A few weeks back, LeEco (formerly known as LeTV) announced three new smartphones in its second generation Le family namely the Le 2, Le 2 Pro and the Le Max 2. Like most Chinese manufacturers, the company has used MediaTek chipsets to keep the price as low as possible on the first two models. The Le 2 comes with the Helio X20 chip while the slightly costlier model, the Le 2 Pro comes with a more powerful Helio X25 chipset. However, it looks like LeEco might have a Snapdragon powered variant as well for its fans, at least for the Le 2 budget model. The phone is said to come with an option of Snapdragon 652 inside. However, we are yet to receive an official confirmation from the company about such a version.

It was recently reported that the Le 2 model with Snapdragon 652 inside was listed and will soon go on sale. The phone was spotted with 32GB ROM inside and came in three colours, gold, silver and grey. Interestingly, the pricing was kept the same as the Helio X20 powered model, i.e. 1099 Yuan which comes to around $168.

This could easily make the Le 2, the cheapest Snapdragon 652 smartphone in the market. This is possible since this Chinese giant tends to resort to negative profit pricing for its phones. If you remember, the recently released Xiaomi Max phablet had a SD652 version, but that costs around $260. This would be way cheaper than that.

So, if LeEco did release a SD652 powered Le 2 model, would you choose that version or the one with Helio X20 inside?

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360 Mobiles unveiled the brand new 360 N4 mid-ranger earlier today at an amazing official price tag of $138. The phone beats most rivals in its segment and gives tough competition to the Le 2 smartphone that was announced last month. Since they both practically fall in the same mid-range segment and come with Helio X20 chip inside, we decided to compare these two value for money devices to see whether there are any significant differences between the two and whether we can pick out one of these two as the winner in this comparison.

Turns out, there are quite a number of differences between the two smartphones, despite nearly the same pricing. So, let us move to the 360 N4 vs Le 2 comparison.

360 N4 vs Le 2: Design

Like always, we start off with the design of the two smartphones. These two companies have used two different design philosophies on their devices. The Le 2 comes with an all metal design, continuing the tradition set by the first generation Le 1 products. On the other hand, 360 Mobiles have used a plastic body on the N4 which doesn’t look too bad either. While the N4 may not be as premium looking as the Le 2, its design is still simple and elegant and I am sure there would be many readers who like this design.

MEASUREMENTS:

360 N4: 149 x 75.7 x 8.3mm

Le 2: 151.1 x 74.2 x 7.5mm

Weight:

360 N4: 140 grams (plastic keeps the weight down)

Le 2: 153 grams

360 N4 vs Le 2: Specs

While we would have thought that these two devices have very similar specs, that is true only to a certain extent. Both the devices come with Helio X20 deca-core chipset on board, but their clock speeds are different. 360 N4 comes with a slightly underclocked X20 chip at 2GHz, on the other hand, the Le 2 features a 2.3GHz Helio X20 chip. Both have Mali-T880 GPU inside.

360 N4 comes with 4GB of RAM while the Le 2 has just 3GB of LPDDR3 RAM on board. Storages are same on both the devices — 32GB as standard. But only the 360 N4’s storage is expandable via MicroSD (hybrid slot) up to 128GB. Another thing to note here is that the storage on the 360 N4 is eMMC 5.0, while the one on the Le 2 is eMMC 5.1 standard. Both have 5.5-inch FHD 1080p screens with 400+ ppi pixel density.

Coming to the cameras, Le 2 seems to have a slight advantage here. It comes with a 16MP sensor with support for 4K recording and slo-mo videos at 720p @ 120 fps. Then there’s PDAF and dual tone LED flash. Up front, you will find a 8MP f/ 2.2 sensor. On the other hand, the 360 N4 comes with a 13MP sensor with 2K video recording support, f/ 2.0 aperture and single LED flash. On the front, the phone has a 5MP f/2.0 aperture camera.

As for the battery, both have almost similar specs. The 360 N4 comes with 3080mAh capacity battery inside with turbo flash charge which charges to 100% in just 1.5 hours. Even the Le 2 comes with a 3000 capacity battery with fast charge.

