Last month, Qualcomm announced the upgraded version of the Snapdragon 8 Gen 1 processor, dubbed Snapdragon 8 Plus Gen 1, which will be powering most of the flagship smartphones getting launched this year.

The company is also gearing up to launch the next-generation flagship processor towards the end of this year, which is likely to be called Qualcomm Snapdragon 8 Gen 2, and details about the chipset have started surfacing online.

As per the latest report from Digital Chat Station, it is claimed that the upcoming Snapdragon 8 Gen 2 processor, which apparently has the SM8550 Kailua model number and codename, will come with a completely different cluster configuration.

The chipset, which will be manufactured by Taiwan Semiconductor Manufacturing Company (TSMC) based on its 4nm process, will reportedly have a 1+2+2+3 configuration instead of the usual 1+3+4 configuration.

The current Snapdragon 8 Gen 1 comes with one common big ARM core, three medium cores, and four low-power cores, a cluster design that is now being used by most chip makers for their high-end processors.

As per the report, the upcoming Snapdragon 8 Gen 2 will have one Makalu generation core, another cluster with two Makalu generation cores, followed by two Matterhorn cores, and three Klein R1 cores. ARM’s Matterhorn generation refers to its 2021 Cortex CPUs, whereas Makalu is meant for 2022 phones.

This means that the Qualcomm Snapdragon 8 Gen 2 could have one Cortex-X3 core, which has not been announced yet, two Cortex-A720 cores, two Cortex-A710 cores, and three older Cortex-A510 cores, likely to be coupled with the Adreno 740 GPU.

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Samsung has announced its latest flagship smartphone processor — Exynos 2200, which will be powering the company’s upcoming premium smartphones later this year. This is the same chipset that the company was set to unveil on 11th January but got delayed.

The announcement of this new chipset from the South Korean giant pretty much confirms that there will be Exynos-powered variants of the Galaxy S22 lineup next month, putting the rumors to rest that Samsung is ditching the Exynos chipset this time.

The South Korean giant says that the Exynos 2200 is a newly designed processor, manufactured using the company’s 4-nanometer EUV node. It packs an octa-core CPU design and uses Armv9 CPU cores.

There are three CPU clusters — a single Cortex-X2 flagship core, three Cortex-A710 big core, and four Cortex-A510 little cores. Further, the chipset comes with a Samsung Xclipse GPU based on the AMD RDNA 2 architecture which the company says will offer a “console-level” gaming experience in smartphones.

The Samsung Xclipse graphics processing unit will offer advanced features like hardware-accelerated ray tracing and variable rate shading. Ray tracing simulates how light physically behaves in the real world inside the game while variable-rate shading can lower the shading rate in areas of the game to optimize GPU workload.

It also comes with some other technologies such as advanced multi-IP governor (AMIGO) that enhance overall performance and efficiency. It manages power efficiency to reduce battery drain for high-resolution games.

The chipset also comes with an upgraded AI thanks to the new NPU. It can be used with the image signal processor to support taking more realistic pictures. The ISP supports 108MP in single camera mode and offers 4K HDR and 8K video recordings.

As for communication, the Samsung Exynos 2200 comes with a fast 3GPP Release 16 5G modem that supports sub-6GHz and mmWave spectrum bands. There’s E-UTRAN New Radio – Dual Connectivity (EN-DC) which utilizes both 4G LTE and 5G NR signals and can boost the speed up to 10Gbps.

For security, it also comes with Integrated Secure Element (iSE) to store private cryptographic keys as well as to play a role as RoT (Root of Trust). The company adds that an inline encryption HW for UFS and DRAM has been reinforced.

Samsung has said that the Exynos 2200 is currently in mass production. While it has not been explicitly confirmed, this chipset will be powering the brand’s upcoming Galaxy S22 series flagship smartphones that are expected to get officially launched on 8th February, along with Snapdragon 8 Gen 1-powered models.

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MediaTek has announced its latest flagship smartphone processor — the Dimensity 9000 which is the company’s most powerful chip so far and is aiming to compete against the best chips from companies like Qualcomm and Samsung.

The MediaTek Dimensity 9000 is the world’s first chipset to be manufactured using TSMC’s 4nm process and is also the first to use ARM’s new v9 architecture. Not just that, it is also the first chipset announced with ARM’s new core designs.

