users to constantly adjust how they hold the phone.
If Huawei adopts the same sensor layout, it could unlock similar benefits on the Android side: cleaner framing in both portrait and landscape, more flexibility during video recording, and fewer compromises when switching formats. This would matter most for users who rely heavily on the front camera for calls, vlogging, or social media. There’s no confirmation yet on resolution, timing, or which phones might get the feature first.
For now, this remains an idea under evaluation, not a locked-in product feature. Still, it highlights how front cameras are becoming a real area of hardware innovation again. If Huawei moves forward, the square sensor could quietly become one of those changes users appreciate every day.
Casio has announced a special edition Edifice watch to commemorate the 60th anniversary of Honda’s first Formula 1 victory. The new model, ECB-2300HR-1AJR, celebrates the historic 1965 Mexican Grand Prix win with a design that draws heavily from the RA272 racecar that secured Honda’s first F1 checkered flag.
Pricing and Availability
The watch is listed on Casio’s official Japanese store with a price tag of ¥66,000 including tax, which converts to approximately $424. It is scheduled for a March 2026 release in Japan. Casio has not confirmed pricing for the European market, but the watch is expected to launch in the region soon.
Design Details
The Edifice design team collaborated with Honda to infuse the watch with elements inspired by the iconic RA272. The bezel features the same Championship White paint used on the original Formula 1 car, while a red ring on the dial echoes the Hinomaru flag design found on its body. The 60-minute marker carries a gold-engraved “60,” symbolizing precision and heritage.
The leather strap features laser-etched engine blueprints from Honda’s 1.5-liter V12 engine, which powered the RA272 to victory. The band loop includes the Latin phrase Veni, Vidi, Vici, referencing a message from Honda’s team leader Yoshio Nakamura. The 9 o’clock sub-dial recreates the original car’s tachometer with detailed scale markings and a redline.
Casio uses a hybrid construction for this model, combining carbon-reinforced resin and stainless steel. The watch includes a sapphire crystal with anti-reflective coating and offers 100-meter water resistance. It supports Casio’s Tough Solar charging and connects to smartphones via Bluetooth for time synchronization, world time, alarms, and phone finder functionality.
The case back displays Honda’s official 60th anniversary logo, and the watch comes in commemorative packaging.
Acemagic has launched the Retro X3 mini PC, a compact desktop powered by the AMD Ryzen 7 H 255. It retains the Nintendo Famicom-inspired retro design of the earlier Retro X5 while adopting a more affordable configuration, and is now available on JD.com priced at 1,899 yuan ($273).
Acemagic Retro X3 Specifications
The Retro X3 comes in a compact square body measuring 128.2 x 128.2 x 44 mm and weighing 406 grams. It features a red, black, and grey color scheme with a sandblasted metal finish, a red toggle-style power button on the front, and a tool-free side panel that makes memory and storage upgrades quick and hassle-free.
Inside, the Retro X3 is powered by an AMD Ryzen 7 H 255 processor built on the 4nm Zen 4 architecture. It offers 8 cores and 16 threads with a maximum boost clock of 4.9GHz and includes 16MB of L3 cache. The chip integrates Radeon 780M graphics based on the RDNA 3 architecture with 12 compute units and a GPU frequency of up to 2.6 GHz.
The system supports up to 128GB of DDR5-5600 memory through two SO-DIMM slots. For storage, it includes two M.2 2280 NVMe SSD slots using PCIe 4.0 x4, with a maximum capacity of 4TB. The device does not support SATA SSDs.
For connectivity, the mini PC includes Wi-Fi 6, Bluetooth 5.2, and a 2.5GbE Ethernet port. It supports up to three external displays via HDMI 2.1, DisplayPort 2.0, and a USB4 Type-C port that also supports 40 Gbps data transfer.
The front panel includes two USB-A 10Gbps ports, a USB4 port, and a 3.5 mm audio jack. The rear offers four USB-A 5Gbps ports, a 2.5GbE LAN port, HDMI, DisplayPort, a DC power input, and a Kensington lock slot.
The system ships with Windows 11 Pro. It uses the brand’s latest Cooling System 3.0, which combines a large fan, dual copper heat pipes, and three-sided airflow to maintain stable thermals during extended workloads.
In related news, Minix has recently introduced the Neo Z95, a pocket-sized mini PC that is smaller than most smartphones, while Gmktec has launched the NucBox K13 featuring an Intel Core Ultra 7 256V processor, 115 TOPS of AI performance, and USB4 connectivity.
For more daily updates, please visit our News Section.
The Dimensity 9400 is a true flagship chipset from MediaTek, featuring an all-big-core CPU design that aims to deliver high peak and sustained performance. It’s powerful enough to rival Qualcomm’s Snapdragon 8 Elite, even if it trails in a few areas, as noted in our detailed comparison. That makes the Snapdragon 8 Gen 5 an interesting opponent.
Announced in November 2025, the Snapdragon 8 Gen 5 sits just below the Snapdragon 8 Elite and therefore is an exciting matchup against the Dimensity 9400. The big question is: can Qualcomm’s sub-Elite flagship hold its ground against MediaTek’s all-big-core powerhouse?
