New data tracking CPU sales on Amazon US shows a sharp year-over-year decline in January 2026. According to figures compiled by analyst TechEpiphany, just 26,100 processors were sold during the month. That might not sound terrible on its own, but it represents a steep 51% drop compared to January 2025.

That’s a significant contraction for one of the largest online retailers, and it adds to a broader downward trend that’s been visible in recent months.

At the same time, prices are moving in the opposite direction. The average selling price of CPUs rose from $227 in January 2025 to $305 in January 2026, a jump of roughly 34%. That suggests buyers who are still upgrading may be choosing higher-end chips, or simply paying more across the board.

Despite the slowdown, AMD continues to lead by a wide margin. The company reportedly sold 23,050 Ryzen CPUs in January, accounting for more than 88% of total units. Revenue share was nearly identical. Intel, by comparison, moved just 3,050 units.

What’s interesting is where demand seems concentrated. AMD’s newer Zen 5-based Ryzen 9000 series performed well, but older Zen 4 (Ryzen 7000) and even Zen 3 (Ryzen 5000) chips continue to sell in meaningful numbers.

Building or upgrading a PC right now means paying more for nearly every major component. Memory prices have climbed noticeably in recent months, affecting both DDR4 and DDR5 kits. SSD pricing has also increased. Graphics cards haven’t helped the situation either. Even mid-range options have seen pricing pressure.

When RAM, storage, and GPUs all cost more, the appeal of upgrading “just the CPU” weakens. Most enthusiasts don’t upgrade in isolation; it’s usually part of a broader platform refresh. And right now, that refresh isn’t cheap.

Between higher component costs, platform transition expenses, and general economic caution, many consumers seem comfortable holding onto existing systems a little longer.

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In 2026, the mini PC is no longer an underpowered alternative to full-sized towers. These machines have grown into serious AI workhorses, packing massive power into palm-sized enclosures.

But under the surface, there’s a deep divide in philosophy, one that boils down to Intel’s modular vision versus Apple’s vertically integrated approach. Picking the right mini desktop today is more about how you think than what you do.

Intel Ultra AI PCs

Mini PCs built around Intel’s Core Ultra Series chips push the boundaries of what a compact Windows machine can be. Brands like Asus, Geekom, and Minisforum are leading this charge, combining powerful AI acceleration with user-serviceable internals and open standards.

The biggest draw? Modularity. Most Intel-based mini PCs support up to 96GB of DDR5 RAM and include dual M.2 slots. That means you can build local AI datasets, train models, or edit 8K footage without ever touching the cloud. If you’re experimenting with open-source LLMs, the ability to expand RAM and storage as demands grow is a serious hedge against obsolescence.

You also get access to GPU freedom. Thanks to Thunderbolt 5 and Oculink support, these machines can connect to external graphics cards, turning a quiet productivity cube into a full-blown gaming or rendering rig. Apple still can’t match this level of expandability.

On the AI front, Intel leans into openness. Whether you’re working in PyTorch, TensorFlow, or ONNX, the ecosystem supports everything from Windows-native tools like DirectML to frameworks like OpenVINO on Linux. And for enterprise users in engineering or finance who still rely on legacy Windows apps, this is the no-compromise route.

Apple Silicon Mac Mini

Apple takes the opposite route: control everything, optimize everything. The M5-series Mac Mini, built on Apple’s newest unified silicon, isn’t modular, but it doesn’t need to be.

Unified memory is the ace here. Instead of separating RAM between CPU, GPU, and neural engines, Apple’s architecture allows them to share one high-bandwidth pool. The result is shockingly efficient performance across AI tasks, 4K editing, and music production, even at lower spec tiers.

Mac Minis also run cool and whisper-quiet under heavy workloads. Where Intel mini PCs crank up fans during AI image generation, Apple Silicon hums along silently. If you’re working in a studio or shared workspace, that matters.

Developers and creatives already embedded in Apple’s world will find even more polish. Final Cut Pro, Logic, Xcode, and Adobe’s Mac-optimized suite fly on these machines. And if you’re building for iOS or visionOS, a Mac is not just preferred, it’s essential.

Which One Should You Choose?

Both platforms are more powerful than ever, but your choice should reflect how you work, not just how fast a benchmark runs.

Go with an Intel Ultra Mini PC if you need customization, frequent upgrades, or a platform that supports everything from gaming to enterprise software. It’s the more flexible path, especially for those running local AI models or experimenting with external GPUs.

Choose the Apple Mac mini if you want a system that just works. The unified experience, quiet operation, and creative tool optimizations make it the ideal choice for video editors, musicians, and app developers.

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Tata Group and Intel Corporation have signed a Memorandum of Understanding to explore a strategic collaboration focused on semiconductor manufacturing, advanced packaging, and hardware enablement for consumer and enterprise markets. The partnership aims to strengthen India’s domestic semiconductor ecosystem and build a stable and geo resilient electronics supply chain based in India.

As part of the MoU, Intel and Tata will explore the manufacturing and packaging of Intel products for the local market at Tata Electronics’ upcoming semiconductor fabrication plant and OSAT facilities in India. The two companies will also evaluate opportunities for advanced semiconductor packaging within the country. These efforts are aligned with India’s long term goal of building local capabilities across the semiconductor value chain, including high value manufacturing and assembly.

The collaboration also includes plans to scale AI PC solutions designed specifically for Indian consumers and enterprises. India is projected to become one of the top five PC markets globally by 2030, supported by rising enterprise digitisation, consumer demand, and rapid adoption of AI based computing. Intel and Tata plan to combine Intel’s AI compute reference designs with Tata Electronics’ electronics manufacturing services expertise. Tata Group’s wide presence across industries and strong access to the Indian market will support distribution and adoption.

N Chandrasekaran, Chairman of Tata Sons, said the Tata Group is committed to building a strong and sustainable semiconductor industry in India. He stated that working with Intel would help accelerate this effort, support the growth of a broader technology ecosystem, and position India to benefit from the growing demand for AI driven computing.

Intel CEO Lip Bu Tan said India represents one of the world’s fastest growing compute markets. He highlighted increasing PC demand and rapid AI adoption as key drivers. He added that the collaboration with Tata would help Intel expand its presence, scale faster, and deliver greater value to customers in India.

Dr Randhir Thakur, CEO and Managing Director of Tata Electronics, said the MoU supports Tata Electronics’ plans across EMS, OSAT, and semiconductor fabrication. He noted that local manufacturing and packaging could improve cost efficiency, shorten time to market, and build a more reliable supply chain while meeting rising demand for next generation AI compute products in India.

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At Computex 2025, the tech industry’s biggest players put forward their boldest visions for the future of artificial intelligence, both at the cloud and at the edge.

But it wasn’t just the usual suspects like Nvidia and Intel grabbing attention. From MediaTek’s AI ambitions to a neuromorphic chip developed by German researchers, this year’s event revealed a diverse and evolving AI silicon landscape.

Here’s a closer look at the most compelling AI chips and architectures introduced at the show.

Nvidia Unveils Grace Blackwell and NVLink Fusion

Nvidia introduced its Grace Blackwell NVL72 architecture at Computex 2025, positioning it as a new standard for high-performance AI computing. The hybrid architecture combines GPUs and CPUs in a tightly fused package and is capable of running trillion-parameter models, real-time inference, and large-scale scientific workloads.

The company also launched NVLink Fusion, a next-generation interconnect designed to enable high-speed chip-to-chip communication. Nvidia confirmed that companies like MediaTek, Qualcomm, and Marvell will adopt NVLink Fusion for building semi-custom AI compute solutions. The move opens Nvidia’s ecosystem to external partners and expands the reach of its AI infrastructure technology.

MediaTek’s Custom AI Ambitions and 2nm Leap

MediaTek announced its plan to tape out its first 2nm chip with TSMC in September 2025. According to the company, the new chip will offer up to 15% better performance and 25% greater power efficiency than current 3nm chips. MediaTek aims to use the new node for both mobile devices and high-performance AI applications.

The company also highlighted its collaboration with Nvidia on the DGX Spark, a compact AI supercomputer for developers. MediaTek contributed a custom 20-core CPU architecture to the system and is using its ASIC expertise to design chips tailored for AI model training and inference. MediaTek’s IP in high-speed I/O, SerDes, and optical interfaces supports this initiative.