Both have fingerprint sensors located at the back. Connectivity features seem to be standard like Wi-Fi, 4G LTE, Bluetooth 4.0, GPS, A-GPS, dual SIM cards etc. However, the Le 2 does have a small addition of an infrared port.

Now, coming to the biggest difference between the two devices, and also a deal breaker for many, the Le 2 does not feature a 3.5mm headphone jack. Instead, the phone uses the CDLA standard (Continuous Digital Lossless Audio) which works with the USB Type-C port at the bottom. On the other hand, the 360 N4 features the standard 3.5mm headphone jack and comes with MicroUSB.

Both run on the new android Marshmallow version with their own UI on top. N4 features the 360 OS while the Le 2 comes with the company’s EUI 5.6.

360 N4 vs Le 2: Pricing

If you read our launch article earlier today, you would know that the 360 N4 is much cheaper. The phone starts at just $138 (899 yuan) for the regular version while the full netcom version retails at $154 (999 Yuan). On the other hand, the Le 2 starts at $170 (1099 Yuan), a bit higher than the N4.

Conclusion:

Well, it looks like you get the exact value for the money you pay. For example, the Le 2 is priced higher, but it comes with a faster-clocked chip, better storage standard (eMMC 5.1) and for most, a better looking metal body. The camera also seems to be better on paper.

But to be honest, the 360 N4 does seem to be the better value for money device here. It comes with the same chip with slight underclocking, 4GB of RAM which is higher than Le 2’s 3GB, MicroSD expansion, and a regular 3.5mm headphone jack. All these for a good $30 cheaper price tag.

But there are many factors that affect a buyer’s decision. For example, 360 Mobiles isn’t as famous as LeEco and is yet to establish a strong presence in the international market. So, it really boils down to the individual buyer’s preference.

So, which one would you pick?

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LeECo is all set to announce its latest device in its popular Le family called as the Le 2. This will be the second generation model in the lineup, with the first batch of phones being announced almost a year before. We have a lot of expectations with the upcoming Le 2, and it looks like there will be multiple versions of the phone.

According to a recent benchmark listing of the Le X820 model, the phone will come with the powerful Snapdragon 820 chipset under the hood with a massive 6GB of RAM inside. In case you remember, only the Vivo XPlay 5 Premium Edition can boast of such specs, and this particular model could soon join the ranks of flagships with ultra powerful hardware. We aren’t sure whether this would end up being called as the Le 2, instead something like the Le Max 2 or the Le 2 Pro would be much more ideal.

What’s more, the Le X820 comes with a 5.5-inch 2K display on board to make sure you have the top features in almost all departments. At the back, the phone will have a 21MP sensor which can record 4K videos while up front, there will be a standard 8MP shooter. Other features include 64GB of internal storage and Android 6.0.1 Marshmallow OS.

We know tomorrow we will see the Le 2 smartphone, thanks to the numerous teasers and leaks about the device. So, what about this particular device?

READ MORE: Le 2 Will Not Feature A 3.5mm Headphone Jack

Well, it’s unlikely that the company would announce both the Le 2 and the this particular device in the same conference. If that was the case, we should have seen hints about this power house. So, we probably have to wait for a few weeks more to see this flagship finally being announced.

The post Le X820 With 6GB of RAM & Snapdragon 820 Spotted On GFXBench appeared first on Gizmochina.

Le 2 will meet us on April 20, which is just a couple of days away. We know that the phone will be good, thanks to the numerous leaks that have been making rounds on the internet for the past few year. But will it be revolutionary? After seeing the new teaser from the Jia Yueting, we probably think so.

The new teaser from the CEO himself reveals a phone broken into pieces and we can clearly see the headphone connector reaching out towards the device. The 3.5mm jack seems to be broken and besides it, we can see a USB Type-C port, which could be a good indication that the Le 2 will abandon the traditional headphone jack in favor of a USB Type-C based headphones.