Let’s begin with the spec sheet:
Dimensity 9400
Snapdragon 8 Gen 5
Announced
October 2024
November 2025
Process node
TSMC’s 3nm (N3E)
TSMC’s 3nm (N3P)
CPU
1 x 3.62GHz — Cortex-X925 3 x 3.3GHz — Cortex-X4 4 x 2.4GHz — Cortex-A720
2 x 3.8GHz — Oryon (3rd gen) 6 x 3.32GHz — Oryon (3rd gen)
GPU
Mali-G925 Immortalis MP12 Ray tracing support MediaTek HyperEngine Gaming Technology
Adreno 840 ray tracing support Snapdragon Elite Gaming features
NPU
MediaTek NPU 890 Agentic AI support
Qualcomm Hexagon NPU Agentic AI support
Memory
LPDDR5x, up to 5.3GHz
LPDDR5x, up to 4.8 GHz
Storage
UFS 4.0 + MCQ
UFS 4.1
Camera
MediaTek Imagiq 1090 ISP up to 320MP single camera up to 8K/60fps video recording supports real-time semantic segmentation
Qualcomm Spectra triple AI ISP (20-bit) up to 320MP single camera up to 108MP single camera with zero shutter lag, 30fps up to 48MP triple cameras with zero shutter lag, 30fps real-time semantic segmentation (limitless) up to 4K/120fps video recording
Dimensity 9400 vs Snapdragon 8 Gen 5: Benchmark score
Note: The benchmark tests were performed on the Vivo X200 Pro (powered by Dimensity 9400) and the OnePlus 15R (powered by Snapdragon 8 Gen 5).
Geekbench score
The single-core scores are pretty close, but Qualcomm holds a slight 4.5% lead. The gap widens in multi-core performance, where the Snapdragon 8 Gen 5 posts a 9% higher score than the Dimensity 9400.
Geekbench scores suggest higher peak performance for the Snapdragon 8 Gen 5. In everyday tasks like browsing the internet, scrolling through your social app feeds, and watching movies, you’d hardly be able to spot a difference.
Dimensity 9400
Snapdragon 8 Gen 5
Single core
2,713
2,837
Multi core
8,592
9,352
AnTuTu score
On the AnTuTu benchmark, the Snapdragon 8 Gen 5 scores nearly 3 million, while the Dimensity 9400 reaches 2.7 million. That’s about a 9% higher score for the Snapdragon chip.
The Snapdragon 8 Gen 5 consistently outperforms the Dimensity 9400 across every AnTuTu test, though the difference is not significant. The CPU score is 7% higher, and the GPU score is 5% higher. The memory and UX scores also favor the Snapdragon chip.
Dimensity 9400
Snapdragon 8 Gen 5
AnTuTu score
2,713,650
2,961,236
CPU
853,995
914,878
GPU
927,892
974,402
Memory
355,391
382,729
UX
576,372
689,228
The benchmarks favor Snapdragon 8 Gen 5 over the Dimensity 9400 in terms of performance, but they don’t provide insights into the capabilities of connectivity, camera, and other important aspects of the chips. So, let’s dig further to uncover the real-world differences between the two high-end chips.
Dimensity 9400 vs Snapdragon 8 Gen 5: Key differences
Both Dimensity 9400 and Snapdragon 8 Gen 5 are manufactured using TSMC’s 3nm process, but the latter uses the N3P node, which offers slightly better performance and power efficiency over the N3E node used for the Dimensity 9400.
Furthermore, the chips differ greatly in terms of CPU architecture. The Dimensity 9400 has a 1+3+4 layout, featuring one Cortex-X925 prime core, three Cortex-X4 performance cores, and four Cortex-A720 performance cores. In contrast, the Snapdragon 8 Gen 5 features a 2+6 CPU layout with two Oryon prime cores and six Oryon performance cores.
Notably, the Snapdragon 8 Gen 5 features third-generation Oryon cores, the same CPU cores from the top-tier Snapdragon 8 Elite Gen 5 chipset. They offer better performance and power efficiency than those inside the Dimensity 9400. Plus, they run at higher speeds, offering an additional performance boost.
For graphics rendering, the Dimensity 9400 relies on the Mali-G925 Immortalis MP12 GPU, while the Snapdragon chip uses the Adreno 829 GPU with the new Sliced architecture. Both chips offer ray tracing capabilities, along with their own set of gaming features: Snapdragon Elite Gaming on the Snapdragon 8 Gen 5 and MediaTek HyperEngine Gaming Technology on the Dimensity 9400.
The Snapdragon 8 Gen 5 also maintains an edge in imaging capabilities, as it borrows the triple 20-bit ISP from the Snapdragon 8 Elite Gen 5 with strong “always-sensing” camera support. The Dimensity 9400 features an Imagiq 1090 ISP with emphasis on HDR video across the zoom range and AI-assisted zoom features.