Intel Expands AI and GPU Lineup with Arc Pro and Gaudi 3

Intel introduced the Arc Pro B50 and B60 GPUs, designed for AI inference and workstation-grade computing. The B60 GPU includes 24GB of memory, while the B50 version ships with 16GB. Both models support multi-GPU scaling and are optimized for applications in architecture, engineering, and design.

Intel also showcased Project Battlematrix, a workstation-class platform supporting up to eight Arc Pro B60 GPUs and capable of running AI models with up to 150 billion parameters. The platform is based on Intel Xeon processors and targets AI developers and researchers.

In addition, Intel rolled out new deployment options for its Gaudi 3 AI accelerators. The Gaudi 3 PCIe cards support scalable inference in existing data centers, while rack-scale configurations support up to 64 accelerators per rack and 8.2TB of high-bandwidth memory.

TUM Introduces Cloud-Free AI Chip Inspired by the Human Brain

Researchers from the Technical University of Munich (TUM) revealed the AI Pro chip, a neuromorphic processor that does not require cloud connectivity or internet access. The chip performs real-time, on-device inference using a memory-compute integrated architecture. It employs hyperdimensional computing, allowing it to recognize patterns using limited training data.

Professor Hussam Amrouch led the development of the chip, which consumes only 24 microjoules per task, significantly less than conventional AI processors. The AI Pro chip targets specific applications in healthcare, robotics, and autonomous navigation where local processing and data security are essential.

Qualcomm Previews Snapdragon X2 and Teases September Launch

Qualcomm did not launch new chips at Computex but used the stage to confirm the dates for its next major event. The company announced that the annual Snapdragon Summit will take place from September 23 to 25 in Hawaii. Qualcomm is expected to launch the Snapdragon 8 Elite 2 for smartphones and possibly introduce the Snapdragon X2 Elite for Windows laptops.

CEO Cristiano Amon said Qualcomm plans to expand its presence in the PC market, aiming for more than 100 Snapdragon-powered laptop models by next year. He also highlighted the growth of native Arm-compatible apps, claiming that over 1,400 games now run on Snapdragon devices.

The AI Chip Race Isn’t Slowing Down

Between Nvidia’s rack-scale ambition, MediaTek’s 2nm plan, Intel’s workhorse GPUs, and TUM’s sci-fi-like brain chip, Computex 2025 made one thing abundantly clear: the AI chip market isn’t just booming — it’s evolving. Fast.

And the conversation is no longer about which chip is faster. It’s about where those chips live, how they connect, and what new kinds of intelligence they can unlock.

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Intel has just announced its most efficient family of x86 processors. The Intel Core Ultra 200V series processors brings breakthroughs in performance, efficiency, and AI computing. These new CPUs arrive with more powerful integrated graphics. So here’s everything you need to know.

Intel Core Ultra 200V Series: What’s New & What’s Improved?

The chipmaker’s latest Core Ultra 200V series aims to offer improved performance with better power efficiency. It is designed to deliver better low power performance for next-gen AI PCs. Intel claims that its latest processors consume up to 50 percent less power while achieving up to 120 TOPS in performance with the CPU, GPU, and NPU. The Core Ultra 200V series processors pack Intel’s fourth generation NPUs that offer up to 4 times faster than the last gen model.

With the Intel Core Ultra 200V series, the brand plans to make PCs great with every model being capable of productivity and battery life of up to 20 hours with typical work use. Thanks to the AI enhancements, the company can leverage over 500 optimized AI models to help in content creation, security, productivity, and gaming. These are the four main areas that will employ Intel’s cutting-edge tech.

Improved Graphics

Apart from making the new processors faster and more efficient, Intel has upgraded the graphics performance with the new Xe2 integrated graphics. Xe2 enhanced performance by 30 percent over its predecessors. Furthermore, the built-in Intel Arc GPUs now include up to 8x 2nd Gen Xe cores, 8x Ray Tracing units, and supports up to three 4K monitors. The new Intel Xe Matrix Extension AI delivers up to 67 TOPS that help applications in creative fields and gaming as well.

Can it outperform Apple M3, Ryzen HX 370, & Snapdragon X Elite?

To showcase the prowess of its new AI processors, Intel pits it against AMD’s new Ryzen HX 370 series, Qualcomm’s Snapdragon X Elite, and even Apple M3. Graphs showed that the Core Ultra 200V processors offer up to three times the performance per thread along with an 80 percent hike in peak performance. All of this while promising a battery life of up to 20 hours.

The top-end Core Ultra 9 2988V outclassed the Ryzen HX 370 and Snapdragon X Elite and Apple MC in speed and power efficiency. Intel showed off the efficiency of its new processors with a laptop that is powered by a 72Wh battery. This notebook managed to run for up to 14 hours while running productivity applications or 9.5 hours while running Microsoft Teams.

When can we expect them?

Intel Core Ultra 200V processors are currently available for preorder and will be released globally starting from 24th September 2024. LG Electronics will be the first to debut the new lineup with the LG Gram 16 Pro with the Intel Core Ultra processor (Series 2), during the Intel Core Ultra Global launch event. Other major brands like Acer, Dell, GP, MSI, Samsung, and others will also launch their offerings soon.

(Via)

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Intel is working on its 15th-generation Lunar Lake and Arrow Lake CPUs. While the Lunar Lake CPUs are said to be focused on power efficiency to compete with Qualcomm’s Snapdragon X series chips and will be used inside thin and lite laptops, the Arrow Lake CPUs are going to be optimized for performance and will mainly power Desktop computers.

Intel’s Arrow Lake desktop platform is expected to use both Intel’s 20A (or 2nm) process and TSMC’s 3nm process. Intel CEO Pat Gelsinger confirmed that Intel will use TSMC’s 3nm process for Arrow Lake’s GPU tiles, which are said to be upgraded to the Xe2 LPG architecture.

Judging from the current signs, Arrow Lake will also adopt a modular architecture, divided into four different Tile modules: CPU, SoC, GPU, and IOE. The CPU is expected to use Intel’s own 20A process.

The latest news comes from a statement from an internal communication meeting, where it has been revealed that Arrow Lake’s power consumption will be at least 100W lower while running at a relatively high frequency as compared to the 14th-generation CPUs. For context, the Arrow Lake CPUs were previously reported to feature a lower clock speed as compared to the i9 14900KS.

Thanks to the new 20A process, it no longer requires the previous high voltage to maintain stability. If true, it should solve the problems of the 13th and 14th generation CPUs that are related to high voltage and power consumption.

While the leak hints at an impressive performance, no detailed information is available about it yet and to be precise, it sounds too good to be true.

Although Intel hasn’t officially announced a release date for Arrow Lake, industry insiders predict a launch sometime in the second half of 2024. According to a previous report, Intel could launch Arrow Lake in October with the first batch of K series CPUs, which may include the high-end Core Ultra 9 285K. The company is expected to release more Arrow Lake products at CES in early 2025.

(Via)

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Geekbench score of the MSI Prestige 13 AI Evo laptop has leaked ahead of the launch, providing insights into Intel’s new Core Ultra 200V series.

We expect Intel’s upcoming Core Ultra 200V series to debut by the end of this year. Previous leaks revealed it will feature three processor series: Core Ultra 5, 7, and 9. The Lunar Lake is focused on efficiency and low-power mobile devices, and it will be featured with Intel’s new mobile processors. The Core Ultra 288V which appeared in Geekbench results, is part of this series and stands out as the best in Core Ultra 9 famiily.

Recently surfaced Geekbench score reveals Intel Core Ultra 9 288V achieved a single-core score of 2790 and a multi-core score of 11048. While these numbers might not seem impressive at first glance, remember that the Core Ultra 9 288V’s maximum turbo power is just 30W. We rely on the processor’s power consumption based on previously leaked information, so it’s not actually official until Intel launches the new chips.

Comparing the Core Ultra 9 288V’s score to Intel’s currently available high-end Core Ultra 9 185H, we see a significant boost in single-core performance. A single-core score of close to 3000 points is quite impressive. If the leaked base and turbo power rates hold true, Intel appears set to introduce a processor that’s both powerful and efficient.

