The Snapdragon 6 Gen 4 and Dimensity 7400 are popular smartphone chips that bring modern capabilities and high performance to lower-mid-range smartphones. The Snapdragon chip aims to offer high-end architecture, including Cortex-A720 cores and elite gaming features, down to a wallet-friendly price point. On the other hand, the Dimensity 7400 prioritizes raw performance with impressive clock speeds and fast 5G download speeds.

Both chipsets arrived at the exact same time, in February 2025, but they take different approaches under the hood. From benchmark battles to real-world gaming and camera capabilities, we’ll compare these two chipsets head-to-head to find out which one has the edge.

Here’s the spec sheet to begin with:

Snapdragon 6 Gen 4 vs Dimensity 7400: Benchmark numbers

Note: The benchmark tests were performed on the Realme P3 (powered by the Snapdragon 6 Gen 4) and the iQOO Z10R (powered by the Dimensity 7400).

Geekbench score

The Snapdragon 6 Gen 4 pulls ahead in both single-core and multi-core tests on Geekbench, though the differences are modest. The chip obtains a 1092 single-core score and a 3094 multi-core score. In contrast, the Dimensity 7400 scores 1042 and 3014 in the single-core and multi-core tests, respectively.

That’s a 4.8% gain in single-core and a 2.6% in the multi-core performance for the Snapdragon 6 Gen 4. While they are unlikely to bring drastic changes, users may notice slightly better performance, faster app loading times, and a more responsive experience.

AnTuTu score

On AnTuTu v11, the Snapdragon 6 Gen 4 achieves a total score of over 980K, while the Dimensity 7400 gets a lower score of 925K. That top-level score doesn’t tell the whole story, however. You get a clearer picture once you look at the breakdown.

The Snapdragon chip posts a 15% higher CPU score and a 10% higher GPU score. The Dimensity chip is ahead of the Snapdragon chip in memory performance, but the difference is too small to be considered. The user experience (UX) score also favors the Dimensity chip.

Both benchmarks suggest the Snapdragon 6 Gen 4 delivers better performance than the Dimensity 7400. Most people would look at the benchmark data and draw a conclusion, but there are important aspects to consider, such as connectivity features and camera capabilities. (more on that below)

Snapdragon 6 Gen 4 vs Dimensity 7400: Key differences that matter

Performance

Both the Snapdragon 6 Gen 4 and the Dimensity 7400 have been manufactured using TSMC’s 4nm process, but they feature different core configurations.

The Snapdragon chip’s CPU cores are arranged in a traditional ‘1+3+4’ structure to deliver balanced performance and efficiency, while the Dimensity 7400 uses a ‘4+4’ structure, focusing on peak performance.

While the Dimensity 7400 chip has higher CPU clock speeds, the Snapdragon 6 Gen 4 uses newer, more powerful CPU cores. It’s the reason the Snapdragon chip can achieve higher Geekbench scores.

For graphics-intensive tasks, the Snapdragon chip has an Adreno 810 GPU. The chip integrates select Snapdragon Elite Gaming features for a smooth gaming experience. It includes the Snapdragon Game Super Resolution feature for the first time in the lineup, which upscales gaming scenes in up to 4K without drawing much power.

The Dimensity 7400 is equipped with a dual-core Mali-G615 GPU, paired with MediaTek HyperEngine Gaming Technology features to deliver an enhanced gaming experience with consistent frame rates and improved network connectivity.

Camera

The Snapdragon 6 Gen 4 is equipped with a Qualcomm Spectra Triple ISP, which can process data from three camera sensors simultaneously. The chip supports zero shutter lag across multiple camera combinations, while the Dimensity 7400 adds Google Ultra HDR support.

The Dimensity chip features a 12-bit Imagiq 950 ISP, with support for up to 200MP single camera and 4K video recording at 30fps, something the Snapdragon chip also brings to the table.

Connectivity

Another crucial difference is the higher peak 5G speed on the Dimensity 7400, while the Snapdragon chip supports mmWave, which the other chip lacks.

• Snapdragon 6 Gen 4: 2.9 Gbps (peak 5G speed)
• Dimensity 7400: 3.27 Gbps (peak 5G speed)

Snapdragon 6 Gen 4 vs Dimensity 7400: Which is better?

The Snapdragon 6 Gen 4 is the clear winner here. It delivers higher CPU performance thanks to newer, more powerful cores. The chip comes with a powerful Adreno GPU, which, paired with Snapdragon Elite Gaming features, delivers a more consistent, lag-free gaming experience compared to Dimensity 7400. The inclusion of mmWave support further strengthens its case.

That said, the Dimensity 7400 is also a very capable mid-range chipset. Except during longer gaming sessions, you will hardly notice a performance difference. It has ISP capabilities comparable to the Snapdragon 6 Gen 4 and offers higher peak 5G speeds.

In short, you should go for the Snapdragon 6 Gen 4 unless gaming isn’t your priority and you can get a Dimensity 7400 phone at a hefty discount.

Best phones with a Snapdragon 6 Gen 4 SoC:

• Nothing Phone 4(b)
• Oppo K13
• Realme P3
• Honor X9d
• Realme 14

Best phones with a MediaTek Dimensity 7400 SoC:

• Motorola Edge 60
• Motorola Edge 60 Fusion
• Vivo T4R
• Motorola Moto G86 Power
• iQOO Z10R

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OPPO Reno 16 Pro is now available for global customers through Giztop with worldwide shipping. The smartphone starts at $649, making it an attractive option for users looking for a premium Android device with flagship-level hardware. It combines a large OLED display, the latest MediaTek processor, powerful cameras, and a massive battery, making it suitable for gaming, photography, and everyday use.

Display

The OPPO Reno 16 Pro features a 6.78-inch AMOLED display with a 2772 × 1272 resolution and a smooth 120Hz refresh rate. The screen also supports HDR10+, 2160Hz PWM dimming, and reaches up to 1,800 nits of local peak brightness for better outdoor visibility. With a 240Hz touch sampling rate and centered punch-hole design, the display delivers a responsive and immersive viewing experience.

Performance and Software

Powering the device is the MediaTek Dimensity 9500s octa-core processor with built-in 5G support. It is paired with 12GB or 16GB of LPDDR5X RAM and up to 512GB of UFS 3.1 storage, ensuring smooth multitasking and fast app loading. The phone runs Android 16 with ColorOS 16, offering a clean interface along with productivity and customization features.

Cameras

The OPPO Reno 16 Pro comes equipped with a versatile triple rear camera setup. It includes a 200MP Sony IMX890 main camera with OIS, a 50MP periscope telephoto camera offering 3.5x optical zoom, and a 50MP ultra-wide camera for capturing landscapes and group shots. On the front, a 50MP selfie camera handles high-resolution selfies and video calls.

Battery and Other Features

The smartphone packs a large 7000mAh battery designed to last through heavy daily use. It supports 80W wired fast charging and 50W wireless charging, allowing users to recharge quickly. Security is handled by an in-display fingerprint scanner for fast and secure unlocking.

Price and Availability

OPPO Reno 16 Pro is currently available from Giztop with worldwide shipping. The phone starts at $649, making it a compelling choice for buyers looking for a premium smartphone with a high-quality display, capable cameras, strong performance, and long battery life.

Read More:

• Vivo X Fold 6 Now Available at Giztop Starting at $1499
• Xiaomi 17T Pro Available at Giztop Starting at $699 With Flagship Specs
• Vivo X300 FE Global Now Available at a Discounted Price on Giztop

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While the Snapdragon 8 Gen 3 is almost three years old, it has gained significant popularity in recent months, and all of us are aware of the reason: the rising cost of memory and RAM, and the difficulty of securing chip production. MediaTek isn’t immune to these challenges either, but its Dimensity 8400 has fast become a strong alternative for high-end devices.

Both Snapdragon 8 Gen 3 and Dimensity 8400 deliver excellent performance and power efficiency, but there are areas where one is ahead of the other. In this post, I’ll break down the benchmark scores and key differences to help you figure out the best choice for your needs.

Here’s the spec sheet to begin with:

Snapdragon 8 Gen 3 vs Dimensity 8400: Benchmark numbers

Note: The benchmark tests were performed on the iQOO 12 (powered by the Snapdragon 8 Gen 3) and the iQOO Z10 Turbo (powered by the Dimensity 8400).

Geekbench score

On Geekbench 6, the Snapdragon 8 Gen 3 posts a strong lead in the single-core performance, scoring 36% higher than the Dimensity 8400. That’s because of the powerful Cortex-X4 prime core.

Multi-core scores don’t have a significant difference, but the Snapdragon chip is still on the higher side.

AnTuTu score

On AnTuTu v11, the iQOO 12, powered by the Snapdragon 8 Gen 3 SoC, achieves a total score of over 2.3 million, while the Dimensity 8400-powered iQOO Z10 Turbo posts a total score of just above 2 million. That’s a solid 14% boost for the Snapdragon chip.

But what matters more is the breakdown of the AnTuTu score, which provides a clearer picture.

The Snapdragon 8 Gen 3 leads the CPU chart, but the difference is thin. The GPU score, however, makes a significant impact here. The Snapdragon chip achieves a massive 26% lead over the Dimensity 8400.

Memory and UX performance also favor the Snapdragon chip.

From benchmark results, it’s clear that the Snapdragon 8 Gen 3 has a more powerful CPU and GPU than the Dimensity 8400. However, benchmarks leave some important aspects untouched, such as connectivity and the camera. We’ve included the important differences in the following section.

Snapdragon 8 Gen 3 vs Dimensity 8400: Key differences that matter

Performance

Both the Snapdragon 8 Gen 3 and the Dimensity 8400 use ARM-designed CPUs but have completely different core configurations. The Snapdragon chip features a ‘1+3+2+2’ core structure, while the Dimensity chip uses a ‘1+3+4’ structure.

The Dimensity 8400 has an all-big-core CPU design, featuring superior mid-level and low-level cores. However, the powerful Cortex-X4 core and higher clock speeds on the Snapdragon chip have a greater impact.

For graphics-heavy tasks, the Snapdragon 8 Gen 3 has an Adreno 750 GPU, featuring more shading units and higher FLOPS than the Mali-G720 GPU on the Dimensity 8400. When it comes to gaming, the Snapdragon chip delivers higher, more consistent performance without noticeable lag.

Both processors also have integrated NPUs for on-device AI intelligence. The Hexagon NPU on the Snapdragon 8 Gen 3 supports generative AI models with up to 10 billion parameters. It also powers the image signal processor (ISP) to improve semantic segmentation, night shots, and photo expansion.

The Dimensity 8400 features a MediaTek NPU 880, optimized to support both Generative AI and Agentic AI, allowing the device to run complex, multi-step on-device AI agents. The AI engine is tightly coupled with the ISP, enabling real-time AI image and video enhancements.

Camera

The Snapdragon 8 Gen 3 utilizes the Spectra Cognitive ISP with three 18-bit pipelines to handle simultaneous data streams. It features real-time semantic segmentation up to 12 layers and integrates advanced AI features, including Video Object Eraser, Photo Expansion, Night Vision Video, and Generative AI Editing.

The Dimensity 8400, on the other hand, features a MediaTek Imagiq 1080 ISP, optimized to deliver high dynamic range, reduce noise in low-light environments, and ensure zero shutter lag across multi-camera configurations.

The Dimensity 8400 supports up to 4K video recording, while the Snapdragon 8 Gen 3 goes further up to 8K. The latter also supports Dolby HDR photo technology and Vlogger’s View.

Connectivity

The Snapdragon 8 Gen 3 utilizes an advanced Snapdragon X75 5G modem, offering up to 10 Gbps download speed and up to 3.5 Gbps of upload speed. In contrast, the Dimensity 8400 offers a lower peak speed of 5.17 Gbps.

While both chips support sub-6GHz connectivity, the Snapdragon chip also supports mmWave, which operates on ultra-high frequency bands. The Snapdragon chip also benefits from the newer Wi-Fi 7 standard, while the Dimensity 8400 is limited to Wi-Fi 6E.

Snapdragon 8 Gen 3 vs Dimensity 8400: Which is better?

The Snapdragon 8 Gen 3 is the clear winner here. It holds a distinct edge in raw performance, thanks to its higher clock speeds, powerful prime core, and superior Adreno 750 GPU. The chipset delivers more consistent, lag-free gaming and smoother graphics-heavy performance compared to the Dimensity 8400. It also offers modern connectivity features and higher peak speeds.

However, if you aren’t a gaming-heavy user, the Dimensity 8400 could be a better choice. It delivers smooth everyday performance, excellent power efficiency, and lag-free gaming on moderate settings. The Dimensity chip also stands out for agentic AI support.

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Smartphone makers are gearing up for the next round of flagships, and right now chip pricing is becoming a pretty interesting battle. MediaTek looks like it’s getting ready to raise the cost of its upcoming flagship chip. The Dimensity 9600 Pro is reportedly landing around $216 per unit, which is a noticeable bump up from the previous generation.

According to supply chain chatter, the Pro model is expected to sit at about $216 (roughly RMB 1,466), which works out to roughly an 8% to 20% increase compared to the Dimensity 9500’s current $180–$200 range. It’s being called a “structural recovery”, basically stronger demand for new phones and improving markets in emerging regions are helping justify the hike. Realtek’s recent ~10% increase on some lines follows a similar pattern.

What we know about the Dimensity 9600 series

There’ll be a standard model and a higher-end Pro version. The Pro is rumored to use TSMC’s advanced N2P (2nm-class) process and support faster LPDDR6 memory, while the regular one might stick with N2 and LPDDR5X.

On the CPU side, the Pro is tipped for an aggressive 2+3+3 octa-core setup: two ultra-high-performance ARM Cortex C2-Ultra cores (pushing close to 5GHz), three C2-Premium cores, and three C2-Pro cores. That should deliver solid gains in both single-core and multi-core performance, making it a strong challenger to Qualcomm’s Snapdragon 8 Elite Gen 6 Pro and even giving Apple’s A-series some competition in certain benchmarks.

Other expected features include UFS 5.0 storage, an upgraded Arm “Magni” GPU, and better AI capabilities. Moving to 2nm brings efficiency improvements and higher peak performance, but it also drives up wafer costs — which explains part of the price jump.

MediaTek has been steadily gaining ground in the premium segment, especially with Chinese brands like Oppo and Vivo. The Dimensity 9600 series is expected to show up in phones launching around September 2026.

A noticeable price increase like this will probably lead to slightly higher phone prices down the line, but it shows MediaTek is investing seriously in new manufacturing tech and architecture to keep closing the gap with rivals.

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The Snapdragon 7s Gen 4 and Dimensity 8350 are popular mid-range mobile processors that target the same price segment but serve different purposes. On one side, we have the Snapdragon chip optimized for sustained performance, cooler daily operation, and excellent power efficiency.

On the other side sits the spec-heavy Dimensity 8350 processor, featuring aggressive CPU speed and flagship-grade LPDDR5X and UFS 4.0 support, designed to crush raw benchmarks. So, the real question is: how do these two chips stack up against each other? Let’s find out.

Here’s the spec sheet for a quick overview:

Snapdragon 7s Gen 4 vs Dimensity 8350: Benchmark score

Note: The benchmark tests were performed on the Vivo T5 Pro (powered by the Snapdragon 7s Gen 4) and the Oppo Reno 14 (powered by the Dimensity 8350).

Geekbench score

The Dimensity 8350 pulls ahead in the CPU test on Geekbench, scoring 1324 in the single-core test and 3971 in the multi-core test, compared to 1228 and 3152 points scored by Snapdragon 7s Gen 4.

While the difference in single-core performance is just 7%, the multi-core score difference jumps to 25%. The latter could offer visible differences in tasks that require multiple cores to work together, such as video editing and multitasking.

AnTuTu score

AnTuTu results are heavily in favor of the Dimensity 8350, which scores 1.72 million, while the Snapdragon 7s Gen 4 scores only 1.16 million. That’s a big 47% difference. The breakdown of the total score reveals rather interesting details.

The CPU score is 14% up in favor of Dimensity 8350, while the GPU difference soars to a massive 151%. The memory and UX scores are also up by 25% and 48%.

While the GPU difference is massive, that’s based on the peak score. It doesn’t address gaming stability. To get a better picture, we also ran the 3DMark test as shown below.

3DMark score

Wild Life Extreme Stress Test

This benchmark extensively tests how well a device maintains its graphical performance and manages heat over an extensive period.

The Dimensity 8350 processors lead this chart by a huge margin, but the Snapdragon 7s Gen 4 is miles ahead in stability. That means the Dimensity chip would offer much higher peak performance, but its performance drops significantly over time. In contrast, the Snapdragon maintains its performance over a longer period.

From benchmark scores, it’s clear that the Dimensity 8350 delivers higher peak performance than the Snapdragon 7s Gen 4, but the latter excels in maintaining a stable performance over a longer period. But that alone doesn’t reflect a chipset’s full capabilities.

We’ll also look at key differences in camera, architecture, and connectivity to make a well-informed decision.