Also, the words on top of the image say, “USB Type-C Era, How To Open Up A New Generation Of Audio Revolution?”. Apart from the image, CEO also said that it is time to get rid of something. So, everything seems to reveal that the upcoming LeEco flagship might be the first one to abandon the 3.5mm headphone jack. Well, if Apple iPhone 7 was going to get rid of this slot, LeEco made sure that it won’t be the first.

Yesterday, the real Le 2 was allegedly leaked, which also showed that the traditional slot was missing.

As for other specs, the Le 2 is expected to come with a borderless design (Borderless technology 3.0) with a 5.5-inch 1080p display. Under the hood, there will be the Helio X20 chipset clocked at 2.3GHz and 3GB of RAM. The phone will feature a 16MP camera at the back and an 8MP front facing shooter. It is said that the base variant starts at 32GB storage.

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LeEco executives have confirmed that the Le 2 flagship is coming very soon. While we are not entirely sure that the launch will be within this month, one of the versions of the Le 2 smartphone has just passed through the network certification website TENAA. Now that the phone has been network certified, we can be sure that the launch is around the corner.

Like always, thanks to the listing, we have a bunch of the specs of the Le 2 as well as the design. Well, to be honest, we are a bit surprised to see that the new model looks a lot like the SD820 powered Le Max 2 flagship that was launched three months back. The phone continues with the all metal design, again a surprise, given that earlier rumors stated that the company would opt for a different material. But this could be the lower-end model and the top-end variant may feature a different material (like the Xiaomi Mi 5 Pro which comes with a ceramic body).

Moving on, the phone features a fingerprint sensor at the back as well as a camera sensor with dual tone flash. What’s interesting is that it carries the LeTV branding and not the new LeEco logo. But we can expect the new logo to end up in the final units.

As for the specs, the Le 2 smartphone will come with a deca-core Helio X20 processor with 3GB of RAM and 32GB of internal storage. At the back, the phone will feature a 16MP rear camera while up front, you will find an 8MP shooter. There will be  a 5.5-inch 1080p display on board as well as an ultrasonic fingerprint sensor. Finally, the phone runs on Android 6.0 with EUI on top and features a 3000mAh battery inside its 7.7mm thin body.

So that’s all we know about the Le 2. There should be another version with SD820 or Snapdragon 652 chip on board, but we will have to wait and see if those rumors turn out to be true.

The post Le 2 With Helio X20 Certified By TENAA, Looks Similar To The Max Pro appeared first on Gizmochina.

We know that LeEco will release the Le 2 flagship sometime in the coming weeks, most likely in April. Thanks to the numerous leaks that have been making rounds for the past few days, we already know a lot about the phone. It is said that the flagship will come in two variants, the higher-end model powered by Snapdragon 652 and another one powered by Helio X25.

While LeEco executives have confirmed a new phone launch, now, the Senior Vice President of the company, Feng Xing has just revealed a new sample photograph take from the upcoming Le 2 smartphone. Although the image seems to be cropped (resolution of 2730 x 2048), from what we can see, the color reproduction and details have come out very well. But of course, we can’t really judge the camera performance of the device in just one picture. So, let’s wait for more samples.

As for the specs, apart from the CPU variants, expect the rest of the specs to be more or less the same. The phone will reportedly come with 3GB of RAM, 5.5-inch 1080p display, an 8MP front camera and a 16MP rear facing shooter.

Previously there were rumors that the Le 2 will come with Snapdragon 820 under the hood. This would have been great, but it was doubtful whether it would be feasable for the company. Now, with Snapdragon 652 octa-core chip inside, the company could keep the price pretty competitive, under 1999 Yuan ($310).

Another confusion is the leaked Le 2 version with Helio X25 chip. Meizu had confirmed earlier that the X25 would be exclusive to the Pro 6 at least for a few months. So, it remains to be seen whether Le 2 comes with recently announced Helio X25 or the slower X20 version.

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Today was a busy day for Mediatek as it announced two chipsets in China, namely the Helio X20 and the Helio X25. The chipmaker had already announced the X20 a few months back, but this seems to be its release event. Anyways, we have seen Helio X20 perform, thanks to ZOPO’s first deca-core flagship, the ZOPO Speed 8. From the benchmark results, we came to know that the company was targeting the upper mid-range market with this chip, while the Helio X25 will be taking care of the top-end segment.

