The “s” chips inside the Snapdragon 8-series have been popular for offering great performance at an affordable price, and the Snapdragon 8s Gen 4 is no different. It delivers a strong CPU performance with an all-big-core CPU design, a reliable Adreno GPU for smooth gaming, and a mature ISP.

The Dimensity 9300 Plus was announced a year before the Snapdragon 8s Gen 4, featuring an even more powerful CPU with more large cores, a capable GPU, and competitive camera and connectivity capabilities. The real question is whether the Snapdragon 8s Gen 4 truly outperforms the Dimensity 9300 Plus, or if the Dimensity 9300 Plus is too compelling to ignore? Let’s find out.

Let’s begin with the spec sheet:

Snapdragon 8s Gen 4 vs Dimensity 9300 Plus: Benchmark score

Note: The benchmark tests were performed on the POCO F7 (powered by the Snapdragon 8s Gen 4) and the Vivo X200 FE (powered by the Dimensity 9300 Plus) 

Geekbench performance

Thanks to a more performance-focused CPU configuration, the Dimensity 9300 Plus pulls higher Geekbench scores. In the single-core test, it gets about a 5.6% higher score, while the multi-core score is up by 7.3%.

The difference isn’t significant. However, the Dimensity 9300 Plus would still benefit from peak performance. In regular everyday tasks like browsing the internet and scrolling through your social feeds, there shouldn’t be any performance difference, though.

AnTuTu performance

In the AnTuTu benchmark, the Snapdragon 8s Gen 4 outperforms the Dimensity 9300+ by 6% in total score. The latter still gets a slightly higher CPU score, but the Snapdragon chip makes a strong comeback in the GPU score, scoring 465K (vs. 455K on the Dimensity 9300+).

The Snapdragon 8s Gen 4 also benefits from better memory performance, while the Dimensity 9300+ achieves a higher score in the user experience (UX) test.

3DMark performance

3DMark Wild Life Extreme Stress Test

The 3DMark Wild Life Extreme Stress Test further solidifies the point that the Snapdragon 8s Gen 4 offers better gaming performance. It gets about a 10% better high score, which represents the peak performance.

The gap widens significantly to 47% in the low-score test, indicating that the Snapdragon 8s Gen 4 chip doesn’t throttle as much as the Dimensity 9300+ during long gaming sessions. This results in much better stability on Snapdragon 8s Gen 4 devices.

Now that we know the benchmark scores, let’s examine the key differences to get a clearer picture.

Snapdragon 8s Gen 4 vs Dimensity 9300 Plus: Key differences

CPU, GPU & NPU

The CPUs of Snapdragon 8s Gen 4 and Dimensity 9300 Plus comprise Cortex-X4 and Cortex-A720 cores. The Cortex-X4 offers higher performance, while the Cortex-A720 balances power and efficiency. Since the Dimensity 9300 Plus features more Cortex-X4 cores, it is able to achieve higher peak performance in CPU tests across benchmarks. The chip also benefits from a higher CPU clock speed.

Gaming performance has always been a major strength of Qualcomm chips, thanks to highly optimized Adreno GPUs, improved driver support, and excellent sustained performance. The Snapdragon 8s Gen 4 with Adreno 825 GPU achieves a much better score and stability on gaming benchmarks than the Dimensity 9300 Plus with Mali-G720 GPU.

For on-device AI intelligence, the Snapdragon 8s Gen 4 relies on Qualcomm’s Hexagon NPU architecture. It brings generative AI capabilities and support for multimodal and multilingual AI assistants.

Qualcomm also uses AI to improve the camera output and deliver stronger connectivity. MediaTek also leverages its NPU 790 in these areas and supports a variety of popular LLMs, including Alibaba Qwen, Google Gemini nano, and Meta Llama 3.

Camera and imaging

Equipped with an 18-bit triple ISP, the Snapdragon 8s Gen 4 supports up to 320MP single camera and real-time semantic segmentation for photos and videos with up to 250 layers. Furthermore, the chip supports intelligent, real-time skin and sky tone correction and up to 4K video recording at 60fps.

The Dimensity 9300 Plus, on the other hand, features an 18-bit Imagiq 990 ISP with up to 320MP single camera, AI Semantic Analysis Video Engine with 16 categories of scene segmentation, and 8K video recording at 30fps. MediaTek highlights AI-videography and zero-latency video preview as key features.

Connectivity

The Snapdragon X75 5G modem on the Snapdragon 8s Gen 4 is a sub-6GHz-only modem with a peak download speed of 4.2Gbps. Over a Wi-Fi 7 connection, the peak speed jumps to 5.8Gbps. The modem supports Bluetooth 6.0, Bluetooth Low Energy, and XPAN, enabling earbuds/headphones to stay connected via Wi-Fi for wider-range coverage.

The Dimensity 9300+ features an integrated 5G modem supporting both mmWave and sub-6 GHz. Furthermore, it offers higher download speeds over 5G and Wi-Fi connections, but doesn’t bring support for the latest Bluetooth standard.

Snapdragon 8s Gen 4 vs Dimensity 9300 Plus: Which is a better choice?

The Snapdragon 8s Gen 4 features a more powerful Adreno 825 GPU, delivering a smooth gaming experience, even during longer sessions, with much less throttling. The positive aspects also include a high memory performance, an advanced Hexagon NPU, a mature 18-bit AI ISP, and Bluetooth 6.0 support.

The Dimensity 9300 Plus excels in peak CPU performance and supports 8K video recording. The integrated 5G modem supports both mmWave and sub-6GHz bands with faster download speeds. And the Imagiq 990 ISP features AI video enhancements and zero-latency preview.

In short, the Snapdragon 8s Gen 4 is a better choice for gaming, while the Dimensity 9300 Plus delivers higher peak CPU performance. For everyday usage, both chipsets offer a similar performance with no significant difference.

The post Snapdragon 8s Gen 4 vs Dimensity 9300 Plus: Benchmark scores, spec sheet, and key differences appeared first on Gizmochina.

The Dimensity 9400 is a true flagship chipset from MediaTek, featuring an all-big-core CPU design that aims to deliver high peak and sustained performance. It’s powerful enough to rival Qualcomm’s Snapdragon 8 Elite, even if it trails in a few areas, as noted in our detailed comparison. That makes the Snapdragon 8 Gen 5 an interesting opponent.

Announced in November 2025, the Snapdragon 8 Gen 5 sits just below the Snapdragon 8 Elite and therefore is an exciting matchup against the Dimensity 9400. The big question is: can Qualcomm’s sub-Elite flagship hold its ground against MediaTek’s all-big-core powerhouse?

Let’s begin with the spec sheet:

Dimensity 9400 vs Snapdragon 8 Gen 5: Benchmark score

Note: The benchmark tests were performed on the Vivo X200 Pro (powered by Dimensity 9400) and the OnePlus 15R (powered by Snapdragon 8 Gen 5).

Geekbench score

The single-core scores are pretty close, but Qualcomm holds a slight 4.5% lead. The gap widens in multi-core performance, where the Snapdragon 8 Gen 5 posts a 9% higher score than the Dimensity 9400.

Geekbench scores suggest higher peak performance for the Snapdragon 8 Gen 5. In everyday tasks like browsing the internet, scrolling through your social app feeds, and watching movies, you’d hardly be able to spot a difference.

AnTuTu score

On the AnTuTu benchmark, the Snapdragon 8 Gen 5 scores nearly 3 million, while the Dimensity 9400 reaches 2.7 million. That’s about a 9% higher score for the Snapdragon chip.

The Snapdragon 8 Gen 5 consistently outperforms the Dimensity 9400 across every AnTuTu test, though the difference is not significant. The CPU score is 7% higher, and the GPU score is 5% higher. The memory and UX scores also favor the Snapdragon chip.

The benchmarks favor Snapdragon 8 Gen 5 over the Dimensity 9400 in terms of performance, but they don’t provide insights into the capabilities of connectivity, camera, and other important aspects of the chips. So, let’s dig further to uncover the real-world differences between the two high-end chips.

Dimensity 9400 vs Snapdragon 8 Gen 5: Key differences

Both Dimensity 9400 and Snapdragon 8 Gen 5 are manufactured using TSMC’s 3nm process, but the latter uses the N3P node, which offers slightly better performance and power efficiency over the N3E node used for the Dimensity 9400.

Furthermore, the chips differ greatly in terms of CPU architecture. The Dimensity 9400 has a 1+3+4 layout, featuring one Cortex-X925 prime core, three Cortex-X4 performance cores, and four Cortex-A720 performance cores. In contrast, the Snapdragon 8 Gen 5 features a 2+6 CPU layout with two Oryon prime cores and six Oryon performance cores.

Notably, the Snapdragon 8 Gen 5 features third-generation Oryon cores, the same CPU cores from the top-tier Snapdragon 8 Elite Gen 5 chipset. They offer better performance and power efficiency than those inside the Dimensity 9400. Plus, they run at higher speeds, offering an additional performance boost.

For graphics rendering, the Dimensity 9400 relies on the Mali-G925 Immortalis MP12 GPU, while the Snapdragon chip uses the Adreno 829 GPU with the new Sliced architecture. Both chips offer ray tracing capabilities, along with their own set of gaming features: Snapdragon Elite Gaming on the Snapdragon 8 Gen 5 and MediaTek HyperEngine Gaming Technology on the Dimensity 9400.

The Snapdragon 8 Gen 5 also maintains an edge in imaging capabilities, as it borrows the triple 20-bit ISP from the Snapdragon 8 Elite Gen 5 with strong “always-sensing” camera support. The Dimensity 9400 features an Imagiq 1090 ISP with emphasis on HDR video across the zoom range and AI-assisted zoom features.

Both chipsets offer robust connectivity features, although the Snapdragon chip may have some advantage here, thanks to mature modem and better carrier-integration in some regions. Furthermore, the chip supports mmWave, UWB, and dual-way satellite connectivity, which are not mentioned on the official Dimensity 9400 page.

Dimensity 9400 vs Snapdragon 8 Gen 5: Conclusion

The Snapdragon 8 Gen 5 holds an upper hand in almost every aspect over the Dimensity 9400. It offers better CPU and GPU performance, a more powerful ISP with greater capabilities, and advanced connectivity features.

That said, the Dimensity 9400 is still a capable high-end chipset with strong performance and robust connectivity. Plus, you’ll likely get a device powered by this chip at a lower price than one powered by Snapdragon 8 Gen 5. That makes it a sweet deal for those looking for a high-performance device at an affordable price. For the absolute best of the two, the Snapdragon 8 Gen 5 is clearly the better choice.

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The Snapdragon 8 Gen 5 is a powerful high-end chipset from Qualcomm, featuring third-generation Oryon CPU, the same CPU from the top-tier Snapdragon 8 Elite Gen 5 chip, but at a lower price. The chipset also integrates a capable Adreno GPU, advanced camera ISP, and robust connectivity, making it a well-rounded option.

On the other hand, the Dimensity 9500 is MediaTek’s most premium smartphone chip, featuring newer-gen C1-series cores. This chip offers serious performance and power efficiency. It would be exciting to see how the Snapdragon 8 Gen 5 performs against the Dimensity 9500. So, let’s dive in.

Here’s the spec sheet to begin with:

Snapdragon 8 Gen 5 vs Dimensity 9500: Benchmark score

Note: The benchmark tests were performed on the OnePlus 15R (powered by Snapdragon 8 Gen 5) and the Vivo X300 Pro (powered by Dimensity 9500).

Geekbench score

The Dimensity 9500 comfortably outperforms the Snapdragon 8 Gen 5 on Geekbench, with a 21% higher single-core score and an 8% higher multi-core score. This should result in better peak performance on Dimensity 9500-powered devices across tasks that require either a single CPU core or multiple cores.

AnTuTu score

AnTuTu scores tell a similar story, with the Dimensity 9500 getting about 22% higher score than the Snapdragon 8 Gen 5. The Dimensity chip continues to lead the CPU score, but the GPU makes a bigger impact here, with a massive 40% higher score. The memory score is more than twice that of the Snapdragon 8 Gen 5, while the user experience (UX) score just beats the Snapdragon chip.

Benchmark scores suggest a clear performance advantage for the Dimensity 9500 over the Snapdragon 8 Gen 5. However, that’s not the complete picture. They do not cover every aspect, such as connectivity, on-device AI, ISP, and more. So, let’s dig further to find out which one is actually the better chipset overall.

Snapdragon 8 Gen 5 vs Dimensity 9500: Key differences that matter

CPU, GPU, & NPU

The Snapdragon 8 Gen 5 uses a 2+6 CPU configuration, featuring two Oryon prime cores and six Oryon performance cores. In contrast, the Dimensity 9500 features a 1+3+4 CPU configuration, with one Cortex C1-Ultra prime core, three Cortex C1-Premium performance cores, and four Cortex C1-Pro lower-power cores. The Dimensity chip has a higher peak speed, allowing it to achieve higher peak performance. We just saw that in benchmark scores.

For rendering graphics, the Snapdragon 8 Gen 5 primarily relies on the Adreno 829, leveraging the Qualcomm Sliced architecture and a full suite of Snapdragon Elite Gaming features to deliver smooth gaming performance with lower latency and stable frame rates. In contrast, the Dimensity 9500s uses Mali-G1 Ultra MP12 GPU with support for MediaTek HyperEngine Gaming Technology and 120fps ray-traced mobile gaming.

Both chipsets feature capable NPUs (the Hexagon NPU on the Snapdragon 8 Gen 5 and the MediaTek NPU 990 on the Dimensity 9500) with multimodal and agentic AI capabilities. The AI also helps optimize camera output, the gaming experience, and connectivity.

Camera, ISP, & connectivity

The Snapdragon 8 Gen 5 uses a 20-bit Spectra triple AI-ISP, while the Dimensity 9500 relies on the Imagiq 1190 ISP to convert raw data into usable photos and videos. Additionally, there are numerous features to improve the output quality. Furthermore, there are additional optimizations from the smartphone brand that could make a significant difference.

Both chipsets deliver robust connectivity features, including 5G support, Bluetooth 6.0 standard, and impressive peak download and upload speeds. However, Qualcomm may have an edge in some markets, such as North America, due to stronger carrier aggregation and more mature modem capabilities.

Snapdragon 8 Gen 5 vs Dimensity 9500: Which is a better choice?

The Dimensity 9500 is the better choice overall. Its newer C1-series CPU cores, higher clock speeds, and stronger GPU output translate into superior benchmark scores and better peak performance, especially in demanding tasks and high-end gaming. The chip should also deliver better power efficiency.

However, if peak performance and longer gaming sessions are not your thing, the Snapdragon 8 Gen 5 is actually a more sensible choice. It delivers robust connectivity, a mature ISP, and better computational photography. On top of everything, the Snapdragon 8 Gen 5 phones tend to be cheaper than phones powered by Dimensity 9500.

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The Dimensity 9500s is a powerful high-end smartphone chipset, promising strong performance and solid power efficiency. That, paired with an upgraded NPU supporting agentic AI and a fully modern connectivity stack, positions it as a flagship-tier contender, directly competing with powerful Qualcomm chips.

The Dimensity 9500s go head-to-head with some powerful Snapdragon 8-series chips, including the Snapdragon 8 Gen 5 and Snapdragon 8 Elite. We’ve already compared it with the Snapdragon 8 Gen 5 (more about it here), and now it’s time for another high-end chip battle. In this comparison, we’ll see how the Dimensity 9500s stack up against the Snapdragon 8 Elite, with its Oryon CPU,  Adreno 840 GPU, and advanced imaging capabilities.

Here’s the spec sheet to begin with:

Dimensity 9500s vs Snapdragon 8 Elite: Benchmark scores

There’s no Dimensity 9500s-powered smartphone on the market right now. However, the upcoming Redmi Turbo 5 Max, which would carry the same chipset, was recently spotted in AnTuTu and Geekbench listings.