Snapdragon 7s Gen 4 vs Dimensity 8350: Key differences

Performance

The Snapdragon 7s Gen 4 and Dimensity 8350 feature the same ‘1+3+4’ core configuration, but the Snapdragon chip has upgraded CPU cores. That should naturally mean better performance on 7s Gen 4, but the higher clock speeds on the Dimensity chip make a bigger impact here.

The Snapdragon chip is equipped with an Adreno 810 GPU, paired with Snapdragon 8 Elite Gaming features, such as Adaptive Performance Engine 3.0 and Snapdragon Game Super Resolution, to deliver an enhanced gaming experience. In contrast, Dimensity 8350 features a more powerful 6-core Mali-G615 GPU, with MediaTek HyperEngine Adaptive Gaming Technology. The Mali-G615 also supports ray tracing, which mimics how light and shadows behave in the real world.

For on-device AI processing, the Snapdragon chip features a Qualcomm Hexagon NPU, while the Dimensity chip relies on the MediaTek NPU 780. Both NPUs support on-device generative AI. The NPU also helps improve camera output and connectivity.

Camera

The Dimensity 8350 features a higher 14-bit depth, allowing the hardware to capture more granular color and luminance data per pixel than the 12-bit pipelines on the Snapdragon 7s Gen 4. It also supports a massive 320MP camera sensor, while the Snapdragon chip is limited to 200MP.

Another key difference is that the 7s Gen 4 doesn’t support 60fps in 4K recording, whereas the Dimensity 8350 does. The latter also allows an OEM to integrate higher-resolution sensors into a multi-camera setup.

Connectivity

The Dimensity 8350 achieves a much higher peak speed on a sub-6 GHz connection (5.17 Gbps vs 2.9 Gbps). However, the Snapdragon 7s Gen 4 offers greater global spectrum flexibility by supporting high-frequency mmWave bands.

The Snapdragon chip also supports premium DSDA (Dual SIM Dual Active), while the Dimensity chip relies on a standard dual-standby architecture. The Snapdragon 7s Gen 4 also holds a slight edge in proprietary wireless audio standards via its aptX Lossless codec integration, and it offers Triple-Frequency GNSS tracking for more accurate positioning data in dense urban areas, compared to MediaTek’s dual-frequency array.

Snapdragon 7s Gen 4 vs Dimensity 8350: Which is better?

Ultimately, it all comes down to what you value the most. The Dimensity 8350 is a more powerful chipset, offering massive peak processing speeds, 4K video recording at higher frames (60fps), faster RAM/storage capabilities, and much higher network speeds.

For those not seeking peak performance, the Snapdragon 7s Gen 4 is a much better choice. It delivers exceptional thermal stability over long gaming sessions, more flexible global connectivity (mmWave), and premium audio features.

To sum it up, you should choose the Dimensity 8350 for raw, explosive speed, or the Snapdragon 7s Gen 4 for a balanced, highly efficient daily driver.

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The Snapdragon 8s Gen 4 is a flagship-grade mobile processor with a high-end CPU configuration and a powerful Adreno GPU with ray tracing support and excellent gaming capabilities. What makes it more appealing is that phones with the 8s Gen 4 chip are available at a much more affordable price. However, there’s strong competition from MediaTek in the same segment.

The Dimensity 8500 Ultra, announced in early 2026, is one of the closest rivals to the Snapdragon 8s Gen 4. The chipset features an all-big-core CPU design with higher peak speed, competing GPU performance, and faster download speeds.

Let’s find out how these two processors stack up against each other and which one delivers better performance and value for the money.

Snapdragon 8s Gen 4 vs Dimensity 8500 Ultra: Benchmark score

Note: The benchmark tests were performed on the POCO F7 (powered by the Snapdragon 8s Gen 4) and the POCO X8 Pro (powered by the Dimensity 8500 Ultra).

Geekbench performance

The Snapdragon 8s Gen 4 delivers 27% higher single-core performance despite a lower peak clock speed. That’s because the prime Cortex-X4 core in the 8s Gen 4 is more powerful than the Cortex-A725 in the Dimensity 8500 Ultra.

The difference in multi-core scores isn’t big, though. The Snapdragon chip still has the upper hand, but the score is only 3% higher than the Dimensity 8500 Ultra’s.

AnTuTu performance

On the AnTuTu v11 benchmark, the Snapdragon 8s Gen 4 pulls off 2.32 million AnTuTu points, while the Dimensity 8500 Ultra remains behind with 2.11 million points. This number suggests better overall performance for the Snapdragon chip, but the picture becomes clear when you look at the individual scores for each test.

The Snapdragon 8s Gen 4 leads the CPU performance with a 13% higher score, while the GPU difference is even bigger. The Snapdragon chip also performs better in the GPU test with a whopping 23% higher score.

3DMark performance

Wild Life Extreme Stress Test

This test specifically measures the gaming performance of a device under heavy workload, where the Snapdragon 8s Gen 4 maintains an edge over the Dimensity 8500 Ultra. The high score is up 7%, and the low score is up 15%. The Snapdragon chip also has better gaming stability.

All benchmark tests we looked at so far tell the same thing: the Snapdragon 8s Gen 4 offers superior performance and gaming stability compared to the Dimensity 8500 Ultra. But that should not be the only factor to consider when deciding on a chip upgrade.

You should also look at the other important aspects, such as the camera and connectivity, detailed below.

Snapdragon 8s Gen 4 vs Dimensity 8500 Ultra: Key differences that matter

Performance

CPU

While both chips have octa-core CPUs with the same ARMv9.2-A instruction set, their core structures vary. The Snapdragon 8s Gen 4 has a ‘1+3+2+2’ layout, featuring one Cortex-X4 core. The remaining seven are Cortex-A720 cores with varying clock speeds.

In contrast, the Dimensity 8500 Ultra uses a ‘1+3+4’ layout. All of them are Cortex-A725 cores, but their peak speeds vary to ensure a good balance between performance and efficiency.

The Dimensity chip benefits from a higher peak clock speed (3.4GHz vs 3.21GHz), but the inclusion of a more powerful Cortex-X4 prime core in the Snapdragon chip makes an even greater impact.

GPU

The Snapdragon 8s Gen 4 has the Adreno 825 GPU, which offers better performance and stability than the Dimensity 8500 Ultra’s Mali-G720 GPU.

In addition to the advanced Adreno GPU, the Snapdragon chip utilizes Qualcomm’s sliced GPU architecture and Snapdragon Elite Gaming features, including Qualcomm Adaptive Performance Engine and Adreno Frame Motion Engine 2.0 to deliver smooth, high-performance gaming sessions while significantly enhancing power efficiency.

The Dimensity 8500 Ultra features MediaTek HyperEngine technology, promising smooth gaming at 120 FPS and smart power efficiency.

While both chips deliver solid gaming performance, the Snapdragon 8s Gen 4 has an edge in gaming stability and smoother performance during longer gaming sessions.

NPU

The Snapdragon 8s Gen 4 has a hexagon NPU with 2x larger shared memory and 44% faster AI performance than its predecessor. It supports a variety of Large Language Models (LLMs) and Large Vision Models (LVMs), offering greater privacy with on-device processing.

The Dimensity chip also has a powerful MediaTek NPU 880 AI system with diffusion transformer support and NeuroPilot compression technology. It can also run various LLMs and LVMs on-device.

Camera

While the camera output on a device mostly depends on OEM’s implementation, like the sensors being used and software tuning before the final output, the chipset’s ISP capabilities also play a crucial role. The ISP is the hardware that converts raw light data from the sensor into a digital image in real time and determines if a phone can shoot in 4K, 8K, or slow motion.

The Snapdragon 8s Gen 4 features an 18-bit Triple AI ISP with support for real-time semantic segmentation (up to 250 layers), real-time skin and sky tone correction, and low-light capture. The chip supports up to 4K video recording at 60FPS and various HDR formats (HDR10, HDR10+, Dolby Vision).

The Dimensity 8500 Ultra is equipped with an Imagiq 1080 ISP with AI-powered Zero Shutter Lag (ZSL) photos, 4K HDR video recording, and semantic segmentation.

Connectivity

The Snapdragon 8s Gen 4 has an integrated X75 5G modem with a peak download speed of 4.2Gbps. The Dimensity 8500 Ultra extends this to 5.17Gbps. Still, the 8s Gen 4 is the superior choice, as it supports advanced features like Wi-Fi 7 and Bluetooth 6.0, whereas the Dimensity 8500 Ultra supports Wi-Fi 6E and Bluetooth 5.4.

Snapdragon 8s Gen 4 vs Dimensity 8500 Ultra: Which is a better choice?

The Snapdragon 8s Gen 4 is the clear winner here. It outperforms the Dimensity 8500 Ultra across every benchmark we tested. The chip did particularly well in the single-core test on Geekbench. Furthermore, 3DMark stress testing highlights that the Snapdragon’s Adreno 825 GPU delivers better stability and sustained frame rates during extended gaming sessions.

While both chipsets offer robust on-device AI and advanced ISPs, the Snapdragon offers future-proof Wi-Fi 7 and Bluetooth 6.0 connectivity, making it a superior choice overall compared to the Dimensity 8500 Ultra.

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Acer has announced three new large-screen tablets aimed at users looking for productivity, entertainment, and everyday computing on bigger displays. The new lineup includes the Iconia Duo S14, Iconia Duo S12, and Iconia Duo D12, offering a range of specifications across different price segments.

The new models feature display sizes of up to 14.2 inches, MediaTek processors ranging from the Helio G99 to the Dimensity 8300, large batteries, and support for accessories such as active styluses. With the latest launch, Acer is targeting users who want laptop-like screen sizes without sacrificing portability.

Acer Iconia Duo S14: The Flagship Model

Leading the lineup is the Acer Iconia Duo S14, which comes with a large 14.2-inch OLED display featuring a 2880 × 1840 resolution and a 120Hz refresh rate. The panel covers 100% of the DCI-P3 color gamut, offers a 3:2 aspect ratio, and reaches up to 400 nits of brightness.

The tablet is powered by the MediaTek Dimensity 8300 processor and is available with up to 8GB RAM and 256GB of storage. Acer has equipped it with a 10,000mAh battery, making it the largest battery in the series.

For multimedia and productivity, the S14 includes four speakers, Wi-Fi 6E connectivity, dual USB-C ports, a microSD card slot, and optional active stylus support. Camera duties are handled by a 13MP rear camera and an 8MP front-facing camera.

Acer Iconia Duo S12: Premium Features in a Smaller Package

The Iconia Duo S12 brings many of the premium features of the S14 into a more compact form factor. It features a 12.2-inch OLED display with a 2800 × 1840 resolution, full DCI-P3 color coverage, and up to 600 nits brightness.

Under the hood is the MediaTek Dimensity 7400 processor paired with up to 8GB RAM and 256GB storage. The tablet houses an 8,000mAh battery and retains the same 13MP rear and 8MP front camera combination found on the S14.

Other features include Wi-Fi 6, dual speakers, USB-C connectivity, microSD expansion, and optional active stylus support.

Acer Iconia Duo D12: Affordable Option for Everyday Use

For buyers looking for a more affordable tablet, Acer has introduced the Iconia Duo D12. The device features a 12.2-inch display with a 2400 × 1600 resolution and a 90Hz refresh rate.

Power comes from the MediaTek Helio G99 processor, accompanied by up to 8GB RAM and 128GB of storage. Users can further expand storage through a microSD card slot.

The tablet packs an 8,000mAh battery and includes an 8MP rear camera alongside a 5MP front-facing camera. Connectivity features include Wi-Fi 6, USB-C, and dual speakers.

How the Three Acer Tablets Compare

While all three models share large displays and modern connectivity features, Acer has clearly positioned them for different audiences.

The Iconia Duo S14 is designed for users who want the best display, strongest performance, and longest battery life. The combination of a 14.2-inch OLED panel and Dimensity 8300 chipset makes it the most capable device in the lineup.

The Iconia Duo S12 offers a balance between premium features and portability. It delivers an OLED display and a modern Dimensity processor while remaining lighter and easier to carry.

Meanwhile, the Iconia Duo D12 focuses on affordability. Although it drops OLED technology and uses a less powerful processor, it still provides a large display, 90Hz refresh rate, and long battery life for everyday tasks.

Which Acer Tablet Should You Buy?

If performance and multitasking are priorities, the Iconia Duo S14 is the obvious choice thanks to its larger OLED display, Dimensity 8300 processor, and 10,000mAh battery.

For most users, however, the Iconia Duo S12 may be the sweet spot. It retains many premium features while offering a more manageable size and weight.

The Iconia Duo D12 is best suited for students, casual users, and those looking for a large-screen tablet without spending extra on flagship-level specifications.

Acer Iconia Duo Series:

Pricing and Availability

Acer has introduced the new Iconia Duo tablet series in China. Pricing details may vary by configuration and region. Buyers in global markets should note that imported pricing can be significantly higher than official Chinese pricing due to taxes, duties, shipping costs, and retailer markups.

Read More:

• Acer Launches Affordable Acer A210 8-inch Eye-Care Tablet With Android 14 and 8-Inch Display
• Why Nvidia’s H2+ Humanoid Robot Has the Tech World Talking
• US Expands AI Chip Restrictions Worldwide: What It Means for China

(via)

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MediaTek’s new Dimensity 7500 has finally shown up in Geekbench, giving us a rough idea of what kind of performance buyers can expect from the chip.

The benchmark was recorded on the Vivo S60 Vitality Edition, which is the first phone to launch with the processor. It scored 1243 points in single-core testing and 3569 points in multi-core.

Those numbers are better than what we typically see from the Dimensity 7400, although not by a huge margin. That’s actually pretty much what the early specifications suggested. MediaTek previously claimed gains of around 24% in single-core performance and 21% in multi-core workloads, but real-world benchmarks rarely line up perfectly with marketing figures. Still, the jump is there.

What caught my attention is that MediaTek doesn’t seem to be chasing massive year-over-year improvements with this chip. Instead, the company appears to be doing what it has done for several generations now: making small improvements, refining efficiency, and moving the platform forward without dramatically changing the formula.

A few years ago, benchmark scores in this range would have belonged to upper-tier devices. Today, they are showing up in phones that sit comfortably in the mid-range. The reality is that most users will spend more time scrolling social media, taking photos, watching videos, and chatting than pushing all CPU cores to their limits.

The Dimensity 7500 itself is built on a 4nm process and uses an octa-core design paired with a Mali-G625 GPU. Nothing particularly surprising there, but the combination should be more than capable for everyday use and the occasional gaming session.

Vivo has paired the chip with a 144Hz AMOLED display, a slim 7.92mm body, and a starting price of 2,899 yuan.

As always, Geekbench is only one piece of the puzzle. Sustained performance, battery life, thermals, and gaming results will tell us much more about the Dimensity 7500 than a single benchmark run ever could. But based on these early numbers, MediaTek’s latest mid-range chip looks exactly like what it was expected to be: a sensible upgrade rather than a dramatic one.

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(Geekbench)

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In a few months, MediaTek will launch Dimensity 9600 chips, which will power the next-generation of flagship smartphones. Alongside the Dimensity 9600, the chipmaker is also expected to unveil the Dimensity 9600 Pro as the company’s first Pro-branded mobile processor with huge upgrades.

While we’re still months away from the official launch, which is likely to happen in September, leaks have already spilled enough details about the upcoming Dimensity flagships to show us what’s to come.

[Note: MediaTek hasn’t officially revealed any details about the upcoming Dimensity 9600 and Dimensity 9600 Pro, so all the details in the post are purely based on leaks and rumors.]

MediaTek Dimensity 9600 series: Spec sheet

MediaTek Dimensity 9600 series: Everything you need to know

MediaTek will split its next-gen tier into a standard Dimensity 9600 and a high-performance Dimensity 9600 Pro. Not just MediaTek but Qualcomm will introduce a “Pro” version of its upcoming Snapdragon 8 Elite Gen 6 chip around the same time later this year.

The battle is going to be more intense this year as the Dimensity 9600 Pro reportedly brings major performance upgrades and will closely compete with the best from Apple and Qualcomm.

Process node and CPU architecture

The Dimensity 9600 Pro will reportedly utilize TSMC’s advanced 2nm (N2P) node. This could offer a 10–15% performance boost and a 25–30% improvement in power efficiency compared to the previous generation. However, uncertainty remains regarding whether the standard Dimensity 9600 will use the same node.

TSMC’s factories are unable to meet the unprecedented demand for high-performance chips, and so, securing a supply of advanced nodes is a big battle in itself. And to keep the cost in check, the standard Dimensity 9600 may use the 3nm node, or it could be a lower-binned 2nm chip.

Besides an advanced node, the Dimensity 9600 Pro is reportedly getting a major CPU architecture upgrade. Instead of a traditional ‘1+3+4’ design, the Pro chip may use a ‘2+3+3’ configuration, featuring two Ultra cores with a 5.0 GHz peak frequency. The standard Dimensity 9600 may also use the new configuration, but will likely have a lower peak frequency.

The Ultra cores are rumored to be Arm’s next-gen Cortex C2-Ultra codenamed “Canyon”. The three performance cores are codenamed “Gelas-B” and the three balanced performance cores are codenamed “Gelas”.