Both chipsets offer robust connectivity features, although the Snapdragon chip may have some advantage here, thanks to mature modem and better carrier-integration in some regions. Furthermore, the chip supports mmWave, UWB, and dual-way satellite connectivity, which are not mentioned on the official Dimensity 9400 page.
Dimensity 9400 vs Snapdragon 8 Gen 5: Conclusion
The Snapdragon 8 Gen 5 holds an upper hand in almost every aspect over the Dimensity 9400. It offers better CPU and GPU performance, a more powerful ISP with greater capabilities, and advanced connectivity features.
That said, the Dimensity 9400 is still a capable high-end chipset with strong performance and robust connectivity. Plus, you’ll likely get a device powered by this chip at a lower price than one powered by Snapdragon 8 Gen 5. That makes it a sweet deal for those looking for a high-performance device at an affordable price. For the absolute best of the two, the Snapdragon 8 Gen 5 is clearly the better choice.
Xiaomi has started the global rollout of its Gaming Monitor G27i 2026, a new 27-inch display aimed at gamers. It follows the recent release of the Mini LED Gaming Monitor G Pro 27Qi 2026 and focuses on high refresh rates, fast response times, and accurate colors at a lower price point.
The G27i 2026 uses a 27-inch Fast IPS LCD panel with a Full HD resolution of 1920 × 1080 pixels and a 16:9 aspect ratio. It supports a 200Hz refresh rate in supported modes, along with a 1ms GTG response time when set to the Ultrafast option. Xiaomi states this combination helps reduce ghosting and motion blur in fast-moving scenes. In the official specification sheet, the panel refresh rate is listed at up to 165Hz, which suggests that 200Hz may depend on specific settings or inputs.
The panel offers wide 178-degree viewing angles and a typical brightness level of 250 nits. Peak brightness reaches up to 400 nits, allowing the monitor to meet VESA DisplayHDR 400 certification. This improves contrast between bright and dark areas, helping details remain visible during gameplay. The static contrast ratio is rated at 1000:1.
Color performance is a key focus, as the monitor comes with factory calibration to achieve Delta E values below 2. The monitor supports 100 percent sRGB and 95 percent DCI-P3 color gamut coverage, along with 8-bit color depth capable of displaying 16.7 million colors. This makes it suitable for gaming, video playback, and general content creation.
The G27i 2026 supports FreeSync Premium and is also listed as G-Sync compatible. This helps reduce screen tearing and stuttering when frame rates fluctuate. Eye comfort features include TÜV Low Blue Light certification and DC dimming to reduce flicker during long sessions.
The monitor features an ultra-narrow bezel design and a tilt-adjustable stand with a range of minus 5 degrees to plus 15 degrees. It also supports 75 × 75 mm wall mounting. Physical controls are handled through a joystick button. Connectivity includes one DisplayPort 1.4, one HDMI 2.0 port, a 3.5 mm audio jack, and a DC input. The monitor consumes up to 36W of power and weighs 3.6 kg with the stand.
Pricing & availability
The Gaming Monitor G27i 2026 is priced at SGD 199 (~$157) in Singapore.
8849 TANK X enters the rugged smartphone segment with a feature set unlike anything currently on the market. Designed for industrial users, outdoor professionals, and extreme-condition environments, it combines a high-lumen DLP projector, ultra-large battery, and advanced connectivity inside a reinforced 5G chassis. This is not a generic lifestyle phone but a strong, purpose-built hardware.
Industrial-Grade Design and Durability
The TANK X uses a half-board, double-sided internal layout to accommodate its projector, dual-cell battery, and thermal controls. With IP68 and IP69K certification, the device is resistant to water immersion, dust ingress, and high-pressure wash environments. Its reinforced construction targets field engineers, emergency responders, and expedition users who require reliability over portability.
Display Optimized for Field Visibility
The device features a 6.78-inch FHD+ LCD panel with a 120Hz adaptive refresh rate and peak brightness of 750 nits. The PWM-free backlight design reduces eye strain during extended usage, making it suitable for long shifts, navigation tasks, and outdoor operations under direct sunlight.
Integrated 1080p DLP Projector System
The standout feature is the built-in DLP projector, capable of projecting content at up to 1920×1080 resolution with 220 lumens brightness. Laser auto-focus, ±40° keystone correction, and one-key activation allow quick deployment. The projector supports multiple power modes, delivering up to six hours of use, making it viable for field briefings, training, or outdoor entertainment without additional equipment.
Performance and Storage
Powered by the MediaTek Dimensity 8200 (4nm) chipset, the TANK X delivers flagship-level efficiency with strong sustained performance. Paired with 16GB LPDDR5 RAM, up to 16GB virtual memory, and 512GB UFS 3.1 storage, it supports heavy multitasking, AI applications, and large offline datasets. Storage expansion up to 2TB via microSD further enhances its utility for professional workflows.
Advanced Imaging and Night Vision
The camera system is tuned for both documentation and surveillance. A 50MP Sony IMX766 main sensor handles standard imaging, while a 64MP infrared night vision camera with quad IR LEDs enables visibility in complete darkness. A 3× optical telephoto lens adds flexibility for inspection and distance capture.