Now that these two chipsets have been released, we are waiting for phones with them inside. We already know that Meizu Pro 6 will be the exclusive smartphone with Helio X25 (at least for the next few months) and now LeEco executives have confirmed that the second generation Le 2 smartphones will feature the mid-range Helio X20.

Although ZOPO was the first manufacturer to release an Helio X20 powered device, it looks like LeEco will be the first true large-scale manufacturer to adopt the chip. What’s more, LeEco’s President of the Mobile department, Feng Xing said that the company will prepare a stock of more than 1 million units of Helio X20 powered products. That’s pretty impressive and shows the confidence of the company in the chip.

However, if you are not a big fan of Mediatek, don’t worry, it is said that there will be a Snapdragon 820 powered Le 2 version as well. And if the phone looks anything like the renders we have come across recently, fans are definitely going to love the overall package.

LeEco is expected to release the Le 2 flagship sometime before the end of March, which means we could see an announcement in the next couple of weeks. Apart from LeEco, manufacturers like OPPO and Qihoo 360 (smartphone division) are also expected to release Helio X20 powered smartphones.

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LeEco has turned out to be one of those manufacturers who we all expect to release something revolutionary in the market. It’s not only because LeEco was the first company to announce a Snapdragon 820 powered flagship, but also because of the way the company has grown and attracted fans within a very short timespan. Phones from LeEco are affordable, feature rich and looks amazing.

Although we haven’t really got our hands on the LeEco Le Max Pro flagship, mainly because it’s not yet readily available in the market, our eyes are all focused on the next phone from the company, namely the Le 2 flagship. This should be another device with Snadpragon 820 chip on board. But that’s not just what excites us. LeEco executive has said that the phone will come with some revolutionary technology. Moreover, according to recent rumors, the design of the phone will also be a lot different than previous releases, featuring a new body material like double glass design or ceramic.

Now, 9to5Google has got their hands on some official Le 2 renders and they look pretty amazing. While these are just concept images for now, the source reveals that the design is basically what the company is aiming to provide with its upcoming phones.

As you can see in the pictures, the Le 2 comes with a non-metal body, probably glass or ceramic. Then there’s a solid metal frame. Another highlight of the phone is the display which curves around the sides like the Galaxy S7 Edge. We have heard rumors about Samsung supplying its curved display panels to Chinese manufacturers, so this could very well turn out to be a reality.

The phone also features a magsafe like charger on its USB Type-C port. Further, the concept phone is said to come with a fingerprint sensor that hides underneath the body. We know that’s possible, thanks to Qualcomm’s Ultrasonic fingerprint sensor.

Well, this may just be a concept, but if the LeEco Le 2 flagship is anything like this in terms of looks, we could have a best seller. With Snapdragon 820 and other powerful specs, the phone seems to be one of the most anticipated devices of this quarter. Rumors say the release could be as soon as March, but we are yet to hear anything official about an event from the company.

The post LeEco Le 2 Concept Renders Reveal What The Phone Could Look Like appeared first on Gizmochina.

Although Le Max Pro was the first smartphone with Snapdragon 820 chipset on board, users haven’t been able to get hold of the device even after nearly two months of its release. This naturally turned our attention to something that we can expect to see soon, the Le 2. The company officials have confirmed that the phone exists and will debut soon in the market.

Now, new renders of the Le 2 have emerged and for the first time we can see the rebranded LeEco logo on the back of the device. From the images, we can see that the Le 2 will feature a similar design as its predecessors. However, when it comes to the materials used for the body, it looks like the company is going to go with a double sided glass design. So, it looks like for the first time, LeEco is going to use glass instead of metal on its smartphones.

This is even more evident from the back of the handset. We can see that the phone features a single piece of glass at the back with a cut out for the fingerprint sensor. Another interesting aspect of the phone is the new LeEco logo at the back. So, this could be the real deal.