(source)

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Intel‘s Sapphire Rapids-Refresh processors are picking up steam. These CPUs have been certified by Ubuntu, guaranteeing compatibility with a whole different operating system. The news gets better: Lenovo‘s upcoming ThinkStation P5 workstation is equipped with a Xeon W7-2595X processor, confirming customer shipments of these Sapphire Rapids-Refresh processors have begun.

The CPU boasts 26 cores and 52 threads, with a max turbo frequency of 4.8GHz

The Xeon W7-2595X CPU in the ThinkStation P5 boasts impressive specs: 26 cores, 52 threads, a maximum turbo frequency of 4.8GHz, and a 250W TDP. While this processor reigns supreme as the flagship of the Xeon W-2500 series, even more powerful options with up to 60 cores are on the horizon with the upcoming Xeon W-3500 series.

The ThinkStation P5 comes equipped with an NVIDIA T400 GPU in its base configuration, but users have the option to upgrade to dual RTX A6000 (Ampere) graphics cards for even more power. Future iterations of the ThinkStation P5 are expected to leverage the next-generation ADA series graphics cards.

An official release date for Sapphire Rapids-Refresh processors remains elusive, but SIGGRAPH 2024 (July 28-August 1), a computer graphics conference, is a strong possibility for Intel to officially unveil these new workstation products.

(Via)

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Intel introduced its Meteor Lake processors towards the end of last year. The company is also expected to release the next Arrow Lake desktop CPUs later this year. According to a leak, the first Arrow Lake CPUs will be named Core Ultra 9 285K, Core Ultra 7 265K, and Core Ultra 5 245K.

Now the recent leak from tipster MebiuW on Weibo suggests that at least the Core Ultra 9 285K (which is considered as a successor of the i9 14900KS) will have a 700MHz lower clock speed than the 14900KS. The Core i9 14900KS reaches up to 6.2GHz, whereas the 285K will reportedly cap at 5.5GHz.

The Arrow Lake CPUs may offer better stability

While the 14900KS will reach a 12% higher clock speed as compared to the upcoming 285K, the new Arrow Lake CPU will reportedly still perform better. However, the difference won’t be much. The tipster noted that the 285K will have a less than 12% higher single-core performance (with a 12% lower clock speed) as compared to the 14900KS.

Actually, it could still be an overall improvement over the 14900KS. The 13th and 14th generation Core i9 CPUs are not really stable and power efficient. In fact, there have been numerous reports of the chips crashing while playing games or doing similar heavy tasks. It could be due to the high temperature.

The extremely high clock speeds give Intel chips a slight edge in performance against AMD‘s offerings. Now it seems that Intel is focusing on stability as well.

The Core Ultra 9 285K, is expected to feature 24 cores and 24 threads of which 8 cores will be based on the Lion Cove P-Core architecture & 16 cores will be based on the Skymont E-Core architecture. It is unclear at this point whether the unlocked K-series chips will also utilize 20A or go with TSMC’s 3nm process node.

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(Source, Via)

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Intel officially announced its 14th generation Meteor Lake series chips towards the end of last year. We have seen plenty of high-end laptops with Core Ultra chips since then. Aside from the performance-focused Meteor Lake chips such as the Intel Core Ultra 9 185H or Core Ultra 5 125H, the company has silently released another efficiency-focused chip – the Intel Core Ultra 5 115U. Surprisingly, the company didn’t even include it in its SKU release list.

Key details about Core Ultra 5 115U

This new Meteor Lake offering comes with a 2+4+2 configuration, that is two performance-cores, four efficient-cores and two more low power efficient-cores, with a total of 10 threads. These two performance cores offer a max turbo frequency of 4.2 GHz where their base frequency is only 1.5GHz.

The max turbo and the base frequency of the four efficient cores are 3.5GHz and 1GHz respectively. Speaking of the two low-power efficient cores their max turbo and base frequencies are measured at 2.1 GHz and only 700MHz respectively.

In comparison to the performance focused Core Ultra 5 125H (4+8+2 configuration), which powers recently launched laptops like the ThinkBook 14 2024 Core Edition and the ThinkBook 14+ 2024 SE, the Core Ultra 115U runs on lower peak frequencies for all cores. Notably, it is rated for a 300MHz higher base frequency for the E and LPE cores as compared to the 125H, probably to compensate for the less number of cores in certain scenarios.

The newly released processor comes with a 10MB cache. For context, the Core Ultra 5 125H boasts 18MB cache.

Speaking of graphics, the Core Ultra 115U can render up to 7680 x 4320 at 60Hz both with HDMI 2.1 and DP. Notably, the resolution output of this chip is exactly the same as the Core Ultra 125H.

Core Ultra 5 115U offers a base power consumption of 15W, which is nearly half of the 125H’s 28W. The maximum turbo power is also a lot lower at just 57W as compared to the 115W of the other.

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Gamers and Intel fanboys have an extra reason to celebrate today. Intel has unveiled the i9-14900KS, the crown jewel of their 14th generation desktop processor family. This unlocked beast came through the gate swinging, boasting a record-breaking turbo frequency of up to 6.2 GHz. It’s not just setting new records, it’s pushing the boundaries of desktop performance. The launch date of the processor was previously revealed in a report by VideoCardz.

The CPU supports up to 192GB of DDR5 memory & is compatible with Z790 and Z690 motherboards.

“This processor showcases the raw power of our 14th Gen lineup,” says Intel’s Roger Chandler. “Gamers and creators can expect a whole new level of performance, taking their experiences to the next level.”

The i9-14900KS packs a serious punch with 24 cores (8 performance-oriented and 16 efficiency cores), 32 threads, and 36MB of Intel Smart Cache. Official benchmarks claim a 15% gaming performance leap over the previous generation, while content creators will enjoy significant efficiency gains in demanding workflows like 3D rendering.

The i9-14900KS boasts a flagship set of features: a record-breaking 6.2 GHz turbo frequency fueled by Thermal Velocity Boost technology, 24 cores, 32 threads, 150W base power, 36MB Intel Smart Cache, and 20 PCIe lanes (including 16 PCIe 5.0 lanes). Gamers can expect an extra edge with Intel Gaming Optimizer (APO), delivering up to an 11% performance boost in supported titles (currently 14 games). Additionally, it supports up to 192GB of DDR5 memory and is compatible with Z790 and Z690 motherboards.

The i9-14900KS will be priced at $689, and it will be available for purchase boxed at retailers or pre-integrated into high-end systems from Intel and its partners.

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(Via)

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Intel is set to release the Core i9-14900KS processor on March 14, according to reports from VideoCardz.

The Core i9-14900KS is expected to hit a boost clock of 6.2 GHz

The Core i9-14900KS joins the lineup alongside its predecessors, the Core i9-12900KS and Core i9-13900KS, which were released on April 5, 2022, and January 12, 2023, respectively. Unlike its predecessors, the i9-14900KS reportedly boasts a higher clock speed of up to 6.2 GHz (instead of 6.0 GHz) on two cores, which was previously spotted in a leak in late February along with Lunar Lake Laptop CPUs. The Core i9-14900KS is also expected to reach up to 5.9 GHz on all P cores and 4.5 GHz on the E cores.

One notable aspect of the Intel Core i9-14900KS is its pricing, which is reported to be around $740, approximately 30% higher than the current flagship i9-14900K. Despite the higher price tag, the i9-14900KS promises significant performance improvements, making it an attractive option for enthusiasts and power users.

In terms of specifications, the i9-14900KS is based on the Raptor Lake Refresh architecture and features 8 performance cores (P) and 16 efficient cores (E), resulting in a total of 24 cores and 32 threads. It comes equipped with 36MB of L3 cache and 32MB of L2 cache, providing ample memory for demanding tasks and multitasking scenarios. Additionally, the maximum thermal design power (TDP) has likely been bumped up from the i9-14900K’s 125W to 150W for the upcoming i9-14900KS.

Notably, this processor will be the final addition to Intel’s LGA-1700 platform and marks the end of an era with the last CPU to utilize the old naming convention for Desktop CPUs. Going forward, it will be replaced by the LGA-1851 socket starting with the 15th-generation Arrow Lake CPUs by the end of this year.