According to leaked benchmark listings, the upcoming Redmi phone powered by the Dimensity 9500s achieves 2,862 points in the single-core test and 9,130 points in the multi-core test. In contrast, the OnePlus 13 (powered by the Snapdragon 8 Elite) bags higher scores: 3,026 (single-core) and 9,306 (multi-core).

The leaked AnTuTu listing for the Redmi Turbo 5 Max shows rather surprising results. The Dimensity 9500s-powered device achieves a total score close to 3.3 million, while the Snapdragon 8 Elite-powered OnePlus 13 scores a little under 3 million. The breakdown of the AnTuTu score shows that the Dimensity 9500s achieves higher scores across all tests, including CPU, GPU, memory, and user experience.

Please note that benchmark scores for the Dimensity 9500s are based on leaks, not on real testing. We’ll update the score once we’ve reviewed a device powered by the same MediaTek chipset.

Dimensity 9500s vs Snapdragon 8 Elite: Key differences you should know

CPU

Starting with the CPU, the Dimensity 9500s opts for a 1+3+4 configuration, featuring one Cortex-X925 prime core, three Cortex-X4 performance cores, and four Cortex-A720 efficiency cores. In contrast, the Snapdragon 8 Elite uses a 2+6 configuration, with two Oryon prime cores and four Oryon performance cores.

The second-gen Oryon core generally outperforms Cortex-X925 in peak performance. The Snapdragon 8 Elite also benefits from a higher CPU clock speed. In terms of peak CPU performance, the Snapdragon 8 Elite has the edge. However, in day-to-day tasks like browsing the internet, scrolling through social media apps, and video streaming, there shouldn’t be a performance gap.

GPU

For graphics rendering, the Dimensity 9500s integrates Immortalis‑G925 GPU with up to 12 cores. MediaTek claims ray tracing support with console-grade lighting and reflections. MediaTek Adaptive Gaming Technology 3.0 (MAGT 3.0) and MediaTek Frame Rate Converter 3.0 (MRFC 3.0) further enhance the gameplay and power efficiency.

The Snapdragon 8 Elite features Adreno 830 GPU with Qualcomm’s sliced GPU architecture for better power efficiency and higher sustained performance. The chip also supports real-time hardware ray tracing and includes a full suite of Snapdragon Elite Gaming features to achieve higher frame rates, improved power efficiency, and lower latency.

AI and on-device capabilities

Both chipsets have capable NPUs with multimodal GenAI capabilities and support for modern LLMs. Additionally, MediaTek claims Agentic AI support for the Dimensity 9500s, whereas Qualcomm has made no such claims.

Camera

The Dimensity 9500s and Snapdragon 8 Elite feature 18-bit ISPs with support for up to 320MP resolution. One key advantage of the Qualcomm chip here is that it allows three 48MP cameras at 30fps, while the Dimensity chip limits them to 36MP. The Dimensity 9500s, however, supports 8K video recording at 60fps, while the Snapdragon 8 Elite can do 8K/30fps recording.

The Snapdragon 8 Elite supports limitless real-time semantic segmentation up to 250 layers. MediaTek hasn’t mentioned semantic segmentation on its official page, but it’s safe to say the Dimensity 9500s support it based on the chip’s capabilities. Furthermore, both chips bring numerous features to improve photos and videos.

Connectivity

The Snapdragon 8 Elite and Dimensity 9500s feature flagship-class connectivity platforms, but the Snapdragon 8 Elite is specced more aggressively for cellular peak speeds, Bluetooth standard, and integrated UWB, while Dimensity 9500s emphasizes higher Wi-Fi speed and long-range Bluetooth.

Dimensity 9500s vs Snapdragon 8 Elite: Conclusion

The Dimensity 9500s prove that MediaTek is no longer playing in the shadows of Qualcomm’s flagship lineup. It offers strong benchmark scores, modern CPU and GPU architectures, advanced AI capabilities, and robust connectivity, positioning itself as a true competitor to Snapdragon 8-series chips.

That said, the Snapdragon 8 Elite may still hold advantages in peak CPU performance, a mature ISP, and modem features, backed by Qualcomm’s mature software ecosystem and long-standing OEM trust.

Please note that there’s no Dimensity 9500s-powered smartphone on the market as of writing this post. So, this comparison may not give you the complete picture. We’ll update it after thoroughly testing a device powered by this new Dimensity chip.

The post Dimensity 9500s vs Snapdragon 8 Elite: Which offers superior performance? appeared first on Gizmochina.

While MediaTek continues to dominate the global smartphone chipset market, according to Counterpoint Research, the company’s grip on the high-end remains relatively weak. Qualcomm and Apple have long dominated this segment, but MediaTek is closing the gap fast by offering competitively-specced and better-priced chipsets — and its latest Dimensity flagships, such as Dimensity 9500 and 9500s, now pose a serious challenge to the best from the other two.

So, the real question is: can MediaTek’s newest silicon overtake Qualcomm and Apple in the high-end segment — or at least meaningfully shift its position in it?

The term “high-end chipsets” may be confusing in itself. Many refer to mid-range chips as high-end and top-tier as flagship, while high-end chips generally refer to flagship-tier processors, designed to deliver peak CPU and GPU performance, advanced on-device AI capabilities, and top-tier power efficiency. In 2026, that elite group is led by Apple’s A-series chips, Qualcomm’s Snapdragon 8-series flagships, and MediaTek’s Dimensity 9000 series processors.

MediaTek’s flagship push: From an affordable alternative to a competitive flagship

Not long ago, MediaTek was primarily associated with entry-level and mid-range chipsets, valued for affordability rather than raw performance. That perception began to shift with the arrival of the Dimensity lineup, but the dramatic shift came with the Dimensity 9000 series in late 2021. MediaTek framed it as a flagship chip “for next-generation flagship smartphones,” with broad OEM endorsements, including Oppo, Vivo, Xiaomi, and Honor.

With the latest Dimensity 9500, MediaTek is no longer positioning itself as a value alternative but competes directly with Snapdragon 8 Elite Gen 5 and Apple A19 Pro. In fact, the Dimensity 9500 beats the other two chips on several key benchmarks.

CPU and GPU performance battle

Qualcomm and Apple held a consistent lead in both CPU and GPU performance for a long time, but the newest silicon from MediaTek, particularly the Dimensity 9500, operates in the same performance class.

The Dimensity 9500 features a newer generation of ARM cores, including C1-Ultra, C1-Premium, and C1-Pro, with a cutting-edge CPU architecture to deliver strong CPU performance. Day-to-day tasks, heavy multitasking, and demanding workloads on a Dimensity 9500-powered device feel just as smooth as high-end chips from Qualcomm and Apple.

GPU performance tells a similar story — an area where Qualcomm has had no real competition in Android, now faces a legitimate challenge from MediaTek. Recent MediaTek high-end chips have significantly closed the gap in GPU performance, signaling that MediaTek is no longer playing catch-up in graphics performance.

Here are the benchmark numbers that offer more clarity:

Note: The benchmark tests were performed on the Vivo X300 Pro (Dimensity 9500), OnePlus 15 (Snapdragon 8 Elite Gen 5), and iPhone 17 Pro (Apple A19 Pro).

Geekbench score

Apple continues to lead the single-core performance chart on Geekbench, but interestingly, the Dimensity 9500 almost matches the Snapdragon 8 Elite Gen 5. The multi-core performance, however, tells a different story. The Dimensity chip scores higher than the A19 Pro but slightly lower than the Snapdragon chip.

3DMark score

Wild Life Extreme Stress Test

Solar Bay Test

In the 3DMark Wild Life Extreme test, the Snapdragon 8 Elite Gen 5 achieves the highest score, but the Dimensity 9500 is just behind it, with a difference of only 1.27%. Meanwhile, the A19 Pro sits at the bottom, and the gap is also pretty significant.

In the Solay Bay test (to measure the ray tracing performance), the Dimensity 9500 actually gains the top spot with 13,973 points, while the Snapdragon 8 Elite Gen 5 and Apple A19 Pro achieve 13,108 and 11,829 points, respectively.

The benchmark scores also verify that MediaTek’s newest chips aren’t just competing with the greatest from Qualcomm and Apple, but also outperforming them in some ways.

AI and on-device intelligence

The demand for on-device AI intelligence is stronger than ever, and therefore, modern chips are expected to handle increasingly complex AI workloads without relying on the cloud. This is an area where Qualcomm and Apple have invested heavily for years, but MediaTek is now pushing just as aggressively.

The newer high-end Dimensity chips feature significantly upgraded AI engines, which enable advanced on-device generative features, improved camera computation, and machine learning tasks. Tasks like real-time translation, background removal in video, AI-assisted photo editing, and contextual voice processing are now handled faster and more efficiently than on previous MediaTek generations.

Qualcomm’s Snapdragon 8-series chips still hold an advantage in terms of software ecosystem maturity, while Apple continues to benefit from deep integration between its Neural Engine and iOS. However, MediaTek’s aggressive focus on AI performance is sharply closing the gap.

Modem, connectivity, and ISP capabilities

Qualcomm has long been regarded as the industry leader in mobile connectivity, thanks to its in-house modem technology. Its latest Snapdragon 8-series chips deliver top-tier 5G performance and strong carrier integration support. Apple also uses Snapdragon modems and further optimizes its connectivity stack through deep hardware-software integration to provide fast, reliable connectivity.

MediaTek’s Dimensity flagships have made substantial progress in this department. The latest chips integrate advanced 5G modems, modern Wi-Fi and Bluetooth standards, and improved power efficiency. Connectivity performance on recent Dimensity-powered flagships, in most cases, is now largely on par with that of Snapdragon-powered devices.

Final verdict: The flagship race just got serious

MediaTek is no longer a flagship-alternative, but is clearly positioning itself as a genuine performance contender. The Dimensity 9500 demonstrates that MediaTek can now match Qualcomm and Apple in CPU performance, challenge them in GPU workloads, and deliver competitive AI and connectivity capabilities — everything at an aggressive pricing. The benchmark numbers also make it clear that MediaTek isn’t playing a catch-up game anymore.

That said, Qualcomm still benefits from deep relationships with Android OEMs, mature software optimizations, and a long-standing reputation in the premium space. Apple, meanwhile, continues to leverage hardware-software integration and ecosystem lock-in that silicon performance alone can’t disrupt.

So, can MediaTek finally overtake them? Not entirely — at least not yet. But it has undeniably changed perceptions among brands and people, treating it as a real flagship rival rather than a budget-focused alternative. Now, there’s a real competition to Qualcomm in the high-end Android segment.

The post Can MediaTek’s latest chipsets finally overtake Qualcomm and Apple in the high-end segment? appeared first on Gizmochina.

Reliable tipster Digital Chat Station has shared fresh insights into the roadmap of next-generation flagship smartphones, building on an earlier post that discussed launch timelines for upcoming Dimensity-powered devices. In that earlier update, he suggested that at least either Oppo or Vivo could launch an iterative flagship as early as September. He also hinted that delaying ultra-premium models until April may not align well with faster chipset refresh cycles, especially for so-called “Ultra” variants.

The tipster contrasted this with Xiaomi’s established rhythm, where standard and Pro models typically arrive around September, followed by Ultra models towards the end of the year. He suggested that other brands may benefit from adopting a similar staggered launch strategy to better match chipset evolution.

Rumored chipsets for Pro Max and Ultra flagships

In his newer Weibo posts, DCS claims that if Oppo and Vivo move forward with Pro Max-branded models, these devices are likely to feature MediaTek’s upcoming Dimensity 9600 series chip built on TSMC’s N2P (2nm) process. He describes this as a full-performance flagship platform, indicating that Pro Max models may prioritize sustained performance and scale.

At the same time, he suggests that Qualcomm’s next Snapdragon 8 Elite Gen 6 Pro, identified internally as SM8975, may be reserved exclusively for Ultra-branded premium, imaging-focused flagships rather than mainstream Pro or Pro Max devices. In replies, DCS further notes that both the Snapdragon 8 Elite Gen 6 and its Pro variant are expected to be manufactured on a 2nm process by TSMC, but with clear segmentation between standard iterative flagships and top-tier models.

He also reiterates that multiple brands under the OV and “H” umbrella are planning Pro Max variants for their next flagship cycles, adding that one brand, abbreviated as “MH” has already introduced such a model in the current generation. Here, “H” appears to be Honor and “MH” seems to be Huawei, which has already launched the Huawei Mate 80 Pro Max.

While none of this has been officially confirmed, the posts collectively point towards tighter launch schedules, clearer flagship tiering, and more aggressive adoption of next-generation silicon across major Chinese smartphone brands.

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In September, MediaTek announced Dimensity 9500 as its most powerful smartphone chipset, and now we’ve an affordable version of it, dubbed Dimensity 9500s. This is still a flagship-grade chipset, promising excellent performance, power efficiency, and competitive AI capabilities.

The Dimensity 9500s would directly compete with the Snapdragon 8 Gen 5, which was announced in November. Both high-end chipsets target the same user segment, so it’s exciting to see how they stack up against each other.

Dimensity 9500s vs Snapdragon 8 Gen 5: Who has the edge?

Both Snapdragon 9500s and Snapdragon 8s Gen 5 use TSMC’s 3nm process node, though there are some differences. The Dimensity chip uses N3E process technology, while the Snapdragon chip uses a more refined N3P node, offering slight improvements to performance and efficiency.

CPU performance

The Dimensity 9500s features an all-big-core CPU design, led by a Cortex-X925 prime core. The octa-core CPU also includes three Cortex-X4 performance cores and four Cortex-A720 power efficiency cores.

• 1 x Cortex-X925 at 3.73 GHz
• 3 x Cortex-X4 at 3.30 GHz
• 4 x Cortex-A720 at 2.0 GHz

In contrast, the Snapdragon 8 Gen 5 features a 2+6 CPU configuration with all third-generation custom-designed Oryon cores.

• 2 x Oryon cores (3rd-gen) at 3.8 GHz
• 6 x Oryon cores (3rd-gen) at 3.32 GHz

From the spec sheet alone, it’s difficult to say which chipset has a faster CPU. And unfortunately, we don’t have benchmark data for the Dimensity 9500s yet. It will take a while for the brand to launch devices with this new Dimensity chipset.

However, if I had to take a calculated guess, the Snapdragon 8 Gen 5 should offer faster CPU performance. That’s because this chip has the same CPU configuration as the flagship Snapdragon 8 Elite Gen 5, but with a slightly lower clock speed. That gap in clock speeds shouldn’t matter as much as the Dimensity 9500s using CPU cores a generation older than the Dimensity 9500.

GPU performance

For graphics rendering, the Dimensity 9500s uses Immortalis-G925 MP12 GPU. MediaTek hasn’t provided more details about the GPU, such as frequency, binning, etc. So, for now, it’s inaccurate to say it’s the same Immortalis-G925 GPU that’s been used inside the Dimensity 9400 and 9400+ chips.

We’ll have to wait for benchmark data or third-party teardowns for better clarification. However, I’m pretty sure the Dimensity 9500s would bring some GPU improvements, if not major upgrades.

The Snapdragon 8 Gen 5, on the other hand, ships with an Adreno 829 GPU with ray tracing support and a full suite of Snapdragon Elite Gaming features. We’ll run benchmark tests and update the data here to provide clearer insight into GPU performance.

AI capabilities

The demand for on-device AI capabilities, such as AI assistants, AI image/video editing, and generative AI, is stronger than ever. Both MediaTek and Qualcomm understand this, and therefore most of their new chips come with powerful NPUs.

The Dimensity 9500s has a MediaTek NPU with support for multimodal models and agentic AI. The NPU also helps with AI photo editing, AI summarization, and a wide range of tools for cameras, creativity, and productivity.

The Snapdragon 8 Gen 5’s Hexagon NPU also supports agentic AI, which can learn and adapt to your preferences over time for highly personalised recommendations. The AI also helps improve camera output and connectivity.

Camera & imaging

The Dimensity 9500s integrates an 18-bit Imagiq ISP. It’s a content-aware ISP, which uses advanced Super Resolution techniques to improve clarity, even at high zoom levels. The chip supports up to 320MP single camera and up to 8K video recording at 60fps.

