Since its financial troubles became public knowledge, Chinese smartphone giant LeEco has been on the quiet side, only managing to pop into the news a few times since the beginning of the year. But one smartphone that has failed to leave our presence is the LeEco flagship with a weird-looking dual rear camera. This device which has been the subject of series of leaks is touted to be of a flagship stock and would even feature AI technology.

There is a new information now, call it rumour if you like, that the LeEco flagship would be launched this April, specifically on April 11. The rumour emanated from a Weibo user who also revealed that the flagship device would use a dual-lens camera setup which he predicts would be the flagship standard going forward despite the Galaxy S8 not having one.  We don’t know the other details of the flagship but there is a rumor that it would sport dual cameras at the front as well as at the rear. Previously we were expecting a Snapdragon 821-powered flagship but we don’t know if that would change since there is a new Sheriff in town now.

Read Also: Camera Screenshot of LeEco Flagship With Dual Cameras Leaked!

Another revelation by the Weibo tipster is that the LeEco smartphone would come with artificial intelligence (AI), making it a true flagship. Incase you are at a loss here, the AI technology will likely function as a voice assistant similar to Samsung’s Bixby. And if indeed the smartphone comes with an AI technology, that would make it the first LeEco smartphone to feature such.

April 11 is just two weeks away, while it is unlikely that LeEco will launch a smartphone on that day, we’ll keep our fingers crossed and hope they do.

(source)

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LeEco may be in a financial strait at the moment but that has not stopped the company from trying its hands on a couple of new innovative smartphones. Recently, a LeEco flagship with Snapdragon 835 and 6GB of RAM leaked in stunning images. Right now, another leak has surfaced online, said to be the screenshot of the camera interface of an unknown LeEco flagship.

The screenshots are said to be those of the professional mode and black and white mode. In the professional mode, users can manually adjust the shutter, ISO and so on. The camera interface also shows the LeEco flagship would come with a dual camera setup with a black and white sensor as well as a color sensor.

Read Also: New LeEco Flagship Spotted, Features Dual Cameras on Front and Rear

LeEco flagship-looking device with a weird-looking dual camera setup have often appeared on leaks since late last year and is even said to feature AI technology. Two leEco models with dual cameras had also been spotted on TENAA in the past but since then nothing has been heard about them until now. There is every likelihood that this would drop soon but if this is the flagship with Snapdragon 835 chip onboard, that won’t be so soon.

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When LeEco releases a new smartphone, we know two things about the device. First, it’s going to feature top-notch features and second, the price is going to be highly competitive

After the entry of LeEco into the smartphone market last year, we have seen some impressive phones from the company. The Le Max 2 is currently the company’s most powerful handset, coming with the mighty Snapdragon 820 and 6GB RAM (on the top-end variant). However, it’s been a few months since the phone’s release and according to previous rumors, we might meet an even powerful LeEco flagship with dual cameras on board later this year. This is supposed to be the company’s flagship for 2016 and it is expected to feature powerful hardware.

While we haven’t seen this rumored LeEco devices in pictures yet, a few hours ago, a set of concept pictures of the LeEco flagship emerged online. Well, the images sure make it look like a concept phone, because the design is just amazing. The display is going to be bezel-less and the screen to body ratio is nothing like we have seen before. Further, other pictures reveal that the handset is going to be super slim as well, and the overall design is refined, smooth and flagship worthy. The back reveals dual cameras on board along with a sleek metal body. Judging from the pictures, the phone could be extremely thin, thinner than most other flagship models!

Specs wise, it is rumored that the LeEco flagship will feature a 4K display, Snapdragon 821 processor, 4GB RAM and dual cameras at the back.

Naturally, these specs and design are too good to be true for current smartphone tech standards. So, even though the design and specs look amazing, don’t expect this concept to make it to real life anytime soon.

Anyway, what do you think about this design? Although just a concept, this is definitely one of the best smartphone designs we have seen in a while.

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In the first half of 2016, flagships specifications basically center around the Snapdragon 820 chip, 4GB or 6GB of RAM, and 128GB internal storage in the hardware aspect, apart from the display types which vary. The recent trends indicate all that is gradually changing during this second half of the year.