GPU and gaming capabilities

The Dimensity 9600 chips are reportedly getting huge graphics advancements, designed to rival or beat top-tier chips from rivals. Both variants are said to feature Arm’s next-generation “Magni” GPU architecture, but the Pro chip may have higher core counts.

Furthermore, the chip could feature integrated dedicated hardware blocks directly into the silicon to offload heavy gaming tasks. According to leakster Digital Chat Station, the chip can artificially insert frames into games at a hardware level, allowing a game running at 60 FPS to be smoothly scaled to 120 FPS or higher. The Magni GPU is also said to have native resolution upscaling rather than relying purely on software tricks.

The chips reportedly feature upgraded ray tracing performance, resulting in more realistic lighting, shadows, and reflections in modern titles. Furthermore, the Dimensity 9600 Pro is said to support LPDDR6 RAM and UFS 5.0 storage, which should greatly improve data transfer speeds, resulting in faster game launches and faster loading of gaming assets.

AI and NPU capabilities

MediaTek is said to have greatly improved the AI capabilities on the Dimensity 9600 chips. The same chip is also expected to power OpenAI’s first AI-first smartphone.

The Dimensity chips may utilize a dual-NPU design for layered computing and a Neural Shader Scheduler (NSS) that dynamically analyzes machine learning tasks and divides the compute fluidity between the GPU and NPU based on real-time efficiency.

The processor may feature integrated hardware support for Arm’s Scalable Matrix Extension 2 (SME2), which would significantly accelerate matrix math to achieve faster AI responses with better power efficiency.

Benchmark numbers

Tipster Digital Chat Station has shared early Geekbench 6 estimates based on engineering samples. While they do not represent the final figures, they do give an idea of where things might land.

According to the leak, the Dimensity 9600 Pro could deliver a single-core score of 4200–4300 on Geekbench 6, and multi-core performance could be around 12000–12500. For context, the estimated Geekbench scores for the previous generation were 4000 for single-core and 11000 for multi-core, as shared by the tipster. These figures suggest a steady, incremental generational leap for the Dimensity 9600 Pro, rather than a dramatic shift.

Upcoming devices with the Dimensity 9600 series chips

Here’s a list of upcoming phones expected to be powered by the upcoming Dimensity chips:

• Vivo X500 (Dimensity 9600)
• Vivo X500 Pro (Dimensity 9600 Pro)
• Oppo Find X10 (Dimensity 9600)
• Oppo Find X10 Pro (Dimensity 9600 Pro)

The first smartphone could launch as early as September 2026.

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MediaTek has announced the Dimensity 7500 chipset, targeting mainstream smartphones with upgrades focused on AI, gaming, camera performance, and power efficiency. Built on a 4nm process, the new processor also brings improvements to connectivity and display support while aiming to deliver better everyday responsiveness compared to the previous generation.

Dimensity 7500 specifications

The Dimensity 7500 features an octa-core CPU based on the latest Armv9.3-A architecture, including four Arm C1 Pro cores clocked at up to 2.6GHz and four Arm C1 Nano cores running at up to 2.0GHz. According to MediaTek, the chipset delivers faster app switching, quicker file transfers, reduced game loading times, and improved app launch performance while also improving power efficiency across apps and games.

MediaTek has also upgraded AI processing with the new NPU 850, which reportedly delivers more than twice the AI performance compared to the earlier generation. The chipset supports several on-device AI features including speech recognition, contextual replies, notification summaries, speech-to-text, and text-to-speech processing. MediaTek says the platform supports a broad range of smartphone-ready language models for improved privacy and faster AI processing directly on the device.

For gaming, the Dimensity 7500 includes MediaTek HyperEngine technology and Adaptive Gaming Technology 4.0 for smoother frame rates and improved thermal management. The chipset also supports displays with resolutions up to 1344 x 2800 at 144Hz, along with support for secondary displays at up to 120Hz. Camera support goes up to 200-megapixel sensors, while the Imagiq 1050 image processor handles features such as hardware-based noise reduction and improved low-light imaging.

The chipset supports Wi-Fi 6E, Bluetooth 5.4, and a 3GPP Release 17 5G modem with download speeds reaching up to 5.2Gbps. MediaTek has also added long-range Bluetooth support for direct phone-to-phone connections over extended distances without mobile networks. Other additions include improved 5G recovery in subway or garage environments and better connectivity performance during high-speed train travel.

Reports have revealed that the Redmi Note 17 Pro Max will be one of the early adopters of this chip. Readers can read more about this phone here.

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MediaTek has quietly announced the Dimensity 8550. The 4nm mobile processor isn’t much different from the Dimensity 8500 in terms of raw specs, but it now supports Google’s new Gemini Nano V3 AI.

But before you get too excited, having this chip in your phone doesn’t automatically mean you’ll get Gemini Nano V3 features. There’s more to it.

MediaTek Dimensity 8550 Specifications

The Dimensity 8550 packs MediaTek’s NPU 880 with a new LLM Booster, which enables on-device AI processing without needing an internet connection. The chip also officially supports Gemini Nano V3, but that alone doesn’t guarantee Gemini Intelligence on any phone using it.

As we recently covered in our article about how much RAM your phone actually needs in 2026, Gemini Intelligence demands at least 12GB of RAM — 50% more than Apple Intelligence’s 8GB minimum — along with Gemini Nano V3 support and a flagship-grade chipset. So, a phone running the Dimensity 8550 with 8GB of RAM won’t make the cut, even with the new chip inside.

Beyond the AI story, the rest of the 8550 is identical to the 8500. It’s built on TSMC’s 4nm process and uses eight Cortex-A725 big cores. The lead core runs at 3.4GHz, three more run at 3.2GHz, and four run at 2.2GHz. The Mali-G720 MC8 GPU handles graphics and can drive 1440p displays at up to 144Hz. For video, you get 4K recording at 60fps and AV1 playback support. Camera support goes up to 320MP.

Connectivity support includes 5G with dual SIM dual active, Wi-Fi 6E, Bluetooth 5.4, LPDDR5X RAM at 9,600Mbps, and UFS 4.0 storage.

Interestingly, the first few phones with the Dimensity 8550 are already on the market. Honor recently launched the Honor 600 Pro, while Oppo announced the Reno 16, both of which use the same chip.

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(Source)

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MediaTek has completely transformed its Dimensity lineup, and the new Dimensity 9500 proves it. The latest Dimensity flagship goes toe-to-toe with the absolute best from Qualcomm and Apple. On the flip side, while Samsung’s Exynos line has historically struggled, the Exynos 2600 feels like a massive leap forward rather than just another boring annual refresh.

The Exynos 2600 is the company’s first smartphone processor to feature an “all-big” CPU design, allowing the chip to unlock higher performance. It’s also the world’s first smartphone chipset fabricated using a 2nm process, further adding to performance and efficiency. Historically, MediaTek chips have outperformed Exynos chips, but this time, the battle looks more intense.

Let’s compare them to see whether the advanced node and all-big CPU design can help the Exynos 2600 beat MediaTek’s rival, the Dimensity 9500.

Here’s the spec sheet to begin with:

Dimensity 9500 vs Exynos 2600: Benchmark numbers

Note: To obtain the benchmark results, the tests were performed using these devices:
– Vivo X300 Pro (Dimensity 9500)
– Galaxy S26 Plus (Exynos 2600)

Geekbench score

In the Geekbench 6 CPU test, the Dimensity 9500 achieves a 13% higher single-core score. In the multi-core test, however, the Exynos 2600 is ahead, but the gap is just too small to create a major difference.

AnTuTu score

The Dimensity 9500 puts up a strong total on AnTuTu, scoring over 3.5 million points, whereas the Exynos 2600 scores 3.2 million points. While it shows the Dimensity chip is stronger, it’s the breakdown of the AnTuTu score that offers more clarity.

The all-big 10-core CPU on the Exynos chip gets about 3.6% higher AnTuTu score than the Dimensity 9500’s 8-core CPU. However, the latter bounces back strongly in the GPU test with a 16% higher score.

3DMark score

Wild Life Extreme Test

The 3DMark benchmark also confirms that the Dimensity 9500 has a more powerful GPU. There isn’t a big difference in the best loop score, but the Dimensity chip has a much better lowest loop score. This means higher gaming stability on the Dimensity 9500-powered smartphone.

In all benchmark tests we’ve run so far, the Dimensity 9500 is more powerful than the Exynos 2600. But there’s more than just the performance. It’s also important to understand the differences in camera capabilities, connectivity, and other key aspects.

Dimensity 9500 vs Exynos 2600: Key differences that matter

Performance

CPU

The Dimensity 9500 utilizes TSMC’s cutting-edge 3nm node, whereas the Exynos 2600 is manufactured using Samsung’s 2nm process. Besides, their CPU configurations also differ. The Dimensity chip has an 8-core layout, featuring one C1-Ultra, three C1-Premium, and four C1-Pro cores.

In contrast, the Exynos 2600 has two additional CPU cores but skips the C1-Premium cores. The 10-core setup includes one C1-Ultra, three C1-Pro, and six C1-Pro cores.

Even with fewer CPU cores, the Dimensity 9500 outperforms the Exynos 2600 in some benchmark tests. That’s because of higher clock speeds and the performance-friendly C1-Premium cores.

GPU

The Dimensity 9500 features a 12-core Mali-G1 Ultra graphics unit, offering superior performance and stability compared to the Xclipse 960 GPU on the Exynos 2600. But when it comes to ray tracing performance, the Exynos chip shines.

The Dimensity chip is widely praised for cooler thermals. On the other hand, Exynos chips have faced major overheating issues, but the latest Exynos 2600 dramatically improves this by introducing the Heat Path Block (HPB). It’s a hardware component located directly over the hottest areas of the main processing unit.

Furthermore, the Dimensity 9500 offers a full suite of MediaTek HyperEngine Gaming Technology, improving latency, frame rates, and power consumption. The Exynos chip benefits from Samsung’s partnership with AMD, which focuses on optimizing game engines like Unity and Unreal for this architecture.

NPU

The Dimensity 9500 comes with an upgraded MediaTek NPU 990 with agentic AI capabilities. MediaTek says it’s twice as powerful as the previous generation, with 56% better power efficiency, and is designed to handle complex, multi-step tasks in the background. The new NPU can generate 4K images from text.

The Exynos 2600 also brings major NPU upgrades compared to the Exynos 2500, including 113% faster generative AI performance and significantly reduced power consumption and latency. The NPU also helps with resolution upscaling and frame generation.

Camera

Both chipsets boast high-end camera features, but there are several key things to note. The Dimensity 9500 integrates an NPU-assisted 30fps focus-tracking engine, ensuring a clear shot in every frame. It also has a powerful denoise technology for 200MP photo captures.

The Exynos 2600 focuses on real-time element recognition and severe low-light optimization, backed by its on-device AI enhancements. It integrates an AI-based Visual Perception System (VPS) that allows the ISP to recognize detailed elements within images and videos in real time.

The Exynos chip also features Deep Learning Video Noise Reduction (DVNR) to enhance clarity in low-light conditions and supports the Advanced Professional Video (APV) codec.

Connectivity

The Dimensity 9500 has an integrated 5G modem, whereas the Exynos 2600 relies on a separate, external component for connectivity. Both chips offer robust, modern connectivity features, but there’s a big difference in the download speed.

On a 5G connection, the Dimensity chip can reach up to 7.4Gbps of download speed, while the Exynos chip can reach 2X of that, up to 14.79Gbps. The Dimensity chip excels in peak Wi-Fi 7 speeds, offering up to 7.3Gbps (versus 4.9Gbps on the Exynos 2600).

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The Snapdragon 8 Gen 5 is one of the most popular high-end smartphone chipsets right now. It’s packs a custom-designed Oryon CPU, a capable GPU that offers excellent gaming performance and stability, and modern connectivity features. Many of the camera capabilities have been borrowed from the top-tier 8 Elite Gen 5 SoC, which is also a big plus for the 8 Gen 5.

The Dimensity 9400 Plus, on the other hand, is a top-tier flagship chipset, but the fact that it’s priced around the same as Snapdragon 8 Gen 5 phones makes the battle more interesting. Let’s look at the benchmark scores, spec sheet, and crucial differences to figure out how these two flagship chips fare against each other.

Quick verdict:
– Choose Snapdragon 8 Gen 5 if you prioritize CPU performance, robust connectivity with higher 5G download speed and mmWave bands, and a premium ISP pipeline.
– Choose Dimensity 9400 Plus if you prioritize sustained gaming performance, faster Wi-Fi speeds, and longer phone-to-phone Bluetooth connections.

Snapdragon 8 Gen 5 vs Dimensity 9400 Plus: Spec sheet

Snapdragon 8 Gen 5 vs Dimensity 9400 Plus: Benchmark score

Geekbench score

On Geekbench 6, the Snapdragon 8 Gen 5 pulls ahead in both single-core and multi-core tests, although the differences aren’t huge. The single-core score is up by 3%, and the multi-core score is 8% higher than that of the Dimensity 9400 Plus.

AnTuTu score

The Snapdragon 8 Gen 5 achieves about a 4% higher AnTuTu score than the Dimensity 9400 Plus. But this doesn’t offer much clarity unless you look at the breakdown of the total AnTuTu score.

The Snapdragon chip still maintain an edge over the Dimensity 9400+ in CPU performance with a 7% higher score, but the GPU score favors the Dimensity chip, which gets about a 4% higher score.

Looking at the benchmark scores, the Snapdragon 8 Gen 5 feels like a more performance-friendly option, but that alone doesn’t tell the complete picture. One should also consider other key metrics, such as camera capabilities and connectivity upgrades, to make an informed decision.

Snapdragon 8 Gen 5 vs Dimensity 9400 Plus: Key differences

CPU, GPU, & NPU

Both chipsets feature an all-big-core CPU design, but differ notably in CPU clusters and peak performance. The Snapdragon 8 Gen 5 utilizes Qualcomm’s custom-designed Oryon CPU, featuring a ‘2+6’ configuration. This includes two prime cores and six performance cores.

The Dimensity 9400 Plus features a tiered ‘1+3+4’ CPU configuration, consisting of one Cortex-X925 prime core, three Cortex-X4 performance cores, and four Cortex-A720 performance cores. The CPU has a peak frequency of 3.73 GHz, while the Snapdragon 8 Gen 5 reaches 3.8 GHz. The latter also excels in higher speeds on secondary scores.

For gaming and other graphics-intensive tasks, the Snapdragon 8 Gen 5 features an Adreno 829 GPU with a full suite of Snapdragon Elite Gaming features, including Snapdragon Adaptive Performance Engine 4.0 and Qualcomm FPS 3.0, further optimizing game performance and power efficiency.

The Dimensity 9400 Plus uses a 12-core Arm Immortalis-G925 GPU, paired with many game-related features, including MediaTek Frame Rate Converter 2.0+ and MediaTek Adaptive Gaming Technology (MAGT) 3.0, to deliver excellent gaming performance and stability. MediaTek says the chip delivers PC-grade ray tracing capabilities.

Turning to AI capabilities, the Snapdragon 8 Gen 5 features an upgraded Hexagon NPU that delivers 46% faster performance than its predecessor (8 Gen 3). This is the first Qualcomm chip to embed hardware matrix acceleration into the Oryon CPU, enabling the CPU to execute matrix-intensive AI subtasks without offloading everything to the NPU. The 8 Gen 5 also supports contextually-aware agentic AI that can learn and adapt to offer personalized assistance.

The Dimensity chip features the MediaTek NPU 890, which supports new generative and agentic AI models. Specifically, it has full support for the DeepSeek-R1-Distill (1.5B/7B/8B) model with on-device processing.

Camera

The Snapdragon 8 Gen 5 inherits many of the camera capabilities from the top-tier 8 Elite Gen 5 chip. It includes a 20-bit Triple AI ISP, up to 320MP camera support, and 4K video recording at 120fps. On top of a robust ISP pipeline, the chip uses AI to process data frame by frame in real time for accurate optimizations. The chip also supports real-time tone control, Night Vision 3.0 for low-light environments, and Snapdragon Audio Sense for HDR audio recording without noise.

In contrast, the Dimensity 9400 Plus features an Imagiq 1090 ISP that promises to offer “DSLR-like experience.” It also supports up to 320MP camera resolution and 4K video recording at 120fps, and adds features such as Full-range HDR zoom, Gen-AI Telephoto, and Lightning Snapshot Camera.

Connectivity

While both chipsets offer cutting-edge connectivity features, there are several key differences worth paying attention to. The Snapdragon 8 Gen 5 supports both sub-6GHz and mmWave bands, but the Dimensity 9400 Plus focuses primarily on sub-6GHz. The official product page doesn’t mention mmWave support.

The Snapdragon chip also has an edge in peak download speed, supporting up to 10Gbps, while the Dimensity 9400 Plus can reach up to 7Gbps on a 5G connection. On Wi-Fi connection, though, the Dimensity chip offer a higher peak speed of 7.3Gbps (vs. 5.8Gbps on the 8 Gen 5).

The Snapdragon 8 Gen 5 natively integrates Ultra Wideband (UWB) along with AI-powered proximity solutions to help you find lost items. It also integrates many features to improve the connectivity stability and power efficiency. The Dimensity chip also includes many connectivity enhancements, including Triple Band Triple Concurrency and phone-to-phone Bluetooth connections up to 10km.