In contrast, the Snapdragon 8 Gen 5 features a 20-bit triple AI ISP, with up to 320MP single camera and 4K/120fps video recording. The chip also supports up to 8K video recording, but at lower frame rates. Additionally, the 8 Gen 5 offers numerous photo and video features, including Truepic photo capture, Bokeh Engine, and Video super resolution.

Connectivity

Both chipsets offer excellent connectivity features, although there are several notable differences. For example, the Dimensity 9500s supports the 3GPP Release 17 standard, while the Snapdragon 8 Gen 5 supports the newer Release 18 standard with additional enhancements.

Over a 5G connection, the Dimensity chip’s download speed can go up to 7 Gbps, while the Snapdragon chip can reach even higher, up to 10 Gbps. The Dimensity 9500s makes a comeback with a higher peak Wi-Fi speed (6.5 Gbps vs 5.8 Gbps).

Dimensity 9500s vs Snapdragon 8 Gen 5: Conclusion

From the spec sheet, the Snapdragon 8 Gen 5 appears to have an edge over the Dimensity 9500s. However, note that specs alone do not give the complete picture. We’ll update this post once we’ve tested a device powered by a Dimensity 9500s for better clarity.

The Redmi Turbo 5 Max will be among the very first phones to feature the Dimensity 9500s chip. It’s expected to launch later this month. Meanwhile, click here to see how the Snapdragon 8 Gen 5 stacks up against the competition.

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The Snapdragon 7 Gen 4, announced in May, has quietly become a popular choice among mid-range phones, powering many devices from top brands, including the Oppo Reno 15, Vivo T4 Pro, Realme 16 Pro+ 5G, and more.

On the other hand, we have the Dimensity 8350 from MediaTek, which was announced in late 2024. From the spec sheet, it appears the Snapdragon 7 Gen 4 has a powerful CPU, but the Dimensity 8350’s higher CPU clock speed makes a more significant difference. Let’s dive deeper into the benchmark scores and real-world differences to find out who has the edge.

Let’s begin with the spec sheet:

Snapdragon 7 Gen 4 vs Dimensity 8350: Benchmark score

Note: The benchmark tests were performed on the Vivo T4 Pro (powered by the Snapdragon 7 Gen 4) and the Oppo Reno 14 (powered by the Dimensity 8350).

Geekbench score

Even though the Snapdragon 7 Gen 4 has newer CPU cores, the higher clock speeds in Dimensity 8350 achieve more on the Geekbench benchmark. The single-core speed is up by 5%, while the multi-core gap widens to about 10%.

While the differences aren’t significant, the Dimensity chip should perform better during higher workloads. For day-to-day tasks like browsing the internet, scrolling through social media apps, or watching videos, both should achieve a similar performance.

AnTuTu score

AnTuTu shows a rather significant performance gap between the two chips, with the Dimensity 8350 delivering a total score that’s 39% higher than the Snapdragon 7 Gen 4. The biggest difference comes from the GPU performance. The Snapdragon 7 Gen 4 scores 323,797 points in the graphics test, while the Dimensity 8350 crosses the 500K mark, a massive 72% lead.

The Snapdragon chip does score slightly higher in CPU tests, but the margin is too small to consider. Meanwhile, the Dimensity 8350 also pulls ahead in memory and UX scores.

The benchmarks show a clear advantage for the Dimensity 8350 chipset, especially in terms of GPU performance. That said, there are still some important aspects that benchmarks don’t cover, such as connectivity and the camera, which we’ll discuss in the following section.

Snapdragon 7 Gen 4 vs Dimensity 8350: Here are the key differences

Both octa-core chips have been fabbed using TSMC’s 4nm process node, although their core configurations differ. The Snapdragon 7 Gen 4 has a 1+4+3 core configuration, featuring one Cortex-A720 big core, four Cortex-A720 mid cores, and three Cortex-A520 small cores.

In contrast, the Dimensity 8350 features a 1+3+4 CPU configuration, with one Cortex-A715 big core, three Cortex-A715 mid cores, and four Cortex-A510 small cores. While the Snapdragon chip features newer cores, the Dimensity 8350 cores benefit from higher clock speed.

For graphics rendering, the Snapdragon 7 Gen 4 features Adreno 722, while the Dimensity 8350 has a Mali-G615 MP6 GPU. The latter features higher frequency, more pipelines, and higher computational power (FLOPS). These are among the reasons why the Dimensity 8250 achieved a much higher GPU score on AnTuTu.

Furthermore, the Dimensity chip features a higher-bit camera and supports higher camera resolution. The output, however, largely depends on the camera sensor and OEM optimizations. The Snapdragon chip may have an edge in connectivity, thanks to newer standard Wi-Fi 7 and Bluetooth 6.0 technologies. The Dimensity chip benefits from a higher peak download speed over a 5G connection (5.17Gbps vs 4.2Gbps).

Snapdragon 7 Gen 4 vs Dimensity 8350: Which one should you choose?

The Dimensity 8350 is a well-rounded choice over the Snapdragon 7 Gen 4. It offers higher peak performance, an advanced camera ISP, and a higher peak download speed over a 5G connection.

If peak performance isn’t your concern, the Snapdragon 7 Gen 4 can be a more reliable choice, while ensuring future-proof connectivity with Wi-Fi 7 and Bluetooth v6.0.

Best Snapdragon 7 Gen 4 phones:

• Oppo Reno 15
• Realme 16 Pro+ 5G
• Vivo V60 5G (review)
• Vivo T4 Pro 5G
• Motorola Edge 70 5G

Best Dimensity 8350 phones:

• OnePlus Nord CE 5 (review)
• Motorola Edge 60 Pro
• Oppo Reno 14 (review)
• Realme P3 Ultra

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Alongside the more affordable Dimensity 8500, MediaTek also announced the Dimensity 9500s in the event today. The processor sits just below MediaTek’s top Dimensity 9500, and is designed to power sub-flagship phones. 

At the heart of the new chip is a flagship-style all-core CPU architecture built on TSMC’s second-generation 3nm manufacturing process. The processor includes a Cortex-X925 core (@3.73GHz), three Cortex-X4 (@3.30GHz), and four Cortex-A720 (@2GHz) cores, and more than 29 billion transistors. 

According to the company, the chip supports “super memory compression technology” that helps speed up everyday tasks. MediaTek claims this can improve app launch speeds by up to 44 percent once enabled. The Dimensity 9500s also comes with a large 19MB CPU cache and 10MB of system cache. 

Graphics duties are handled by a flagship-grade Immortalis-G925 GPU that supports ray-tracing. The chip can also handle a range of on-device AI tasks without needing an internet connection. 

Camera and AI

The 9500s is also built with camera and video features in mind. MediaTek says it includes a high-end autofocus engine, fast capture capabilities, and a semantic segmentation video engine for smarter image processing. On the video side, the chip supports 8K HDR recording with Dolby Vision.

Moving to connectivity, the processors include a 5G Release 17 modem with support for four-carrier aggregation and theoretical download speeds of up to 7Gbps. 

It also supports Wi-Fi 7 with speeds up to 6.5Gbps. And MediaTek even highlighted a new Bluetooth feature that allows direct phone-to-phone connections at distances of up to five kilometers without using cellular networks.

MediaTek confirmed that the first phone to use the new processor will be the Redmi Turbo 5 Max. In lab testing, that device reportedly managed to score 3,612,095 points in the AnTuTu benchmark.

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MediaTek has officially taken the wraps off its latest chip for mid-range smartphones, the Dimensity 8500. The company announced the processor today at a launch event where it also introduced the Dimensity 9500s.

The Dimensity 8500 is built around an all-big-core design based on TSMC’s N4P (4nm) process. What’s interesting about this setup is that Cortex-A725 cores make up all eight CPU cores, running at different clock speeds. A prime Cortex-A725 core clocks at 3.4GHz, three high-performance Cortex-A725 cores run at 3.20GHz, and four additional Cortex-A725 cores operate at 2.20GHz.

The Dimensity 8400 also uses an all-Cortex-A725 design, but MediaTek says this second-generation all-big-core CPU delivers a 7% performance improvement. The chip also supports faster LPDDR5X memory with speeds of up to 9600Mbps, increasing memory bandwidth by as much as 12%

Dimensity 8500 brings a boost in GPU performance

Where the Dimensity 8500 makes its biggest jump is in the graphics department. The chip uses a new Mali-G720 MC8 GPU, which reportedly delivers 25% higher peak performance than the previous generation while cutting power consumption by 20% at peak load. 

The company is also touting the 8500 as the first chip in its segment to bring “realistic ray tracing” to more affordable flagship-style phones.

As for the actual gameplay, MediaTek says the GPU can deliver stable frame rates above 110fps even in outdoor environments at 35 degrees Celsius. Its Dimensity Multi-Frame Rate technology is further designed to save up to 30% power during gameplay, while MOBA titles can see power savings of up to 37%.

AI, Camera and Connectivity

It’s 2026, so it’s a violation not to talk about artificial intelligence. The Dimensity 8500 uses MediaTek’s NPU 880 for neural processing and supports on-device generative AI features such as real-time translation and image generation. The chip is also compatible with the Dimensity AI Development Kit and major global language models (LLM / MLLM). 

For optics, MediaTek is offering several AI-assisted imaging tools, including an AI Ultra-Clear Telephoto Algorithm, semantic segmentation, and AI-powered reflection and glare removal. Furthermore, you get support for cinema-grade 4K HDR video recording, zero shutter lag, and full-pixel phase detection autofocus.

On the connectivity side, the Dimensity 8500 features a 5G modem capable of download speeds up to 5.17Gbps, along with three-carrier aggregation and dual-SIM dual-standby. MediaTek’s UltraSave 3.0+ technology is also included to help reduce power consumption during network use.

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After the performance rankings, AnTuTu has shared its latest snapshot of the Android processor landscape in China for Q4 2025. Unsurprisingly, Qualcomm is the leader with over 70% market share, but there’s a surprise new entry to the list. 

According to the data, Qualcomm-powered devices make up 71.2 percent of Android phones in use. The figure effectively means that around seven out of every ten Android smartphones currently in the Chinese market are running on a Qualcomm chip. 

Qualcomm’s share comes from its wide mobile processors for the mid-to-high end segment. The Snapdragon 8 Elite / Gen series is the default choice for many Android flagships, while the Snapdragon 7 and Snapdragon 6 series fill the mid-range segment. Then there’s the Snapdragon 4 series for affordable phones. 

MediaTek is the second biggest, followed by Samsung

MediaTek, meanwhile, enjoys 27.4% market share. While that’s still a long way behind Qualcomm, MediaTek has been on a steady rise over the past few years. The company’s Dimensity 9000 series chips have become popular among manufacturers looking to balance performance and cost.

However, the company’s biggest win comes from budget and mid-range phones, largely dominated by Helio and Dimensity 7000 and 8000 chips. For instance, AnTuTu’s mid-range smartphone ranking for December 2025 shows 9 out of 10 phones with a MediaTek chip.

Beyond those two, the field thins out quickly. Samsung ranks third with a modest 0.6 percent share, largely limited to its own Galaxy devices using Exynos processors. 

Surprisingly, Xiaomi has also made it onto the list with a 0.4% market share. Its XRING O1 processor is currently exclusive to the Xiaomi 15S Pro and Xiaomi Pad 7 Ultra. The fact that only two devices allowed it to make the list suggests that Xiaomi’s self-developed chip has already gained traction within the vast smartphone landscape.

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MediaTek has confirmed that it will hold a launch event on January 15 in China. The teaser released by the brand confirms that it will launch two chipsets on the said date. The Taiwanese chipmaker is expected to officially unveil the Dimensity 8500 as well as a new Dimensity 9-series chip.

Dimensity 9500s, Dimensity 8500 chipset details leaked

According to reports, MediaTek will unveil the Dimensity 8500 and Dimensity 9500s chipsets on Jan. 15. While the Dimensity 9500s will be a completely new chip, the Dimensity 8500 already powers the Honor Power 2, which has just gone official in China.

The Dimensity 8500 is built on TSMC’s N4P process and features an octa-core CPU configuration made up of one Cortex-A725 core clocked at 3.4GHz, three additional Cortex-A725 cores running at 3.20GHz, and four efficiency-focused Cortex-A725 cores operating at 2.20GHz. Graphics duties are handled by the Mali-G720 MC8 GPU.

Reports have revealed that the Dimensity 9500s is manufactured using TSMC’s more advanced N3E process. It comes with a more powerful CPU setup that includes a single Cortex-X925 core clocked at 3.73GHz, three Cortex-X4 performance cores running at 3.30GHz, and four Cortex-A720 efficiency cores at 2.40GHz. The chipset is paired with a Mali Immortalis-G925 MC12 GPU, operating at a frequency of 1612MHz.

Reports have also revealed that the upcoming Redmi Turbo 5 Max series will include two models. Likely, the base model could be powered by the Dimensity 8500 chipset, whereas the higher variant could feature the Dimensity 9500s.

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MediaTek has quietly added a new chip to its mid-range lineup. The Dimensity 7100 is now listed on the company’s official website as a 5G chipset built on TSMC’s 6nm process.

At a basic level, the Dimensity 7100 follows a familiar formula. It features an eight-core CPU setup, comprising four Cortex-A78 performance cores clocked at up to 2.4 GHz and four Cortex-A55 efficiency cores running at 2.0 GHz. 

The setup isn’t significantly different from previous Dimensity 7000-series chips, but MediaTek claims users should experience faster app launches and smoother multitasking compared to older mid-range processors.

Graphics are handled by the Arm Mali-G610 GPU, which is up to 8 percent faster than the GPU found in the Dimensity 7050. 

Dimensity 7100 is touted for efficiency 

One of the bigger themes here is efficiency. MediaTek says the Dimensity 7100 is around 5 percent more power-efficient during app usage, up to 16 percent more efficient during multimedia playback, and up to 23 percent more efficient on the modem side. The integrated 3GPP Release 16 5G modem supports download speeds of up to 3.3Gbps and uses MediaTek’s UltraSave 3.0+ technology to reduce battery drain during extended 5G sessions.

The chip also checks the expected boxes for modern hardware support. It works with LPDDR5 RAM at speeds of up to 5500Mbps and supports UFS 3.1 storage. Wireless options include Wi-Fi 6 and Bluetooth 5.4. On the display side, the Dimensity 7100 supports 10-bit color depth and HDR video playback.

As for the optics, the chip supports sensors up to 200 megapixels, along with HDR imaging, multi-frame noise reduction, and hardware-accelerated face detection. According to the company, portrait detection and autofocus performance have seen notable improvements compared to previous generations, at least on paper.

There’s also support for 45W fast charging and the UFCS universal charging protocol, alongside a new power management system designed to work at lower voltages for slightly longer battery life.

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For a while, Qualcomm‘s Snapdragon series was the de-facto choice for flagship Android smartphones. But in recent years, the landscape has shifted with chips from its rival, MediaTek, posing a direct channel on every segment. While the Snapdragon was often found in flagship smartphones, recent premium models even carry the latest Dimensity SoCs. So if you’re eyeing a flagship Android phone without Snapdragon, here’s what you can expect and what trade-offs you might need to consider.

Snapdragon vs Dimensity: Performance

Historically, Snapdragon chips have excelled in sustained single-thread performance and optimized multi-core throughput. This basically translated to faster app launches, snappy multitasking, and stable performance under heavy loads. So even Qualcomm’s top-end Snapdragon 8 Elite Gen 5 continues this tradition with strong single-core and multi-core scores in benchmarks.

Yet MediaTek’s Dimensity 9500 isn’t far behind, and in some tests even edges out Snapdragon in certain metrics. For example, early Geekbench 6 scores show the Dimensity can slightly outperform the Snapdragon chip in single-core tasks, while multi-core results are tightly matched. Meaning, both chips are capable of delivering flagship level performance. So, regardless of which side you pick, everyday use or intense workloads isn’t a compromise on either side.