It comes with a single Cortex-X2 performance core clocked at 3.05GHz, three Cortex-A710 cores at 2.85GHz, and four Cortex-A510 efficiency cores at 1.8GHz. For graphics, the chipset features a 10-core Arm Mali-G710.

There’s also MediaTek’s fifth-generation APU with six total cores for AI processing. It is claimed by the company to offer four times the performance and power efficiency compared to its previous generation.

The Dimensity 9000 will support LPDDR5x memory at bandwidths of up to 7,500 Mbps. It is also said to be able to handle screens with up to a 180Hz refresh rate at FHD+ resolutions.

Coming to the photography department, the chipset supports the first 18-bit image signal processor, which offers the ability to capture 4K HDR video using up to three cameras at the same time, or still photos using up to a massive 320MP sensor.

For connectivity, the Dimensity 9000 supports Wi-Fi 6E as well as Bluetooth 5.3. There’s no integrated modem with mmWave 5G support but the company says it supports 3CC carrier aggregation for sub-6HZ 5G with top data speeds of up to 7Gbps.

Devices powered by this new Dimensity 9000 SoC are expected to be available in the market as soon as the first quarter of 2022. To know for sure how the chipset performs, we will have to wait to test a real smartphone powered by this new SoC.

The launch of the MediaTek Dimensity 9000 flagship chipset comes when the Taiwan-based company has seen impressive results in the year 2020 and 2021 and is now the world’s largest smartphone chipset maker with around 40 percent of the market share. It is also claimed to be growing at 28 percent in the 5G SoC market.

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Every year, towards the end, Qualcomm hosts its annual Tech Summit where the company also unveils its flagship next-generation processor for smartphones. This year, the Qualcomm Tech Summit will be hosted from 30th November to 2nd December.

A banner for the event on the company’s website shows a boat tracking an infinity sign and carries a tagline that reads “More to come, soon!” without revealing any extra information. But, it’s safe to assume that the next-generation Snapdragon series flagship chipset, the Qualcomm Snapdragon 898 will be officially announced on 30th November.

The upcoming Snapdragon 898 (SM-8450) will be manufactured by South Korean giant Samsung using its 4nm process. It is expected to run on Dual 3400 architecture with Adreno’s 730 graphics processing unit. It will bring the same octa-core chip with a frequency of 1.79GHz and can be overclocked by using higher power wattage.

The chipset is expected to have a prime ARM Cortex-X2 CPU core running at 3.0GHz, three Cortex-A710 based mid-cores clocked at 2.5GHz and four efficient Cortex-A510 derived cores running at 1.79GHz.

It is expected to offer 20 percent performance improvement over its predecessor and come packed with the Snapdragon X65 5G modem which could theoretically offer a maximum downlink speed of 10Gbps.

As for smartphones, Xiaomi is expected to be the first manufacturer to launch a device powered by this Qualcomm Snapdragon 898. The phone, which is likely to be the Xiaomi 12, is expected to get launched by the end of this year.

Apart from Xiaomi, many manufacturers, including Huawei, Lenovo, Motorola, Vivo, OPPO, and Samsung are in the first batch of companies that will launch smartphones powered by the new Snapdragon 898 chipset.

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Qualcomm Snapdragon 888 is the current flagship chipset from the company and now it is working on a stripped-down version of the same, which is expected to come without the support for 5G communication.

The company had recently launched the Snapdragon 870 and it is not yet known how the upcoming chipset will differ from the SD870 SoC. However, the chipset is likely to be based on the 5nm process and meant for markets where 5G is still not available.

Additionally, Qualcomm has also started working on the Snapdragon 888 successor which is internally known as “Waipio” and has a model number SM8450. It is expected to get launched by the end of this year.

Roland Quandt says that the company is testing samples compatible with 12GB of LPDDR5 RAM and 256GB of storage. What’s interesting is the camera capabilities of the chipset which is expected to get a major boost.

It is being reported that the upcoming flagship chipset from Qualcomm will come with Leica technology and for this, both the company has entered into a partnership. Currently, they are testing on a module named “Leica1.”

For those who are unaware, Leica is a German company that manufactures cameras, lenses, binoculars, rifle scopes, microscopes and ophthalmic lenses. Huawei has been using the Leica lens for its flagship devices since past few years and has been appreciated for its camera performance over the years.