Extreme Battery Capacity and Charging
A defining advantage is the 17,600mAh dual-cell battery, engineered for multi-day endurance. Despite the capacity, 120W wired fast charging delivers a full charge in approximately 70 minutes. Reverse wired charging allows the device to function as a portable power source in the field.
Connectivity, Tools, and Emergency Systems
The TANK X supports global 5G bands, Wi-Fi 6, Bluetooth 5.4, dual-band GNSS with meter-level accuracy, NFC, IR remote control, and a comprehensive digital toolbox. High-output camping lights, emergency RGB warning lights, programmable PTT keys, and SOS features position it as a multifunctional operational device.
Pricing and Availability
8849 Tank X is now available for an early bird price of $549.99, significantly reduced from its regular price of $1049.99. Pre-orders are live, with global shipping beginning March 1 from multiple international warehouses. The 8849 TANK X sets a new benchmark for rugged smartphones by merging projection, power, and durability into a single professional-grade platform.
Several reports recently claimed that MediaTek may skip launching the Dimensity 9500 Plus, an overclocked version of the Dimensity 9500. However, a fresh leak shared by tipster Digital Chat Station suggests that the chip has not been completely shelved and could power a next-generation flagship arriving in the second half of the year. This development has now been linked to Oppo’s upcoming Find X10 series.
Oppo Find X10 series chipset details tipped
Oppo Find X10 series chip seemingly tipped by DCS
According to information shared by Digital Chat Station, an upcoming flagship lineup having standard, Pro, and Pro Max models are currently being tested with different MediaTek processors across its variants. The tipster has previously indicated that the Find X10 range may include three models, namely the Find X10, Find X10 Pro, and Find X10 Pro Max. Therefore, the tipster could be talking about the X10 family in the latest leak.
The standard Find X10 is said to be evaluated with the Dimensity 9500 Plus, which is reportedly built on a 3nm process. Meanwhile, the Pro and Pro Max models are expected to move to a more advanced 2nm Dimensity 9600-series chipset. If accurate, this approach would allow Oppo to clearly differentiate performance tiers within the same flagship family, rather than relying solely on camera or display upgrades.
Early rumors suggest that the Find X10 series could be unveiled in China around October. Oppo is also expected to follow up with a Find X10 Ultra model a few months later, which may switch to a Snapdragon 8 Elite Gen 6 Pro chipset, continuing the brand’s trend of reserving Snapdragon silicon for its top-tier Ultra devices.
For now, Oppo’s immediate focus appears to be on earlier launches. Reports indicate that the Find X9 Ultra, Find X9s Pro, and the Find N6 foldable could debut in China in March. While the X9 Ultra and Find N6 are tipped to run on the Snapdragon 8 Elite Gen 5 chip, the Find X9s Pro may rely on the Dimensity 9500. More clarity on Oppo’s flagship roadmap should emerge as these launches draw closer.
For more daily updates, please visit our News Section.
Vivo introduced the X300 series globally in October, with the vanilla and Pro models. The company is currently working on the X300 Ultra as its next big reveal—China first, of course. A new report now suggests that Vivo is also cooking another member of the lineup, called the X300e.
Vivo X300e and X Fold 6 make it to IMEI
The smartphone has appeared on the GSMA IMEI database with the Vivo X300e moniker. Vivo has not used the “e” suffix in the X series so far. Instead, the company introduced the X200 FE last year and the X200T more recently. That said, we expect the X300e to be an affordable flagship option like the X200 FE and X200T.
Also appearing in the IMEI database is the Vivo X Fold 6 foldable. Much like the X300 Ultra, the Fold 6 is expected to launch in China first, followed by a wider global release.
The listings do not reveal any hardware details for either device, but they do confirm that development is underway.
As mentioned earlier, details on both phones remain scarce. However, a leak from November suggests that the Fold 6 will be powered by the Snapdragon 8 Gen 5 chipset.
The Fold 6 is also expected to feature a 200MP camera and a side-mounted fingerprint scanner.
For context, the current Vivo X Fold 5 already offers a high-end setup, including a large 8.03-inch LTPO AMOLED foldable display with a 120Hz refresh rate, Zeiss-tuned triple cameras, and a 6,000mAh battery with support for both wired and wireless fast charging.
For now, Vivo is staying quiet. Still, with both the X300e and X Fold 6 appearing in official databases, it’s clear the company is preparing to expand its flagship and foldable lineup in the coming months.
Apple’s first foldable iPhone is still some distance away, but new leaks suggest battery life could be one of its main selling points. According to a new leak, Apple may be planning its largest battery ever for the foldable model.
Weibo leaker Fixed Focus Digital claims Apple’s foldable iPhone could ship with a battery exceeding 5,500mAh, which would already put it ahead of every iPhone currently on the market. For reference, the iPhone 17 Pro Max tops out at 5,088mAh, making this a meaningful jump rather than a minor increase.