Gaming & Graphics

Gaming is where the chipset battle gets interesting. Snapdragon’s Adreno GPU traditionally excels at raw graphical throughput and stable framerates, backed by Qualcomm’s “Elite Gaming” suite and optimizations tailored to top Android titles. This can mean slightly better peak performance in games, especially at higher resolutions or demanding settings.

On the other hand, the Dimensity 9500’s Mali-G1 Ultra GPU delivers very strong performance for most gaming scenarios and has shown impressive gains in GPU scores in benchmarks. Some real-world tests even highlight smoother sustained performance during long gaming sessions, thanks to better thermal behavior and power distribution.

However, certain aspects like thermal throttling are also related to the brand’s optimization and cooling solutions. If your priority is maxing out graphics, Snapdragon phones could still have an edge. But the difference in minimal and the Dimensity powered devices are holding their own with balanced performance and efficiency.

Power Efficiency & Thermals

Efficiency isn’t just about benchmarks, it’s about how long your phone can last during everyday use. Dimensity 9500’s architecture emphasizes a mix of high-performance and efficiency cores, often resulting in cooler operation and lower power draw during sustained tasks like gaming or video editing. This can translate to better real-world battery life, especially over extended use.

Meanwhile, Qualcomm designed its flagship Snapdragon chips with higher clock speeds and custom Oryon cores, which deliver slightly better burst performance. But this can come with increased heat under load that can trigger thermal throttling in some scenarios. Some users have even reported that Snapdragon-equipped phones run warmer during extended gaming or benchmarking sessions compared to Dimensity-powered counterparts.

AI, Camera, & Connectivity Features

AI performance and camera processing are increasingly important in flagship devices. Both Snapdragon 8 Elite Gen 5 and Dimensity 9500 support advanced NPUs and modern ISP pipelines capable of AI-driven photography and on-device intelligence. Qualcomm typically edges ahead with its Hexagon NPU and camera ISP tuning, which can benefit high-end videography and computational photography workflows.

However, Dimensity’s NPU also shows strong results and, in some benchmarks, uses lower power for similar tasks. In terms of connectivity, Snapdragon often leads with slightly faster 5G modem speeds and mature signal handling, but Dimensity isn’t far behind with robust 5G support and Wi-Fi advancements.

Verdict: More Choices, Not Compromises

High-end Android phones without Snapdragon aren’t second-class anymore. They are competitive flagship choices that reflect how far Android chip competition has come. With Samsung also revitalizing its Exynos lineup of chips, the competition is getting stiffer. So if you need top tier performance, excellent battery life, and great gaming experience, a Dimenity powered device is absolutely worth considering and offers no real trade offs when compared to Snapdragon equipped flagships.

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Qualcomm and MediaTek were earlier supposed to be among the first brands to push 2nm smartphone chips into the market, but Samsung has quietly taken the crown by announcing Exynos 2600 — the world’s first smartphone chip built using 2nm GAA (Gate-All-Around) manufacturing process.

The Exynos 2600 sits above the Exynos 2500, promising notable improvements in performance, thermal efficiency, and AI capabilities. Although not officially confirmed, this chip is likely to power some of the upcoming Galaxy S26 series phones in many regions.

The latest Exynos chip features a 10-core CPU based on Arm’s latest v9.3 architecture, which includes C1-Ultra and C1-Pro cores. Samsung didn’t include any low-power little cores, as the CPU only comprises big and high-performance cores.

The Exynos 2600’s CPU comprises one prime C1-Ultra core clocked at 3.8GHz, three high-performance C1-Pro cores at 3.25GHz, and six efficiency-tuned C1-Pro cores at 2.75GHz. This new structure is claimed to have improved the CPU performance by up to 39%.

Gamers should also notice some improvements, as the new Xclipse 960 GPU is claimed to offer twice the compute performance of its predecessor and up to 50% better ray tracing performance. The chip also introduces Exynos Neural Super Sampling (ENSS) technology, which further improves gaming performance by leveraging AI-based resolution upscaling and frame generation technologies.

The South Korean giant has taken a step forward towards fixing the heating issues associated with Exynos chips by introducing the new Heat Path Block (HPB) technology. It improves heat transfer using High-k EMC materials, which are said to be as effective as a heat sink, and lowers thermal resistance by up to 16%.

The Exynos 2600 chip features an AI engine with a 32K MAC NPU and brings support for ARM’s Scalable Matrix Extension 2 (SME 2), which can accelerate AI and ML-based applications and provide enhanced support for matrix operations. Samsung claims the upgraded NPU delivers a 113% increase in AI performance over its predecessor, Exynos 2500.

The chip supports up to 320MP single-camera or 64MP + 32MP dual-camera configurations. Additionally, it enables zero shutter lag for 108MP shots. The chip can do 8K/30fps and 4K/120fps HDR video recording, with support for Samsung’s APV codec for higher-quality videos. Samsung claims the improved ISP is also up to 50% more efficient.

Other specs include LPDDR5x RAM, UFS 4.1 storage, 4K displays at a refresh rate of up to 120Hz, and HDR10+ playback.

Qualcomm and MediaTek will join in next year

From the specs sheet and brand claims, the Exynos 2600 appears to offer solid gains across CPU, GPU performance, and API capabilities. Particularly, the latest measures to fix heating issues could build more confidence in potential buyers. However, Qualcomm and MediaTek aren’t sleeping either.

The two chip giants are working towards announcing their 2nm smartphone chips. According to reports, those could be called: Snapdragon 8 Elite Gen 6 and Dimensity 9600. Both will reportedly use TSMC’s 2nm (N2P) manufacturing process.

MediaTek and Qualcomm usually release their latest flagship chips around September. That’s when you can expect them to unveil their 2nm flagship chips. That’s still months away, but in the meantime, we’re likely to hear more about these chips through various leaks.

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The chipset has always been a crucial part of a smartphone, but today it matters more than ever. From gaming performance and connectivity to battery life, camera processing, and AI features, the processor plays a central role in determining how a phone performs day-to-day — making the right choice increasingly important.

For years, Qualcomm’s Snapdragon chips were the go-to choice for most users. But MediaTek has dramatically closed the gap in recent years, and in some cases, it even pulled ahead. So, which one should you actually pick for your next upgrade? Let’s break it down.

Snapdragon and MediaTek: A quick background

Qualcomm’s Snapdragon chips have dominated the Android flagship market for over a decade. Major brands, including Samsung, Xiaomi, and OnePlus, have heavily relied on Qualcomm to power their high-end smartphones. Over time, Snapdragon has also earned a strong reputation for strong performance and reliable connectivity.

MediaTek, on the other hand, was primarily known for entry-level and mid-range chips. That perception has changed significantly with the rise of the Dimensity series. Today, MediaTek offers flagship-grade processors with modern CPU designs, powerful GPUs, and impressive power efficiency — often at a lower cost to smartphone manufacturers.

As a result, the two chipmakers now compete head-to-head across nearly every price segment.

Performance and gaming: where Snapdragon still holds an edge

Snapdragon chips have long been dominating smartphone gaming, and that’s still true. That said, MediaTek has aggressively filled the gap in recent years.

Modern Dimensity chips feature powerful GPUs that can match, or even outperform, Snapdragon chips on benchmarks. However, during longer gaming sessions, Snapdragon-powered phones generally deliver more consistent frame rates. MediaTek-powered phones exhibit relatively higher thermal throttling during extended gaming, but newer flagships have significantly improved in this regard.

This makes Snapdragon the safer choice for sustained gaming performance, although MediaTek chips still offer more than enough power for casual and even moderate gamers.

In CPU benchmarks, Snapdragon chips tend to have a slight edge in single-core performance, resulting in marginally faster app launches and smoother UI interactions. MediaTek’s recent Dimensity chips often perform better in multi-core workloads. In real-world use, however, these differences are subtle, and most users won’t notice a meaningful gap during everyday tasks like browsing, social media, or video streaming.

Battery life and efficiency: MediaTek’s quiet strength

MediaTek chips have consistently received praise for their excellent power efficiency, particularly in mid-range and upper mid-range segments. Dimensity chips are often optimized for sustained efficiency, resulting in longer screen-on time and reduced heat buildup.

Snapdragon chips are still efficient, especially recent generations, but MediaTek-powered phones deliver comparable or even better battery life at similar price points.

Camera and imaging: Snapdragon has a slight edge

Camera performance isn’t just about the sensor or megapixel count; the chipset also plays an important role. The image signal processor (ISP) on a chip processes the raw data (captured by the sensor) into usable image data, after which the OEM applies its own processing and tuning.

Snapdragon still holds a slight reliability edge due to years of ISP optimization and broader software support, particularly for video recording. MediaTek’s flagship chips have made major strides, but camera results still depend heavily on how well OEMs tune the imaging pipeline.

Connectivity and network reliability

Both Snapdragon and MediaTek offer modern connectivity features, including advanced 5G support, Wi-Fi standards, and Bluetooth enhancements.

In the US, however, the Snapdragon may have an edge due to carrier-specific optimizations. This is because of Snapdragon’s dominance in the region. That said, modern MediaTek flagships also perform reliably in most regions, including the US.

For the majority of users, connectivity differences between the two are unlikely to be a deciding factor, as both integrate modern connectivity features.

Pricing and value: where MediaTek shines

Pricing is one of MediaTek’s biggest advantages. Smartphones powered by MediaTek chips are typically more affordable than comparable Snapdragon-powered devices — that’s also true for flagship phones.

MediaTek chipsets often offer better specifications on paper for the same price, and this advantage is especially noticeable in the mid-range segment. Snapdragon-powered phones tend to cost more, reflecting brand perception, premium modem technology, and the long-standing maturity of their ecosystem.

Snapdragon vs MediaTek: which one should you choose?

• Choose Snapdragon if you prioritize sustained gaming performance, consistent camera results, and reliable connectivity.
• Choose MediaTek if you want excellent performance and battery efficiency at a lower price, and you’re comfortable trading a bit of ecosystem maturity for better value.

Both Snapdragon and MediaTek make capable chips. The choice ultimately depends less on the brand name and more on how the phone is optimized and how you plan to use it.

Keep reading further:
1. Snapdragon 8 Elite Gen 5 vs Dimensity 9500 vs Apple A19 Pro
2. Dimensity 9500 vs Dimensity 9400
3. Snapdragon 8 Gen 5 vs Snapdragon 8 Elite

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MediaTek has officially released its latest automotive cockpit processor, the Dimensity Cockpit P1 Ultra. Built on an advanced 4nm manufacturing process, the chip prioritizes high performance, robust AI capabilities, and enhanced in-car entertainment features. MediaTek says the first car models utilizing this chip will be launched soon.

MediaTek Dimensity P1 Ultra Specs

The P1 Ultra comes with a powerful 8-core CPU that delivers up to 175K DMIPS of computing power. For graphics, MediaTek has added a hardware-level ray-tracing GPU that offers up to 1800 GFLOPS of performance. 

On the AI side, the P1 Ultra includes a dedicated NPU capable of 23 TOPS, and MediaTek says it can even run edge-side generative AI. Thanks to the Armv9 architecture and built-in AI units, the chip supports 7-billion-parameter large language models directly inside the car. 

As a result, you can expect it to handle features like advanced voice assistants, multimodal interactions, on-device image generation (like Stable Diffusion), and even AI-based safety monitoring can run without needing cloud support.

MediaTek has also focused on reducing development time for automakers. The P1 Ultra integrates multiple components, including smart cockpit, connectivity modules, and T-BOX into a single platform. 

It supports 5G, dual-band Wi-Fi, Bluetooth, GNSS, and even includes a built-in modem. For cameras, there’s an HDR ISP with AI noise reduction, AI 3A, and other enhancements. This helps with features such as 360-degree surround view, driving recorders, and cabin monitoring.

For entertainment, the P1 Ultra supports up to six displays at the same time, and thanks to MediaTek’s MiraVision tech, it can handle 4K 60fps video playback and recording. This means cars can offer multi-screen setups for the driver, passengers, and rear-seat entertainment systems, all powered by a single chip.

MediaTek also confirmed that the Dimensity Cockpit P1 Ultra will come in three versions — 5G, 4G, and Wi-Fi models — all featuring an 8-core CPU and 6-core GPU.

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(Via)

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The Snapdragon 6s Gen 4, announced in October, delivers higher performance and expanded capabilities to mid-range phones by incorporating modern chip technologies and premium features from flagship chipsets. Qualcomm would be hoping for a stronger presence in the mid-range segment with this new chip, but its biggest rival, MediaTek, already has an answer to that: Dimensity 7400.

The Dimensity 7400 was announced earlier this year and has a similar spec sheet to the Snapdragon 6s Gen 4. Both have the same CPU cores, but they also bring notable differences. We’ll look at every aspect of the two chips, including benchmark numbers, in this detailed comparison to find out which delivers superior performance.

Snapdragon 6s Gen 4 vs Dimensity 7400: Benchmark numbers

Note: The Geekbench 6 scores for the Snapdragon 6s Gen 4 were obtained from an alleged Moto G100s listing. For the Dimensity 7400, we tested the Motorola Edge 60 to get the benchmark scores.

The Snapdragon 6s Gen 4 has scored 1,018 single-core points and 2,893 multi-core points in the Geekbench 6 test. These are good numbers for a lower mid-range chipset, but the Dimensity 7400 is slightly ahead with 1,058 points and 3,041 points in single-core and multi-core tests, respectively.

While the differences aren’t huge, the Dimensity 7400-powered devices should offer better CPU performance compared to the Snapdragon 6s Gen 4.

We weren’t able to compare GPU scores because no device with the Snapdragon 6s Gen 4 chip has been released yet. We’ll update the scores here after testing.

Snapdragon 6s Gen 4 vs Dimensity 7400: Key differences

The Snapdragon 6s Gen 4 is manufactured using Samsung’s 4nm process node, while the Dimensity 7400 uses TSMC’s 4nm node. The latter generally offers better performance and power efficiency.

CPU, GPU, & NPU

Both mid-range chipsets feature octa-core CPUs with four Cortex-A78 performance cores and four Cortex-A55 efficiency cores. The difference here is that all cores in the Dimensity 7400 run at a relatively higher speed than those in the Snapdragon 6s Gen 4.

The higher clock speeds of the CPU cores and TSMC’s advanced manufacturing on the Dimensity 7400 should deliver higher peak performance than the Snapdragon 6s Gen 4. This also reflects in the benchmark scores.

For graphics rendering, the Snapdragon chip has an Adreno GPU. Qualcomm hasn’t revealed much about the GPU, but it claims the chip is 59% faster than the 6s Gen 3 and supports 144fps gaming. Additionally, the chip supports Variable Rate Shading and Qualcomm Game Quick Touch to improve touch latency and render graphics more efficiently.

The Dimensity 7400 is equipped with Mali-G615 MC2 GPU, which is 10% faster than its predecessor. Furthermore, it comes with MediaTek Adaptive Gaming Technology (MAGT) 3.0 and MediaTek’s Network Observation System (NOS) for improved performance, power efficiency, and connectivity.

Both chipsets also have NPUs for on-device AI capabilities: Qualcomm Hexagon NPU on Snapdragon 6s Gen 4 and MediaTek NPU 655 on Dimensity 7400. They also help optimize various aspects of the device, including camera, connectivity, and gaming.

Camera & Imaging

The Snapdragon chip features dual 12-bit Spectra ISPs, allowing up to 200MP photo capture and 2K HDR video recording at 30fps. Additionally, it supports 720p slow-motion video recording at 240 fps.

The 12-bit HDR ISP on the Dimensity 7400 also supports up to 200MP single camera. It supports precise noise reduction (MCNR) and video HDR for sharp, clear outputs. The Dimensity chipset also supports Google Ultra HDR image and up to 4K video recording.