The current-generation flagship chip — Qualcomm Snapdragon 888 is manufactured by Samsung using the 5nm process. It remains to be seen if the company opts for a 4nm node for the production of its successor.

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Samsung is among those rare smartphone makers that also makes their own chipsets and the South Korean giant has now started focusing on further development of its processors to make them compete with the the high-end offerings from its rivals.

This year, the company is expected to launch three new Exynos chipsets in the market which includes a mid-range 800-series chip, a high-end 1200-series and a flagship 2200-series. Two of them, 1200-series and 2200-series chips are expected to feature GPUs based on AMD’s RDNA architecture.

There are also reports that the South Korean giant is working on two different versions of the Exynos 2200 chipset — one for the Android smartphones and another for the laptops. Both are expected to share similar architecture but tuned for different form factors.

Samsung is working with AMD for developing a custom GPU and the company will demonstrate the graphics processor in June this year. The chipsets with this new GPU are expected to launch at a later date and the devices powered by them are expected to go official in the next year.

The Exynos 2200 version being developed for laptops will be used to power the Windows 10 laptops and could go official in the third or fourth quarter of this year. So far, Samsung has been relying on Qualcomm chipsets for laptops running Windows on ARM system.

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Samsung recently launched its latest flagship smartphones in the Galaxy S-series, which includes the Galaxy S21, S21 Plus, and S21 Ultra. All three devices are powered by the company’s new Exynos 2100 chipset or the Qualcomm Snapdragon 888, depending on the region of availability.

Although the Samsung Exynos 2100 is a big improvement over the company’s Exynos 990, the chipset still lags behind when compared to the Apple A14 Bionic chipset that powers the Apple iPhone 12 lineup.

Now, it is being reported that the South Korean giant is working on a new chipset with an aim to beat the performance of the Apple A14 Bionic. Further, it is also being said that this new smartphone chipset could be launched in the first half of this year.

It’s noteworthy that the Samsung Exynos 2100 SoC is comparable to the flagship Qualcomm Snapdragon 888 chipset when it comes to CPU test, however, it lags behind in terms of GPU performance.

We previously reported that the company is working with AMD for enhancing the graphics performance on its upcoming Exynos chips. The early performance results are also impressive and put the chipset ahead of Apple A14 by a significant margin.

With the suggested timeline for launch being somewhere in the second quarter of this year, Samsung seems to be on a path to change the launch schedule of its chipsets. As the fate of the Galaxy Note series remains unclear, it will be interesting to see what device becomes the first one to be powered by this new upcoming chipset from Samsung.

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Recently, Qualcomm officially announced its next-generation flagship mobile chipset — Snapdragon 888. The processor is the successor to the company’s own Snapdragon 865 SoC launched last year.

The company was expected to name this chipset Qualcomm Snapdragon 875 but instead, when launched, the company named it Snapdragon 888. The reason for such a move from the company is also interesting.

During the keynote, Qualcomm claimed the number 888 to be the most premium name possible. That is because, in the Chinese culture, the number 888 symbolizes luck and prosperity, which the company wants to ensure for its continued success.

For Qualcomm, out of its 14 partners, 12 are the Chinese smartphone manufacturers. With the ongoing US-China trade war, the company wanted to ensure that it doesn’t affect the adaptability of its flagship chipset, and thus, opted for Snapdragon 888.

Xiaomi has confirmed that the brand’s Mi 11 will be the first smartphone to feature the newly launched SD888 SoC. While the launch date is not yet known, reports indicate that the phone could go official later this month.

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Several other companies have also confirmed their flagship smartphone powered by the Snapdragon 888 chipset, which includes Black Shark, Nubia Red Magic, OPPO, Realme, LG, Vivo, iQOO, and OnePlus.

As for the chipset, the Qualcomm Snapdragon 888 is the most powerful offering from the company so far. It packs one Cortex X1 core, three Cortex A78 cores, and four Cortex A55 cores, along with Adreno 660 GPU.

It has an integrated Snapdragon X60 5G modem with support for mmWave and sub-6GHz 5G with support for most of the bands worldwide. The new SoC also supports Wi-Fi 6 and Bluetooth 5.2 and connectivity features. Here are the detailed specs of the chipset.

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Qualcomm Tech Summit is scheduled to start from 1st December and the company will be announcing its next-generation flagship smartphone chipset — Qualcomm Snapdragon 875. Now, just weeks before the official announcement, details about the upcoming SoC have been leaked online.