Remember a few days back, we had seen similar renders with the old logo. This could be a newer version of the Le 2’s design, considering the updated logo.

As for the specs, it is said that the Le 2 will come in two versions, one with Snapdragon 820 on board and the other with Helio X20 deca-core chip. You can expect a 5.7-inch 2K display up front with 4GB of RAM and 64GB of storage under the hood. The camera could be similar to the Le Max Pro, with a 21MP shooter at the back and a 4MP ultrapixel sensor up front. Other possible features of the device include Quick Charging, Fingerprint Sensor at the back etc.

Considering that LeEco sold the first batch of Le Max Pro smartphones at just 1999 Yuan, the Le 2 could retail for even cheaper. With the company opting for a negative profit strategy, wherein it sells its smartphones for less than cost price, we hope that LeEco Le 2 is priced aggressively at launch. Somewhere around 1799 Yuan, which comes to $276 would be perfect.

So, what do you think about these leaked images of the Le 2? Prefer the metal body or the double sided glass design?

The post Leaked Le 2 Images Reveal Double Sided Glass Design & New Logo appeared first on Gizmochina.

Its almost a year since LeTV, now called as LeEco entered the smartphone market. And they have managed to build a solid brand image, both in China as well as India. Back in January, LeEco released the world’s first Snapdragon 820 smartphone, Le Max Pro, however, even now, the phone is not available to purchase for the regular public.

So, this brings the focus to another upcoming smartphone from the company, which could be launched in the coming months, namely the Le 2. This particular model is rumored to come with pretty great specs and now, we might have the first glimpse of the device.

As you can see, the phone is a bit different than the ones the company have released till now. The back is clean, a bit too clean which means this may not be a metal body smartphone. There are no visible antenna lines, which could hint that the body is made out of something else. If we had to guess, we would say ceramic material since there have been a couple of rumors going around about such a design on the new Le 2.

We can also see a fingerprint sensor at the back, along with a large camera sensor. The overall looks of the device isn’t very polished, which hints that this is probably a prototype device. Another interesting aspect is the presence of the old LeTV logo, instead of the new LeEco. So, take this leak with a pinch of salt.

As for the specs, earlier leaks have hinted that the Le 2 will feature Helio X20 deca-core processor with 4GB RAM and 64GB of ROM. It could have the same 21MP rear camera sensor and 4MP ultrapixel front shooter as the Le Max Pro, but nothing is confirmed for now.

LeEco has always been aggressive in its pricing. In fact, LeEco CEO Jia Yueting had earlier said that the company often resorts to negative profit to make their devices competitive. So, pricing should be affordable, somewhere around 1799 Yuan which comes to just $275.

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LeTV which was recently rebranded as LeEco is going to be quite busy this year. The company announced the world’s first Snapdragon 820 powered smartphone, namely the Le Max Pro. Now, it looks like LeEco is all set to announce another powerful device in the market, which goes by the name Le 2. From the naming scheme, this will probably be the successor to the Le One series that was announced in April last year.

A set of renders of the Le 2 smartphone have been leaked and they look quite good. LeEco has been praised for its super value for money smartphones with good design and it seems that the Le 2 continues with that tradition. According to the renders, the phone will feature a simple yet elegant body, with 2.5D glass up front on a curved metal body. As you can see in one of the images, the phone seems to be quite thin as well. At the back, there’s a flat camera sensor that blends well with the overall design along with dual tone dual LED flash. The bezels on the sides of the display look super slim as well with various functions available at on the side.

As for the release, according to sources, the phone could meet us sometime late February. Specs wise, the Le 2 is said to come with the 10-core Helio X20 chipset based on Cortex A72 and Cortex A53 cores. The screen size is said to be of 5.5-inch with 2.5D glass on top. There could be a lot of high-end features such as fingerprint sensor under the screen, iris recognition, and long lasting battery life.

The design looks super cool and the specs listed are also pretty high-end. However, we have to remember that LeEco hasn’t revealed anything about its new Le 2 smartphone yet. So, do take this news with a pinch of salt.

Meanwhile, let us know whether you like the design shown in the pictures above.

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