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(Source)

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Tech enthusiasts and laptop users have a whole new reason to be excited as new leaks provide a peek into Intel‘s upcoming developments. Among the highlights are the Lunar Lake processors, poised to enhance battery life in laptops, and a sneak peek at the Raptor Lake Refresh’s new powerhouse, the Core i9-14900KS.

The Lunar Lake processor revealed 8 cores split for efficiency and performance

The Lunar Lake processors, as unveiled by leaks, appear to focus on energy efficiency and performance. A glimpse at a sample processor running on Windows reveals an intriguing setup: eight cores split between performance and efficiency, aiming for a balanced power consumption without sacrificing capability. Interestingly, this early look suggests a departure from conventional designs, with an unconventional cache configuration that might hint at new optimization strategies.

On the other hand, the buzz around the Core i9-14900KS suggests Intel isn’t holding back on performance. Spotted with a potential 6.2GHz peak speed, this CPU could set new benchmarks for high-end computing, although the listed price – potentially higher than its predecessors – has sparked discussions about value and accessibility.

Both these developments signal Intel’s strategy: pushing the envelope on both ends of the spectrum, from power efficiency to peak performance. The Lunar Lake series, with its promise of extending battery life, could be a game-changer for the next generation of thin-and-light laptops, offering a blend of mobility and power. Meanwhile, the Core i9-14900KS represents the pinnacle of desktop CPU performance, catering to gamers and professionals seeking the utmost in computing power. While specifics, including pricing and final specifications, remain speculative, the direction is clear. Intel is gearing up for something big.

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(Via)

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Intel continues to expand its product family. In this regard, the company recently showcased its new 14th-Gen mobile and desktop CPU lineup at CES 2024. However, competition with AMD is more intense than ever. Consequently, Intel aims to achieve success in different markets through diverse marketing strategies and products. The latest example of this is the release of the Core i7-14790F and i5-14490F processors, available exclusively in China. Here are the details…

Unveiling the Core i7-14790F and i5-14490F Processors for China

Intel recently released a new processor, the Core i7-14790F, featuring 16 cores and a maximum frequency of 5.40 GHz. It’s specifically available in China and can be identified by its black packaging. Despite its higher numerical designation compared to the i7-14700F, it has 4 fewer CPU cores. The cache increases by 3MB in line with the usual series. On the JD platform’s official store, these processors are priced at 2,909 yuan.

In addition, Intel also released the i5-14490F with a lower configuration, which has 10 cores and 16 threads, a turbo frequency of 4.9 GHz, and 24 MB of cache. It is priced at 1,659 yuan. The i5-14400F with a turbo frequency of 4.7 GHz and 20 MB of cache is also priced at 1,659 yuan.

• The Core i7-14790F has a base frequency of 3.60 GHz and a TDP of 125 W
• The Core i5-14490F has a base frequency of 3.20 GHz and a TDP of 65 W
• Both processors are based on the Alder Lake-S architecture and use the LGA 1700 socket

The release of these processors is a sign that Intel is continuing to invest in the Chinese market. The company has been facing increasing competition from AMD in recent years, and these new products could help it regain market share.

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Intel is stepping up its game in the tech world with its latest 14th Gen mobile and desktop processor lineup. This includes the new HX-series mobile processors, set to rev up 2024’s gaming laptops. Don’t mix these up with the Core Ultra CPUs for laptops; these new processors are an upgrade from the 13th Gen Raptor Lake mobile versions.

The new mobile CPU has an impressive 24 cores and a max clock speed of 5.8GHz

The star of the show is the Intel Core i9-14900HX, tailored for high-performance gaming laptops. It boasts an impressive 24 cores and can reach speeds up to 5.8GHz. But it’s not just about speed – these chips support up to 192GB of DDR5-5600 memory, along with the latest in connectivity like Wi-Fi 7, Bluetooth 5.4, and Thunderbolt 5.

Intel has also beefed up the Core i7 variant. The new Core i7-14700HX now has 20 cores, four more efficiency cores than its predecessor. This upgrade should enhance the performance of multithreaded applications and games.

In the ring with AMD, Intel’s Core i9-14900HX seems to have an edge in most tests compared to AMD’s Ryzen 9 7945HX, although it doesn’t outperform in every game. It’s important to note, however, that Intel hasn’t compared these new chips with its own 13th Gen models. Our previous look at the 14th Gen desktop chips suggested they were more of a refresh than a revolution, especially when stacked against AMD’s top desktop gaming CPUs.

On the desktop front, Intel is also launching its mainstream 14th Gen CPUs. There are 18 new processors in this lineup, including the flagship Core i9-14900. This one also has 24 cores and is designed to be less power-hungry, operating at 65 watts base power. Like its mobile counterparts, these desktop CPUs support up to DDR5-5600 and 192GB of memory and are compatible with existing Intel 600- and 700-series motherboards.

Follow Gizmochina’s coverage of CES 2024 here.

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Israel’s government has agreed to provide Intel with a grant of $3.2 The Israeli government has approved a grant of $3.2 billion, to Intel for the establishment of a chip plant in southern Israel with no connection to the ongoing tensions involving Hamas. This move by Intel is seen as a step towards strengthening the global supply chain and enhancing resilience in the face of challenges. In addition to this investment, Intel has also made plans for manufacturing expansions in Europe and the United States.

The grant, amounting to 12.8 percent of the total investment, is part of Israel’s effort to foster economic growth and innovation. Intel has additionally committed to procuring goods and services worth 60 billion shekels from Israeli suppliers over the next decade. The new facility is expected to create several thousand job opportunities.

Intel, which already operates four development and production sites in Israel, employing nearly 12,000 people, had its investment plans in Israel confirmed following Prime Minister Benjamin Netanyahu’s earlier announcement. Construction is underway for the expansion, with progress in the development of clean rooms and support buildings, including pile casting and initial floors.

The projected opening of the new plant is set for 2027, with operations expected to continue through 2035. Intel’s investment not only solidifies its presence in Israel but also marks a significant contribution to the nation’s economic landscape and employment sector. The tech giant’s forward-looking approach aligns with its global strategy and underscores its role in the evolving technology supply chain.

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As the chip packaging industry gets more advanced, so do the aspirations of Intel. The company aims to make a chip with a trillion transistors by 2030. The chips should double the number of transistors every year in accordance with Moore’s law, which Fairchild Semiconductor and Intel developed. But it got worse over time, and the rate of doubling transistors slowed down to three years.

Well, a big performance upgrade seems on the way for Intel chipsets, as Intel CEO Pat Glesinger confirms that Intel could surpass Moore Law’s pace by 2031. Instead, he talked about pushing the “Super Moore’s Law” concept or “Moore’s Law 2.0” for increased transistor counts. TSMC and Samsung Foundry are going to play an exceptional role in bringing Intel’s new chips built on a 2nm node. Even Qualcomm is switching to TSMC and Samsung Foundry.

Gelsinger said during his talk, “I think we’ve been declaring the death of Moore’s Law for about three to four decades.” And while that might be true, he did admit that “we’re no longer in the golden era of Moore’s Law, it’s much, much harder now, so we’re probably doubling effectively closer to every three years now, so we’ve definitely seen a slowing.”

Following the advancements, Intel could achieve the magic number of 1 trillion transistors on a chip by 2030. This is not the first time that some Intel officials have mentioned such a big development. Even Ann Kelleher, who is executive vice president and general manager at Interl’s Technology Development, revealed, “As Moore’s Law has been progressing, traditional scaling has been slowing down.”

There are a couple of different technologies that could help Intel achieve a trillion-dollar mark on a chip. The company aims to do advanced packaging and heterogeneous integration to pack more transistors into a chip. Additionally, the company plans to use the RibbonFET that Samsung uses for 3nm production. It covers all four sides, which reduces current leakage. There is another way via PowerVIA Power Delivery, which moves the power supply lines to the rear of the chip, improving performance.

However, the advancements would cost Intel a lot. Talking about the same, Gelsinger said, “Seven or eight years ago a modern fab would have cost about $10 billion,” he said. “Now, it costs about $20 billion, so you’ve seen a distinct change in the economics.”

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Intel has officially launched its latest Intel Core 14th Generation desktop processor family, with the flagship Intel Core i9-14900K leading the pack. This new lineup features six unlocked desktop processors, delivering up to 24 cores, 32 threads, and an impressive frequency of up to 6 GHz straight out of the box.