A new report coming from China claims that the Snapdragon 875 will be manufactured using a 5nm node. It’s noteworthy that this is not new information as it had already been revealed earlier. Also, it won’t be the first chipset to be made using the 5nm process as Apple A14 Bionic and Huawei HiSilicon Kirin 9000 have already been launched.

The report reveals that the upcoming octa-core chipset will come with one oversized core clocked at 2.84GHz, three Cortex-A78 cores clocked at 2.42GHz, and four Cortex-A55 cores which are clocked at 1.8GHz. It is also said to pack Adreno 660 GPU for enhanced graphics performance.

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Previously, it was reported that for the SD875 chipset, Qualcomm is opting for an “oversized” core which is Cortex-X1 that is claimed to offer 23 percent improvements in terms of performance than the Cortex-A78.

As for the connectivity support, the SoC is expected to come with Snapdragon X60 5G modem but it remains to be seen if the company opts to make it an integrated modem, similar to what it did with its predecessor.

Just a couple of days ago, a prototype device powered by the Qualcomm SD875 SoC was spotted on the AnTuTu benchmarking platform, revealing that the chipset scored 899,401 points with a CPU score of 333,246 points and a GPU score of 342,225 points.

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Qualcomm Snapdragon 865 chipset is currently the flagship offering from the company which is powering most of the premium smartphones launched this year so far and will continue to do so until its successor arrives.

The successor to the SD865 SoC is expected to get launched as Qualcomm Snapdragon 875 by the end of this year, most probably in December. As per the reports, the chipset could be the company’s first to be manufactured using 5nm process.

Now, a new report claims that the upcoming Snapdragon 875 chipset, codenamed SM8350, will come packed with the new Snapdragon X60 5G modem RF-integrated system. It remains to be seen if the modem will be integrated or optional. Given that the 5G adaptation is on the rise, it won’t be surprising if Qualcomm decides to go with the integrated modem route.

The Qualcomm Snapdragon 865 also comes with an embedded 5G modem but people are not happy with this given that it has increased the cost of the chipset. This has led to smartphones being more expensive even for the 4G-only models as 5G infrastructure is still at the early stage of development.

The report adds that the upcoming SD875 will have Kryo 685 CPU built on ARM v8 Cortex technology with Adreno 660 GPU, Adreno 65 VPU, and Adreno 1095 DPU. The modem will support mmWave and sub-6GHz bands.

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It is also said to have Qualcomm Secure Processing Unit (SPU250), Spectra 580 image-processing engine, and Snapdragon Sensors Core Technology. As for the connectivity options, it’ll have external Wi-Fi 802.11ax, 2×2 MIMO, and Bluetooth Milan.

The chipset will come with Compute Hexagon DSP with Hexagon Vector eXtensions and Hexagon Tensor Accelerator. It will support Quad-channel package-on-package (PoP) high-speed LPDDR5 SDRAM. It is also said to come with low-power audio subsystem combined with Aqstic Audio Technologies WCD9380 and WCD9385 audio codec.

Meanwhile, we are waiting for some kind of confirmation about the Snapdragon 865+ chipset. Some some reports says that the upgraded SoC is coming and the specs have also leaked, Meizu CMO recently said that SD865+ isn’t coming this year.

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(Source)

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In an unexpected move, Qualcomm recently launched the Snapdragon 855 Plus octa-core processor which is an upgraded variant of the Snapdragon 855 SoC. Now, just months after the launch of SD855+ chipset, the company is now set to launch the next-generation SoC.

If the new reports are to be believed, then the Qualcomm Snapdragon 865 processor is all set to launch next month. It is said that the chipset could be fabricated using TSMC’s second-generation 7nm processor.

Contradicting earlier reports of SD865 getting launched in December this year, the new report claims that the Snapdragon 865 SoC will get launched in November in order to keep up with the competition from Huawei.

Further, the report goes on adding that the smartphone manufacturers Samsung, Oppo, Vivo, and Xiaomi will also be showcasing early prototypes of devices running Qualcomm Snapdragon 865 chipset.

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While the report claims that the next-generation flagship chipset from Qualcomm is all set to get launched next month, we are yet to come across leaks related to this upcoming processor but given the launch timeline, we should get more information soon.