Connectivity

Both chips have Release 16 5G modems, but their capabilities differ. The Snapdragon 6s Gen 4 offers up to 2.9 download speed, while the Dimensity 7500 can reach up to 3.27Gbps. The peak download speed remains the same for the Snapdragon chip on a Wi-Fi 6E connection. The Dimensity 7400 also supports Wi-Fi 6E, but MediaTek hasn’t revealed the data transfer speed.

Snapdragon 6s Gen 4 vs Dimensity 7400: Spec sheet

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In a fresh leak, tipster Digital Chat Station (DCS) is back with more details on Qualcomm’s next-gen flagship chip. Earlier this week, rumors suggested the Snapdragon 8 Elite Gen 6 could launch in two variants: a standard model and a Pro version. Now, DCS claims to have more specifics.

The tipster revealed that the Snapdragon 8 Elite Gen 6 will carry the model number SM8950, while the Gen 6 Pro will be designated SM8975. Both chips are rumored to be built on TSMC’s N2P, or 2nm, manufacturing process.

The hierarchy could be 8 Elige Gen 6, Dimensity 9600, and 8 Elite Gen 6 Pro

Meanwhile, DCS claims that MediaTek’s Dimensity 9600 slots in between the two Qualcomm chips. This technically means it will perform better than the vanilla 8 Elite Gen 6, but might not match the performance level of Pro.

However, unlike Qualcomm, MediaTek doesn’t appear to be planning multiple versions of its flagship just yet and is reportedly sticking with the trusted ARM CPU and architecture. 

DCS also confirmed in the comments that the Dimensity 9600 will likely use the same 2nm TSMC process as Qualcomm’s upcoming chips.

It’s still unclear exactly what performance configuration the Dimensity 9600 will have to bridge the gap between the two Snapdragon models. For the Qualcomm chips, earlier reports suggest both will feature the company’s third-generation custom CPU architecture in a 2+3+3 core layout.

The main difference between the two Snapdragon variants seems to be in GPU performance, with only the Pro model expected to support LPDDR6 memory.

A separate report also hints that the advanced manufacturing process and faster memory could push up production costs, potentially making flagship phones even more expensive by 2027.

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The flagship phone battle in China is almost settled for this year. What comes next is a wave of sub-flagship models to be powered by the up-and-coming chips from Qualcomm and MediaTek. 

Qualcomm is set to unveil the Snapdragon 8 Gen 5 later this year, and phones powered by it will start showing up soon after. A new leak has now given us a tentative timeframe for the launch of MediaTek’s counterpart.

MediaTek is reportedly working on two smartphone chips: the Dimensity 8500 and Dimensity 9500e. And according to tipster Digital Chat Station, the first phones powered by these chips will not launch until January next year. These phones are also said to have flagship-level specifications and large batteries.

What we know so far

As you might have guessed, the Dimensity 9500e is the more powerful of the two, running at up to 3.73GHz. It reportedly uses a CPU setup of 1× Cortex-X925, 3× Cortex-X4, and 4× Cortex-A720 cores.

The GPU is said to be an Arm G925 MP12 clocked at 1612MHz, and the chip is built on TSMC’s advanced 3nm N3E process.

Meanwhile, the Dimensity 8500 is designed for slightly more affordable phones but still carries a punch. It’s reportedly based on TSMC’s 4nm process and uses an 8-core setup built around ARM’s A725 architecture — meaning all cores are “big” cores. 

The prime core is said to reach 3.4GHz, a small but notable bump from the 3.25GHz seen in its predecessor, the Dimensity 8400. Graphics performance could also get a lift thanks to a Mali-G720 GPU tuned to around 1.5GHz. The Dimensity 8500 reportedly scores around 2.2 million points on AnTuTu. 

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If you thought Qualcomm’s Snapdragon 8 Elite Gen 5 flex in the flagship charts this month was impressive, wait till you see what happened in the mid-range segment. 

AnTuTu also shared its October 2025 list of the top 10 Android mid-range phones recently, and MediaTek has officially locked down the entire leaderboard. Every single phone in the ranking is powered by a Dimensity chip. Yes, all ten.

Leading the pack is Realme’s Neo7 SE, running the Dimensity 8400-Ultra, with a beefy average score of 1,931,641. Following right behind are the iQOO Z10 Turbo and Vivo Y300 GT, both using the standard Dimensity 8400 chip, scoring 1,915,499 and 1,909,184, respectively. 

It’s all Dimensity from top to bottom

Fourth place goes to the Redmi Turbo 4, again rocking a Dimensity 8400-Ultra at 1,868,587 points. After that, the list starts mixing in slightly different Dimensity flavors. 

Oppo’s Reno 14 series grabs fifth and sixth place with the Dimensity 8350 and Dimensity 8450. Rounding out the top 10 are phones like the Motorola Edge 60 Pro and OPPO K13 Turbo 5G, all sticking with Team MediaTek.

Every device in the top 10 crosses 1.28 million points, which tells how strong the upper-midrange category has become. To say the least, these scores are similar to the flagship phones of 2022 / 2023. 

It’s absolutely surprising that not even a single Snapdragon-powered phone has made it to the top 10 list. Qualcomm’s direct rival to the Dimensity 8400 is the Snapdragon 8s Gen 4 / Snapdragon 7 Gen 4. However, MediaTek’s adoption is clearly much higher in the mid-range segment, and it’s clearly winning there.

It’s also worth noting how AnTuTu calculates its rankings. Instead of reporting one best benchmark attempt, the score is the average score for that model across the month.

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MediaTek’s Dimensity 9400 made a strong impression last year, but it couldn’t quite outperform Qualcomm’s powerhouse, the Snapdragon 8 Elite. Fast forward to September, and MediaTek is back with a bold new challenger: the Dimensity 9500. The company claims it brings massive gains in performance, power efficiency, and AI processing — all areas where Snapdragon has long dominated.

The Dimensity 9500 is MediaTek’s best shot yet at taking the performance crown. But does it finally outmuscle the Snapdragon 8 Elite, or is Qualcomm still the benchmark to beat? Let’s dive into the numbers and find out.

Let’s begin with the spec sheet.

Dimensity 9500 vs Snapdragon 8 Elite: benchmark comparison

Note: For benchmark numbers, we tested the Vivo X300 Pro (Dimensity 9500) and Xiaomi 15 (Snapdragon 8 Elite).

Geekbench score

On the Geekbench 6 platform, the Dimensity 9500 achieves roughly 13% higher score in single-core and 9% higher score in multi-core performance. While these are not huge leaps, the Dimensity 9500-powered phones should feel faster compared to Snapdragon 8 Elite.

AnTuTu score

On AnTuTu v11, MediaTek’s chip takes a clear lead with a total score about 22% higher than the Snapdragon 8 Elite.

The CPU gains are modest at around 5%, but the GPU score jumps by over 25%, signaling a major leap in graphics performance. The Dimensity 9500 also shows stronger memory and UX performance, hinting at smoother multitasking and faster app responsiveness.

3D Mark Wild Life Extreme score

The 3D Mark’s Wide Life Extreme is a popular gaming benchmark that measures a GPU’s performance under demanding graphics workloads.

The high score represents the best performance when the device runs at its maximum capability. In other words, it represents how well a device can handle short bursts of intense graphics workloads, similar to what happens in demanding mobile games. The low score reflects how well the device maintains performance over time, showing the impact of thermal throttling and sustained workload management.

Here, the Dimensity 9500 delivers a 49% higher high score and 17% higher sustained score, suggesting it can maintain better performance over longer gaming sessions.

Dimensity 9500 vs Snapdragon 8 Elite: key differences

Both chips have been manufactured by TSMC using its 3nm process node, but they still bring several differences. The Dimensity 9500 utilizes the latest N3P technology, which provides slightly improved performance and power efficiency compared to the N3E process used for the Snapdragon 8 Elite.

The Dimensity 9500’s CPU consists of the latest ARM cores, which include one C1-Ultra core, three C1-Premium cores, and four C1-Pro cores. The Snapdragon 8 Elite, on the other hand, uses self-designed second-generation Oryon CPU cores. In fact, this is the first Qualcomm mobile chipset to feature Oryon cores.

For the graphics-related tasks such as gaming and visual rendering, the Dimensity 9500 features a 12-core Mali-G1 Ultra GPU with support for 120fps ray-traced mobile gaming. The chip also features MediaTek HyperEngine Gaming Technology, a suite of gaming features designed to offer optimized gaming performance and power efficiency.

The Snapdragon 8 Elite is equipped with the Adreno 830 GPU, featuring the new sliced architecture. It also supports hardware-based ray tracing and the Snapdragon Elite Gaming features for an enhanced gaming experience.

The two chipsets also don’t miss out on the on-device AI capabilities, thanks to MediaTek NPU 990 on the Dimensity 9500 and a Qualcomm Hexagon NPU on the Snapdragon 8 Elite. Both are high-performance and highly efficient NPUs with large context windows and agentic AI capabilities. The NPUs also help optimize camera performance, connectivity, and gaming.

The Dimensity 9500 features the Imagiq 1190 ISP, which supports up to 320MP single camera and up to 8K video recording. MediaTek says the chip can record 4K/120fps videos with electronic image stabilization (EIS) and 4K/60fps cinematic video. The chip also supports real-time semantic segmentation.

The Snapdragon 8 Elite also features power camera capabilities, enabling up to 320MP single-camera capture and up to 8K video recording. It features 18-bit triple ISPs with limitless semantic segmentation at 4K resolution. Additionally, the chip offers numerous camera features, including AI-based auto-exposure, AI-based auto-focus, AI-based face detection, Truepic photo capture, Video super resolution, and Engine for Visual Analytics 3.0.

The two flagship chipsets also bring notable differences in connectivity. The Dimensity 9500, featuring a 3GPP Release-17 5G modem, supports a peak speed of up to 7.4 Gbps. On a Wi-Fi 7 connection, it can reach up to 7.3 Gbps. On the other hand, the Snapdragon 8 Elite’s X80 5G modem supports download speeds of up to 10 Gbps and upload speeds of up to 3.5 Gbps. The peak speed over a Wi-Fi 7 connection is 5.8 Gbps. In short, MediaTek leads in Wi-Fi throughput, while Qualcomm maintains an edge in 5G performance.

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A new leak from well-known tipster Digital Chat Station gives us a pretty detailed look at MediaTek’s upcoming Dimensity 8500 chip.

According to the leak, the Dimensity 8500 is built on TSMC’s 4nm process and uses an 8-core setup based on ARM’s A725 architecture. That means all cores are big cores, like the Dimensity 8400.

The prime apparently hits 3.4GHz, which is slightly higher than 3.25GHz on its predecessor. Whereas the remaining cores could also have higher clock speeds than before. 

On the graphics side, the Mali-G720 GPU is reportedly scaled up and running around 1.5GHz. It’s still early numbers, but the chip reportedly lands around 2.2 million on AnTuTu.

Digital Chat Station claims the GPU’s theoretical performance could beat Qualcomm’s Snapdragon 8 Gen 3 and 8s Gen 4 — at least on paper. Of course, theory doesn’t always match real-world gaming, heat control, or battery life, so it’s better to wait for actual phones before jumping to conclusions. 

The first wave of phones with the Dimensity 8500 is already in testing, according to the leak. One is a mid-range phone with a standard-sized display, while the other is focused on battery life with a large-capacity battery. The rollout has reportedly started quietly.

There’s also a familiar brand name tied to this chip. Back in August, the blogger hinted that the Dimensity 8500 may debut on Xiaomi’s Redmi Turbo line. Honor, OPPO, OnePlus, and vivo are expected to follow with their own models soon after. 

For context, the Redmi Turbo 4 series split its chips between MediaTek and Qualcomm — the base model launched with the Dimensity 8400-Ultra, while the Pro variant picked the Snapdragon 8s Gen 4. 

If the leak pans out, the Dimensity 8500 might slot in as the next step for Xiaomi’s mid-range performance phones. No release date yet, and no confirmation from MediaTek.

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Both MediaTek and Qualcomm are preparing their next sub-flagship chips for release soon. We know Qualcomm is coming with Snapdragon 8 Gen 5, but MediaTek’s upcoming chip remains more of a mystery.

According to earlier reports, it might be called the Dimensity 9500e, though that name hasn’t been confirmed.

Now, tipster Digital Chat Station has shared new details on Weibo, referring to the chip as the Dimensity 9400++ instead. There’s a reason for that, though. The processor is reportedly based on the Dimensity 9400+, a flagship chip from earlier this year.

Dimensity 9500e Specifications (Expected)

The new leak claims the prototype runs at up to 3.73GHz and features a CPU configuration of 1× Cortex-X925, 3× Cortex-X4, and 4× Cortex-A720 cores. It also includes a G925 MP12 GPU clocked at 1612MHz and is built on TSMC’s latest 3nm N3E process.

Moreover, the CPU, GPU, and cache are said to remain the same as the Dimensity 9400+. All these specs are nearly identical to the flagship Dimensity 9400 / Plus, which makes it somewhat surprising that MediaTek is reusing them for a chip expected to be in the sub-flagship category.

Digital Chat Station also notes that the first phones using this chip will feature larger batteries, premium displays, better build quality, and stronger overall hardware.

As for timing, the Dimensity 9400++ (or whatever it ends up being called) is expected to debut in Q1 2026, while Qualcomm is reportedly on track to unveil the Snapdragon 8 Gen 5 later this year.

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MediaTek is not just about powering Android smartphones with its Dimensity or Helio line. The company continues to expand its reach across connected devices, and its latest effort in doing so is the Kompanio 540, a new processor built specifically for Chromebooks.

Kompanio 540 Specifications

MediaTek says the Kompanio 540 is a chip built for superior performance and all-day battery life in student Chromebooks. The chipmaker claims it delivers up to 35% better power efficiency compared to the previous Kompanio 520.

While that is to be proven in real-world usage, the Kompanio 540 brings an architecture upgrade designed to improve overall performance. 

It features an eight-core CPU based on a 2+6 configuration, which includes two high-performance Cortex-A78 cores clocked at 2.6GHz and six power-efficient Cortex-A55 cores running at 2.0GHz. In comparison, the Kompanio 520 includes two Cortex-A76 cores (2.0GHz) and six Cortex-A55 cores (2.0GHz).

The chip also comes with ARM’s Mali-G57 MC2 GPU that enables support for 4K displays at 60Hz or dual 2.5K monitors when connected to external screens. For a Chromebook, that’s a notable step forward in display flexibility and graphical capability, especially for users who rely on multitasking setups.

The Kompanio 540 supports Wi-Fi 7, Bluetooth 6.0, and Bluetooth Low Energy (LE) for connectivity. Storage and memory options are also flexible. The chip supports both LPDDR5-6400 and LPDDR4x-4266 RAM, as well as eMMC 5.1 and faster UFS 3.1 storage. 

Last but not least, it’s also compatible with USB 3.2 Gen 2 and PCIe Gen 2 for peripheral expansion. The Kompanio 540 will make its debut in consumer devices starting January 2026.

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Qualcomm continues to push more power into affordable chips by incorporating modern chip technologies and premium features. The newly announced Snapdragon 6s Gen 4 aims to strengthen Qualcomm’s presence in the affordable and lower mid-range smartphone market. But there’s strong competition from MediaTek in that segment.

The Dimensity 7300, announced in June 2024, has a similar spec sheet, featuring four Cortex-A78 and four Cortex-A55 cores. The chipset already powers many phones from different brands, such as Vivo, Oppo, and Nothing. Here, we’ll compare it against the Snapdragon 6s Gen 4 to see which one has the edge.

Snapdragon 6s Gen 4 vs Dimensity 7300

As of writing this post, no smartphone has been launched with the Snapdragon 6s Gen 4. So, we don’t have the benchmark data as yet. So, we’ll be focusing on the rest of the details for this comparison. We’ll update this comparison with benchmark data once available.

CPU, GPU, & NPU

The Snapdragon 6s Gen 4 is manufactured using Samsung’s 4nm process node, while the Dimensity 7300 uses TSMC’s 4nm process node. The difference here is that TSMC’s manufacturing facility generally produces chips that offer higher performance and power efficiency than Samsung’s.