Flagships during the second half seem to shift towards the inclusion of dual cameras at the rear, Qualcomm’s latest Snapdragon 821 chipset, a minimum of 6GB RAM and the inclusion of a curved display on the design of the flagship. This setup looks like the flagship standard on board and quite a sizable numbers of manufacturers are reportedly cooking up similar products focused on this configuration, as gathered from leaks and insider information.

A recent post on popular Android forum, XDA-developers leaked what is purported to be a freehand sketch of LeEco’s next flagship design exposing a dual camera design at the back as well as the frontal design which reveals a curved edge design.

The alleged design drafts showed the dual camera positions in different symmetrical positions at the back with dual flash also part of the design as leaked. The positioning (symmetry) of the dual cameras seems to suit both left handed and right hands users. One of the sketches even shows the dual cameras lying side by side in a diagonal position. Already, LeEco has adopted the dual camera design on its collaborative smartphone with Coolpad, the Cool1 which was also seen in a leak and on TENAA recently.

Read More: LeEco Coolpad joint phone revealed as Cool1, Features Dual Cameras

Apart from the dual cameras, a sketch of what is said to be a curved edge design also finds its way into the device, according to the leaked drawings. It should be noted though that these are just sketches from an unverified source, and the final design of LeEco’s next flagship may look nothing similar. Also, we cannot confirm the authenticity of the sketches that they are actually those of any of LeEco’s smartphone still in the pipeline.

(source)

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We have been hearing rumors about a dual camera smartphone from LeEco. While the company is yet to acknowledge the existence of such a device, recently a new smartphone with LeEco’s logo at the back was spotted. Well, what we saw in the picture was just a rear shell, but it did reveal a lot of things about the device.

From the image, it looks like LeEco is working on a dual camera flagship model. We can clearly see the new LeEco logo at the back, which gave away its identity. Further, the dual camera placement is actually quite interesting, since the company seems to have placed the cameras and the flash to slightly resemble a human face. Further, just below this setup is an opening which should be for the fingerprint sensor. LeEco likes fingerprint sensors at the back of the phone, hence, this design is in line with the company’s design philosophy. From the image, the back shell seems to be made out of metal.

Another highlight of the new LeEco smartphone is the position of the antenna lines. As you can see in the image, the white antenna lines are placed on the top and the bottom. Now isn’t this a bit too familiar? Yes, it is! This is the same antenna design used by Meizu Pro 6 and considering the renders we have seen recently, even the iPhone 7 is expected to use this same design.

RELATED: Samsung to supply dual cameras to Xiaomi & LeEco from July this year!

Specs wise, we have very limited information, however, there have been reports about a powerful flagship from LeEco as soon as tomorrow! The specs are said to be top-notch including Snapdragon 821 chip, 8GB RAM, and dual cameras. While we are not sure whether LeEco will unveil this beast at tomorrow’s MWC Shanghai event, if that doesn’t happen, then the phone should be released sometime later this year.

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We have been hearing rumors that LeEco is soon going to announce a new flagships smartphone with the new Snapdragon 821 chipset inside. The new chip is supposed to be a slightly upgraded version of this year’s Snapdragon 820 flagship chipset, increasing the clock speed to 2.5GHz. Now, LeEco’s upcoming flagship phone was spotted on the AnTuTu benchmarking app revealing key specs and performance. The model number LEX720 is powered by Qualcomm Snapdragon 8996Pro chipset, which should either be called as the Snapdragon 821 or Snapdragon 823.

As for the other specs, the LeEco LEX720 model features 4GB RAM and 32GB of internal storage on board. The screen size is unknown but the resolution will be 1080p. At the back, the phone comes with a 16MP camera, while up front, you have an 8MP shooter. The LE720 is running Android 6.0.1. These specs are quite impressive and hence, the performance is also pretty good. In fact, it is one of the best we have seen on AnTuTu till date. This particular model managed to score an amazing 154,000 points on the benchmarking app.