The i9-14900K has laid claim to the title of the world’s fastest desktop processor, providing gamers with a substantial edge through its 6 GHz speeds from the start. For creators, the Intel Core i7-14700K offers 20 cores and 28 threads, a 25% increase over its predecessor, ensuring significant performance gains in multi-threaded workloads.

Intel introduces the new AI Assist feature in its Extreme Tuning Utility (XTU), offering one-click AI-guided overclocking for select unlocked Intel Core 14th Gen desktop processors. This feature brings simplicity to the overclocking experience, catering to both experts and beginners.

The Intel Core 14th Gen processors leverage Intel’s advanced performance hybrid architecture, prioritizing compute performance for day-to-day workflows. The lineup promises an immersive gaming experience, delivering up to a 23% performance uplift compared to “leading competitor processors”. Enhanced gaming-focused features, including Intel Application Optimization (APO) and Thread Director application thread scheduling, aim to improve application threading. Moreover, these processors support DDR5 XMP speeds well beyond 8,000 megatransfers/second (MT/S).

Intel’s latest desktop processor family comes equipped with integrated support for Wi-Fi 6/6E and Bluetooth 5.3, as well as discrete support for new Wi-Fi 7 and Bluetooth 5.4 wireless technologies. The processors maintain compatibility with both Intel 600 and 700 series chipsets, allowing enthusiasts to easily upgrade existing systems and enjoy the latest-generation gaming and creator performance.

The Intel Core 14th Gen desktop processors are set to hit retail outlets and OEM partner systems starting October 17, 2023.

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Intel has introduced the latest Core Ultra mobile processors at the “AI Everywhere” event, signaling a transformative phase in personal computing. These processors, built on Intel’s 4 process technology, employ Foveros 3D advanced packaging, representing a significant architectural shift with dedicated AI acceleration across CPU, GPU, and the newly integrated neural processing unit (NPU).

Supporting over 100 independent software vendors (ISVs) and boasting more than 300 AI-accelerated features, Intel aims to position AI PCs as the dominant force in the PC market by 2028, reshaping the way users work, learn, and create.

Key features of the Core Ultra processors include the Performance-core (P-core) architecture, offering up to 11% better multi-threaded performance for ultrathin PCs. The Intel Arc GPU, featuring up to eight Xe-cores, promises double the graphics performance of its predecessor. The Intel AI Boost NPU enhances power efficiency by 2.5x for longer-running AI workloads.

In addition to these features, the processors support up to 16 cores, 22 threads, and the next-gen Intel Thread Director. With a maximum turbo frequency of 5.1 GHz, they provide a substantial performance boost. Memory capacity reaches up to 64 GB LP5/x and an impressive 96 GB DDR5. Supporting Wi-Fi 6E and discrete Intel Wi-Fi 7, the processors ensure seamless connectivity. Intel Bluetooth LE Audio enhances the audio experience, while Thunderbolt 4 connectivity offers speeds of 40 Gbps for lightning-fast data transfer. OpenVINO toolkits support further enhances AI performance, making these processors ideal for AI-driven applications.

The Intel Core Ultra mobile processors are now globally available, set to power over 230 AI PCs from leading partners like Acer, ASUS, Dell, HP, Lenovo, and more. This marks a significant advancement in personal computing, where efficiency, computation, and AI converge to redefine the user experience.

Acer has already announced its Predator Triton Neo 16 laptop powered by the new Intel Core Ultra CPUs. The machine is tailored towards both gamers and content creators.

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Technology continues to advance rapidly. While this often benefits consumers, even billion-dollar tech giants can sometimes struggle to keep up with this pace. It appears that Intel is currently facing a similar challenge. Nvidia, AMD, and Qualcomm are all working on ARM-based PC platforms, and Apple’s success with ARM-based technology has demonstrated its potential across the PC landscape. If Intel doesn’t adapt to this change, the company could face some serious challenges. Here are the details…

Intel’s PC chip ship is sinking with ARM-ada on the horizon

Intel is facing a number of serious challenges, including the rise of ARM-based PCs and Apple Silicon. Nvidia, AMD, and Qualcomm are all developing ARM-based PC platforms, which could pose a major threat to Intel’s dominance in the PC chip market. ARM-based chips are known for being more energy-efficient and less expensive than x86 chips, which are the type of chips that Intel uses.

Apple Silicon has also shown that ARM can be best-of-breed across the PC landscape. Apple’s M1 chip has outperformed Intel’s chips in a number of benchmarks, and it has helped to make Apple’s MacBooks some of the most popular laptops on the market. Intel also has a history of innovation failure. In the past, Intel has misread the market with the i860, the Itanium, and the Atom processors. These failures have cost Intel billions of dollars and have allowed its competitors to gain ground.

In the past, Intel has been able to use its dominance in the PC chip market to force its own standards on the industry. However, this approach is no longer sustainable. Intel needs to collaborate with other companies and be more flexible in order to meet the needs of its customers. It is too late for Intel to get back into the mobile market, and the dynamics that lost it the mobile market are spreading to commodity PCs and laptops. This is because the market is demanding more energy-efficient and less expensive devices.

Intel needs to improve its innovation process and focus on customer needs. If Intel can do these things, it may be able to survive in the new era of computing. However, if Intel fails to change, it could be left behind by its competitors.

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Intel recently introduced its 14th-gen Raptor Lake processors. These eagerly anticipated processors have once again managed to impress with their performance. For instance, the P-cores on the 14th-gen processors can reach up to 6 GHz, which is 200 MHz higher than the 12th-gen processors. However, in addition to all this performance and innovative features, the new processors have a significant drawback. According to Intel’s announcement, the 14th-gen desktop processors do not support Thunderbolt 5. Here are the details…

Intel 14th-Gen Desktop Processors Do Not Support Thunderbolt 5

If there are those among you who don’t know, Thunderbolt 5 is the newest version of the Thunderbolt interface developed by Intel. This technology is a universal bus interface that merges PCI Express and DisplayPort into one serial signal. It’s capable of transmitting both data and video through a single cable.

Thunderbolt 5 supports a bi-directional bandwidth of up to 80 Gbps, which is double the speed of Thunderbolt 4. With Thunderbolt 5, you can mirror displays, transmit data, and use it for many different tasks. In fact, we often see this technology being frequently used in laptops. However, the 14th-gen Intel desktop processors do not support Thunderbolt 5.

This was a surprise to many, as Intel had initially stated that the 14th-gen processors would support the new connectivity standard. However, the company has since clarified that this technology will only be supported on upcoming laptop processors based on the Meteor Lake architecture.

While it is disappointing that the 14th-gen desktop processors do not support Thunderbolt 5, it is important to note that the technology is still in its early stages of development. It is not expected to be widely available until 2024, and it is likely that only high-end laptops will support it at first.

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Intel is at it again. Not long after the launch of the Core i9-13900KS that stunned with its 6GHz speed, the tech giant has unveiled its 14th-gen desktop CPUs, led by the i9-14900K. The new chip is also capable of hitting the 6GHz mark, thanks to its “Thermal Velocity Boost.” But is this raw power just for show or does it serve a real purpose?

The chip also consumes 253 watts of power, which is a lot

It’s easy to get lured by the flashy 6GHz number, but the i9-14900K’s high speed only lasts for short bursts. These chips may have the upper hand in the Intel vs. AMD performance race, but they’re not for everyone. Intel claims that its 14900K chip is up to 23% faster than AMD’s Ryzen 9 7950X3D when playing games like Starfield in 1080p. It’s worth noting that the comparisons could be skewed, as Intel’s benchmarks involved tasks that work better with its own UHD graphics. This chip guzzles power like it’s going out of style—253 watts, to be exact. That’s not exactly what you’d call efficient.

And speaking of AMD, Intel’s got its rival in the crosshairs. The company claims its flagship chip is up to 23% faster than AMD’s Ryzen 9 7950X3D in gaming benchmarks. But let’s take that with a grain of salt. The tests favored Intel’s own graphics tech, so is it a fair fight? Jury’s still out.

But hey, if the i9-14900K is too rich for your blood at $589, there’s always the more budget-friendly i7-14700K. It’s got a cool 20 cores and tops out at 5.6GHz for a much more palatable $409. Now that’s a deal.