Furthermore, the Snapdragon chip uses four Cortex-A78 performance cores and four Cortex-A55 power-efficiency cores. The Dimensity 7300 also has the same CPU configuration, but the cores run at higher speeds, which should offer higher peak performance.

The Snapdragon 6s Gen 4 is equipped with an Adreno GPU (the exact model hasn’t been disclosed yet) that promises 59% better performance than its predecessor, the Snapdragon 6s Gen 3. Qualcomm says the chip is capable of delivering ultra-smooth 144fps gaming at FHD+ resolution. Additionally, the chip supports Variable Rate Shading and Qualcomm Game Quick Touch for an enhanced gaming experience.

The Dimensity 7300, on the other hand, uses a dual-core Mali-G615 GPU. It also brings MediaTek HyperEngine optimizations, which improve performance, battery efficiency, and latency. In short, both GPUs promise smooth gaming. However, to see which chip offers better gaming performance, we’ll have to wait until a device with the Snapdragon 6s Gen 4 chip arrives in the market.

Both chipsets also feature NPUs for on-device AI capabilities: Qualcomm Hexagon NPU on the Snapdragon 6s Gen 4 and MediaTek APU 655 on the Dimensity 7300.

Camera & Imaging

The Snapdragon chip features dual 12-bit Spectra ISPs, allowing up to 200MP photo capture and 2K HDR video recording at 30fps. Additionally, it supports 720p slow-motion video recording at 240 fps.

The Dimensity 7300 has a 12-bit Imagiq 950 ISP, which also allows up to 200MP photo capture. It supports hardware-based noise reduction, as does the Snapdragon 6s Gen 4, but the Dimensity chip can record HDR videos at up to 4K resolution, while the Snapdragon chip is capped at 2K.

Connectivity

The Snapdragon 6s Gen 4 uses a 5G modem from Qualcomm that offers up to 2.9 Gbps download speed. The peak speed over a Wi-Fi connection is also limited to 2.9 Gbps. The chip supports Wi-Fi 6E, Bluetooth v5.4, and both 5G mmWave and sub-6 GHz networks. Additionally, it features Qualcomm 5G PowerSave 2.0, Qualcomm SmartTransmit 2.0, and Qualcomm Wideband Envelope Tracking for strong connectivity and improved power saving.

The Dimensity 7300, with its in-house 5G modem and 3CC carrier aggregation, can achieve up to 3.27Gbps download speed over a 5G connection. The chip supports Wi-Fi 6E and Bluetooth v5.4 and features MediaTek 5G UltraSave 3.0+ technology for improved power savings.

Snapdragon 6s Gen 4 vs Dimensity 7300: spec sheet

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The smartphone chip battle between Qualcomm, MediaTek, and Apple is more intense than ever before. All three have made huge progress with their high-end chips in recent years, particularly MediaTek, which is emerging as a strong competitor to the other two. Its latest Dimensity 9500 chip goes neck-to-neck with the Snapdragon 8 Elite Gen 5 and Apple A19 Pro on benchmarks.

Here, we’ll look at the benchmark data and real-world differences to find out who has the edge over the other two chipsets.

Snapdragon 8 Elite Gen 5 vs Dimensity 9500 vs Apple A19 Pro: benchmark comparison

Note: Devices that have been used for benchmark testing are Honor Magic 8 (Snapdragon 8 Elite Gen 5), Vivo X300 Pro (Dimensity 9500), and iPhone 17 Pro (Apple A19 Pro).

Geekbench score

Apple still leads the single-core chart with 3,784 points, the most for a smartphone chipset, but the Snapdragon 8 Elite Gen 5 with 3,634 points is not very much behind. The Dimensity 9500 sits behind the two with 3,177 points.

The multi-core score is an entirely different story, as the Snapdragon 8 Elite Gen 5 leads the race with 10,813 points. This is about 11% higher than the Dimensity 9500 (9701 points) and Apple A19 Pro (9752 points).

In short, the Apple A19 Pro leads the single-core chart, but the Snapdragon 8 Elite Gen 5 makes a strong comeback in the multi-core territory. The Dimensity 9500 lags behind the two, but the gap has significantly narrowed over the years.

AnTuTu score

On the AnTuTu v11 platform, the Snapdragon 8 Elite Gen 5 gets about 4.16 million total score. The Dimensity 9500 is a little behind with a 4 million score, while the Apple A19 Pro is nowhere near either of them, scoring about 2.43 million points.

There are several reasons for this massive difference between the Apple A19 Pro and the other two chips from Qualcomm and MediaTek. One is that AnTuTu uses different testing methods for iOS and Android devices. Secondly, the A19 Pro has been tested on AnTuTu v10, while the Snapdragon and Dimensity chips have been tested on a newer AnTuTu v11 platform.

Snapdragon 8 Elite Gen 5 vs Dimensity 9500 vs Apple A19 Pro: spec sheet and key differences

The Snapdragon 8 Elite Gen 5, Dimensity 9500, and Apple A19 Pro were announced in September, built using the same TSMC’s 3nm (N3P) process node. The Snapdragon 8 Elite Gen 5 features eight third-gen Oryon CPU cores, with two of them running at 4.61 GHz and the remaining six at 3.63 GHz.

The Dimensity 9500 uses the latest ARM cores, featuring one C1-Ultra at 4.21 GHz, three C1-Premium at 3.5 GHz, and four C1-Pro at 2.7 GHz. Unlike the two, the Apple A19 Pro features six CPU cores, with two performance cores at 4.26 GHz and six performance cores at 2.6 GHz.

As for the graphics needs, the Snapdragon chip relies on the newly announced Adreno 840 with improved ray tracing capabilities, better performance, and power efficiency. The 12-core Mali-G1 Ultra on the Dimensity 9500 and the 6-core Apple GPU on the A19 Pro also bring substantial gaming enhancements.

The flagship chips also bring better on-device AI capabilities. They use the same LPDDR5x memory, although the storage type differs: UFS 4.1 on Snapdragon 8 Elite Gen 5 and NVMe on Apple A19 Pro. The connectivity part brings notable differences, with the Snapdragon 8 Elite Gen 5 featuring the highest peak download speed of 12.5 Gbps. The Dimensity 9500 makes a comeback by offering the highest Wi-Fi speed (7.3 Gbps). The Apple A19 Pro uses a Snapdragon X80 5G modem, which was used on last year’s Snapdragon 8 Elite.

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The Dimensity 9500 is the latest and greatest mobile chipset from MediaTek, promising a significant boost to performance and power efficiency across CPU and GPU. The NPU, camera, and connectivity have also received notable upgrades, making it a well-rounded option for high-end devices.

Built on TSMC’s 3nm (N3P) process node, the latest Dimensity chip adopts a third-generation “All Big Core” CPU design featuring ARM’s latest C1-series processors, which promises a significant boost to performance and power efficiency. The new 12-core Mali-G1 Ultra GPU also delivers notable performance gains and enhancements for ray tracing.

The Dimensity 9500 looks excellent on paper, but how big of an upgrade is it over last year’s Dimensity 9400? Let’s look at the benchmark scores to find out.

Dimensity 9500 vs Dimensity 9400: benchmark score

Note: The benchmark scores were obtained from leaked listings of Vivo X300 Pro (Dimensity 9500). For Dimensity 9400, we used the Vivo X200 Pro.

Geekbench score

On the Geekbench 6 platform, the Dimensity 9500 gets 3,177 in single core, which is about 18% higher than the Dimensity 9400. The gap widens further in multi-core, where the Dimensity chip has posted a total score of 9,701, while its predecessor couldn’t cross the 8,000 mark. That’s a solid 25% gain in multi-core score for the newer chip.

AnTuTu score

On the AnTuTu benchmarking platform, the Dimensity 9500’s total score crosses the 4 million mark, which is a big achievement in itself. This is about 57% higher than Dimensity 9400.

The breakdown reveals that the Dimensity 9500’s CPU achieves a significantly higher CPU score (1,043,247 vs 591,239). That’s a solid 76% increase. The GPU gets a 32% higher score (1,510,982 vs 1,144,638). The memory (667,254 vs. 411,334) and the UX (790,449 vs. 394,544) have also gained about 62% and 100% higher scores, respectively.

The latest advancements to the Dimensity 9500 are the driving factors behind this significant gap, but this is also partly due to differences in AnTuTu versions. The AnTuTu score for the Vivo X200 Pro (powered by Dimensity 9400) is from AnTuTu v10, while the X300 Pro (powered by Dimensity 9500) is tested on a newer version, v11. So, we’ll update the score for Dimensity 9400 after benchmarking on the same AnTuTu version for a fair comparison.

Dimensity 9500 vs Dimensity 9400: spec sheet

Key upgrades to Dimensity 9500

The Dimensity 9500 brings comprehensive upgrades across all major components. It’s built on TSMC’s 3nm (N3P) process node, which offers better performance and power efficiency over the N3E node used for Dimensity 9400.

CPU, GPU, and NPU

The latest Dimensity chip adopts MediaTek’s third-generation “All Big Core” CPU design, featuring ARM’s latest C1-series processors. The chipmaker claims a 32% uplift in single core performance and a modest 17% jump in multi-core performance. Remarkably, the Ultra core achieves 55% lower power consumption at peak performance, while there’s a 37% reduction in power consumption at peak CPU usage. The overall chip is 30% more power efficient during multitasking in gaming and social audio applications.

The Dimensity 9500 also brings significant upgrades to graphics capabilities and gaming experience. The new 12-core ARM Mali-G1 Ultra GPU, combined with MediaTek HyperEngine Gaming Technology, offers 33% faster GPU performance and 42% improved power efficiency at peak performance. Furthermore, the Dimensity 9500 claims a 119% boost to raytracing performance.

The chip introduces MRFC 3.0 technology to upgrade 60fps titles to 120fps. In fact, it’s the first mobile chipset to support 120FPS raytraced mobile gaming. Furthermore, the Dimensity 9500 debuts two first-to-market features: support for the Vulkan Raytracing Pipeline and native Unreal Engine 5.5+ integration, further enhancing the gaming experience. The GPU also supports advanced gaming technologies, including MegaLights and Nanite, enabling console-class rendering and lighting effects on mobile devices.

The Dimensity 9500 introduces the ninth-generation MediaTek NPU 990, paired with Generative AI Engine 2.0 doubles the computer power for seamless and immediate AI execution. Furthermore, it offers 100% faster 3 billion parameter LLM output, 128K token long text processing, and 4K ultra-high-definition image generation on-device. On top of this, the peak power consumption has reduced by 56%.

Storage, Camera, and Connectivity

The storage read/write speed has doubled compared to UFS 4.0 in the Dimensity 9400. This also helps in 40% faster loading of AI models. There’s no change to memory, though — still LPDDR5X at 10667 Mbps.

The Dimensity 9500 still supports up to 320MP camera, but it introduces a new Imagiq 1190 ISP with higher bandwidth and lower latency, and brings support for RAW-domain pre-processing for cleaner detail and color fidelity. It introduces a powerful AI denoise technology, which works with up to 200MP camera capture. The video capture capabilities have also improved, with the inclusion of support for 4K/120fps video capture with EIS and 4K/60fps cinematic video capture. In contrast, the Dimensity 9400 only supports 4K/60fps video capture.

The connectivity part has also received several upgrades, including a 10% reduction in power consumption for 5G, a 20% reduction in power consumption for Wi-Fi, and a 50% reduction in latency, thanks to AI-assisted technologies. The AI also helps to achieve 20% higher signal accuracy. The peak connection speed on a 5G network has increased to 7.4Gbps (up from 7Gbps), while the peak Wi-Fi speed remains unchanged at 7.3Gbps.

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MediaTek’s Dimensity 9500 chipset is set to power a new generation of flagship smartphones. Built on a 3nm process, the chip features console-grade ray tracing, improved AI capabilities, and major gains in power efficiency.

It introduces an updated NPU, a faster CPU architecture, and support for advanced display and camera features. The first phones with the Dimensity 9500 will arrive in October, with Vivo and Oppo leading the charge.

Vivo X300 & X300 Pro

Vivo will be the first brand to launch Dimensity 9500-powered phones. The company will unveil the Vivo X300 series on October 13 in China. The lineup includes the standard X300 and the higher-end X300 Pro.

As per leaks, both devices use BOE’s Q10 Plus LTPO OLED displays with a 1.5K resolution and 120Hz refresh rate. The X300 has a 6.31-inch screen, while the X300 Pro features a 6.78-inch panel. The panels support minimum brightness as low as 1 nit for better eye protection.

Vivo has equipped both models with the Dimensity 9500 chip. This enables faster performance, hardware-based ray tracing, and AI enhancements for imaging and power management. The X300 Pro has a triple rear camera setup with a 50MP Sony LYT-828 sensor, a 200MP Samsung HPB periscope telephoto lens, and a 50MP JN5 ultra-wide camera.

The X300 has a slightly different configuration, using the same 200MP HPB sensor as its main camera, alongside a 50MP ultra-wide lens and a 50MP Sony LYT602 periscope unit. Both phones support 4K 60fps portrait video recording and Zeiss optics.

According to a recent leak, the X300 will feature a 6,040mAh battery, while the X300 Pro will use a larger 6,510mAh unit. Both support 90W wired charging and fast wireless charging. The phones will ship with Android 16 and Vivo’s OriginOS 6, which includes ecosystem support for Apple devices.

Oppo Find X9 & X9 Pro

Oppo has scheduled the China launch of the Find X9 and Find X9 Pro for October 16, and a global launch event is set to follow on October 28. Both devices will use the Dimensity 9500 chip, with ColorOS 16 based on Android 16 running out of the box.

According to leaks and rumors, the Find X9 Pro features a 6.78-inch flat LTPO OLED display with 1.5K resolution and 120Hz refresh rate. The screen supports up to 3,600 nits of peak brightness and uses Tianma’s latest 1-nit bright eye-protection panel. Oppo has confirmed an ultrasonic fingerprint sensor under the display.

The Pro model uses a 50MP Sony LYT-828 main sensor, a 50MP Samsung JN5 ultra-wide, and a 200MP Samsung HP5 periscope telephoto camera. The module also includes a 2MP multispectral sensor.

Oppo has designed the camera layout with a rounded-square design and included Hasselblad branding. The phone supports an external Hasselblad teleconverter for added zoom capabilities. For selfies, a 32MP lens is present on the Find X9, while the Pro version upgrades to a 50MP front-facing unit.

The Find X9 Pro includes a 7,500mAh battery with 80W wired charging and 50W wireless charging. The Find X9 uses a slightly smaller 7,025mAh battery and retains the same charging speeds.

The Find X9 and X9 Pro have received certification in multiple markets, including Thailand, India, Singapore, and Malaysia, confirming their international rollout plans. Oppo has also revealed that ColorOS 16 will be released on October 15, just ahead of the Find X9 launch.

Why Dimensity 9500 Matters

The Dimensity 9500 uses an eight-core architecture with a 4.21GHz Ultra Core, three 3.5GHz Super Cores, and four 2.7GHz Performance Cores. MediaTek claims a 32 percent increase in single-core performance and a 17 percent boost in multi-core performance over its predecessor. The chip also uses 55 percent less power at peak load.

MediaTek has added support for 4-channel UFS 4.1 storage and LPDDR5X RAM at 9600Mbps, enabling faster data transfers and smoother multitasking. The new NPU 990 improves large model processing and allows 100 percent faster AI image generation at 4K resolution while consuming 33 percent less power.

The G1-Ultra GPU delivers a 33 percent jump in graphics performance and improves power efficiency by 42 percent. Features like MegaLights in Unreal Engine 5.6 and support for Nanite rendering position the chip as a serious option for mobile gaming.

The Imagiq 1190 ISP allows for 320MP image capture, Dolby Vision 4K recording at 120fps with stabilization, and adaptive display enhancements via MiraVision.