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MediaTek is reportedly working on the Dimensity 9600, which is said to be the company’s first-generation 2nm chipset. A new leak, courtesy of reliable tipster Digital Chat Station, suggests that the upcoming chip could deliver a significant performance upgrade and may even surpass Apple’s chips in certain areas. Here’s a look at what the tipster revealed.

Dimensity 9600’s performance tipped

According to the leak, the 2nm Dimensity 9600 chip could arrive with a 2+3+3 all-big-core CPU architecture aimed at delivering single-core performance close to Apple’s chips, while multi-core performance may surpass them. However, the tipster did not specify whether the comparison was being made against the upcoming Apple A20 Pro or the existing A19 Pro.

The tipster also claims that the chipset could bring a major improvement in CME/SME capabilities, potentially doubling compared to the previous generation, while cache changes are said to remain limited.

On the graphics side, the Dimensity 9600 is tipped to feature a larger next-generation “Magin” GPU compared to rival 2nm chipsets. It is also expected to support native-level frame interpolation and super-resolution technologies, alongside improvements in ray tracing and overall rendering efficiency.

The tipster added that devices powered by the Dimensity 9600 series chipset are reportedly being targeted for a September debut. Most likely, he could be indirectly referring to the Vivo X500 Pro series, which is expected to break cover during the same month.

The Oppo Find X10 Pro and Find X10 Pro Max are also said to feature the Dimensity 9600 series chipset. However, it remains unclear whether the lineup will debut in September or continue with an October launch timeline like the previous generation.

Speaking of September, Qualcomm is also expected to unveil the Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Gen 6 Pro in the same month. The Xiaomi 18 series, which is tipped to feature the said chipsets, is also expected to debut around the same time.

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MediaTek will unveil the Dimensity 9600 chip built with 2nm process later this year. This chip is designed to power the upcoming flagship phones, such as Vivo X300 series and Oppo Find X10 lineup. A new development reveals that the brand is also working on a new chip called the Dimensity 8600. Here’s a look at the first details about that have surfaced today.

Dimensity 8600 to be built with 3nm process

According to a new leak shared by tipster Digital Chat Station, MediaTek’s upcoming Dimensity 8600 chipset is expected to deliver a major generational upgrade for the company’s upper mid-range smartphone lineup. The tipster claims the chip will be built on a 3nm process and feature significant improvements in both architecture and manufacturing technology, marking one of the biggest upgrades yet for MediaTek’s mid-range performance-focused chips.

To recall, the Dimensity 8500, which debuted first in China in January this year, is a 4nm chip. It powers the likes of Redmi Turbo 5, Poco X8 Pro, Honor Power 2, iQOO Z11 (Chinese), Motorola Edge 70 Pro, and Oppo K15 Pro.

Coming back to the leak, it further suggests that smartphone brands such as Oppo, Vivo, Xiaomi, Honor, and their sub-brands are already evaluating new devices powered by the Dimensity 8600. Some of these upcoming phones are also tipped to feature massive batteries exceeding the 10,000mAh mark. The new devices are expected to be launched around the end of this year.

One of the upcoming devices appears to be the Honor Power 3. It remains to be seen whether the Redmi Turbo 6 and Poco X9 Pro and successors of the above-mentioned phones will feature the D8500 chip.

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The Dimensity 9500 is MediaTek’s most powerful smartphone chipset right now, with performance and efficiency going toe-to-toe with Qualcomm’s Snapdragon 8 Elite Gen 5 SoC, but at a lower price point.

If you’re in for a high-end upgrade with strong hardware and long-term software support, these are the top five Dimensity 9500-powered smartphones to watch in 2026.

5 Best Dimensity 9500 smartphones in 2026

1. Vivo X300 Pro

The Vivo X300 Pro offers excellent rear cameras. The triple camera setup includes a 50MP primary shooter, a 200MP periscope telephoto lens, and a 50MP ultrawide camera. The 50MP selfie camera takes great shots with excellent details.

The smartphone features a 6.78-inch LTPO AMOLED screen with a 120Hz refresh rate and 4500 nits of peak brightness. It supports HDR10+ and Dolby Vision. The device ships with Android 16 out of the box and promises up to five generations of OS upgrades, all the way up to Android 21.

The X300 Pro houses a 6,540mAh battery, but the EU markets get a slightly lower capacity at 5,440mAh. The charging capabilities remain the same across all markets: 90W wired fast charging and 40W wireless charging support. The Vivo phone also offers strong connectivity, featuring Wi-Fi 7, Bluetooth 5.4, NFC, and USB Type-C 3.2.

Vivo X300 Pro specs:

• Display: 6.78-inch LTPO AMOLED, 1260 x 2800 pixels, 120Hz refresh rate, HDR10+, HDR Vivid, Dolby Vision, 4500 nits (peak)
• Processor: MediaTek Dimensity 9500 (3 nm)
• Software: Android 16, up to five major Android upgrades
• Rear camera: 50MP (wide) + 200MP (periscope telephoto, 3.7x optical zoom) + 50MP (119˚ ultrawide)
• Selfie camera: 50MP
• Battery: 6510mAh (global), 5440mAh (EU markets)
• Charging: 90W (wired), 40W (wireless)
• Connectivity: Wi-Fi 7, Bluetooth 5.4, NFC, USB Type-C 3.2

2. Vivo X300

The Vivo X300 (review) is a compact flagship phone, featuring a 6.31-inch LTPO AMOLED screen. It supports a 120Hz refresh rate, HDR10+, HDR Vivid, and a peak brightness of 4500 nits.

The smartphone features a different camera setup than its Pro model. The triple camera setup includes a 200MP primary camera, a 50MP periscope telephoto lens, and a 50MP ultrawide camera. The selfie camera is still a 50MP snapper. The X300 also boots Android 16 out of the box and promises OS upgrades up to Android 21.

The Vivo X300 packs a 6,040mAh battery, with EU markets getting a slightly lower capacity of 5,360mAh. The charging speeds, though, match the Pro model, so you still get 90W wired charging and 40W wireless charging.

Vivo X300 Pro specs:

• Display: 6.31-inch LTPO AMOLED, 1216 x 2640 pixels, 120Hz refresh rate, HDR10+, HDR Vivid, 4500 nits (peak)
• Processor: MediaTek Dimensity 9500 (3 nm)
• Software: Android 16, up to five major Android upgrades
• Rear camera: 200MP (wide) + 50MP (periscope telephoto, 3x optical zoom) + 50MP (119˚ ultrawide)
• Selfie camera: 50MP
• Battery: 6040mAh (global), 5360mAh (EU markets)
• Charging: 90W (wired), 40W (wireless)
• Connectivity: Wi-Fi 7, Bluetooth 5.4, NFC, USB Type-C 3.2

3. Oppo Find X9 Pro

The Find X9 Pro (review) has a 6.78-inch LTPO AMOLED panel with a 120Hz refresh rate, HDR10+, HDR Vivid, and a peak brightness of 3600 nits. The display specs closely resemble the Vivo X300 Pro, and so do the camera specs, which include a 50MP primary camera, a 200MP periscope telephoto lens, and a 50MP ultrawide camera. The selfie camera is also a 50MP snapper.

The Oppo Find X9 Pro boots Android 16 and promises five major Android OS upgrades, up to Android 21. On the battery side, it houses a 7,500mAh battery with support for 80W wired charging and 50W wireless charging. Connectivity specs include Wi-Fi 7, Bluetooth 6.0, NFC, and USB Type-C 3.2.

Oppo Find X9 Pro specs:

• Display: 6.78-inch LTPO AMOLED, 1272 x 2772 pixels, 120Hz refresh rate, HDR10+, HDR Vivid, Dolby Vision, 3600 nits (peak)
• Processor: MediaTek Dimensity 9500 (3 nm)
• Software: Android 16, up to five major Android upgrades
• Rear camera: 50MP (wide) + 200MP (periscope telephoto, 3x optical zoom) + 50MP (120˚ ultrawide)
• Selfie camera: 50MP
• Battery: 7500mAh
• Charging: 80W (wired), 50W (wireless)
• Connectivity: Wi-Fi 7, Bluetooth 6.0, NFC, USB Type-C 3.2

4. Oppo Find X9

The standard Find X9 (review) is a compact flagship phone featuring a 6.59-inch AMOLED screen with a 120Hz refresh rate, HDR10+, and 3600 nits of peak brightness. It boots Android 16 and promises OS upgrades up to Android 21.

The smartphone features three rear cameras, all with 50MP resolution. It includes a primary camera, a periscope telephoto lens with 3x optical zoom, and a 50MP ultrawide camera. The selfie camera has a lower resolution of 32MP.

Inside the device is a 7,025mAh battery with support for 80W wired and 50W wireless charging. On the connectivity side, the device supports Wi-Fi 7, Bluetooth 6.0, and NFC.

Oppo Find X9 specs:

• Display: 6.59-inch AMOLED, 1256 x 2760 pixels, 120Hz refresh rate, HDR10+, HDR Vivid, 3600 nits (peak)
• Processor: MediaTek Dimensity 9500 (3 nm)
• Software: Android 16, up to five major Android upgrades
• Rear camera: 50MP (wide) + 50MP (periscope telephoto, 3x optical zoom) + 50MP (120˚ ultrawide)
• Selfie camera: 32MP
• Battery: 7025mAh
• Charging: 80W (wired), 50W (wireless)
• Connectivity: Wi-Fi 7, Bluetooth 6.0, NFC, USB Type-C

5. Honor Magic 8 Pro Air

The Honor Magic 8 Pro Air (review) is currently exclusive to China. However, a global release is expected to follow soon, though an official confirmation is still awaited. The phone ships with a 6.31-inch LTPO OLED panel, featuring a 120Hz refresh rate, Dolby Vision, and 6000 nits of peak brightness.

The smartphone boots Android 16 OS with the MagicOS 10 skin on top of it. It features a triple camera setup on the back, comprising a 50MP primary shooter, a 64MP periscope telephoto lens, and a 50MP ultrawide camera. The front side has a 50MP selfie snapper.

The Magic 8 Pro Air houses a 5,500mAh battery with 80W wired and 50W wireless charging support. And its connectivity specs include Wi-Fi 7, Bluetooth 6.0, NFC, and USB Type-C 2.0.

Honor Magic 8 Pro Air specs:

• Display: 6.31-inch LTPO OLED, 1216 x 2640 pixels, 120Hz refresh rate, HDR Vivid, 6000 nits (peak)
• Processor: MediaTek Dimensity 9500 (3 nm)
• Software: Android 16, MagicOS 10
• Rear camera: 50MP (wide) + 64MP (periscope telephoto, 3.2x optical zoom) + 50MP (112˚ ultrawide)
• Selfie camera: 50MP
• Battery: 5500mAh
• Charging: 80W (wired), 50W (wireless)
• Connectivity: Wi-Fi 7, Bluetooth 6.0, NFC, USB Type-C 2.0

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MediaTek has quietly expanded its mid-premium smartphone chipset lineup with the introduction of the Dimensity 7450 and Dimensity 7450X. The new chips have appeared on the company’s official website and are expected to power upcoming smartphones and foldable devices in the near future. Reports already suggest that the Dimensity 7450X may debut inside the rumored Motorola Razr 70.

Dimensity 7450 and Dimensity 7450X specifications

The Dimensity 7450 and Dimensity 7450X share very similar hardware specifications and are designed to deliver improved gaming, AI, camera, and connectivity performance. The processors are built on a 4nm-class process and feature an octa-core CPU setup with four Cortex-A78 cores clocked at up to 2.6GHz alongside four Cortex-A55 efficiency cores. Graphics duties are handled by the Arm Mali-G615 MC2 GPU.

MediaTek has also integrated its sixth-generation NPU to improve on-device AI processing. According to the company, the AI engine delivers up to 7 percent better performance compared to previous-generation chips while improving efficiency for AI camera features and other edge AI tasks.

For gaming, the new chipsets include MediaTek HyperEngine technology and Adaptive Gaming Technology 3.0. These features are designed to balance performance and power consumption dynamically during gameplay sessions. Connectivity features include support for Wi-Fi 6E, Bluetooth 5.4, and 5G download speeds of up to 3.27Gbps with 3CC carrier aggregation support.

On the camera front, both processors support up to 200-megapixel camera sensors through the Imagiq 950 ISP. The chips also support 4K HDR video recording, hardware-assisted noise reduction, and Google Ultra HDR imaging support. Display support extends up to WFHD+ resolution at 120Hz and Full HD+ panels at up to 144Hz refresh rates.

Both the Dimensity 7450 and Dimensity 7450X support LPDDR5 and LPDDR4X RAM, with memory speeds of up to 6400Mbps. For storage, the chipsets are compatible with UFS 2.2 and UFS 3.1 storage standards.

How the Dimensity 7450X differs from the Dimensity 7450

While the two chipsets are nearly identical in terms of core specifications, the Dimensity 7450X includes additional support aimed at foldable devices. MediaTek says the chip supports dual-display functionality for flip-style foldables, making it more suitable for devices with external and internal screens.

This small but important difference suggests that the Dimensity 7450X could primarily target foldable smartphones like the Razr 70, while the standard Dimensity 7450 may power regular smartphones focused on gaming and multimedia experiences.

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MediaTek’s upcoming Dimensity 9600 Pro has previously been tipped to reach 5GHz clock speed. Now, a new leak from tipster Digital Chat Station (DCS) adds some rough performance numbers to the picture.

According to the insider, the Dimensity 9600 Pro could deliver Geekbench 6 scores of around 4200 to 4300 for single-core performance and around 12,000 to 12,500 for multi-core.

DCS notes that these numbers are early estimates based on engineering samples, so they aren’t final, but they do give an idea of where things might land.

For context, DCS claims the previous generation’s official figures were around 4,000 for single-core and 11,000 for multi-core. That puts the projected gains of Dimensity 9600 Pro in a noticeable range on paper, though not necessarily dramatic.

What can you expect?

Part of that performance bump comes from a more aggressive CPU design. The chip is said to feature a dual super-core setup, with both cores running at clock speeds close to 5GHz. The configuration is rounded out by three “Gelas-b” and three standard “Gelas” cores.

Essentially, the Dimensity 9600 Pro will feature a 2+3+3 core configuration with an “all-big-core” design. On the graphics side, the chip is tipped to include an Arm “Magni” GPU.

Its counterpart from Qualcomm, the Snapdragon 8 Elite Gen 6 Pro is expected to deliver a performance uplift of under 20%, despite reaching similar clock speeds near 5GHz.

The chip will be based on TSMC’s N2P process. While earlier leaks mentioned potential power savings in the 25 to 30 percent range, those figures remain unverified. Even so, moving to a newer node should help balance the higher clock speeds, especially if the chip consistently pushes toward that 5GHz mark.

According to previous reports, the Vivo X500 series and the Oppo Find X10 lineup will be the first to use the Dimensity 9600 chip.

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TSMC would hit another major milestone this year as its advanced nodes would allow smartphone chipsets to reach clock speeds up to 5GHz. Companies like Qualcomm, MediaTek, and Apple have already been greatly benefiting from TSMC’s cutting-edge technologies, and later this year, we’ll witness new chips reaching up to 5GHz of peak clock speeds for the first time in history, and that only makes it worse for Huawei to compete with.

Over the years, Qualcomm, MediaTek, and Apple have grown strongly to offer powerful chips with excellent performance and efficiency, and TSMC has been at the center of it. The chart below (shared by Kurnal) shows how these companies have gradually increased peak clock speeds, now pushing toward the 5.0GHz mark.

The latest flagship from Qualcomm, the Snapdragon 8 Elite Gen 5, can already reach a peak speed of 4.61GHz, and the upcoming Snapdragon 8 Elite Gen 6 Pro is said to reach 5.0GHz. MediaTek’s Dimensity 9600 Pro will reportedly achieve a similar feat, following the Dimensity 9500’s 4.21GHz peak clock speed. This increase enables SoCs to offer major improvements in both single-threaded and multi-threaded workloads.

Huawei’s Kirin chipsets, on the other hand, are nowhere near the performance and efficiency offered by Qualcomm, MediaTek, and Apple. Its downtrend on the above graph is due to U.S. trade sanctions that banned the company from doing business with TSMC. Huawei had no other option but to use China’s SMIC facility, which is still generations behind TSMC. Even today, SMIC is limited to the 5nm process because it’s restricted from using the most advanced EUV (Extreme Ultraviolet) lithography machines.

Huawei’s latest chip, Kirin 9030 Pro, hasn’t crossed the 3.0GHz mark. As things stand today, Huawei is still a long way behind Qualcomm, MediaTek, and Apple to even compete with them, and the difference is a foundry partner.

source/via: wccftech

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Just days after reports suggested the MediaTek Dimensity 9600 Pro could flirt with 5GHz clock speeds, a new leak is adding a bit more shape to the rumor.

According to tipster Digital Chat Station (DCS) on Weibo, the Dimensity 9600 Pro will use a 2+3+3 CPU layout built around what the tipster describes as a “dual-core all-big-core architecture.”