This isn’t the first time similar numbers have surfaced. Earlier leaks from yeux1122 suggested Apple was testing battery capacities in the 5,400–5,800mAh range, alongside efforts to slim down internal components and improve power efficiency. Analyst Ming-Chi Kuo has also pointed to Apple using higher-density battery cells, likely to balance size, weight, and longevity.
If the numbers are accurate, Apple’s foldable would be competitive even by foldable standards. Recent devices like the Huawei Mate X7, Oppo Find N5, and Honor Magic V series all sit in roughly the same battery range, while Samsung’s Galaxy Z Fold lineup continues to lag behind in capacity.
iPhone Fold: 5,500mAh (rumored) Huawei Mate X7: 5,600 mAh (or 5,525 mAh in some variants) Honor Magic V5: 5,820 mAh (international) or 6,100 mAh (China model) Xiaomi Mix Fold 4: 5,100 mAh Oppo Find N5: 5,600 mAh Vivo X Fold5: 6,000 mAh
While the leak focuses on battery capacity rather than real-world battery life, Apple’s track record suggests the numbers could translate well in practice. iPhones often deliver longer endurance than Android devices with significantly larger batteries, largely due to Apple’s tight hardware-software integration. If Apple’s foldable launches with a battery similar in size to Chinese rivals — and notably larger than Samsung’s Galaxy Z Fold lineup — it could realistically offer stronger battery life than many competing foldables.
The foldable iPhone is rumored to feature a 7.8-inch inner display, a 5.5-inch outer screen, Touch ID integrated into the side button, a dual-camera setup, and Apple’s upcoming A20 chip with a custom modem. A launch alongside the iPhone 18 Pro series in 2026 is currently expected.
The Samsung Galaxy S26 has, for the first time, been spotted on Geekbench. The model that has appeared on the benchmarking platform is the South Korean edition bearing the model number SM-S942N. Here’s a look at the details that have emerged through the Galaxy S26’s Geekbench listing.
The Geekbench listing reveals that the Samsung Galaxy S26 heading to South Korea may feature the Exynos 2600. While the chipset’s name is not explicitly mentioned, it can be identified through its part number, S59965.
The benchmark listing further reveals that the Galaxy S26 has 12GB of RAM and runs Android 16, which is likely to feature the One UI 8.5 skin.
Coming back to the chip, the Exynos 2600 is the world’s first 2nm chip with a 10-core CPU architecture, equipped with a prime core operating at 3.8GHz and an Xclipse 960 GPU. The device has scored around 3,000 to 3,300 in the single-core test and 10,450 to 11,370 in the multi-core test.
As far as other specifications are concerned, the Galaxy S26 is expected to feature a 6.32-inch AMOLED FHD+ display with a 120Hz refresh rate and 2,600 nits of peak brightness. Its rear camera setup may comprise a 50-megapixel main camera with OIS, a 12-megapixel ultra-wide lens, and a 10-megapixel telephoto camera with 3x optical zoom. It may feature a 12-megapixel front camera and pack a 4,300mAh battery with 25W charging.
The Galaxy S26 series includes multiple models, such as the S26, S26+, and S26 Ultra. It appears that the base and Plus models may come in Exynos or Snapdragon versions, depending on the region. On the other hand, there is a possibility that the Ultra edition may ship with the Snapdragon chip in all markets.
For more daily updates, please visit our News Section.
Samsung is just a few weeks away from hosting the first Galaxy Unpacked event of 2026. At the event, the company will announce new Galaxy S26 phones, including the vanilla, Plus, and Ultra models.
After that, Samsung typically waits until late Q3 to unveil its other flagship products. However, early signs of what’s coming next are already surfacing on the web.
Samsung Galaxy Tab S12 series and Watch Ultra 2 confirmed by this global certification
According to Smartprix, the Samsung Galaxy Tab S12 Ultra and Galaxy Tab S12+ have appeared in the GSMA IMEI database months ahead of launch.
The models are listed as SM-X946B for the Galaxy Tab S12 Ultra and SM-X846B for the Galaxy Tab S12+. Notably, the database makes no reference to a standard Galaxy Tab S12.
The Galaxy Tab S11 series skipped the Plus model in favor of the Tab S11 and S11 Ultra combo. It’s possible that Samsung is once again tweaking its naming strategy this year by launching only the Plus and Ultra variants. That said, the regular Tab S12 could still show up in the IMEI database at a later date.
Samsung Galaxy Watch 2 Ultra and Watch 9 also make it to the certification
Tablets aren’t the only Samsung products appearing early. The GSMA database has also added entries for two new smartwatches: the Galaxy Watch 9 with model number SM-L345U, and the Galaxy Watch Ultra 2, listed as SM-L716U.
As usual, IMEI listings don’t reveal specifications or features; however, they do confirm that Samsung’s next-generation products are already moving through the early stages of launch preparation.
If the brand sticks to its usual release patterns, these listings offer a meaningful clue about timing. Historically, there’s often a six- to seven-month gap between a device appearing in the IMEI database and its official announcement.
Based on that timeline, the Galaxy Tab S12 series—along with the Galaxy Watch 9 and Watch Ultra 2—are likely candidates for Samsung’s second Galaxy Unpacked event, which typically takes place in August or September.