Apart from the powerful Snapdragon 821 / 823 chipset inside, rest of the specs, as you can see, are normal flagship stuff. In fact, the Le Max 2 flagship comes with a better rear camera (21MP) and larger RAM 6GB module. But there could be a higher-end model of the LEX720 which could turn out to be the true flagship smartphone of the company. Previous rumors have said that the phone could have a version with 8GB of RAM. So, with SD821 and 8GB RAM inside, the upcoming LeEco phone could turn out be the most powerful handset of 2016.

RELATED: LeEco said to release an SD823 powered flagship at MWC Shanghai by the end of June

The company has a new conference on June 29. So let’s wait and watch!

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LeEco is progressing pretty quickly as a smartphone maker. After launching the Le 1 phones, which were the first smartphones from the company, it has now transformed into an important player in the crowded phone market. All thanks to its aggressive pricing strategy. So, whenever LeEco announces a new smartphone launch conference, we all get excited.

Now, LeEco has released a new teaser for the launch of a smartphone on June 29 in Shanghai. Given that the Mobile World Congress – Shanghai commences on June 29, LeEco could be planning to announce this new smartphone and showcase it at the event.

Coming to the most important point here — which phone is the company planning to release on June 29? LeEco hasn’t revealed any details about the phone’s specifications, but we have some guesses.

We have been seeing rumors about a top-end flagship from LeEco, which is even more powerful than the Le Max 2 unveiled back in April. While the previous leaks have shown that the upcoming flagship was going to feature a very similar design as the Le Max 2, it will be coming in two new colors, blue and red. As for the specs, they are nothing less than extraordinary!

Rumors state that the new LeEco flagship will come with the Snapdragon 821 chipset under the hood with a whopping 8GB of RAM and a 25MP rear-facing camera. In case you are wondering, the Snapdragon 821 chipset is not expected to upgrade much in terms of configuration, but the clock speed is expected to be bumped up from 2.15GHz to 2.5GHz. Considering LeEco’s aggressive pricing, it shouldn’t retail for more than 2999 Yuan ($455), which if true, would be just amazing.

However, it seems a bit too early to meet a flagship such as the one mentioned above. SD821 hasn’t been announced yet and still 6GB RAM hasn’t become mainstream among all flagship phones. So, 8GB RAM phone in June seems a bit too early. There have been reports about LeEco releasing this beast sometime in August, which seems more plausible.

So, what can we expect at the launch event on June 29? Well, there are reports that LeEco will announce a special edition of the Le 2 model that was released back in April, most likely called Le 2 Eco edition. From the name, it looks like the phone will come with the company’s services inbuilt.

Anyway, we can expect more information about this launch in the next few days. So, stay tuned!

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LeEco surprised us everyone by announcing the first Snapdragon 820 powered smartphone in the market, namely the Le Max Pro. Although the phone wasn’t sold to the regular consumers in plenty, the company does hold the title of the first manufacturer with SD820 phone. Now, it looks like this Chinese company is going to boast of another great title this year.

According to Chinese media, LeEco is said to be working on a brand new Snapdragon 823 powered smartphone and it is expected to be announced at Mobile World Congress at Shanghai that starts at the end of this month, from June 29 and goes on till July 1. If true, LeEco will probably become the first smartphone maker to release a Snapdragon 823 powered phone!

According to rumors, Snapdragon 823 will come with slightly upgraded specs as compared to the already powerful SD820. The company is said to have increased the clock speed, with other upgrades such as Adreno 530 GPU, X12 LTE baseband and Cat.12 / 13 support. Other possible specs include support for 8GB DDR4 memory and 25MP camera sensor. The Galaxy Note 6 is long rumored to be using this new chip and so is the ASUS ZenFone Deluxe model for some Asian markets.

The Snapdragon 820 is already a powerful chipset and there’s hardly any other chips in the market that can match the performance of this beast. So, it would be interesting to see what the Snapdragon 823 brings to the table. We expect a slight boost in performance (because there’s actually no need for a significant increase right now) along with GPU and some connectivity upgrades as mentioned above.

Considering Snapdragon 820 smartphones started entering the market by February 2016, it would be really surprising if Snapdragon 823 phones make it to the market so early. Qualcomm usually follows yearly release period for its chips, but looks like that’s changing this year.

Anyway, it’s still too early to comment as we don’t have official details, but expect more details soon.

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