MediaTek Dimensity 9600 Pro core setup

More specifically, the chip is said to feature two high-performance “Canyon” cores, alongside three “Gelas-b” and three standard “Gelas” cores. The tipster further reiterates that the prime core clock speeds are expected to push close to the 5GHz mark.

The leak also mentions support for SME 2 (Scalable Matrix Extension 2), an extension designed to improve machine learning and AI-related workloads. On the graphics side, the chip is tipped to feature an Arm “Magni” GPU.

Memory and storage upgrades are also on the table. The Dimensity 9600 Pro is rumored to support LPDDR6 RAM and UFS 5.0 storage, both of which promise faster data throughput and improved efficiency over today’s standards.

Underlying all of this is TSMC’s N2P process. According to DCS, internal specifications reportedly suggest a 10 to 15 percent boost in performance alongside a 25 to 30 percent reduction in power consumption.

Interestingly, even Qualcomm’s Snapdragon 8 Elite Gen 6 Pro is expected to deliver a performance uplift of under 20%, despite reaching similar clock speeds near the 5GHz mark.

Anywho, as you might have guessed by now, the Dimensity 9600 lineup won’t be a one-size-fits-all affair. The Pro model is set to carry the most advanced architecture, while the standard variant is rumored to stick with a 3nm process and will likely target more mainstream devices.

According to previous reports, the Vivo X500 series and the Oppo Find X10 lineup will be the first to use the Dimensity 9600 chip.

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MediaTek is reportedly working on the Dimensity 9600 series of flagship chipsets. Recent reports have revealed that the brand may unveil 2nm chips, namely the Dimensity 9600 and 9600 Pro, later this year. Today, tipster Digital Chat Station released a Weibo post to reveal the performance leap the D9600 series will offer.

Dimensity 9600 Pro performance details tipped

According to DCS, the Dimensity 9600 and 9600 Pro may introduce a dual ultra-core CPU setup, marking a notable change from previous designs. The chip is said to reach peak clock speeds close to 5GHz, which places it in a new league for smartphone processors.

The architecture is expected to follow a 2+3+3 core configuration, with two ultra-large cores leading performance-heavy tasks. This approach could bring desktop-level processing capabilities to mobile devices. The chipset is also believed to be based on TSMC’s advanced N2P process, which may result in a 25 to 30 percent drop in power consumption, but this is yet to be verified, claims the tipster.

Earlier reports suggest that MediaTek could segment the lineup into multiple tiers. The standard version may be based on an enhanced Dimensity 9500+, while the Pro and Pro Max variants are likely to adopt the newer 2nm-class architecture. This layered strategy could allow brands to target different price segments while maintaining flagship-grade performance.

The Dimensity 9600 series is also expected to benefit from MediaTek’s involvement in developing advanced AI chips, including work related to Google’s TPU platform. This could translate into better on-device AI capabilities and improved power efficiency in real-world usage.

Leaks indicate that the Vivo X500 series and the Oppo Find X10 lineup may adopt the Dimensity 9600 series, particularly in their Pro Max models. Meanwhile, competing Snapdragon 8 Elite Gen 6 series chipsets from Qualcomm are expected to be reserved for select ultra-premium devices, setting up an interesting battle in the flagship segment.

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Just as rumors begin to swirl around Qualcomm’s Snapdragon 8 Elite Gen 6, a new leak from tipster Digital Chat Station is shedding light on what MediaTek has in store next.

According to recent reports, the Dimensity 9600 will be built on TSMC’s 2nm N2P process. But the more interesting shift could be in its CPU design. The chip is rumored to adopt a new 2+3+3 layout, two “prime” cores paired with six high-performance cores.

If true, this would be the first time MediaTek’s Dimensity 9 series will move to a dual prime-core configuration. For context, Dimensity 9500 has one ARM C1-Ultra (4.21GHz) for peak performance, three ARM C1-Premium (3.5GHz) for sustained power, and four ARM C1-Pro (2.7GHz) for efficiency. 

Digital Chat Station says the dual prime-core setup in Dimensity 9600 is internally referred to as “Canyon.”

Even its competitor has a similar setup

On paper, this setup should make the Dimensity 9600 better equipped to handle demanding workloads, especially as AI tasks continue to grow more complex. Paired with the new process node, the chip is expected to deliver a noticeable jump over its predecessor.

As for graphics, the Dimensity 9600 is said to include a new GPU with neural network shader technology that should improve coordination between the GPU and NPU. Better collaboration between these components could reduce power draw while maintaining smoother performance.

Meanwhile, its competition isn’t standing still. The Snapdragon 8 Elite Gen 6 is also rumored to adopt a similar 2+3+3 CPU layout. Not to forget, Qualcomm’s solution relies on its in-house Oryon cores, while the Dimensity 9600 will feature ARM’s upcoming Cortex-C2 series cores. 

This sets up a familiar situation where both companies are chasing similar architectural goals, even if their execution differs.

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The “s” chips inside the Snapdragon 8-series have been popular for offering great performance at an affordable price, and the Snapdragon 8s Gen 4 is no different. It delivers a strong CPU performance with an all-big-core CPU design, a reliable Adreno GPU for smooth gaming, and a mature ISP.

The Dimensity 9300 Plus was announced a year before the Snapdragon 8s Gen 4, featuring an even more powerful CPU with more large cores, a capable GPU, and competitive camera and connectivity capabilities. The real question is whether the Snapdragon 8s Gen 4 truly outperforms the Dimensity 9300 Plus, or if the Dimensity 9300 Plus is too compelling to ignore? Let’s find out.

Let’s begin with the spec sheet:

Snapdragon 8s Gen 4 vs Dimensity 9300 Plus: Benchmark score

Note: The benchmark tests were performed on the POCO F7 (powered by the Snapdragon 8s Gen 4) and the Vivo X200 FE (powered by the Dimensity 9300 Plus) 

Geekbench performance

Thanks to a more performance-focused CPU configuration, the Dimensity 9300 Plus pulls higher Geekbench scores. In the single-core test, it gets about a 5.6% higher score, while the multi-core score is up by 7.3%.

The difference isn’t significant. However, the Dimensity 9300 Plus would still benefit from peak performance. In regular everyday tasks like browsing the internet and scrolling through your social feeds, there shouldn’t be any performance difference, though.

AnTuTu performance

In the AnTuTu benchmark, the Snapdragon 8s Gen 4 outperforms the Dimensity 9300+ by 6% in total score. The latter still gets a slightly higher CPU score, but the Snapdragon chip makes a strong comeback in the GPU score, scoring 465K (vs. 455K on the Dimensity 9300+).

The Snapdragon 8s Gen 4 also benefits from better memory performance, while the Dimensity 9300+ achieves a higher score in the user experience (UX) test.

3DMark performance

3DMark Wild Life Extreme Stress Test

The 3DMark Wild Life Extreme Stress Test further solidifies the point that the Snapdragon 8s Gen 4 offers better gaming performance. It gets about a 10% better high score, which represents the peak performance.

The gap widens significantly to 47% in the low-score test, indicating that the Snapdragon 8s Gen 4 chip doesn’t throttle as much as the Dimensity 9300+ during long gaming sessions. This results in much better stability on Snapdragon 8s Gen 4 devices.

Now that we know the benchmark scores, let’s examine the key differences to get a clearer picture.

Snapdragon 8s Gen 4 vs Dimensity 9300 Plus: Key differences

CPU, GPU & NPU

The CPUs of Snapdragon 8s Gen 4 and Dimensity 9300 Plus comprise Cortex-X4 and Cortex-A720 cores. The Cortex-X4 offers higher performance, while the Cortex-A720 balances power and efficiency. Since the Dimensity 9300 Plus features more Cortex-X4 cores, it is able to achieve higher peak performance in CPU tests across benchmarks. The chip also benefits from a higher CPU clock speed.

Gaming performance has always been a major strength of Qualcomm chips, thanks to highly optimized Adreno GPUs, improved driver support, and excellent sustained performance. The Snapdragon 8s Gen 4 with Adreno 825 GPU achieves a much better score and stability on gaming benchmarks than the Dimensity 9300 Plus with Mali-G720 GPU.

For on-device AI intelligence, the Snapdragon 8s Gen 4 relies on Qualcomm’s Hexagon NPU architecture. It brings generative AI capabilities and support for multimodal and multilingual AI assistants.

Qualcomm also uses AI to improve the camera output and deliver stronger connectivity. MediaTek also leverages its NPU 790 in these areas and supports a variety of popular LLMs, including Alibaba Qwen, Google Gemini nano, and Meta Llama 3.

Camera and imaging

Equipped with an 18-bit triple ISP, the Snapdragon 8s Gen 4 supports up to 320MP single camera and real-time semantic segmentation for photos and videos with up to 250 layers. Furthermore, the chip supports intelligent, real-time skin and sky tone correction and up to 4K video recording at 60fps.

The Dimensity 9300 Plus, on the other hand, features an 18-bit Imagiq 990 ISP with up to 320MP single camera, AI Semantic Analysis Video Engine with 16 categories of scene segmentation, and 8K video recording at 30fps. MediaTek highlights AI-videography and zero-latency video preview as key features.

Connectivity

The Snapdragon X75 5G modem on the Snapdragon 8s Gen 4 is a sub-6GHz-only modem with a peak download speed of 4.2Gbps. Over a Wi-Fi 7 connection, the peak speed jumps to 5.8Gbps. The modem supports Bluetooth 6.0, Bluetooth Low Energy, and XPAN, enabling earbuds/headphones to stay connected via Wi-Fi for wider-range coverage.

The Dimensity 9300+ features an integrated 5G modem supporting both mmWave and sub-6 GHz. Furthermore, it offers higher download speeds over 5G and Wi-Fi connections, but doesn’t bring support for the latest Bluetooth standard.

Snapdragon 8s Gen 4 vs Dimensity 9300 Plus: Which is a better choice?

The Snapdragon 8s Gen 4 features a more powerful Adreno 825 GPU, delivering a smooth gaming experience, even during longer sessions, with much less throttling. The positive aspects also include a high memory performance, an advanced Hexagon NPU, a mature 18-bit AI ISP, and Bluetooth 6.0 support.

The Dimensity 9300 Plus excels in peak CPU performance and supports 8K video recording. The integrated 5G modem supports both mmWave and sub-6GHz bands with faster download speeds. And the Imagiq 990 ISP features AI video enhancements and zero-latency preview.

In short, the Snapdragon 8s Gen 4 is a better choice for gaming, while the Dimensity 9300 Plus delivers higher peak CPU performance. For everyday usage, both chipsets offer a similar performance with no significant difference.

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The Dimensity 9400 is a true flagship chipset from MediaTek, featuring an all-big-core CPU design that aims to deliver high peak and sustained performance. It’s powerful enough to rival Qualcomm’s Snapdragon 8 Elite, even if it trails in a few areas, as noted in our detailed comparison. That makes the Snapdragon 8 Gen 5 an interesting opponent.

Announced in November 2025, the Snapdragon 8 Gen 5 sits just below the Snapdragon 8 Elite and therefore is an exciting matchup against the Dimensity 9400. The big question is: can Qualcomm’s sub-Elite flagship hold its ground against MediaTek’s all-big-core powerhouse?

Let’s begin with the spec sheet:

Dimensity 9400 vs Snapdragon 8 Gen 5: Benchmark score

Note: The benchmark tests were performed on the Vivo X200 Pro (powered by Dimensity 9400) and the OnePlus 15R (powered by Snapdragon 8 Gen 5).

Geekbench score

The single-core scores are pretty close, but Qualcomm holds a slight 4.5% lead. The gap widens in multi-core performance, where the Snapdragon 8 Gen 5 posts a 9% higher score than the Dimensity 9400.

Geekbench scores suggest higher peak performance for the Snapdragon 8 Gen 5. In everyday tasks like browsing the internet, scrolling through your social app feeds, and watching movies, you’d hardly be able to spot a difference.

AnTuTu score

On the AnTuTu benchmark, the Snapdragon 8 Gen 5 scores nearly 3 million, while the Dimensity 9400 reaches 2.7 million. That’s about a 9% higher score for the Snapdragon chip.

The Snapdragon 8 Gen 5 consistently outperforms the Dimensity 9400 across every AnTuTu test, though the difference is not significant. The CPU score is 7% higher, and the GPU score is 5% higher. The memory and UX scores also favor the Snapdragon chip.

The benchmarks favor Snapdragon 8 Gen 5 over the Dimensity 9400 in terms of performance, but they don’t provide insights into the capabilities of connectivity, camera, and other important aspects of the chips. So, let’s dig further to uncover the real-world differences between the two high-end chips.

Dimensity 9400 vs Snapdragon 8 Gen 5: Key differences

Both Dimensity 9400 and Snapdragon 8 Gen 5 are manufactured using TSMC’s 3nm process, but the latter uses the N3P node, which offers slightly better performance and power efficiency over the N3E node used for the Dimensity 9400.

Furthermore, the chips differ greatly in terms of CPU architecture. The Dimensity 9400 has a 1+3+4 layout, featuring one Cortex-X925 prime core, three Cortex-X4 performance cores, and four Cortex-A720 performance cores. In contrast, the Snapdragon 8 Gen 5 features a 2+6 CPU layout with two Oryon prime cores and six Oryon performance cores.

Notably, the Snapdragon 8 Gen 5 features third-generation Oryon cores, the same CPU cores from the top-tier Snapdragon 8 Elite Gen 5 chipset. They offer better performance and power efficiency than those inside the Dimensity 9400. Plus, they run at higher speeds, offering an additional performance boost.

For graphics rendering, the Dimensity 9400 relies on the Mali-G925 Immortalis MP12 GPU, while the Snapdragon chip uses the Adreno 829 GPU with the new Sliced architecture. Both chips offer ray tracing capabilities, along with their own set of gaming features: Snapdragon Elite Gaming on the Snapdragon 8 Gen 5 and MediaTek HyperEngine Gaming Technology on the Dimensity 9400.

The Snapdragon 8 Gen 5 also maintains an edge in imaging capabilities, as it borrows the triple 20-bit ISP from the Snapdragon 8 Elite Gen 5 with strong “always-sensing” camera support. The Dimensity 9400 features an Imagiq 1090 ISP with emphasis on HDR video across the zoom range and AI-assisted zoom features.

Both chipsets offer robust connectivity features, although the Snapdragon chip may have some advantage here, thanks to mature modem and better carrier-integration in some regions. Furthermore, the chip supports mmWave, UWB, and dual-way satellite connectivity, which are not mentioned on the official Dimensity 9400 page.

Dimensity 9400 vs Snapdragon 8 Gen 5: Conclusion

The Snapdragon 8 Gen 5 holds an upper hand in almost every aspect over the Dimensity 9400. It offers better CPU and GPU performance, a more powerful ISP with greater capabilities, and advanced connectivity features.

That said, the Dimensity 9400 is still a capable high-end chipset with strong performance and robust connectivity. Plus, you’ll likely get a device powered by this chip at a lower price than one powered by Snapdragon 8 Gen 5. That makes it a sweet deal for those looking for a high-performance device at an affordable price. For the absolute best of the two, the Snapdragon 8 Gen 5 is clearly the better choice.

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The Snapdragon 8 Gen 5 is a powerful high-end chipset from Qualcomm, featuring third-generation Oryon CPU, the same CPU from the top-tier Snapdragon 8 Elite Gen 5 chip, but at a lower price. The chipset also integrates a capable Adreno GPU, advanced camera ISP, and robust connectivity, making it a well-rounded option.

On the other hand, the Dimensity 9500 is MediaTek’s most premium smartphone chip, featuring newer-gen C1-series cores. This chip offers serious performance and power efficiency. It would be exciting to see how the Snapdragon 8 Gen 5 performs against the Dimensity 9500. So, let’s dive in.

Here’s the spec sheet to begin with:

Snapdragon 8 Gen 5 vs Dimensity 9500: Benchmark score

Note: The benchmark tests were performed on the OnePlus 15R (powered by Snapdragon 8 Gen 5) and the Vivo X300 Pro (powered by Dimensity 9500).

Geekbench score

The Dimensity 9500 comfortably outperforms the Snapdragon 8 Gen 5 on Geekbench, with a 21% higher single-core score and an 8% higher multi-core score. This should result in better peak performance on Dimensity 9500-powered devices across tasks that require either a single CPU core or multiple cores.

AnTuTu score

AnTuTu scores tell a similar story, with the Dimensity 9500 getting about 22% higher score than the Snapdragon 8 Gen 5. The Dimensity chip continues to lead the CPU score, but the GPU makes a bigger impact here, with a massive 40% higher score. The memory score is more than twice that of the Snapdragon 8 Gen 5, while the user experience (UX) score just beats the Snapdragon chip.

Benchmark scores suggest a clear performance advantage for the Dimensity 9500 over the Snapdragon 8 Gen 5. However, that’s not the complete picture. They do not cover every aspect, such as connectivity, on-device AI, ISP, and more. So, let’s dig further to find out which one is actually the better chipset overall.