Here’s something intriguing, though. Intel’s throwing in some AI help for the overclocking crowd. Their new XTU AI Assist feature makes it simpler to push your CPU to the edge without frying it. Cool, right? But don’t look for an NPU (neural processing unit) for AI tasks in these new desktop chips; that’s reserved for Intel’s upcoming mobile line-up.

Is Intel’s 14th-gen desktop CPU line-up really the next big thing, or is it just a flashy way to outdo AMD? Bottom line: these chips are powerhouses, no doubt. But unless you’ve got specific, demanding needs (or just love to brag), the i7-14700K might be the more sensible pick. The new CPUs drop on October 17th, but maybe give it a good think before you grab your wallet.

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Intel has officially launched high-volume manufacturing on the Intel 4 process technology at its Fab 34 facility in Leixlip, Ireland. The event, graced by Intel CEO Pat Gelsinger, marks a significant leap forward in semiconductor technology. 

The Intel 4 process, employing extreme ultraviolet (EUV) lithography, represents Intel’s foray into a future brimming with cutting-edge products, from processors revolutionizing artificial intelligence in PCs to chips fueling the world’s largest data centers.

Central to this achievement is the integration of EUV lithography technology, a marvel of precision, enabling the definition of smaller and more intricate chip features. The EUV machines, provided by Dutch manufacturer ASML, represent a pinnacle of engineering, boasting mind-boggling accuracy. Each of these colossal machines, resembling a bus in size, costs around $150 million and plays a pivotal role in Intel’s quest for technological supremacy.

Ann Kelleher, Intel’s General Manager of Technology Development, emphasized the company’s progress, stating that two manufacturing processes have been successfully completed, with a third swiftly underway. The Leixlip facility stands as a testament to Intel’s unwavering commitment to innovation, boasting an intricate network of overhead robots navigating a 22km track, ensuring the seamless transport of silicon wafers from one advanced tool to another. 

The Irish plant is now gearing up to produce chips, including the highly anticipated Meteor Lake PC processors. Intel’s investment in this venture has been substantial, with a staggering $18.5 billion USD spent on doubling the manufacturing space in Leixlip. This expansion aligns with Intel’s ambitious plans to deliver five generations of technology within just four years, reaffirming the company’s commitment to regaining process leadership by 2025.

The commencement of high-volume production on the Intel 4 process in Leixlip heralds a new era of innovation, where the boundaries of what’s possible in computing technology are continually pushed.

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As the U.S. government tightens its grip on chip exports to China, Intel emerges as a savior for Chinese firms desperate to fuel their growing large language models (LLMs). According to a report from DigiTimes, Intel‘s Gaudi2 processors have gained significant traction in mainland China since their launch this past July.

The new Intel chips are designed for AI algorithms

Traditionally, Chinese tech firms have relied on Nvidia’s A100 and H100 processors to train their advanced algorithms. However, U.S. export restrictions have hampered the supply, opening a black market for smuggled chips. Intel’s Gaudi2 chips, designed to navigate these export curbs, are offering a legitimate alternative.

David Zinsner, Intel’s CFO, highlighted earlier this month that there’s a growing interest in Gaudi chips due to a shortfall in alternative processors. The chips aren’t just a stopgap; they’re shaping up to be a catalyst in China’s pursuit of AI dominance. In August, the Chinese government approved the launch of its first batch of local LLMs. Names like Baidu’s Ernie Bot and SenseTime’s SenseChat were part of this roll-out. Intel’s Gaudi2 chips offer these companies a viable way to train their AI algorithms, given that they cater to the specific technological constraints imposed by U.S. export laws.

Intel, which last year made 27% of its total revenue in China, seems to have strategically positioned its Gaudi2 processors. At its launch, Sandra Rivera, Intel’s executive vice-president, said that these chips aim to “lower the barrier to entry” and help build up China’s AI capabilities.

Given that China accounted for a third of global semiconductor sales last year, according to the Semiconductor Industry Association, Intel’s focus on mainland clients is both timely and strategic. Amid geopolitical tensions and technological limitations, Intel’s Gaudi2 chips are not just filling a gap; they’re also potentially shaping the future of AI in one of the world’s largest markets.

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If you follow technology and Gizmochina closely, you’ve heard of Thunderbolt many times by now. If you haven’t heard of it or don’t know what it is, Thunderbolt is a high-speed input/output technology developed by Intel. It combines the features of several other technologies, including USB, DisplayPort, and PCIe, into a single connector and cable.

This makes it possible to connect a wide variety of devices to a computer with a single port, such as the popular Type-C port. Now, Intel has announced Thunderbolt 5, the next generation of its high-speed connectivity standard. Here are the details…

Thunderbolt 5: The Next Generation of High-Speed Connectivity

Thunderbolt 5 will deliver 80 Gbps of bi-directional bandwidth, which is twice the speed of Thunderbolt 4. It will also support Bandwidth Boost, which can temporarily increase the bandwidth to 120 Gbps for video-intensive applications. In addition to its increased speed, Thunderbolt 5 also doubles the PCI Express data throughput for faster storage and external graphics.

It is also built on industry standards including USB4 V2, DisplayPort 2.1, and PCI Express Gen 4, making it fully compatible with previous versions of Thunderbolt and USB. Thunderbolt 5 is also designed to be more power efficient than previous versions. It can deliver up to 240 watts of power, which is enough to charge a laptop or power an external GPU.

The bandwidth needs of content creators, gamers, and professionals are increasing significantly. These users want high-resolution displays and low-latency visuals while working with increasingly larger video and data files. Thunderbolt 5 has been designed to meet these needs, providing the performance and bandwidth required for the most demanding applications.

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Industry expert Ming-Chi Kuo claims that Intel Foundry Services (IFS) is ceasing to produce Qualcomm SoCs using the 20A fabrication process. Qualcomm will most likely go with TSMC and Samsung Foundry instead.

Kuo did not provide much information as to why Qualcomm is making such a decision. But according to recent reports, the reason may be due to high production costs. This decision may have a negative effect on RibbonFet (transistor architecture) and PowerVia (backside power delivery method), as this will put Intel’s upcoming 18A mass production at a high level of risk.

It is also highly anticipated that Qualcomm will go to TSMC Foundry for its upcoming Snapdragon 8 Gen 3 production, which is set to launch in October. For the Snapdragon 8 Gen 4, though, Qualcomm might have to dual source from both TSMC and Samsung. Recently, it was said that Samsung’s custom version of the Snapdragon 8 Gen 4 will be manufactured using its own 3GAP node. While the standard Snapdragon 8 Gen 4 chip will be manufactured using TSMC’s node.

Aside from this, rumors suggest that the upcoming Snapdragon 8 Gen 3 SoC will feature a more modernized architecture. It is expected to have a more powerful prime core with a higher frequency. It will likely be manufactured using the TSMC N4P process. Snapdragon 8 Gen 3 may include one Cortex-X4 core, Five A720 cores for enhanced performance, two A520 power-efficient cores, and an Adreno 750 GPU.

We can expect more leaks and official news on Snapdragon 8 Gen 3 SoC as the launch date grows near.

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Exciting news has emerged from Intel, as reports indicate that the tech giant is gearing up to release the highly anticipated Granite Rapids-D peripheral chip in 2024. According to foreign technology media Computer Base, the chip will utilize the cutting-edge Intel Process 3, promising a significant leap in performance and capabilities.

The Granite Rapids-D Chip may be delayed until 2025

Leaked PPT slides of the Granite Rapids-D peripheral chip have provided a sneak peek into what we can expect. These slides reveal that the new chip will serve as the successor to the Xeon D-1700 and D-2700 (Ice Lake-D) models. Leveraging the power of the Intel 3 process, the Granite Rapids-D chip boasts a higher core density compared to its predecessors, promising enhanced processing capabilities and improved efficiency.

While specifics regarding the release date of the new Xeon-D chip (Granite Rapids-D) remain uncertain, reports suggest that Intel plans to launch the Granite Rapids-AP and Granite Rapids-SP server processors by the end of 2024. This leads to speculation that the release of the Granite Rapids-D chip may potentially be delayed until 2025. However, Intel’s commitment to delivering cutting-edge technology ensures that enthusiasts and professionals alike can expect an exceptional product whenever it becomes available.