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For years, Qualcomm Snapdragon chips have been the go-to choice for top performance and efficiency on Android devices over MediaTek. However, recent MediaTek Dimensity chips have been closing in on the gap, and as a result, the competition between the two chipmakers is now fiercer than ever before.

In September, both chipmakers announced their most powerful mobile chipsets, Snapdragon 8 Elite Gen 5 and Dimensity 9500, promising significant improvements to performance and power efficiency. But how do they stack up against each other? Let’s look at benchmark figures and key differences to find out the answer.

Snapdragon 8 Elite Gen 5 vs Dimensity 9500: Benchmark Score

Note: The benchmark scores were obtained from the listings of the Honor Magic 8 (powered by Snapdragon 8 Elite Gen 5) and Vivo X300/Pro (powered by Dimensity 9500) spotted on benchmark websites.

Geekbench Score

The Snapdragon 8 Elite Gen 5 posts 3,364 points in single-core, which is about 15% higher than Dimensity 9500. The multi-core performance also tells the same story, getting about 12% higher score than the Dimensity chip.

The Snapdragon chip, featuring a robust Oryon CPU, dominates Geekbench with higher single-core and multi-core scores. In other words, the 8 Elite Gen 5 should offer better performance than the Dimensity 9500 in tasks that require a single core, as well as in multi-core tasks such as multitasking, running heavy apps, and managing background apps.

AnTuTu Score

Both Snapdragon 8 Elite Gen 5 and Dimensity 9500 have managed to cross the 4 million mark on AnTuTu, becoming the first mobile chipsets to achieve this feat. The Snapdragon chip comes at the top, posting a total score of 4,166,339 (vs. 4,011,932). The difference here is just 4%, but it gets wider as you look at the breakdown.

The Snapdragon 8 Elite Gen 5 achieves a 16% higher CPU score (1,213,845 vs. 1,043,247). The GPU score, however, favors the Dimensity 9500 (1,510,982 vs. 1,468,351), but the difference is small — just 3%. It also gets a higher memory score, but the Snapdragon chip bounces back with a higher UX score.

Snapdragon 8 Elite Gen 5 vs Dimensity 9500: Specs and Key Differences

Both flagship chipsets utilize TSMC’s 3nm (N3P), shifting from the N3E process used in their predecessors, for improved power efficiency and performance density. The key difference lies in the CPU architecture, where Qualcomm maintains its proven “2+6” core configuration, featuring two prime cores at 4.6GHz and six performance cores at 3.62GHz. MediaTek, on the other hand, continues with its “All Big Core” design, featuring one C1-Ultra core at 4.21 GHz, three C1-Premium cores at 3.5 GHz, and four C1-Pro cores at 2.7 GHz.

The GPU also gets notable upgrades on both chips. The Snapdragon 8 Elite Gen 5 introduces a new Adreno 840 GPU clocked at up to 1.2 GHz, paired with Qualcomm’s gaming technologies, which offer exceptional gaming performance. The Dimensity 9500 chip features an Arm Mali-G1 Ultra GPU, which delivers significant improvements in ray-tracing capabilities and power efficiency.

Coming to the NPU, the improved Hexagon NPU inside the 8 Elite Gen 5 is 37% faster and 16% more power-efficient than its predecessor. It supports advanced “agentic AI” capabilities. The Dimensity 9500 has a MediaTek NPU 990, which is 2x faster and offers a 56% reduction in peak power consumption compared to its predecessor.

Both chipsets offer excellent connectivity features, albeit with some differences. The Snapdragon 8 Elite Gen 5 supports a maximum speed of 12.5 Gbps over a 5G connection, while the Dimensity 9500 can go up to 7.4 Gbps. However, it’s a different story with Wi-Fi speed, as the Snapdragon chip peaks at 5.8 Gbps, but the Dimensity 9500 can reach 7.3 Gbps.

The camera has also received notable upgrades, including a 20-bit triple ISP (upgraded from 18-bit) for the Snapdragon 8 Elite Gen 5, which offers nearly four times the dynamic range. Additionally, it supports Advanced Professional Video (APV), making it the first mobile chipset to offer near-lossless video recording quality. The Dimensity 9500 features the Imagiq 1190 ISP, which includes an NPU-assisted focusing tracking engine and powerful AI denoise technology.

Also Read:
1. Snapdragon 8 Elite Gen 5 tops Apple A19 Pro and Dimensity 9500 in early benchmarks
2. Snapdragon 8 Elite Gen 5 vs Snapdragon 8 Elite: here are all the major upgrades
3. Upcoming smartphones powered by the Snapdragon 8 Elite Gen 5

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After months of leaks and rumors, the Snapdragon 8 Elite Gen 5 is finally here, and it’s clearly a big leap over last year’s Snapdragon 8 Elite. More importantly, it outperforms its biggest rivals, the Apple A19 Pro and Dimensity 9500, in early benchmark figures.

Built on a 3nm process, the Snapdragon 8 Elite Gen 5 is touted as the “world’s fastest mobile system-on-a-chip” by Qualcomm, and the benchmark numbers mostly tell the same thing. For the benchmark comparison, we’re using the first-party benchmark numbers as shared by Notebookcheck.

Note that the benchmark figures have been obtained from a reference device, which has a high-end setup like a massive 24GB of LPDDR5X RAM, 1TB UFS4.1 storage, and a large 6.8-inch 3,200×1,440 AMOLED LTPO display. Retail handsets might not perform as well as they prioritize battery life, optimal temperature, and other features over raw performance.

Snapdragon 8 Elite Gen 5 benchmarks

Geekbench Score

Geekbench 6 (single core)

On Geekbench 6, the Snapdragon 8 Elite Gen 5 gets about 20% higher single-core score over last year’s Snapdragon 8 Elite. It also beats the Dimensity 9500 by a 10% margin, but there’s a close matchup with Apple’s powerful A19 Pro. The 8 Elite Gen 5 is slightly behind Apple’s A19 Pro, although the gap is now very thin. The Tensor G5, with a single-core score of 2,316, isn’t a trouble to other chips on the list.

So, in terms of single-core performance on Geekbench, the Snapdragon 8 Elite Gen 5 easily outperforms most of its rivals, except for the Apple A19 Pro, which is as good as Qualcomm’s. However, the multi-core CPU performance is a whole different story.  

Geekbench 6 (multi core)

The Snapdragon 8 Elite Gen 5 achieves over 12,000 points in multi-core performance on Geekbench, leaving all other smartphone chips in the dust. This means more than 20% boost for the latest Snapdragon flagship compared to the A19 Pro and Dimensity 9500 when it comes to tasks that utilize multiple cores. The Tensor G5 disappoints again, scoring just 6,452, almost half of the Snapdragon 8 Elite Gen 5.

AnTuTu score

The reference device, powered by the Snapdragon 8 Elite Gen 5, scores over 4.3 million points on the AnTuTu benchmark. Other than this, only the Dimension 9500 could reach the 4 million territory, with a total score of 4,011,932.

The Apple A19 Pro barely gets past last year’s Snapdragon 8 Elite, while the Tensor G5 struggles at 1.4 million.

Please note that AnTuTu uses different test methods for Android and iOS platforms. This is one of the major reasons you’re seeing a huge difference in the scores here.

3DMark Wild Life Extreme Score

The Snapdragon 8 Elite Gen 5 also shines in the 3DMark test, thanks to architectural upgrades and software enhancements. In the Wild Life Extreme test, it scores 8,329 points, while the A19 Pro can’t get past the 6,000 mark. The Snapdragon 8 Elite, surprisingly, performs better than Apple’s fastest chipset, while the Tensor G5 continues to struggle by a significant margin.

For the Dimensity 9500, we obtained the 3DMark benchmark numbers from the test conducted by Xiaobai’s Tech Reviews. Since no device with this chip has been released yet, the test was likely carried out on a reference device. For the Vivo X300 Pro, we used the leaked benchmark figures from Geekbench, while the AnTuTu score was recently revealed by the company itself.

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MediaTek followed up the launch of its flagship Dimensity 9500 with a new mid-range chip, called the Dimensity 7360. Despite the new name, this one isn’t exactly a ground-up design. It’s more of a refresh of last year’s Dimensity 7300.

At its core, the Dimensity 7360 is built on a familiar setup of four Arm Cortex-A78 performance cores running up to 2.5GHz, paired with four Cortex-A55 efficiency cores.

That’s a fairly standard layout for this segment, but MediaTek is leaning on its software optimizations to make the difference. The chip now supports Adaptive Gaming Technology 3.0, which promises smoother frame rates by balancing visuals and performance while keeping battery drain in check. 

The company claims the chip can deliver up to 20 percent better frame rates and efficiency compared to rival platforms, though those numbers will ultimately depend on how it performs in real-world devices.

On the imaging front, the Imagiq 950 ISP supports cameras up to 200 megapixels, with features like real-time HDR video recording, motion-compensated noise reduction, and faster live focus processing. MediaTek says its HDR video can achieve over 50 percent wider dynamic range than competitors.

The chip also includes MiraVision 955 for improved display rendering on WFHD+ panels with 10-bit color support. The connectivity option includes 5G with up to 3CC carrier aggregation, VoNR, WiFi 6E, Bluetooth LE Audio, Dual Link stereo, and what MediaTek calls Lightning Connect, which essentially speeds up Bluetooth connections.

For AI, the chip has NPU 655, which brings support for mixed precision data types to help with efficiency in visual and camera-related tasks. It supports LPDDR4x and LPDDR5 RAM, alongside UFS 3.1 storage.

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MediaTek has just announced the Dimensity 9500, and it brings serious upgrades over its predecessors. The latest chip features MediaTek’s third-generation All Big Core design and ARM’s latest C1 series CPU cores, offering a significant boost to performance and efficiency. The new G1-Ultra GPU also offers a much better gaming experience while drawing substaintially less power.

The chipmaker promises huge upgrades for the Dimensity 9500, but we’re more interested in what the benchmarks have to say. While we are yet to test the chip, company officials have already published its raw performance data from AnTuTu and Geekbench. We’ll also look at the spec sheet and the biggest upgrades to the chip later in this post.

MediaTek Dimensity 9500 Geekbench Score

During the launch event, MediaTek revealed that the Dimensity 9500 scores 4,007 points in single-core and 11,217 points in multi-core on the Geekbench v6.4 platform. That’s a 32% increase in single-core score and 17% in multi-core score over last year’s Dimensity 9400.

Please note that these are official figures from MediaTek, and it’s likely that the chip is tested under optimal conditions. Anyway, we’ll update the score once we do the testing.

Apple’s A19 Pro (4,019/11,054) recently became the first smartphone chip to surpass the 4000 mark in single-core performance, now joined by the Dimensity 9500. The latter also matches Apple’s latest silicon in multi–core performance. Qualcomm’s Snapdragon 8 Elite Gen 5 is also expected to put on a tough show against these two chips.

MediaTek Dimensity 9500 AnTuTu Score

MediaTek didn’t share the AnTuTu score for the Dimensity 9500 at the event, but a Vivo executive, Han Boxiao, recently shared the AnTuTu (v11) score for Vivo X300 Pro, which runs the same chipset. The latest Dimensity chipset surpassed the 4 million AnTuTu mark, becoming the first smartphone chip to achieve this feat.

Here’s a breakdown of the AnTuTu score:

That’s an impressive 40% jump in the overall AnTuTu score from last year’s Vivo X200 Pro, powered by the Dimensity 9400, scoring 2.88 million AnTuTu points.

MediaTek Dimensity 9500 Spec Sheet

The Dimensity 9500 is fabbed using TSMC’s 3nm (N3P) process, which offers slightly better performance and efficiency than the N3E process used for Dimensity 9400. It features ARM’s latest C1 architecture, enabling the chip to deliver up to 32% faster single-core performance. The Ultra core achieves 55% lower power consumption at peak performance, while the overall chip is 30% more power efficient.

There’s a new 12-core Mali-G1 Ultra GPU with significant upgrades. MediaTek says the new GPU offers a 33% performance uplift and 42% better power efficiency at peak performance, and supports 120fps raytracked gaming and 119% ray tracing improvements.

The chip also gets better at AI capabilities, thanks to ninth generation MediaTek NPU 990 with 2nd gen Gen-AI Engine. It enables 2x faster token generation speed, 4K text-to-image generation, and offers up to 56% reduced power consumption at peak AI performance.

The Dimensity 9500 features a new MediaTek Imagiq 1190 ISP with support for 200MP capture with 30fps continuous focus tracking and 4K 60fps portrait video recording with advanced RAW-domain pre-processing. The connectivity portion has also undergone several upgrades, including a 10% power savings with AI traffic prediction, a 50% reduction in latency with AI congestion prediction, a 20% power saving on Wi-Fi, and a 20% improvement in location accuracy. There’s also some boost to the connection speed.

Overall, the Dimensity 9500 looks promising. It has got a faster and efficient CPU, a more powerful GPU with excellent ray tracing capabilities, enhanced AI capabilities, and more robust connectivity features. However, it remains to be seen how this MediaTek’s flagship fares against the Snapdragon 8 Elite Gen 5.

We’ll soon post a comparison between the Dimensity 9500 and Snapdragon 8 Elite Gen 5. Be sure to follow us on Telegram so you stay up-to-date with the latest happenings in tech.

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MediaTek has officially unveiled its latest flagship mobile chipset, the Dimensity 9500. Designed to power the next wave of premium smartphones, the new SoC brings a major leap in AI processing, gaming graphics, and overall efficiency. It is based on a refined 3nm process that brings console-level ray tracing tech, a faster NPU, and upgrades to CPU performance. So here’s everything new and improved.

MediaTek Dimensity 9500: Faster CPU

The chipmaker unveiled the Dimensity 9500 earlier today (22nd September 2025) with eight cores that consists of a 4.21GHz C1 ultra core, three super core C1 cores clocked at 3.5GHz, and four 2.7GHz big core C1 pro. MediaTek claims up to 32 percent bump in single core performance and 17 percent jump in multi core performance over its predecessor. Even at peak performance with the ultra core, the Dimensity 9500 claims to offer up to 55 percent lesser power consumption.

So you get improved performance without sacrificing power efficiency. Overall, the brand stated that the Dimensity 9500 is 30 percent more power efficient during multitasking, gaming, and calls made via social media apps. This is paired with new cache and memory architecture, bringing the industry’s first 4 channel UFS 4.1 support that helps improve performance with large AI models by 40 percent.

Improved AI Processing

Similar to the new Google Tensor G5 on the Pixel 10 series, MediaTek also focused on improving the AI performance on its latest flagship chip with an upgraded NPU. The latest MediaTek NPU 990 arrives with Generative AI Engine 2.0 that doubles compute power for faster large model processing while also offering up to 33 percent reduction in power consumption.

Thanks to this, users get access to 100 percent faster LLM output for 4K image generation, which is another industry first. The super efficient NPU is also 56 percent more power efficient than its predecessor when performing this task.

Console-level Gaming Tech

MediaTek’s latest flagship chip arrives with upgrades to its graphical prowess, with the new ARM G1-Ultra GPU. It promises to offer up to 33 percent higher performance, along with 42 percent improvement on power efficiency. You also get up to 120fps frame rate interpolation with ray tracing enabled. The company worked with leading studios to bring support for MegaLights in Unreal Engine 5.6 and Nanite in Unreal Engine 5.5 to offer AAA console-like real time rendering and ray tracing lighting effects.

New & Improved ISP

The Dimensity 9500 features MediaTek’s new Imagiq 1190 ISP that supports RAW domain, up to 320MP camera, 30fps continuous focus tracking, an upgraded portrait engine, and supports cinematic 4K 60fps portrait videos. It is also the first on Android to bring Dolby Vision recording at 4K 120fps with EIS (Electronic Image Stabilization).

Another major addition is MiraVision’s Adaptive Display technology that can intelligently adjust contrast and color saturation based on ambient lighting via real time analysis. This should allow for improved color reproduction and better shots in low light scenarios.