For more daily updates, please visit our News Section.
Xiaomi’s HyperOS 3 rollout began in October 2025 and has been gradually expanding to a long list of eligible devices. The update is now available on dozens of its devices, and only a few models are pending the HyperOS 3 upgrade. It appears Xiaomi won’t take long to wrap it up, as it has already begun the rollout for the last batch of eligible devices.
Here’s a list of Xiaomi, Redmi, and POCO devices that are still waiting for the HyperOS 3 update, as shared by Xiaomi Time:
Xiaomi 13T
Redmi Note 15 Pro 4G
Redmi 14R
Redmi 15 (LTE & 5G)
Redmi 15C (LTE & 5G)
Redmi A4
POCO C85 (LTE & 4G)
POCO C75 5G
POCO M7 5G
POCO M7 Plus
Redmi Pad Pro
POCO Pad
While some of these devices may have started receiving beta builds in select regions, the stable release has yet to appear. However, we expect the rollout to be completed by the end of February, as the HyperOS 3.1 release is also around the corner.
Xiaomi has already completed the first batch of the HyperOS 3.1 beta release and has recently opened the second batch. So, the development is happening at a rapid pace, and therefore, we’re expecting the stable rollout to begin as soon as next month. Check the list of Xiaomi devices receiving the latest beta update here.
To stay updated with the latest news about HyperOS, visit the Xiaomi section regularly. Or, you can join us on Telegram to get instant notifications about the latest HyperOS updates, along with the biggest tech headlines.
Vivo is gearing up to launch the Vivo X300 Max and Vivo X300 Ultra flagship smartphones in China. These devices are expected to debut in March this year, with a global launch likely around the second quarter.
At the same time, the rumor mill has already shifted focus to Vivo’s next-generation flagship lineup, namely the Vivo X500 and Vivo X500 Pro. Reports suggest the brand may skip the X400 naming altogether, with the X500 series expected to arrive around September or October this year. Interestingly, leaks have also started surfacing about an Ultra variant in the X500 lineup.
Vivo X500 Ultra launch accelerated
According to tipster Smart Pikachu, the Vivo X500 Ultra could launch earlier than initially expected. However, the tipster has not shared any details regarding the device’s specifications, design, or camera hardware so far.
Recent reports have revealed that Qualcomm will announce its next-generation Snapdragon 8 Elite Gen 6 chipset, along with a Gen 6 Pro variant, later this year. If that happens, it is likely that Ultra-branded flagships from major Chinese smartphone brands, including the Vivo X500 Ultra, could be powered by the Snapdragon 8 Elite Gen 6 Pro platform, positioning them as true next-generation performance flagships.
Xiaomi surprised the tech world by launching the Xiaomi 17 Ultra in December 2025. So, there is a possibility that the Xiaomi 18 Ultra may launch by the end of this year. It won’t be surprising if Vivo decides to unveil the X500 Ultra by the end of this year or by January 2027.
At the same time, Smart Pikachu has also shared fresh insights about the Vivo X300 Ultra. The device is said to be one of the heaviest Ultra flagships yet, indicating a hardware-heavy build. It is tipped to debut in March with dual 200-megapixel cameras, a new-generation Zeiss lens coating, and a redesigned zoom lens system. The leak further suggests strong night photography performance, reinforcing its positioning as a top-tier imaging-focused smartphone.
The Vivo X300 Ultra’s March launch event will also see the arrival of the Vivo X300 Max and the company’s first action camera, the details of which are scarce. The X300 Max is said to have a 6.78-inch OLED 1.5K display, a Dimensity 9500 chip, a 7,000mAh battery, and a 200-megapixel triple camera unit.
For more daily updates, please visit our News Section.
Casio has quietly expanded its Edifice lineup with two new analog watches, called the Edifice EFB-109D-5AV and EFB-109D-3AV. Even though they’re part of the company’s motosport-inspired line, the new EFB-109D watches lean more toward everyday wear than outright motorsport theatrics.
As a result, these watches stand out less for complications and more for proportion. The EFB-109D series uses a compact stainless-steel case measuring 43.5 × 38.5 × 9.2 mm, with a noticeably slimmer profile than many modern sports watches.
Both models feature a gradated dial design, a simple three-hand analog layout, applied hour markers, and a clean overall look that nods to 1970s sports watches. The bezel is mirror-finished, while the case itself uses a hairline finish, giving the watch a mix of polish and restraint.
Under the hood, you don’t get anything flashy, and that’s very much the point. The EFB-109D runs on a quartz movement (Module 5340) powered by an SR920SW battery.
It is rated for around three years of use with an accuracy of ±20 seconds per month. Casio has also included a scratch-resistant sapphire crystal and a screw-lock case back, features that are often skipped in more affordable models.
The solid stainless-steel bracelet uses a one-touch three-fold clasp and supports wrist sizes from 150 to 205 mm. Water resistance is rated at 100 meters, which covers everyday use and surface swimming without issue.
