Qualcomm Snapdragon 888 is the current flagship chipset from the company and now it is working on a stripped-down version of the same, which is expected to come without the support for 5G communication.
The company had recently launched the Snapdragon 870 and it is not yet known how the upcoming chipset will differ from the SD870 SoC. However, the chipset is likely to be based on the 5nm process and meant for markets where 5G is still not available.
Additionally, Qualcomm has also started working on the Snapdragon 888 successor which is internally known as “Waipio” and has a model number SM8450. It is expected to get launched by the end of this year.
Roland Quandt says that the company is testing samples compatible with 12GB of LPDDR5 RAM and 256GB of storage. What’s interesting is the camera capabilities of the chipset which is expected to get a major boost.
It is being reported that the upcoming flagship chipset from Qualcomm will come with Leica technology and for this, both the company has entered into a partnership. Currently, they are testing on a module named “Leica1.”
For those who are unaware, Leica is a German company that manufactures cameras, lenses, binoculars, rifle scopes, microscopes and ophthalmic lenses. Huawei has been using the Leica lens for its flagship devices since past few years and has been appreciated for its camera performance over the years.
The current-generation flagship chip — Qualcomm Snapdragon 888 is manufactured by Samsung using the 5nm process. It remains to be seen if the company opts for a 4nm node for the production of its successor.
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