The Granite Rapids-D chip holds immense promise for a range of applications, from high-performance computing to enterprise-level data centers. With its advanced architecture and increased core density, this chip is poised to revolutionize the computing landscape, delivering faster processing speeds, improved multitasking capabilities, and heightened energy efficiency.

Intel’s continuous innovation and dedication to pushing the boundaries of technology have solidified its position as a leader in the industry. The upcoming Granite Rapids-D chip serves as a testament to Intel’s commitment to delivering groundbreaking solutions that meet the ever-evolving demands of the market.

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The COVID-19 pandemic has had a major impact on the technology industry. Many companies have realized the risks of relying on a single region for production, and are now looking to diversify their supply chains. For example, Apple has started manufacturing some of its iPhones in India. In a similar move, Germany and Intel have agreed on a deal that will see the US chipmaker receive €10 billion in subsidies to build a semiconductor manufacturing facility in Germany. Here are the details…

Germany, Intel Agree Chip Plant Subsidies Worth €10 Billion

As we mentioned before, technology companies are investing in production in different countries. This is good news for the regions where these companies invest, as it means economic development and job creation. Governments are signing agreements with tech giants to provide them with incentives and infrastructure facilities. The latest of these agreements was signed between Germany and Intel.

The agreement, which was signed by Chancellor Olaf Scholz and Intel CEO Pat Gelsinger on Monday, will see Intel build a new chip plant in the city of Magdeburg. The plant is expected to create thousands of jobs and cost around €30 billion to build. A significant part of this will be paid by Germany.

The subsidies will come in the form of both financial aid and price caps on energy. The financial aid will be used to help Intel cover the cost of building the plant, while the price caps on energy will help to keep costs down for Intel once the plant is operational. The agreement is a major boost for Intel, which has been looking to expand its manufacturing capacity in Europe.

The agreement is also a major win for Germany, which is looking to become a leading producer of semiconductors. The country has a strong manufacturing base, and the new chip plant will help to create jobs and boost economic growth. The new chip plant in Magdeburg is expected to be operational by 2027.

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For the longest time, Intel Core CPUs came with an iconic “i” in their names— Intel Core i3, Core i5, and Core i7. But moving forward, the company may get rid of the “i” from the names of its processors, branding them to a simpler “Core 3/5/7/9” concept. This rebranding will apparently make Intel’s products better align with customer requests. Additionally, the company is introducing an Ultra tier for higher-end chips.

Say goodbye to the “i” and hello to “Ultra”

Benchmarks of the upcoming “Meteor Lake generation” of CPUs have leaked, revealing the name “Core Ultra 5 1003H,” as reported by VideoCardz. The absence of the “i” in the processor’s name suggests that Intel is indeed abandoning the iconic letter. The reasoning behind this decision is intriguing—Intel believes that the name “Intel” is becoming overshadowed, and customers primarily identify the company through terms like “Core i5” or “Core i7.”

“When we looked at how the tech press, how our retailers, our OEMs, our partners talk about it, it was interesting to see how we got shortchanged all the way to a letter and a number,” Christopher Hirsch, Intel’s director of product branding, told The Verge.

Furthermore, the US tech giant will introduce a new tier called “Ultra” in its branding, positioned before the number. This means the future high-end processors may be referred to as “Intel Core Ultra X.” Intel has clarified that generational information will still be included at the end, such as “Intel Core X processor 1300AB.” The company has stated that both the standard Core and Core Ultra processors will be compatible with its Intel Arc graphics (Via Engadet).

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Intel has just launched a couple of new workstation grade graphics cards for its Arc series. The company has unveiled the new Arc Pro A60 and Pro A60M that are made to handle hefty workloads and features up to 12GB of VRAM and other capable specs. So here are all the details.

Intel Arc Pro A60 & Pro A60M GPUs launched with up to 12GB VRAM

The American tech giant has announced the two new GPU models that are built specifically to meet professional workstation requirements. These new GPUs offer 12GB of VRAM and can handle up to four monitors with HDR and Dolby Vision. The company’s new GPUs offer various improvements over their predecessor and promise to offer enhancements to handle various tasks that will be ideal for professional environments. The new Intel Arc Pro A60 and A60M offer 16 PCIe lanes and 384 gigabytes per second memory bandwidth for improved data transfer speeds.

Furthermore, the advanced AI Xe matrix helps the GPUs complete AI related tasks while 16 ray tracing units enable realistic graphics and better visual effects. Lastly, there is even full media encode and decode support including the AV1 standard for media processing. The new Intel GPUs are optimizing for workstation applications, which means taht it works well with Blender and other rendering tools. These can even run rendering and ray tracing libraries from the Intel oneAPI Rendering Toolkit.

The new Arc Pro A60 GPU for desktop PCs will be available via authorized retailers soon. On the other hand, the Arc Pro A60M is a mobile graphics card. Meaning, we can expect it to arrive in the upcoming months through OEM partners. Intel Arc Pro GPUs will also come with 3 year limited warranty. Notably, the news also arrives as the brand is rumored to be working on Intel Meteor Lake-S chips that may debut soon.

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Intel has announced in its first quarter 2023 financial report meeting that it is accelerating the mass production of its 14th generation Meteor Lake Core processor. The processor is scheduled to be launched in the second half of this year and will be produced using the Intel 4 process node. Its transistor density and performance per watt are comparable to TSMC‘s N5 and N4 series nodes.

The Meteor Lake CPU Tile will have a Hybrid Core Design

The Meteor Lake processor is expected to feature a new small chip architecture, mainly composed of three tiles: IO Tile, SOC Tile, and Compute Tile. The Compute Tile includes CPU Tile and GFX Tile. The CPU Tile will use a new hybrid core design to provide higher performance with lower power consumption, and the GPU is also built with a new architecture.

This new architecture will allow the processor to achieve high performance while consuming less power. It is a significant improvement from previous generations, which often struggled with high power consumption and heating issues. The new design will make the Meteor Lake processor more efficient, reliable, and versatile, making it an excellent choice for demanding tasks such as gaming, content creation, and machine learning.

Furthermore, Intel has also announced that it is advancing the Intel 3, Intel 20A, and Intel 18A process nodes, which are expected to offer even more significant improvements in performance and efficiency.

It’s worth noting that the top-of-the-line Meteor Lake processor is expected to adopt a 6P+16E configuration, with only two series of Core i3 and Core i5, and no Core i7 and Core i9. This is a strategic move from Intel to optimize the processor’s performance for specific tasks while keeping the price competitive.

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The competition in the CPU market continues at full speed. Intel, which has been struggling due to complacency from being at the top for a while and falling behind its rival AMD, is working to widen the gap with the red team. According to the latest information, Intel’s 14th Generation Meteor Lake processors may soon enter the desktop market, as an LGA1851 Meteor Lake-S interposer was recently discovered. Here are the details…

Intel Meteor Lake-S CPU Tool Surfaces for Desktop PC

Intel’s 14th Generation Meteor Lake processors might make their way into the desktop market. While Intel‘s commitment to a socket isn’t as steadfast as AMD’s, the appearance of these leaks may imply that the company is preparing Meteor Lake-S desktop chips. However, without access to technical specifications or documentation, the exact purpose and features of the Meteor Lake-S processors remain speculative.

The leaked information indicates a potential increase in contacts compared to the current LGA1700 socket. This could lead to improved performance and compatibility with future hardware. Another leak suggests that the 14th Generation moniker is designated for the upcoming Meteor Lake processors, but it remains unclear whether these processors are intended for mobile, desktop, or both.

An unverified Intel roadmap casts doubt on the possibility of Meteor Lake coming to desktops in the near future, as it suggests that Intel is preparing a Raptor Lake Refresh (RPL-R) for a Q3 release. This could indicate that the rumored RPL-R will be the last to utilize Intel’s LGA1700 socket. With recent developments in Meteor Lake, including Linux patches and the confirmation of an L4 cache, it’s plausible that if a desktop variant is planned, it may not arrive until 2024.