While these new Edifice models skip the chronograph and tachymeter elements found in other Edifice watches, they focus instead on simplicity, slimness, and materials.
The company has not announced pricing and availability details yet.
For more daily updates, please visit our News Section.
A new leak suggests that Redmi is preparing a performance-focused flagship that could significantly raise the bar for gaming-centric smartphones. Early details point to the Redmi K90 Ultra, with emphasis on sustained performance, battery life, and display upgrades, hinting at a notable shift in Redmi’s flagship strategy this year.
Redmi K90 Ultra key details tipped
According to information shared by tipster Digital Chat Station, the Redmi K90 Ultra is expected to be powered by the Dimensity 9500 chipset. Previous iterations of K-series Ultra phones have featured “Plus” versions of Dimensity 9-series chipsets, such as the Dimensity 9400+, Dimensity 9300+, and Dimensity 9200+. Recent reports reveal that this time MediaTek has no plans to launch the Dimensity 9500+, which was expected to be an overclocked version of the existing Dimensity 9500.
What makes the Redmi K90 Ultra stand out is the reported inclusion of an internal cooling fan. This would make it the first Xiaomi group smartphone to feature active cooling, aimed at maintaining stable performance during extended gaming sessions. The cooling system is expected to allow the chipset to run closer to its peak capabilities without thermal throttling.
The Redmi K90 Ultra is tipped to pack an 8,500mAh battery, with internal testing reportedly ongoing to push the capacity even higher. Fast charging support is said to reach 100W via wired charging, with possible compatibility with high-power PPS standards.
The display is expected to be a large flat panel measuring around 6.8 inches, offering 1.5K resolution and a refresh rate that could go as high as 165Hz. With more games now supporting higher refresh rates, this setup should deliver a smoother experience. Other anticipated features include a metal frame, an ultrasonic in-display fingerprint sensor, and full water resistance.
The Redmi K90 Ultra may launch in May or June this year. The brand is also expected to unveil the Redmi K Pad 2, a performance-focused tablet, alongside it.
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After the upcoming Chinese Spring Festival, Vivo and Oppo are expected to announce new flagship phones. In the latest leak, tipster Digital Chat Station has revealed the model numbers of the upcoming Vivo flagships, which have reportedly received China’s SRRC (State Radio Regulation Commission) network access certification, confirming radio transmission approvals and support for the N79 frequency band.
Vivo X300 series’ model numbers emerge
According to DCS, the model numbers Vivo V2547A, V2547DA, and V2548A belong to the upcoming X300 series. It appears that the V2547A is associated with the Vivo X300 Ultra, while the V2547DA is its Beidou satellite communication version. The leak suggests that the V2548A belongs to the Vivo X300 Max. This is the first time this moniker has surfaced, and it appears to be the same device that was being referred to as the Vivo X300s in recent reports.
Vivo X300 Max: What to expect?
A recent leak by the same source revealed that the Vivo X300 Max will have a 6.78-inch OLED 1.5K flat display surrounded by ultra-thin bezels. For security, it will feature an ultrasonic in-display fingerprint sensor.
On the back, it will have a circular camera module housing a 200-megapixel main camera, an ultra-wide lens, and a mid-tier periscope telephoto camera. Under the hood, it may feature the existing Dimensity 9500, as the rumoured Plus variant of the chip has reportedly been cancelled. This device is also rumoured to pack a huge 7,000mAh battery.
Apart from leaking details about the upcoming X300 series, the tipster also claimed that the PME110 model number belongs to the Find X9s Pro (previously known as Find X9s). The Find X9 Ultra’s model number is not known yet.
All the above devices are expected to break cover in March in China. Except for the X300 Max, all of them are also rumoured to hit the global market around the second quarter of the year.
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The smartphone market is facing mounting instability in early 2026, driven by a sharp and sustained surge in memory chip prices. According to popular tipster Digital Chat Station, the impact is already rippling across product segments, with mid-range phones on the verge of being pulled from shelves and next-gen flagships entering development limbo.
The strain isn’t limited to increased bill of materials (BOM) costs. It is disrupting brand roadmaps and forcing internal teams to rethink launch schedules. Even Apple has reportedly felt the pressure, as suppliers like Samsung and SK Hynix have raised LPDDR memory prices by up to 100%. Some value-segment devices released in late 2025 may be phased out earlier than planned, while their successors have been pushed to mid-2026 or later. When they do eventually launch, many are expected to carry higher price tags.
Digital Chat Station also says that some internal product teams now view new smartphone launches as high-risk financial liabilities. In response, several brands have already paused development of their next-generation flagship phones. There is growing concern that brands may exit certain regional markets entirely to stem losses.
In a related post from late January, the same source pointed to the mid-range segment, especially the 2,000 to 2,500 yuan tier ($275-$345), as the most vulnerable. The pressure is evident: early Snapdragon 8 Elite phones have quietly dropped launch discounts, the price difference between 512GB and 256GB models has widened to over 400 yuan ($58), and 1TB variants are practically disappearing. Some phones are slashing production volumes just weeks after launch, while others aren’t making it out of prototype stages.