Other Notable Features

MediaTek’s latest and greatest brings support for WiFi 7, Bluetooth 6.0, Dual SIM Dual Active 5G/4G support, and various satellite based positioning technologies like GLONASS, GPS, NavIC, and others. The Dimensity 9500 supports LPDDR5X 10667 9600Mbps RAM and memory up to 10.7Gbps, along with UFS 4.0 for storage.

This chip will make its global debut on the upcoming Vivo X300 series that will be unveiled in China on 13th October 2025. Vivo’s new premium phones are among the first wave of next gen flagship devices.

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MediaTek has officially confirmed the date for its upcoming flagship chip reveal. The company’s Weibo post announced a launch event scheduled for September 22 at 14:00pm (local time). The upcoming Dimensity 9500 is set to power premium smartphones from Vivo and Oppo, and later on from other brands.

Dimensity 9500 specifications and performance

As per reports, the Dimensity 9500 will adopt a 1+3+4 CPU configuration made up of one Travis core clocked at 4.21GHz, three Alto cores at 3.50GHz, and four Gelas cores at 2.7GHz. Both Travis and Alto belong to Arm’s new X9 line, while Gelas are part of the updated A7 series.

The chip will also feature a Mali-G1 Ultra MC12 GPU built on a new architecture, promising over 40 percent efficiency gains and more than 40 percent improvement in ray tracing capabilities. Early figures suggest that ray-traced gaming could exceed 100 frames per second, signalling a significant upgrade for mobile gaming.

The platform includes 16MB of L3 cache, 10MB SLC, SME instruction set support, and NPU 9.0 with an expected 100 TOPS of AI performance. Memory support extends to LPDDR5x at 10667Mbps along with UFS 4.1 storage for faster data handling.

Vivo’s X300 series will be the first to introduce the Dimensity 9500 to the market. Last week, Vivo’s product manager revealed benchmark results for the X300 Pro satellite communication variant, which crossed the 4 million mark on AnTuTu, making it the first Android device to achieve this milestone. However, the Oppo Find X9 Pro satellite communication version’s AnTuTu score, which was confirmed today, has even surpassed that of the X300 Pro satellite version.

Rumours are rife that the Vivo X300 series will debut on Oct. 13, whereas the Oppo Find X9 lineup may break cover on Oct. 21 in China.

MediaTek Dimensity 9600 could be a 2nm chip

Interestingly, MediaTek also disclosed progress on its 2nm flagship SoC, expected to enter mass production by the second half of 2026, likely as the Dimensity 9600.

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Qualcomm announced the Snapdragon 8 Elite last year, featuring Oryon cores for the first time in a mobile chipset. These are high-performance CPU cores that also offer excellent power efficiency. The Snapdragon 8 Elite quickly became favorite among high-end Android devices, but it continued to face fierce competition from MediaTek.

The Dimensity 9400 flagship lineup competes with Qualcomm’s top-tier chipsets, offering impressive performance and efficiency. The lineup recently got its newest member, Dimensity 9400e, which we will be comparing here with the Snapdragon 8 Elite to see how the two chips stack up against each other.

Let’s begin with the spec sheet:

Snapdragon 8 Elite vs Dimensity 9400e: Benchmark comparison

Note: The tests were conducted on the Realme GT 7 Pro (Snapdragon 8 Elite) and Realme GT 7 (Dimensity 9400e).

AnTuTu score

The Snapdragon 8 Elite establishes a clear lead over the Dimensity 9400e on AnTuTu, scoring 2,745,602 against MediaTek’s 2,123,428 — a difference of nearly 29% in overall performance.

Qualcomm’s chip has the edge across all categories. The CPU score is about 15% higher, while the GPU shows a significant 35% boost. The Memory and UX scores also greatly favor the Snapdragon chip.

Here’s a detailed look at the breakdown:

Geekbench score

On Geekbench 6, the Snapdragon 8 Elite once again shows a decisive lead over the Dimensity 9400e. It scores 3,122 in single-core and 9,507 in multi-core, while the Dimensity 9400e could only manage 2,208 and 7,310 in single-core and multi-core, respectively.

This translates to 41% better single-core performance and 30% better multi-core performance for the Snapdragon flagship.

In terms of raw performance, the Snapdragon 8 Elite outperforms the Dimensity 9400e. However, it doesn’t provide the complete picture, including details about the manufacturing process, camera, and connectivity. So, let’s dive into the real-world differences to gain more clarity.

Snapdragon 8 Elite vs Dimensity 9400e: Key differences that really matter

Performance and efficiency

Manufacturing:

Both the Snapdragon 8 Elite and Dimensity 9400e use TSMC’s manufacturing facility, yet they bring notable differences. The Snapdragon chip utilizes a newer and more advanced 3nm (N3E) process node, while the Dimensity chip is built using a 4nm node. This results in notable improvements in performance and efficiency for the Snapdragon chip.

CPU:

The CPU brings major changes. For the Snapdragon 8 Elite, Qualcomm didn’t go with ARM’s Cortex CPU, but instead, it developed its own Oryon cores. The 8 Elite features the 2nd-gen Oryon cores, which have higher clock speeds than the Cortex cores inside the Dimensity 9400e.

Here’s what the CPU cluster looks like:

Snapdragon 8 Elite

• 2 x Oryon (2nd-gen) at 4.32 GHz
• 6 x Oryon (2nd-gen) at 3.53 GHz

Dimensity 9400e

• 1 x Cortex-X4 at 3.4 GHz
• 3 x Cortex-X4 at 2.85 GHz
• 4 x Cortex-A720 at 2 GHz

The Snapdragon 8 Elite has more powerful CPU cores. Additionally, they operate at higher speeds, providing an extra performance boost.

GPU:

The Snapdragon 8 Elite features an Adreno 830 GPU, which is one of the most powerful and power-efficient GPUs for mobile chipsets. It features a new “sliced architecture,” which has helped the GPU achieve 40% enhanced performance and 40% improved efficiency over its predecessor.

Additionally, the 8 Elite supports hardware ray tracing, Unreal Engine 5.3 with Nanite virtualized geometry, and a full suite of Snapdragon Elite Gaming features for a better gaming experience.

The Dimensity 9400e, on the other hand, features a 12-core Immortalis-G720 GPU, which is capable of smoothly running high-end games. It also supports ray tracing capabilities and features MediaTek Adaptive Gaming Technology (MAGT 2.0), a suite of gaming optimizations.

The bottom line here is that the Snapdragon 8 Elite has a more powerful and power-efficient GPU.

NPU:

The Snapdragon chip features an improved hexagon NPU that delivers 45% better AI performance and 45% better performance per watt than its predecessor. It brings on-device personalization and multimodal support. The NPU also helps improve the photo quality, gaming, connectivity, and other areas on a device.

The Dimensity 9400e has MediaTek NPU 790 with generative AI capabilities and support for popular LLMs, such as Qwen 1.5B, Llama 7B, and Llama 8B, with on-device processing.

Memory and storage:

Both chipsets support fast UFS 4.0 storage and LPDDR5X RAM. However, there’s a slight difference. The RAM speed can go up to 5.3 GHz on the Snapdragon 8 Elite, while the Dimensity chip peaks at 4.2 GHz. This means faster app loading and slightly better performance for the Snapdragon chip.

Camera

Both chipsets support up to 320MP camera sensors and up to 8K video recording. The Snapdragon 8 Elite supports limitless real-time semantic segmentation for photos and videos with up to 250 layers. Additionally, it offers a range of camera features, including Truepic photo capture, Video super resolution, Multi-frame Noise Reduction (MFNR), and Bokeh Engine.

The Dimensity 9400e also supports semantic segmentation that automatically detects various scenes and objects and applies precise optimizations. It also supports AI-powered noise reduction, real-time AI processing for cinematic video capture and photo enhancements, and features triple microphones with high dynamic range and noise reduction.

Connectivity

The Snapdragon 8 Elite is equipped with an X80 5G modem, which offers up to 10 Gbps download speed and up to 3.5 Gbps upload speed. Over a Wi-Fi 7 connection, the maximum speed the chip can hit is 5.8 Gbps.

On the other hand, the Dimensity 9400e offers a maximum download speed of up to 7 Gbps on a 5G connection (sub-6GHz) and up to 7.3 Gbps on a Wi-Fi 7 connection. This means it has a higher speed on a Wi-Fi 7 connection but lower on a 5G connection than the 8 Elite.

Additionally, both chips offer a range of features to further enhance connection speed, power efficiency, and coverage.

Snapdragon 8 Elite vs Dimensity 9400e: Conclusion

The Dimensity 9400e is a capable high-end chipset, boasting impressive performance, strong AI capabilities, and competitive gaming capabilities. Its high-end CPU, powerful Immortalis-G720 GPU, and AI-driven optimizations make it a serious challenger in the premium segment. However, the Snapdragon 8 Elite remains the stronger all-rounder.

The Snapdragon 8 Elite is significantly ahead of the Dimensity 9400e in almost all aspects. Its newer 3nm process, custom Oryon CPU cores, and Adreno 830 GPU with sliced architecture give it a significant edge in both performance and efficiency. The benchmarks also greatly favor it over Dimensity 9400e.

In short, the Dimensity 9400e is an excellent alternative, but if you’re after the absolute best in performance, gaming, and efficiency, the Snapdragon 8 Elite is an absolute no-brainer pick.

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New flagship phones are expected to launch soon, starting with Apple introducing the iPhone 17 series on Sept. 9, followed by the Xiaomi 16 series towards the end of the month. A slew of new flagship phones from brands such as Vivo, Oppo, Honor, iQOO, Realme, OnePlus, and Redmi are also anticipated in October. Alongside the flagship war, this period will also mark the battle of new chipsets that will power these phones.

Chipset war to begin soon

According to reliable tipster Digital Chat Station, the smartphone industry is heading into a major “chip war” before the big wave of flagship phone launches. Apple is leading with the A19 and A19 Pro, followed by MediaTek with the Dimensity 9500, and then vwith two Snapdragon 8 series platforms, the SM8850 and SM8845. These Qualcomm chips are likely to hit the market with respective names such as the Snapdragon 8 Elite Gen 5 (aka. Snapdragon 8 Elite 2) and Snapdragon 8 Gen 5.

All of these are based on TSMC’s N3P process and are positioned as powerful “performance beasts.” The tipster also mentions that Apple and Qualcomm have already shifted to a dual-chip strategy. With chipset makers expected to adopt the 2nm process next year, which will bring higher costs, it remains to be seen whether MediaTek will also follow a dual-chip strategy.

As per reports, the cost of TSMC’s 2nm wafers is estimated at around $30,000 per wafer, higher than the price of 3nm wafers. This surge in cost is expected to affect the pricing of Android flagship phones in 2026.

Snapdragon 8 Gen 5 to power next-generation foldable phones

DCS said that the Snapdragon 8 Gen 5 is currently being tested by manufacturers such as Honor, Oppo, and Vivo, and he plans to share his own hands-on results soon. He added that some brands are considering using the Snapdragon 8 Gen 5 for foldable phones.

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MediaTek’s next flagship processor, the Dimensity 9500, is expected to launch later this month, and a new leak has laid out most of its key specifications. The information comes from tipster Digital Chat Station, who has a track record of detailing smartphone hardware ahead of release.

At the heart of the Dimensity 9500 is a CPU built on TSMC’s advanced N3P process. The setup follows an all-large-core layout that MediaTek has been using for the past few generations.  The configuration includes one Cortex-X930 core running at 4.21GHz, three Cortex-X930 cores at 3.5GHz, and four Cortex-A730 cores at 2.7GHz. 

On the graphics side, the processor integrates a Mali-G1 Ultra MC12 GPU, running at around 1MHz. The leak notes that the GPU has a new microarchitecture that improves ray tracing performance while reducing power draw.

Beyond cores and graphics, the Dimensity 9500 has a 16MB L3 cache, 10MB system-level cache, and support for the SME instruction set, plus a next-gen NPU 9.0 said to hit 100 TOPS (trillion operations per second). For memory and storage, the chip supports LPDDR5X RAM at 10667Mbps and UFS 4.1 storage over a 4-lane setup.

Digital Chat Station also pointed out that the imaging stack may include a version of Vivo’s V3+ ISP, though this will likely be exclusive to Vivo devices.

MediaTek Dimensity 9500 known specs

According to earlier leaks, the Dimensity 9500 will debut on September 22nd, slightly ahead of Qualcomm’s next-gen Snapdragon. The processor is expected to launch first in the vivo X300 series, with Oppo’s Find X9 lineup following in October.

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(Source)

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A new leak suggests that MediaTek’s upcoming flagship chip, the Dimensity 9500, could be one of the first processors to break past 400,000 points on the upcoming AnTuTu v11 benchmark. 

The info comes from reliable tipster Digital Chat Station, who claims that test platforms running the new chip are already showing promising results.

The score isn’t final yet. In fact, AnTuTu v11 itself hasn’t even launched. However, the leak suggests that storage will play a big role in pushing numbers higher. 

Better storage, more speed on AnTuTu 

According to the tipster, both “blue” and “green” platforms (likely Vivo and Oppo) are experimenting with 1TB 4-lane UFS 4.1 storage and it could add anywhere from 80,000 to 100,000 points on top of the raw CPU and GPU performance. That means a properly equipped Dimensity 9500 device could easily widen the gap over older flagships.

On the technical side, the Dimensity 9500 will stick to ARM’s reference designs rather than going custom. It reportedly features four Cortex-X930 cores (with three clocked slightly lower) and four Cortex-A730 cores, paired with a 12-core Mali-G1 Ultra GPU. 

It’s fastest core may reach 4.00GHz mark. That’s still behind Qualcomm’s upcoming Snapdragon 8 Elite 2, which is rumored to hit 4.74GHz with its custom Oryon cores.

As for Geekbench 6, the Dimensity 9500 scored over 3,900 in single-core and more than 11,000 in multi-core tests. The chip is built on TSMC’s 3nm process and includes support for ARM’s Scalable Matrix Extension (SME), which should improve AI and machine learning tasks.

MediaTek is expected to unveil the Dimensity 9500 on September 22, just a day before Qualcomm’s Snapdragon 8 Elite 2. Several phone manufacturers are expected to announce their respective devices powered by the chip soon after.

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The upcoming Android flagship chips are expected to launch in September. Qualcomm has already confirmed the launch of the Snapdragon 8 Elite 2 during the Snapdragon Summit on September 23.

Now, tipster Digital Chat Station says the new Dimensity 9500 will be announced on September 22, just one day before Qualcomm’s Snapdragon event.

We’ve already seen some early benchmark numbers for Qualcomm’s chip in a phone that appears to be the Galaxy S26 Edge. The results weren’t final, but they gave us a rough idea of its power.

Both new chips are expected to use TSMC’s latest 3nm process, which should make them faster and more power-efficient. However, their designs are different.

MediaTek will use ARM’s standard CPU and GPU designs for Dimensity 9500. It is expected to feature a combo of four Cortex-X930 (three clocked slightly lower) and four Cortex-A730. Qualcomm, on the other hand, is working on custom Oryon cores for 8 Elite 2.

Moreover, the Dimensity 9500’s fastest cores could run at 4.00GHz, faster than last year’s Dimensity 9400, but still slower than Qualcomm’s rumored 4.74GHz for the 8 Elite 2. The chip will likely keep the same 12-core Mali-G1 Ultra GPU as before.

With this setup, MediaTek’s solution reportedly scores over 3,900 in single-core and exceeds 11,000 in multi-core tests on Geekbench 6. 

Another notable upgrade could be support for ARM’s Scalable Matrix Extension (SME), which could make the Dimensity 9500 much better at heavy computing tasks and boost multi-core performance by a notable margin. 

September will not be just about the chips, though. Once they’re official, we are pretty sure that Android manufacturers will start teasing their new flagship phones with these chips. In fact, the Xiaomi 16 series, powered by the Snapdragon 8 Elite 2, is expected to launch later that month.

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(Source)

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