The Qualcomm Snapdragon 855 Plus comes with the same Kryo 485 CPU cores but is now clocked at 2.96GHz, up from the 2.84GHz clock speed of the Snapdragon 855. The Adreno 640 GPU is also reported to have gained a 15% boost in speed.

As per the company’s claim, the upgrade in the GPU department makes the Snapdragon 855 Plus a great chipset for gaming. Also, it should also make it quite useful for AR and VR devices. The processor doesn’t have the new X55 modem. Even the X50 modem isn’t integrated, so manufacturers who want to use this for 5G phones will have to install the X50 modem separately.

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(Source)

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A few days ago, at the IFA 2019 in Berlin, Germany, China-based Huawei announced its much-awaited Kirin 990 5G flagship chipset for smartphones. The chipset comes with dual NPU hardware which not only makes it superior than its predecessor but also superior compared to its competition.

The AI Benchmark test puts the newly announced Kirin 990 5G chipset ahead of the Qualcomm Snapdragon 855 Plus SoC, topping the rankings. The chipset has achieved a score of 52,403 in the test, far ahead compared to the scores of Unisoc Tiger T710 and Qualcomm Snapdragon chipsets.

The Huawei HiSilicon Kirin 990 5G is a 7nm octa-core chipset that has 10.3 billion transistors. It uses two big, two middle and four little cores to optimize multitasking, with clock speeds of 2.86GHz, 2.36GHz and 1.95GHz respectively. The 990 5G also packs a 16-core Mali G76 graphics processor which should offer plenty of power for mobile gaming, as well as smart cache built in to reduce bandwidth by up to 15 percent.

It is also touted to be the first full-frequency 5G SoC — with support both non-standalone and standalone architectures as well as TDD/FDD full frequency bands. The Kirin 990 is a true unified design, supporting Sub-6 GHz 5G networks on both SA and NSA architectures.

For photography, it has a new fifth-generation Dual ISP boasts DSLR-level hardware noise reduction and block-matching and 3D filtering. Huawei’s smartphone cameras already produce stunning low-light results, but it looks like that can be improved further.

Aside from implementing the 5G modem, the biggest change in the Kirin 990 is going to be the NPU, or Neural Processing Unit. Boiled down to basics, it’s a co-processor optimized for the sort of vector math that’s the lifeblood of machine learning frameworks.

Huawei has scheduled a launch event in Munich on the 19^th of September, where the company is expected to launch Huawei Mate 30 and Mate 30 Pro flagship smartphones, which will be powered by this new Kirin 990 SoC.

Today, Huawei’s sub-brand Honor has released a poster confirming a new lineup of smartphones — Honor Vera30. While nothing much is known about this new smartphone series, the company has confirmed that it’ll be powered by the Kirin 990 5G chipset.

(Source)

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Qualcomm Snapdragon 855 is the company’s current-generation flagship chipset which powers most of the high-end flagship smartphones launched this year. Recently, the company released two new upper mid-range chipsets — Qualcomm Snapdragon 665 and Snapdragon 730/G.

Now, the company has reportedly started working on its next-generation flagship chipset, which is expected to be named Snapdragon 865. The SD855 had an internal model number SM8150 and was codenamed “Hana” and if the reports are to be believed, then its successor has the model number SM8250.

The codename of the upcoming flagship chipset is said to be “Project Kona”. Kona is a name referring to the Hawaiian Islands. Interestingly, Qualcomm has been hosting a Qualcomm Tech Summit in Hawaii to present its high-end processors in December.

While nothing much is known about the Snapdragon 865 processor, it is said that the chipset will come with support for LPDDR5 RAM. The high-end chip for Windows devices Snapdragon 8cx is still using LPDDR4X. Qualcomm already has samples of the new SM8250 internally and is testing them in conjunction with the LPDDR5 memory, leaving it open who the supplier is.

However, it’s a long time before we see anything substantially related to the upcoming Snapdragon 865 flagship chipset from Qualcomm. So, we expect to know more about this SoC in the coming months.

Read More: Qualcomm Chipsets already support 192-Megapixel sensors; Phones with 100MP and 64 MP cameras coming soon

Meanwhile, TSMC has announced its new 5nm process infrastructure, readying base for the Apple A14 chipset, which will be powering the Apple iPhones launching in 2020. Thus, we are also expecting a Qualcomm chipset manufactured using a 5nm process.

(Via)

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