As pricing volatility collides with thinning margins, it’s clear that 2026 might be less about product innovation and more about survival. What used to be a battle of specs could quickly turn into a test of who can stay afloat, and which phone brands are still standing when the dust settles.
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Ffalcon, a sub-brand under TCL, has launched the Thunderbird Q7A Pro gaming monitor in China. The new 27-inch display is listed on JD.com with a retail price of 2,299 yuan ($330) and an introductory launch price of 1,999 yuan ($288).
Thunderbird Q7A Pro Specifications
The Q7A Pro uses a 27-inch Fast IPS panel from CSOT with a 2560 x 1440 resolution and a 320Hz refresh rate, targeting competitive and esports gaming. It relies on a QD-Mini LED backlight with 1,196 local dimming zones to boost contrast and limit haloing, while peak brightness reaches 1,200 nits with VESA DisplayHDR 1000 certification.
The display supports quantum dot color enhancement, covering 99% of both the DCI-P3 and sRGB color spaces. Ffalcon rates its color accuracy at ΔE < 2, and the panel supports 10-bit color through 8-bit + FRC processing.
The panel delivers a 1ms GTG response time, offers multiple overdrive modes for motion tuning, includes an MPRT-Plus mode for clearer fast scenes, and supports FreeSync Premium and G-Sync Compatible to reduce tearing and stutter.
For connectivity, the monitor includes two HDMI 2.1 ports and one DisplayPort 1.4 port, all supporting full 2K 320Hz bandwidth. It also includes a headphone jack and offers picture-in-picture (PIP) and picture-by-picture (PBP) modes for multitasking with multiple input sources.
The monitor features a hexagonal base with an ergonomic stand offering 125 mm height adjustment, tilt, swivel, and pivot, supports VESA 100 x 100 mounting, uses full-range DC dimming with a low blue light mode, draws 65W of power, and comes with a three-year replacement warranty.
Lenovo has officially revealed the Legion Y700 (2026) by rolling out its first teaser. The image gives a first look at the company’s upcoming performance-focused compact tablet. At the same time, tipster Digital Chat Station has leaked the key specifications and launch timeframe of the device.
The Lenovo Legion Y700 (2026) teaser images show that it will be available in white and black colour variants. The overall design is similar to the previous generation, but a new addition is the RGB ring light below the rear camera unit. The company is yet to share any technical details of the device.
According to tipster Digital Chat Station, the Legion Y700 (2026) will be the first compact tablet to come equipped with the Snapdragon 8 Elite Gen 5 chipset this year. Like the Legion Y700 (2025), the new device will feature an 8.8-inch LCD panel delivering a 3K resolution and a 165Hz refresh rate.
The Legion Y700 (2026) will have a 50-megapixel camera on the back. It is said to pack a massive 9,000mAh+ battery, but there is no information about its fast charging capabilities. A previous leak revealed that the screen will offer a 16:10 aspect ratio and the device will pack a vapour chamber cooling unit with a large heat dissipation area.
DCS further revealed that the Legion Y700 (Gen 5) will be announced in March in China. The previous generation was China-exclusive, so there is no clarity on whether the fifth-generation variant will debut globally.
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The Oppo Find X10 series has begun making early appearances in the rumour mill, months ahead of its expected launch. While Oppo is preparing to introduce new Find X9 models in the near term, fresh leaks suggest that the next-generation Find X10 lineup could bring notable upgrades, particularly in the camera department.
Oppo Find X10 series camera details leak
Oppo Find X10 series camera details leaked
According to information shared by Digital Chat Station on Weibo, Oppo is currently evaluating a dual 200-megapixel camera setup for the Find X10 series. The configuration reportedly includes a 200-megapixel primary camera paired with a 200-megapixel periscope telephoto camera, both using large 1/1.3-inch sensors. If finalized, this would mark the largest telephoto sensor Oppo has ever tested for its Find lineup.
The leak suggests that this camera setup is being tested across the entire Find X10 range, including the standard and Pro variants. There are also indications that Oppo may introduce a Pro Max model for the first time, expanding the lineup beyond the usual two variants. An Ultra model is said to follow next year, continuing Oppo’s staggered release strategy.
Interestingly, similar camera hardware is expected to debut earlier on the Find X9s Pro, which is tipped to launch in China in the first half of the year. That device is also rumored to feature dual 200-megapixel Samsung HP5 cameras, indicating Oppo’s broader push towards high-resolution imaging across its flagship portfolio.
Oppo Find X9 Pro
On the performance front, the Find X10 series is expected to be among the first smartphones powered by the MediaTek Dimensity 9600 chipset. Built on a 2nm process, the new platform is said to offer higher performance at lower power consumption compared to previous generations. Early testing reportedly shows notable gains in efficiency and sustained performance.
At this stage, details about display technology, battery capacity, and charging remain limited. However, Oppo is expected to position the Find X10 series as a major leap over the Find X9 lineup, especially in camera hardware. With the launch still some time away, more concrete information should emerge in the coming months.
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