Snapdragon 8 Gen 5 vs Dimensity 9500: Key differences that matter

CPU, GPU, & NPU

The Snapdragon 8 Gen 5 uses a 2+6 CPU configuration, featuring two Oryon prime cores and six Oryon performance cores. In contrast, the Dimensity 9500 features a 1+3+4 CPU configuration, with one Cortex C1-Ultra prime core, three Cortex C1-Premium performance cores, and four Cortex C1-Pro lower-power cores. The Dimensity chip has a higher peak speed, allowing it to achieve higher peak performance. We just saw that in benchmark scores.

For rendering graphics, the Snapdragon 8 Gen 5 primarily relies on the Adreno 829, leveraging the Qualcomm Sliced architecture and a full suite of Snapdragon Elite Gaming features to deliver smooth gaming performance with lower latency and stable frame rates. In contrast, the Dimensity 9500s uses Mali-G1 Ultra MP12 GPU with support for MediaTek HyperEngine Gaming Technology and 120fps ray-traced mobile gaming.

Both chipsets feature capable NPUs (the Hexagon NPU on the Snapdragon 8 Gen 5 and the MediaTek NPU 990 on the Dimensity 9500) with multimodal and agentic AI capabilities. The AI also helps optimize camera output, the gaming experience, and connectivity.

Camera, ISP, & connectivity

The Snapdragon 8 Gen 5 uses a 20-bit Spectra triple AI-ISP, while the Dimensity 9500 relies on the Imagiq 1190 ISP to convert raw data into usable photos and videos. Additionally, there are numerous features to improve the output quality. Furthermore, there are additional optimizations from the smartphone brand that could make a significant difference.

Both chipsets deliver robust connectivity features, including 5G support, Bluetooth 6.0 standard, and impressive peak download and upload speeds. However, Qualcomm may have an edge in some markets, such as North America, due to stronger carrier aggregation and more mature modem capabilities.

Snapdragon 8 Gen 5 vs Dimensity 9500: Which is a better choice?

The Dimensity 9500 is the better choice overall. Its newer C1-series CPU cores, higher clock speeds, and stronger GPU output translate into superior benchmark scores and better peak performance, especially in demanding tasks and high-end gaming. The chip should also deliver better power efficiency.

However, if peak performance and longer gaming sessions are not your thing, the Snapdragon 8 Gen 5 is actually a more sensible choice. It delivers robust connectivity, a mature ISP, and better computational photography. On top of everything, the Snapdragon 8 Gen 5 phones tend to be cheaper than phones powered by Dimensity 9500.

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The Dimensity 9500s is a powerful high-end smartphone chipset, promising strong performance and solid power efficiency. That, paired with an upgraded NPU supporting agentic AI and a fully modern connectivity stack, positions it as a flagship-tier contender, directly competing with powerful Qualcomm chips.

The Dimensity 9500s go head-to-head with some powerful Snapdragon 8-series chips, including the Snapdragon 8 Gen 5 and Snapdragon 8 Elite. We’ve already compared it with the Snapdragon 8 Gen 5 (more about it here), and now it’s time for another high-end chip battle. In this comparison, we’ll see how the Dimensity 9500s stack up against the Snapdragon 8 Elite, with its Oryon CPU,  Adreno 840 GPU, and advanced imaging capabilities.

Here’s the spec sheet to begin with:

Dimensity 9500s vs Snapdragon 8 Elite: Benchmark scores

There’s no Dimensity 9500s-powered smartphone on the market right now. However, the upcoming Redmi Turbo 5 Max, which would carry the same chipset, was recently spotted in AnTuTu and Geekbench listings.

According to leaked benchmark listings, the upcoming Redmi phone powered by the Dimensity 9500s achieves 2,862 points in the single-core test and 9,130 points in the multi-core test. In contrast, the OnePlus 13 (powered by the Snapdragon 8 Elite) bags higher scores: 3,026 (single-core) and 9,306 (multi-core).

The leaked AnTuTu listing for the Redmi Turbo 5 Max shows rather surprising results. The Dimensity 9500s-powered device achieves a total score close to 3.3 million, while the Snapdragon 8 Elite-powered OnePlus 13 scores a little under 3 million. The breakdown of the AnTuTu score shows that the Dimensity 9500s achieves higher scores across all tests, including CPU, GPU, memory, and user experience.

Please note that benchmark scores for the Dimensity 9500s are based on leaks, not on real testing. We’ll update the score once we’ve reviewed a device powered by the same MediaTek chipset.

Dimensity 9500s vs Snapdragon 8 Elite: Key differences you should know

CPU

Starting with the CPU, the Dimensity 9500s opts for a 1+3+4 configuration, featuring one Cortex-X925 prime core, three Cortex-X4 performance cores, and four Cortex-A720 efficiency cores. In contrast, the Snapdragon 8 Elite uses a 2+6 configuration, with two Oryon prime cores and four Oryon performance cores.

The second-gen Oryon core generally outperforms Cortex-X925 in peak performance. The Snapdragon 8 Elite also benefits from a higher CPU clock speed. In terms of peak CPU performance, the Snapdragon 8 Elite has the edge. However, in day-to-day tasks like browsing the internet, scrolling through social media apps, and video streaming, there shouldn’t be a performance gap.

GPU

For graphics rendering, the Dimensity 9500s integrates Immortalis‑G925 GPU with up to 12 cores. MediaTek claims ray tracing support with console-grade lighting and reflections. MediaTek Adaptive Gaming Technology 3.0 (MAGT 3.0) and MediaTek Frame Rate Converter 3.0 (MRFC 3.0) further enhance the gameplay and power efficiency.

The Snapdragon 8 Elite features Adreno 830 GPU with Qualcomm’s sliced GPU architecture for better power efficiency and higher sustained performance. The chip also supports real-time hardware ray tracing and includes a full suite of Snapdragon Elite Gaming features to achieve higher frame rates, improved power efficiency, and lower latency.

AI and on-device capabilities

Both chipsets have capable NPUs with multimodal GenAI capabilities and support for modern LLMs. Additionally, MediaTek claims Agentic AI support for the Dimensity 9500s, whereas Qualcomm has made no such claims.

Camera

The Dimensity 9500s and Snapdragon 8 Elite feature 18-bit ISPs with support for up to 320MP resolution. One key advantage of the Qualcomm chip here is that it allows three 48MP cameras at 30fps, while the Dimensity chip limits them to 36MP. The Dimensity 9500s, however, supports 8K video recording at 60fps, while the Snapdragon 8 Elite can do 8K/30fps recording.

The Snapdragon 8 Elite supports limitless real-time semantic segmentation up to 250 layers. MediaTek hasn’t mentioned semantic segmentation on its official page, but it’s safe to say the Dimensity 9500s support it based on the chip’s capabilities. Furthermore, both chips bring numerous features to improve photos and videos.

Connectivity

The Snapdragon 8 Elite and Dimensity 9500s feature flagship-class connectivity platforms, but the Snapdragon 8 Elite is specced more aggressively for cellular peak speeds, Bluetooth standard, and integrated UWB, while Dimensity 9500s emphasizes higher Wi-Fi speed and long-range Bluetooth.

Dimensity 9500s vs Snapdragon 8 Elite: Conclusion

The Dimensity 9500s prove that MediaTek is no longer playing in the shadows of Qualcomm’s flagship lineup. It offers strong benchmark scores, modern CPU and GPU architectures, advanced AI capabilities, and robust connectivity, positioning itself as a true competitor to Snapdragon 8-series chips.

That said, the Snapdragon 8 Elite may still hold advantages in peak CPU performance, a mature ISP, and modem features, backed by Qualcomm’s mature software ecosystem and long-standing OEM trust.

Please note that there’s no Dimensity 9500s-powered smartphone on the market as of writing this post. So, this comparison may not give you the complete picture. We’ll update it after thoroughly testing a device powered by this new Dimensity chip.

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While MediaTek continues to dominate the global smartphone chipset market, according to Counterpoint Research, the company’s grip on the high-end remains relatively weak. Qualcomm and Apple have long dominated this segment, but MediaTek is closing the gap fast by offering competitively-specced and better-priced chipsets — and its latest Dimensity flagships, such as Dimensity 9500 and 9500s, now pose a serious challenge to the best from the other two.

So, the real question is: can MediaTek’s newest silicon overtake Qualcomm and Apple in the high-end segment — or at least meaningfully shift its position in it?

The term “high-end chipsets” may be confusing in itself. Many refer to mid-range chips as high-end and top-tier as flagship, while high-end chips generally refer to flagship-tier processors, designed to deliver peak CPU and GPU performance, advanced on-device AI capabilities, and top-tier power efficiency. In 2026, that elite group is led by Apple’s A-series chips, Qualcomm’s Snapdragon 8-series flagships, and MediaTek’s Dimensity 9000 series processors.

MediaTek’s flagship push: From an affordable alternative to a competitive flagship

Not long ago, MediaTek was primarily associated with entry-level and mid-range chipsets, valued for affordability rather than raw performance. That perception began to shift with the arrival of the Dimensity lineup, but the dramatic shift came with the Dimensity 9000 series in late 2021. MediaTek framed it as a flagship chip “for next-generation flagship smartphones,” with broad OEM endorsements, including Oppo, Vivo, Xiaomi, and Honor.

With the latest Dimensity 9500, MediaTek is no longer positioning itself as a value alternative but competes directly with Snapdragon 8 Elite Gen 5 and Apple A19 Pro. In fact, the Dimensity 9500 beats the other two chips on several key benchmarks.

CPU and GPU performance battle

Qualcomm and Apple held a consistent lead in both CPU and GPU performance for a long time, but the newest silicon from MediaTek, particularly the Dimensity 9500, operates in the same performance class.

The Dimensity 9500 features a newer generation of ARM cores, including C1-Ultra, C1-Premium, and C1-Pro, with a cutting-edge CPU architecture to deliver strong CPU performance. Day-to-day tasks, heavy multitasking, and demanding workloads on a Dimensity 9500-powered device feel just as smooth as high-end chips from Qualcomm and Apple.

GPU performance tells a similar story — an area where Qualcomm has had no real competition in Android, now faces a legitimate challenge from MediaTek. Recent MediaTek high-end chips have significantly closed the gap in GPU performance, signaling that MediaTek is no longer playing catch-up in graphics performance.

Here are the benchmark numbers that offer more clarity:

Note: The benchmark tests were performed on the Vivo X300 Pro (Dimensity 9500), OnePlus 15 (Snapdragon 8 Elite Gen 5), and iPhone 17 Pro (Apple A19 Pro).

Geekbench score

Apple continues to lead the single-core performance chart on Geekbench, but interestingly, the Dimensity 9500 almost matches the Snapdragon 8 Elite Gen 5. The multi-core performance, however, tells a different story. The Dimensity chip scores higher than the A19 Pro but slightly lower than the Snapdragon chip.

3DMark score

Wild Life Extreme Stress Test

Solar Bay Test

In the 3DMark Wild Life Extreme test, the Snapdragon 8 Elite Gen 5 achieves the highest score, but the Dimensity 9500 is just behind it, with a difference of only 1.27%. Meanwhile, the A19 Pro sits at the bottom, and the gap is also pretty significant.

In the Solay Bay test (to measure the ray tracing performance), the Dimensity 9500 actually gains the top spot with 13,973 points, while the Snapdragon 8 Elite Gen 5 and Apple A19 Pro achieve 13,108 and 11,829 points, respectively.

The benchmark scores also verify that MediaTek’s newest chips aren’t just competing with the greatest from Qualcomm and Apple, but also outperforming them in some ways.

AI and on-device intelligence

The demand for on-device AI intelligence is stronger than ever, and therefore, modern chips are expected to handle increasingly complex AI workloads without relying on the cloud. This is an area where Qualcomm and Apple have invested heavily for years, but MediaTek is now pushing just as aggressively.

The newer high-end Dimensity chips feature significantly upgraded AI engines, which enable advanced on-device generative features, improved camera computation, and machine learning tasks. Tasks like real-time translation, background removal in video, AI-assisted photo editing, and contextual voice processing are now handled faster and more efficiently than on previous MediaTek generations.

Qualcomm’s Snapdragon 8-series chips still hold an advantage in terms of software ecosystem maturity, while Apple continues to benefit from deep integration between its Neural Engine and iOS. However, MediaTek’s aggressive focus on AI performance is sharply closing the gap.

Modem, connectivity, and ISP capabilities

Qualcomm has long been regarded as the industry leader in mobile connectivity, thanks to its in-house modem technology. Its latest Snapdragon 8-series chips deliver top-tier 5G performance and strong carrier integration support. Apple also uses Snapdragon modems and further optimizes its connectivity stack through deep hardware-software integration to provide fast, reliable connectivity.

MediaTek’s Dimensity flagships have made substantial progress in this department. The latest chips integrate advanced 5G modems, modern Wi-Fi and Bluetooth standards, and improved power efficiency. Connectivity performance on recent Dimensity-powered flagships, in most cases, is now largely on par with that of Snapdragon-powered devices.

Final verdict: The flagship race just got serious

MediaTek is no longer a flagship-alternative, but is clearly positioning itself as a genuine performance contender. The Dimensity 9500 demonstrates that MediaTek can now match Qualcomm and Apple in CPU performance, challenge them in GPU workloads, and deliver competitive AI and connectivity capabilities — everything at an aggressive pricing. The benchmark numbers also make it clear that MediaTek isn’t playing a catch-up game anymore.

That said, Qualcomm still benefits from deep relationships with Android OEMs, mature software optimizations, and a long-standing reputation in the premium space. Apple, meanwhile, continues to leverage hardware-software integration and ecosystem lock-in that silicon performance alone can’t disrupt.

So, can MediaTek finally overtake them? Not entirely — at least not yet. But it has undeniably changed perceptions among brands and people, treating it as a real flagship rival rather than a budget-focused alternative. Now, there’s a real competition to Qualcomm in the high-end Android segment.

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Reliable tipster Digital Chat Station has shared fresh insights into the roadmap of next-generation flagship smartphones, building on an earlier post that discussed launch timelines for upcoming Dimensity-powered devices. In that earlier update, he suggested that at least either Oppo or Vivo could launch an iterative flagship as early as September. He also hinted that delaying ultra-premium models until April may not align well with faster chipset refresh cycles, especially for so-called “Ultra” variants.

The tipster contrasted this with Xiaomi’s established rhythm, where standard and Pro models typically arrive around September, followed by Ultra models towards the end of the year. He suggested that other brands may benefit from adopting a similar staggered launch strategy to better match chipset evolution.

Rumored chipsets for Pro Max and Ultra flagships

In his newer Weibo posts, DCS claims that if Oppo and Vivo move forward with Pro Max-branded models, these devices are likely to feature MediaTek’s upcoming Dimensity 9600 series chip built on TSMC’s N2P (2nm) process. He describes this as a full-performance flagship platform, indicating that Pro Max models may prioritize sustained performance and scale.

At the same time, he suggests that Qualcomm’s next Snapdragon 8 Elite Gen 6 Pro, identified internally as SM8975, may be reserved exclusively for Ultra-branded premium, imaging-focused flagships rather than mainstream Pro or Pro Max devices. In replies, DCS further notes that both the Snapdragon 8 Elite Gen 6 and its Pro variant are expected to be manufactured on a 2nm process by TSMC, but with clear segmentation between standard iterative flagships and top-tier models.

He also reiterates that multiple brands under the OV and “H” umbrella are planning Pro Max variants for their next flagship cycles, adding that one brand, abbreviated as “MH” has already introduced such a model in the current generation. Here, “H” appears to be Honor and “MH” seems to be Huawei, which has already launched the Huawei Mate 80 Pro Max.

While none of this has been officially confirmed, the posts collectively point towards tighter launch schedules, clearer flagship tiering, and more aggressive adoption of next-generation silicon across major Chinese smartphone brands.

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In September, MediaTek announced Dimensity 9500 as its most powerful smartphone chipset, and now we’ve an affordable version of it, dubbed Dimensity 9500s. This is still a flagship-grade chipset, promising excellent performance, power efficiency, and competitive AI capabilities.

The Dimensity 9500s would directly compete with the Snapdragon 8 Gen 5, which was announced in November. Both high-end chipsets target the same user segment, so it’s exciting to see how they stack up against each other.

Dimensity 9500s vs Snapdragon 8 Gen 5: Who has the edge?

Both Snapdragon 9500s and Snapdragon 8s Gen 5 use TSMC’s 3nm process node, though there are some differences. The Dimensity chip uses N3E process technology, while the Snapdragon chip uses a more refined N3P node, offering slight improvements to performance and efficiency.

CPU performance

The Dimensity 9500s features an all-big-core CPU design, led by a Cortex-X925 prime core. The octa-core CPU also includes three Cortex-X4 performance cores and four Cortex-A720 power efficiency cores.

• 1 x Cortex-X925 at 3.73 GHz
• 3 x Cortex-X4 at 3.30 GHz
• 4 x Cortex-A720 at 2.0 GHz

In contrast, the Snapdragon 8 Gen 5 features a 2+6 CPU configuration with all third-generation custom-designed Oryon cores.

• 2 x Oryon cores (3rd-gen) at 3.8 GHz
• 6 x Oryon cores (3rd-gen) at 3.32 GHz

From the spec sheet alone, it’s difficult to say which chipset has a faster CPU. And unfortunately, we don’t have benchmark data for the Dimensity 9500s yet. It will take a while for the brand to launch devices with this new Dimensity chipset.

However, if I had to take a calculated guess, the Snapdragon 8 Gen 5 should offer faster CPU performance. That’s because this chip has the same CPU configuration as the flagship Snapdragon 8 Elite Gen 5, but with a slightly lower clock speed. That gap in clock speeds shouldn’t matter as much as the Dimensity 9500s using CPU cores a generation older than the Dimensity 9500.

GPU performance

For graphics rendering, the Dimensity 9500s uses Immortalis-G925 MP12 GPU. MediaTek hasn’t provided more details about the GPU, such as frequency, binning, etc. So, for now, it’s inaccurate to say it’s the same Immortalis-G925 GPU that’s been used inside the Dimensity 9400 and 9400+ chips.

We’ll have to wait for benchmark data or third-party teardowns for better clarification. However, I’m pretty sure the Dimensity 9500s would bring some GPU improvements, if not major upgrades.

The Snapdragon 8 Gen 5, on the other hand, ships with an Adreno 829 GPU with ray tracing support and a full suite of Snapdragon Elite Gaming features. We’ll run benchmark tests and update the data here to provide clearer insight into GPU performance.

AI capabilities

The demand for on-device AI capabilities, such as AI assistants, AI image/video editing, and generative AI, is stronger than ever. Both MediaTek and Qualcomm understand this, and therefore most of their new chips come with powerful NPUs.

The Dimensity 9500s has a MediaTek NPU with support for multimodal models and agentic AI. The NPU also helps with AI photo editing, AI summarization, and a wide range of tools for cameras, creativity, and productivity.

The Snapdragon 8 Gen 5’s Hexagon NPU also supports agentic AI, which can learn and adapt to your preferences over time for highly personalised recommendations. The AI also helps improve camera output and connectivity.

Camera & imaging

The Dimensity 9500s integrates an 18-bit Imagiq ISP. It’s a content-aware ISP, which uses advanced Super Resolution techniques to improve clarity, even at high zoom levels. The chip supports up to 320MP single camera and up to 8K video recording at 60fps.

In contrast, the Snapdragon 8 Gen 5 features a 20-bit triple AI ISP, with up to 320MP single camera and 4K/120fps video recording. The chip also supports up to 8K video recording, but at lower frame rates. Additionally, the 8 Gen 5 offers numerous photo and video features, including Truepic photo capture, Bokeh Engine, and Video super resolution.

Connectivity

Both chipsets offer excellent connectivity features, although there are several notable differences. For example, the Dimensity 9500s supports the 3GPP Release 17 standard, while the Snapdragon 8 Gen 5 supports the newer Release 18 standard with additional enhancements.

Over a 5G connection, the Dimensity chip’s download speed can go up to 7 Gbps, while the Snapdragon chip can reach even higher, up to 10 Gbps. The Dimensity 9500s makes a comeback with a higher peak Wi-Fi speed (6.5 Gbps vs 5.8 Gbps).

Dimensity 9500s vs Snapdragon 8 Gen 5: Conclusion

From the spec sheet, the Snapdragon 8 Gen 5 appears to have an edge over the Dimensity 9500s. However, note that specs alone do not give the complete picture. We’ll update this post once we’ve tested a device powered by a Dimensity 9500s for better clarity.

The Redmi Turbo 5 Max will be among the very first phones to feature the Dimensity 9500s chip. It’s expected to launch later this month. Meanwhile, click here to see how the Snapdragon 8 Gen 5 stacks up against the competition.

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The Snapdragon 7 Gen 4, announced in May, has quietly become a popular choice among mid-range phones, powering many devices from top brands, including the Oppo Reno 15, Vivo T4 Pro, Realme 16 Pro+ 5G, and more.

On the other hand, we have the Dimensity 8350 from MediaTek, which was announced in late 2024. From the spec sheet, it appears the Snapdragon 7 Gen 4 has a powerful CPU, but the Dimensity 8350’s higher CPU clock speed makes a more significant difference. Let’s dive deeper into the benchmark scores and real-world differences to find out who has the edge.

Let’s begin with the spec sheet:

Snapdragon 7 Gen 4 vs Dimensity 8350: Benchmark score

Note: The benchmark tests were performed on the Vivo T4 Pro (powered by the Snapdragon 7 Gen 4) and the Oppo Reno 14 (powered by the Dimensity 8350).

Geekbench score

Even though the Snapdragon 7 Gen 4 has newer CPU cores, the higher clock speeds in Dimensity 8350 achieve more on the Geekbench benchmark. The single-core speed is up by 5%, while the multi-core gap widens to about 10%.

While the differences aren’t significant, the Dimensity chip should perform better during higher workloads. For day-to-day tasks like browsing the internet, scrolling through social media apps, or watching videos, both should achieve a similar performance.

AnTuTu score

AnTuTu shows a rather significant performance gap between the two chips, with the Dimensity 8350 delivering a total score that’s 39% higher than the Snapdragon 7 Gen 4. The biggest difference comes from the GPU performance. The Snapdragon 7 Gen 4 scores 323,797 points in the graphics test, while the Dimensity 8350 crosses the 500K mark, a massive 72% lead.

The Snapdragon chip does score slightly higher in CPU tests, but the margin is too small to consider. Meanwhile, the Dimensity 8350 also pulls ahead in memory and UX scores.

The benchmarks show a clear advantage for the Dimensity 8350 chipset, especially in terms of GPU performance. That said, there are still some important aspects that benchmarks don’t cover, such as connectivity and the camera, which we’ll discuss in the following section.

Snapdragon 7 Gen 4 vs Dimensity 8350: Here are the key differences

Both octa-core chips have been fabbed using TSMC’s 4nm process node, although their core configurations differ. The Snapdragon 7 Gen 4 has a 1+4+3 core configuration, featuring one Cortex-A720 big core, four Cortex-A720 mid cores, and three Cortex-A520 small cores.

In contrast, the Dimensity 8350 features a 1+3+4 CPU configuration, with one Cortex-A715 big core, three Cortex-A715 mid cores, and four Cortex-A510 small cores. While the Snapdragon chip features newer cores, the Dimensity 8350 cores benefit from higher clock speed.

For graphics rendering, the Snapdragon 7 Gen 4 features Adreno 722, while the Dimensity 8350 has a Mali-G615 MP6 GPU. The latter features higher frequency, more pipelines, and higher computational power (FLOPS). These are among the reasons why the Dimensity 8250 achieved a much higher GPU score on AnTuTu.

Furthermore, the Dimensity chip features a higher-bit camera and supports higher camera resolution. The output, however, largely depends on the camera sensor and OEM optimizations. The Snapdragon chip may have an edge in connectivity, thanks to newer standard Wi-Fi 7 and Bluetooth 6.0 technologies. The Dimensity chip benefits from a higher peak download speed over a 5G connection (5.17Gbps vs 4.2Gbps).

Snapdragon 7 Gen 4 vs Dimensity 8350: Which one should you choose?

The Dimensity 8350 is a well-rounded choice over the Snapdragon 7 Gen 4. It offers higher peak performance, an advanced camera ISP, and a higher peak download speed over a 5G connection.

If peak performance isn’t your concern, the Snapdragon 7 Gen 4 can be a more reliable choice, while ensuring future-proof connectivity with Wi-Fi 7 and Bluetooth v6.0.

Best Snapdragon 7 Gen 4 phones:

• Oppo Reno 15
• Realme 16 Pro+ 5G
• Vivo V60 5G (review)
• Vivo T4 Pro 5G
• Motorola Edge 70 5G

Best Dimensity 8350 phones:

• OnePlus Nord CE 5 (review)
• Motorola Edge 60 Pro
• Oppo Reno 14 (review)
• Realme P3 Ultra

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Alongside the more affordable Dimensity 8500, MediaTek also announced the Dimensity 9500s in the event today. The processor sits just below MediaTek’s top Dimensity 9500, and is designed to power sub-flagship phones. 

At the heart of the new chip is a flagship-style all-core CPU architecture built on TSMC’s second-generation 3nm manufacturing process. The processor includes a Cortex-X925 core (@3.73GHz), three Cortex-X4 (@3.30GHz), and four Cortex-A720 (@2GHz) cores, and more than 29 billion transistors. 

According to the company, the chip supports “super memory compression technology” that helps speed up everyday tasks. MediaTek claims this can improve app launch speeds by up to 44 percent once enabled. The Dimensity 9500s also comes with a large 19MB CPU cache and 10MB of system cache. 

Graphics duties are handled by a flagship-grade Immortalis-G925 GPU that supports ray-tracing. The chip can also handle a range of on-device AI tasks without needing an internet connection. 

Camera and AI

The 9500s is also built with camera and video features in mind. MediaTek says it includes a high-end autofocus engine, fast capture capabilities, and a semantic segmentation video engine for smarter image processing. On the video side, the chip supports 8K HDR recording with Dolby Vision.

Moving to connectivity, the processors include a 5G Release 17 modem with support for four-carrier aggregation and theoretical download speeds of up to 7Gbps. 

It also supports Wi-Fi 7 with speeds up to 6.5Gbps. And MediaTek even highlighted a new Bluetooth feature that allows direct phone-to-phone connections at distances of up to five kilometers without using cellular networks.

MediaTek confirmed that the first phone to use the new processor will be the Redmi Turbo 5 Max. In lab testing, that device reportedly managed to score 3,612,095 points in the AnTuTu benchmark.

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MediaTek has officially taken the wraps off its latest chip for mid-range smartphones, the Dimensity 8500. The company announced the processor today at a launch event where it also introduced the Dimensity 9500s.

The Dimensity 8500 is built around an all-big-core design based on TSMC’s N4P (4nm) process. What’s interesting about this setup is that Cortex-A725 cores make up all eight CPU cores, running at different clock speeds. A prime Cortex-A725 core clocks at 3.4GHz, three high-performance Cortex-A725 cores run at 3.20GHz, and four additional Cortex-A725 cores operate at 2.20GHz.

The Dimensity 8400 also uses an all-Cortex-A725 design, but MediaTek says this second-generation all-big-core CPU delivers a 7% performance improvement. The chip also supports faster LPDDR5X memory with speeds of up to 9600Mbps, increasing memory bandwidth by as much as 12%

Dimensity 8500 brings a boost in GPU performance

Where the Dimensity 8500 makes its biggest jump is in the graphics department. The chip uses a new Mali-G720 MC8 GPU, which reportedly delivers 25% higher peak performance than the previous generation while cutting power consumption by 20% at peak load. 

The company is also touting the 8500 as the first chip in its segment to bring “realistic ray tracing” to more affordable flagship-style phones.

As for the actual gameplay, MediaTek says the GPU can deliver stable frame rates above 110fps even in outdoor environments at 35 degrees Celsius. Its Dimensity Multi-Frame Rate technology is further designed to save up to 30% power during gameplay, while MOBA titles can see power savings of up to 37%.

AI, Camera and Connectivity

It’s 2026, so it’s a violation not to talk about artificial intelligence. The Dimensity 8500 uses MediaTek’s NPU 880 for neural processing and supports on-device generative AI features such as real-time translation and image generation. The chip is also compatible with the Dimensity AI Development Kit and major global language models (LLM / MLLM). 

For optics, MediaTek is offering several AI-assisted imaging tools, including an AI Ultra-Clear Telephoto Algorithm, semantic segmentation, and AI-powered reflection and glare removal. Furthermore, you get support for cinema-grade 4K HDR video recording, zero shutter lag, and full-pixel phase detection autofocus.

On the connectivity side, the Dimensity 8500 features a 5G modem capable of download speeds up to 5.17Gbps, along with three-carrier aggregation and dual-SIM dual-standby. MediaTek’s UltraSave 3.0+ technology is also included to help reduce power consumption during network use.

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After the performance rankings, AnTuTu has shared its latest snapshot of the Android processor landscape in China for Q4 2025. Unsurprisingly, Qualcomm is the leader with over 70% market share, but there’s a surprise new entry to the list. 

According to the data, Qualcomm-powered devices make up 71.2 percent of Android phones in use. The figure effectively means that around seven out of every ten Android smartphones currently in the Chinese market are running on a Qualcomm chip. 

Qualcomm’s share comes from its wide mobile processors for the mid-to-high end segment. The Snapdragon 8 Elite / Gen series is the default choice for many Android flagships, while the Snapdragon 7 and Snapdragon 6 series fill the mid-range segment. Then there’s the Snapdragon 4 series for affordable phones. 

MediaTek is the second biggest, followed by Samsung

MediaTek, meanwhile, enjoys 27.4% market share. While that’s still a long way behind Qualcomm, MediaTek has been on a steady rise over the past few years. The company’s Dimensity 9000 series chips have become popular among manufacturers looking to balance performance and cost.

However, the company’s biggest win comes from budget and mid-range phones, largely dominated by Helio and Dimensity 7000 and 8000 chips. For instance, AnTuTu’s mid-range smartphone ranking for December 2025 shows 9 out of 10 phones with a MediaTek chip.

Beyond those two, the field thins out quickly. Samsung ranks third with a modest 0.6 percent share, largely limited to its own Galaxy devices using Exynos processors. 

Surprisingly, Xiaomi has also made it onto the list with a 0.4% market share. Its XRING O1 processor is currently exclusive to the Xiaomi 15S Pro and Xiaomi Pad 7 Ultra. The fact that only two devices allowed it to make the list suggests that Xiaomi’s self-developed chip has already gained traction within the vast smartphone landscape.

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MediaTek has confirmed that it will hold a launch event on January 15 in China. The teaser released by the brand confirms that it will launch two chipsets on the said date. The Taiwanese chipmaker is expected to officially unveil the Dimensity 8500 as well as a new Dimensity 9-series chip.

Dimensity 9500s, Dimensity 8500 chipset details leaked

According to reports, MediaTek will unveil the Dimensity 8500 and Dimensity 9500s chipsets on Jan. 15. While the Dimensity 9500s will be a completely new chip, the Dimensity 8500 already powers the Honor Power 2, which has just gone official in China.

The Dimensity 8500 is built on TSMC’s N4P process and features an octa-core CPU configuration made up of one Cortex-A725 core clocked at 3.4GHz, three additional Cortex-A725 cores running at 3.20GHz, and four efficiency-focused Cortex-A725 cores operating at 2.20GHz. Graphics duties are handled by the Mali-G720 MC8 GPU.

Reports have revealed that the Dimensity 9500s is manufactured using TSMC’s more advanced N3E process. It comes with a more powerful CPU setup that includes a single Cortex-X925 core clocked at 3.73GHz, three Cortex-X4 performance cores running at 3.30GHz, and four Cortex-A720 efficiency cores at 2.40GHz. The chipset is paired with a Mali Immortalis-G925 MC12 GPU, operating at a frequency of 1612MHz.

Reports have also revealed that the upcoming Redmi Turbo 5 Max series will include two models. Likely, the base model could be powered by the Dimensity 8500 chipset, whereas the higher variant could feature the Dimensity 9500s.

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MediaTek has quietly added a new chip to its mid-range lineup. The Dimensity 7100 is now listed on the company’s official website as a 5G chipset built on TSMC’s 6nm process.

At a basic level, the Dimensity 7100 follows a familiar formula. It features an eight-core CPU setup, comprising four Cortex-A78 performance cores clocked at up to 2.4 GHz and four Cortex-A55 efficiency cores running at 2.0 GHz. 

The setup isn’t significantly different from previous Dimensity 7000-series chips, but MediaTek claims users should experience faster app launches and smoother multitasking compared to older mid-range processors.

Graphics are handled by the Arm Mali-G610 GPU, which is up to 8 percent faster than the GPU found in the Dimensity 7050. 

Dimensity 7100 is touted for efficiency 

One of the bigger themes here is efficiency. MediaTek says the Dimensity 7100 is around 5 percent more power-efficient during app usage, up to 16 percent more efficient during multimedia playback, and up to 23 percent more efficient on the modem side. The integrated 3GPP Release 16 5G modem supports download speeds of up to 3.3Gbps and uses MediaTek’s UltraSave 3.0+ technology to reduce battery drain during extended 5G sessions.

The chip also checks the expected boxes for modern hardware support. It works with LPDDR5 RAM at speeds of up to 5500Mbps and supports UFS 3.1 storage. Wireless options include Wi-Fi 6 and Bluetooth 5.4. On the display side, the Dimensity 7100 supports 10-bit color depth and HDR video playback.

As for the optics, the chip supports sensors up to 200 megapixels, along with HDR imaging, multi-frame noise reduction, and hardware-accelerated face detection. According to the company, portrait detection and autofocus performance have seen notable improvements compared to previous generations, at least on paper.

There’s also support for 45W fast charging and the UFCS universal charging protocol, alongside a new power management system designed to work at lower voltages for slightly longer battery life.

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For a while, Qualcomm‘s Snapdragon series was the de-facto choice for flagship Android smartphones. But in recent years, the landscape has shifted with chips from its rival, MediaTek, posing a direct channel on every segment. While the Snapdragon was often found in flagship smartphones, recent premium models even carry the latest Dimensity SoCs. So if you’re eyeing a flagship Android phone without Snapdragon, here’s what you can expect and what trade-offs you might need to consider.

Snapdragon vs Dimensity: Performance

Historically, Snapdragon chips have excelled in sustained single-thread performance and optimized multi-core throughput. This basically translated to faster app launches, snappy multitasking, and stable performance under heavy loads. So even Qualcomm’s top-end Snapdragon 8 Elite Gen 5 continues this tradition with strong single-core and multi-core scores in benchmarks.

Yet MediaTek’s Dimensity 9500 isn’t far behind, and in some tests even edges out Snapdragon in certain metrics. For example, early Geekbench 6 scores show the Dimensity can slightly outperform the Snapdragon chip in single-core tasks, while multi-core results are tightly matched. Meaning, both chips are capable of delivering flagship level performance. So, regardless of which side you pick, everyday use or intense workloads isn’t a compromise on either side.

Gaming & Graphics

Gaming is where the chipset battle gets interesting. Snapdragon’s Adreno GPU traditionally excels at raw graphical throughput and stable framerates, backed by Qualcomm’s “Elite Gaming” suite and optimizations tailored to top Android titles. This can mean slightly better peak performance in games, especially at higher resolutions or demanding settings.

On the other hand, the Dimensity 9500’s Mali-G1 Ultra GPU delivers very strong performance for most gaming scenarios and has shown impressive gains in GPU scores in benchmarks. Some real-world tests even highlight smoother sustained performance during long gaming sessions, thanks to better thermal behavior and power distribution.

However, certain aspects like thermal throttling are also related to the brand’s optimization and cooling solutions. If your priority is maxing out graphics, Snapdragon phones could still have an edge. But the difference in minimal and the Dimensity powered devices are holding their own with balanced performance and efficiency.

Power Efficiency & Thermals

Efficiency isn’t just about benchmarks, it’s about how long your phone can last during everyday use. Dimensity 9500’s architecture emphasizes a mix of high-performance and efficiency cores, often resulting in cooler operation and lower power draw during sustained tasks like gaming or video editing. This can translate to better real-world battery life, especially over extended use.

Meanwhile, Qualcomm designed its flagship Snapdragon chips with higher clock speeds and custom Oryon cores, which deliver slightly better burst performance. But this can come with increased heat under load that can trigger thermal throttling in some scenarios. Some users have even reported that Snapdragon-equipped phones run warmer during extended gaming or benchmarking sessions compared to Dimensity-powered counterparts.

AI, Camera, & Connectivity Features

AI performance and camera processing are increasingly important in flagship devices. Both Snapdragon 8 Elite Gen 5 and Dimensity 9500 support advanced NPUs and modern ISP pipelines capable of AI-driven photography and on-device intelligence. Qualcomm typically edges ahead with its Hexagon NPU and camera ISP tuning, which can benefit high-end videography and computational photography workflows.

However, Dimensity’s NPU also shows strong results and, in some benchmarks, uses lower power for similar tasks. In terms of connectivity, Snapdragon often leads with slightly faster 5G modem speeds and mature signal handling, but Dimensity isn’t far behind with robust 5G support and Wi-Fi advancements.

Verdict: More Choices, Not Compromises

High-end Android phones without Snapdragon aren’t second-class anymore. They are competitive flagship choices that reflect how far Android chip competition has come. With Samsung also revitalizing its Exynos lineup of chips, the competition is getting stiffer. So if you need top tier performance, excellent battery life, and great gaming experience, a Dimenity powered device is absolutely worth considering and offers no real trade offs when compared to Snapdragon equipped flagships.

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Qualcomm and MediaTek were earlier supposed to be among the first brands to push 2nm smartphone chips into the market, but Samsung has quietly taken the crown by announcing Exynos 2600 — the world’s first smartphone chip built using 2nm GAA (Gate-All-Around) manufacturing process.

The Exynos 2600 sits above the Exynos 2500, promising notable improvements in performance, thermal efficiency, and AI capabilities. Although not officially confirmed, this chip is likely to power some of the upcoming Galaxy S26 series phones in many regions.

The latest Exynos chip features a 10-core CPU based on Arm’s latest v9.3 architecture, which includes C1-Ultra and C1-Pro cores. Samsung didn’t include any low-power little cores, as the CPU only comprises big and high-performance cores.

The Exynos 2600’s CPU comprises one prime C1-Ultra core clocked at 3.8GHz, three high-performance C1-Pro cores at 3.25GHz, and six efficiency-tuned C1-Pro cores at 2.75GHz. This new structure is claimed to have improved the CPU performance by up to 39%.

Gamers should also notice some improvements, as the new Xclipse 960 GPU is claimed to offer twice the compute performance of its predecessor and up to 50% better ray tracing performance. The chip also introduces Exynos Neural Super Sampling (ENSS) technology, which further improves gaming performance by leveraging AI-based resolution upscaling and frame generation technologies.

The South Korean giant has taken a step forward towards fixing the heating issues associated with Exynos chips by introducing the new Heat Path Block (HPB) technology. It improves heat transfer using High-k EMC materials, which are said to be as effective as a heat sink, and lowers thermal resistance by up to 16%.

The Exynos 2600 chip features an AI engine with a 32K MAC NPU and brings support for ARM’s Scalable Matrix Extension 2 (SME 2), which can accelerate AI and ML-based applications and provide enhanced support for matrix operations. Samsung claims the upgraded NPU delivers a 113% increase in AI performance over its predecessor, Exynos 2500.

The chip supports up to 320MP single-camera or 64MP + 32MP dual-camera configurations. Additionally, it enables zero shutter lag for 108MP shots. The chip can do 8K/30fps and 4K/120fps HDR video recording, with support for Samsung’s APV codec for higher-quality videos. Samsung claims the improved ISP is also up to 50% more efficient.

Other specs include LPDDR5x RAM, UFS 4.1 storage, 4K displays at a refresh rate of up to 120Hz, and HDR10+ playback.

Qualcomm and MediaTek will join in next year

From the specs sheet and brand claims, the Exynos 2600 appears to offer solid gains across CPU, GPU performance, and API capabilities. Particularly, the latest measures to fix heating issues could build more confidence in potential buyers. However, Qualcomm and MediaTek aren’t sleeping either.

The two chip giants are working towards announcing their 2nm smartphone chips. According to reports, those could be called: Snapdragon 8 Elite Gen 6 and Dimensity 9600. Both will reportedly use TSMC’s 2nm (N2P) manufacturing process.

MediaTek and Qualcomm usually release their latest flagship chips around September. That’s when you can expect them to unveil their 2nm flagship chips. That’s still months away, but in the meantime, we’re likely to hear more about these chips through various leaks.

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The chipset has always been a crucial part of a smartphone, but today it matters more than ever. From gaming performance and connectivity to battery life, camera processing, and AI features, the processor plays a central role in determining how a phone performs day-to-day — making the right choice increasingly important.

For years, Qualcomm’s Snapdragon chips were the go-to choice for most users. But MediaTek has dramatically closed the gap in recent years, and in some cases, it even pulled ahead. So, which one should you actually pick for your next upgrade? Let’s break it down.

Snapdragon and MediaTek: A quick background

Qualcomm’s Snapdragon chips have dominated the Android flagship market for over a decade. Major brands, including Samsung, Xiaomi, and OnePlus, have heavily relied on Qualcomm to power their high-end smartphones. Over time, Snapdragon has also earned a strong reputation for strong performance and reliable connectivity.

MediaTek, on the other hand, was primarily known for entry-level and mid-range chips. That perception has changed significantly with the rise of the Dimensity series. Today, MediaTek offers flagship-grade processors with modern CPU designs, powerful GPUs, and impressive power efficiency — often at a lower cost to smartphone manufacturers.

As a result, the two chipmakers now compete head-to-head across nearly every price segment.

Performance and gaming: where Snapdragon still holds an edge

Snapdragon chips have long been dominating smartphone gaming, and that’s still true. That said, MediaTek has aggressively filled the gap in recent years.

Modern Dimensity chips feature powerful GPUs that can match, or even outperform, Snapdragon chips on benchmarks. However, during longer gaming sessions, Snapdragon-powered phones generally deliver more consistent frame rates. MediaTek-powered phones exhibit relatively higher thermal throttling during extended gaming, but newer flagships have significantly improved in this regard.

This makes Snapdragon the safer choice for sustained gaming performance, although MediaTek chips still offer more than enough power for casual and even moderate gamers.

In CPU benchmarks, Snapdragon chips tend to have a slight edge in single-core performance, resulting in marginally faster app launches and smoother UI interactions. MediaTek’s recent Dimensity chips often perform better in multi-core workloads. In real-world use, however, these differences are subtle, and most users won’t notice a meaningful gap during everyday tasks like browsing, social media, or video streaming.

Battery life and efficiency: MediaTek’s quiet strength

MediaTek chips have consistently received praise for their excellent power efficiency, particularly in mid-range and upper mid-range segments. Dimensity chips are often optimized for sustained efficiency, resulting in longer screen-on time and reduced heat buildup.

Snapdragon chips are still efficient, especially recent generations, but MediaTek-powered phones deliver comparable or even better battery life at similar price points.

Camera and imaging: Snapdragon has a slight edge

Camera performance isn’t just about the sensor or megapixel count; the chipset also plays an important role. The image signal processor (ISP) on a chip processes the raw data (captured by the sensor) into usable image data, after which the OEM applies its own processing and tuning.

Snapdragon still holds a slight reliability edge due to years of ISP optimization and broader software support, particularly for video recording. MediaTek’s flagship chips have made major strides, but camera results still depend heavily on how well OEMs tune the imaging pipeline.

Connectivity and network reliability

Both Snapdragon and MediaTek offer modern connectivity features, including advanced 5G support, Wi-Fi standards, and Bluetooth enhancements.

In the US, however, the Snapdragon may have an edge due to carrier-specific optimizations. This is because of Snapdragon’s dominance in the region. That said, modern MediaTek flagships also perform reliably in most regions, including the US.

For the majority of users, connectivity differences between the two are unlikely to be a deciding factor, as both integrate modern connectivity features.

Pricing and value: where MediaTek shines

Pricing is one of MediaTek’s biggest advantages. Smartphones powered by MediaTek chips are typically more affordable than comparable Snapdragon-powered devices — that’s also true for flagship phones.

MediaTek chipsets often offer better specifications on paper for the same price, and this advantage is especially noticeable in the mid-range segment. Snapdragon-powered phones tend to cost more, reflecting brand perception, premium modem technology, and the long-standing maturity of their ecosystem.

Snapdragon vs MediaTek: which one should you choose?

• Choose Snapdragon if you prioritize sustained gaming performance, consistent camera results, and reliable connectivity.
• Choose MediaTek if you want excellent performance and battery efficiency at a lower price, and you’re comfortable trading a bit of ecosystem maturity for better value.

Both Snapdragon and MediaTek make capable chips. The choice ultimately depends less on the brand name and more on how the phone is optimized and how you plan to use it.

Keep reading further:
1. Snapdragon 8 Elite Gen 5 vs Dimensity 9500 vs Apple A19 Pro
2. Dimensity 9500 vs Dimensity 9400
3. Snapdragon 8 Gen 5 vs Snapdragon 8 Elite

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MediaTek has officially released its latest automotive cockpit processor, the Dimensity Cockpit P1 Ultra. Built on an advanced 4nm manufacturing process, the chip prioritizes high performance, robust AI capabilities, and enhanced in-car entertainment features. MediaTek says the first car models utilizing this chip will be launched soon.

MediaTek Dimensity P1 Ultra Specs

The P1 Ultra comes with a powerful 8-core CPU that delivers up to 175K DMIPS of computing power. For graphics, MediaTek has added a hardware-level ray-tracing GPU that offers up to 1800 GFLOPS of performance. 

On the AI side, the P1 Ultra includes a dedicated NPU capable of 23 TOPS, and MediaTek says it can even run edge-side generative AI. Thanks to the Armv9 architecture and built-in AI units, the chip supports 7-billion-parameter large language models directly inside the car. 

As a result, you can expect it to handle features like advanced voice assistants, multimodal interactions, on-device image generation (like Stable Diffusion), and even AI-based safety monitoring can run without needing cloud support.

MediaTek has also focused on reducing development time for automakers. The P1 Ultra integrates multiple components, including smart cockpit, connectivity modules, and T-BOX into a single platform. 

It supports 5G, dual-band Wi-Fi, Bluetooth, GNSS, and even includes a built-in modem. For cameras, there’s an HDR ISP with AI noise reduction, AI 3A, and other enhancements. This helps with features such as 360-degree surround view, driving recorders, and cabin monitoring.

For entertainment, the P1 Ultra supports up to six displays at the same time, and thanks to MediaTek’s MiraVision tech, it can handle 4K 60fps video playback and recording. This means cars can offer multi-screen setups for the driver, passengers, and rear-seat entertainment systems, all powered by a single chip.

MediaTek also confirmed that the Dimensity Cockpit P1 Ultra will come in three versions — 5G, 4G, and Wi-Fi models — all featuring an 8-core CPU and 6-core GPU.

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The Snapdragon 6s Gen 4, announced in October, delivers higher performance and expanded capabilities to mid-range phones by incorporating modern chip technologies and premium features from flagship chipsets. Qualcomm would be hoping for a stronger presence in the mid-range segment with this new chip, but its biggest rival, MediaTek, already has an answer to that: Dimensity 7400.

The Dimensity 7400 was announced earlier this year and has a similar spec sheet to the Snapdragon 6s Gen 4. Both have the same CPU cores, but they also bring notable differences. We’ll look at every aspect of the two chips, including benchmark numbers, in this detailed comparison to find out which delivers superior performance.

Snapdragon 6s Gen 4 vs Dimensity 7400: Benchmark numbers

Note: The Geekbench 6 scores for the Snapdragon 6s Gen 4 were obtained from an alleged Moto G100s listing. For the Dimensity 7400, we tested the Motorola Edge 60 to get the benchmark scores.

The Snapdragon 6s Gen 4 has scored 1,018 single-core points and 2,893 multi-core points in the Geekbench 6 test. These are good numbers for a lower mid-range chipset, but the Dimensity 7400 is slightly ahead with 1,058 points and 3,041 points in single-core and multi-core tests, respectively.

While the differences aren’t huge, the Dimensity 7400-powered devices should offer better CPU performance compared to the Snapdragon 6s Gen 4.

We weren’t able to compare GPU scores because no device with the Snapdragon 6s Gen 4 chip has been released yet. We’ll update the scores here after testing.

Snapdragon 6s Gen 4 vs Dimensity 7400: Key differences

The Snapdragon 6s Gen 4 is manufactured using Samsung’s 4nm process node, while the Dimensity 7400 uses TSMC’s 4nm node. The latter generally offers better performance and power efficiency.

CPU, GPU, & NPU

Both mid-range chipsets feature octa-core CPUs with four Cortex-A78 performance cores and four Cortex-A55 efficiency cores. The difference here is that all cores in the Dimensity 7400 run at a relatively higher speed than those in the Snapdragon 6s Gen 4.

The higher clock speeds of the CPU cores and TSMC’s advanced manufacturing on the Dimensity 7400 should deliver higher peak performance than the Snapdragon 6s Gen 4. This also reflects in the benchmark scores.

For graphics rendering, the Snapdragon chip has an Adreno GPU. Qualcomm hasn’t revealed much about the GPU, but it claims the chip is 59% faster than the 6s Gen 3 and supports 144fps gaming. Additionally, the chip supports Variable Rate Shading and Qualcomm Game Quick Touch to improve touch latency and render graphics more efficiently.

The Dimensity 7400 is equipped with Mali-G615 MC2 GPU, which is 10% faster than its predecessor. Furthermore, it comes with MediaTek Adaptive Gaming Technology (MAGT) 3.0 and MediaTek’s Network Observation System (NOS) for improved performance, power efficiency, and connectivity.

Both chipsets also have NPUs for on-device AI capabilities: Qualcomm Hexagon NPU on Snapdragon 6s Gen 4 and MediaTek NPU 655 on Dimensity 7400. They also help optimize various aspects of the device, including camera, connectivity, and gaming.

Camera & Imaging

The Snapdragon chip features dual 12-bit Spectra ISPs, allowing up to 200MP photo capture and 2K HDR video recording at 30fps. Additionally, it supports 720p slow-motion video recording at 240 fps.

The 12-bit HDR ISP on the Dimensity 7400 also supports up to 200MP single camera. It supports precise noise reduction (MCNR) and video HDR for sharp, clear outputs. The Dimensity chipset also supports Google Ultra HDR image and up to 4K video recording.

Connectivity

Both chips have Release 16 5G modems, but their capabilities differ. The Snapdragon 6s Gen 4 offers up to 2.9 download speed, while the Dimensity 7500 can reach up to 3.27Gbps. The peak download speed remains the same for the Snapdragon chip on a Wi-Fi 6E connection. The Dimensity 7400 also supports Wi-Fi 6E, but MediaTek hasn’t revealed the data transfer speed.

Snapdragon 6s Gen 4 vs Dimensity 7400: Spec sheet

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