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The competition in the processor market has never been higher. With the increase in performance of mobile processors and the success Apple has achieved with its M-series Mac models, traditional manufacturers like Intel and AMD are compelled to adapt. Intel, recognizing this situation, is taking early steps to adjust. By optimizing its fabs for ARM chip production, the company is opening new opportunities in the global supply chain. Here are the details…

Intel Optimizes Fabs for ARM Chip Production, Opening New Possibilities for Global Supply Chain

Intel and ARM announced an agreement that will optimize Intel’s 18A fabrication process for use with ARM designs and intellectual property. While the deal doesn’t involve “Intel Foundry Services” division producing chipsets for ARM, it will significantly simplify the process for ARM licensees, such as Qualcomm and MediaTek, to commission Intel for future chip production.

Initially, the partnership will concentrate on optimizing Intel’s 18A process for mobile system-on-a-chip (SoC) designs. However, both companies anticipate that the collaboration could expand to encompass silicon designed for the automotive industry, Internet of Things (IoT) devices, and data centers. Additionally, Intel will extend its support to ARM licensees beyond wafer production, offering services related to packaging, software, and chiplets.

This comprehensive support highlights Intel’s vision to become a one-stop solution for ARM-based chip manufacturing. Intel has also emphasized the geopolitical implications of the agreement. By optimizing its fabs for ARM chip production, the company aims to create a more balanced global supply chain for foundry customers working on mobile SoC designs with ARM-based CPU cores. As of July last year, Taiwan Semiconductor Manufacturing Company (TSMC) was responsible for manufacturing nearly 70% of all critical chipsets used in modern smartphones, as reported by Counterpoint Research.

The recent military exercises by China, involving the encirclement of Taiwan, have raised concerns over potential conflicts on the island and the stability of the semiconductor supply chain. By collaborating with ARM, Intel is positioning itself as a viable alternative to TSMC, offering a more geographically diverse and secure chip production option for ARM licensees. This partnership is expected to have far-reaching effects on the global chipmaking landscape, potentially alleviating supply chain bottlenecks and fostering a more competitive market.

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Intel has reportedly chosen to partner with TSMC to produce its next-generation Battlemage and Celestial GPUs, set to release in the second half of 2024 and 2026, respectively. According to Taiwanese media outlet ctee.com.tw, the Battlemage GPU will use the Xe2 architecture and be manufactured using TSMC’s 4nm process node, while the Celestial GPU will use the Xe3 architecture and be manufactured using TSMC’s N3X (3nm) process node.

This report is not surprising given that Intel used TSMC for its first-gen GPUs, Alchemist (Xe), which launched in mid-2022. The leaked product plan shows that the Battlemage Xe2 and Celestial Xe3 GPUs will come in both HPG and LPG flavors, with the HPG versions targeting the 75-250W segment.

Despite facing challenges in operations and pressure to reduce inventory in the production chain, Intel remains committed to its GPU R&D plans. The company has invested heavily in constructing 4nm and more advanced process wafer fabs but will continue to maintain its business model of cooperation with wafer foundries, with TSMC being its sole partner.

Intel’s focus on gaming and AI segments is driving demand for discrete GPUs, and the company is poised to continue improving its GPU offerings with the upcoming launches of the Battlemage and Celestial GPUs. The next-gen discrete Arc graphics card lineup is also expected to receive a refresh under the Alchemist+ family, as rumored for some time now.

Overall, this partnership between Intel and TSMC marks an exciting development in the world of GPUs, and we can expect to see continued advancements and innovations in the future.

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Intel plans to release its first energy-efficient data center chip, Sierra Forest, in early 2024. The company has faced a challenging period marked by product delays but still holds over 70% market share in the PC and server processing chips sector, down from 90% in 2017. Here are the details…

Intel Gears Up to Launch Power-Efficient Sierra Forest Chip in 2024

Sandra Rivera, head of Intel’s Data Center and AI Group, admitted the company’s recent struggles but affirmed that Intel is now on track, hitting key engineering milestones. The fourth-generation Xeon processor, Sapphire Rapids, faced delays, allowing AMD to narrow the gap. Rivera confirmed that the fifth-generation Xeon processor, Emerald Rapids, will be delivered by 2023’s end. The next-generation Granite Rapids processor is set for a 2024 release, followed by Sierra Forest. Clearwater Forest, another energy-efficient chip, is planned for a 2025 launch.

Intel is also developing the Intel Developer Cloud, featuring 256 Xeon chips and 512 Gaudi chips for AI applications. AI startups Hugging Face and Stable Diffusion are already using Intel chips. With a robust lineup of upcoming products, Intel aims to strengthen its data center market presence and focus on power efficiency and innovation. The company’s commitment to improving its product portfolio and meeting crucial engineering milestones highlights a renewed emphasis on addressing data center customers’ needs and maintaining a competitive edge in the rapidly evolving tech landscape.

Intel’s upcoming releases, including the power-efficient Sierra Forest and Clearwater Forest chips, demonstrate the company’s dedication to creating innovative, eco-friendly solutions for data centers. By offering energy-efficient options, Intel can cater to the growing demand for sustainable technology and attract environmentally conscious clients.

The Intel Developer Cloud, which offers AI developers access to powerful Xeon and Gaudi chips, exemplifies Intel’s commitment to advancing artificial intelligence. By collaborating with AI startups like Hugging Face and Stable Diffusion, Intel is supporting the growth of the AI industry and ensuring its products remain relevant in this dynamic sector.

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Intel has launched its highly anticipated NUC 13 Pro, which promises to offer significant performance and efficiency improvements compared to its predecessors. This mini-PC has been codenamed the Arena Canyon and is based on the Raptor Lake-P architecture.

The NUC 13 Pro series utilizes Raptor Lake-P processors with up to 28W TDPs and 64W PL2, which makes it ideal for a wide range of computing applications. With dimensions of just 117 x 112 mm, the mini-PC is remarkably compact, and its thickness varies between 37 and 54 mm, depending on the model chosen.

One of the key features of the NUC 13 Pro is its commitment to sustainability. Intel has announced that the mini-PC utilizes 75% post-consumer recycled (PCR) plastic, making it a highly environmentally friendly option.

The mini-PC offers ample space for storage, with the thicker model accommodating a 2.5-inch HDD or SSD, and both sizes supporting M.2 2280 PCIe 4.0 SSDs, as well as up to 64 GB of DDR4-3200 RAM.

Intel has also announced that it will offer the NUC 13 Pro with the Core i3-1315U, Core i5-1340P, Core i5-1350P, Core i7-1360P or Core i7-1370P processors, along with various vPro options. The Core i7-1370P has a 40W TDP (PL1), but the NUC 13 Pro’s cooling system should be sufficient to handle its 64W PL2 without throttling. The mini-PC can also reduce the TDP to 20W to reduce fan noise.

The NUC 13 Pro features a range of ports, including a 2.5 GbE Ethernet port (Intel i226-LM), a 3.5 mm audio jack, two HDMI 2.1 ports, two Thunderbolt 4 ports, one USB 2.0 Type-A port, and three USB 3.2 Gen 2 Type-A ports.

The mini-PC is currently available for order from SimplyNUC, with prices starting at €619, excluding VAT. This starting price includes a Core i5-1340P processor, 4 GB RAM, and a 256 GB SSD. Higher-end options with the Core i7-1360P, 4 GB RAM, and 4 GB RAM are also available for €799, although full pricing and availability details have not yet been announced.

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The United States-based technology giant Intel has been a prominent player in various fields, with 5G and LTE technologies being among them. However, recent news indicates that Intel will cease its efforts in these areas. Here are the details…

Intel to Halt 5G and LTE Research: Prioritizing IDM 2.0 Strategy

Numerous sources reported a few days ago that Intel would soon stop working on 5G modems, and by 2025, it would halt research on LTE modems. Recent announcements from the company confirm these intentions.In a statement to More than Moore, the tech giant confirmed the rumors while explaining the reason behind the decision: “We made the difficult decision to exit both our LTE and 5G WWAN (Wireless Wide Area Network) businesses as we continue to prioritize investments in our IDM 2.0 strategy.”

The IDM 2.0 technology was announced in 2021. With this strategy aimed at expanding production, the company sought to design and manufacture the best products. Intel expressed its intention to be a leader in process, product, supply, and cost through this approach.Three years ago, Intel sold its 5G modem business to Apple for $1 billion. Subsequently, it formed a partnership with MediaTek to start producing 5G modems for computers. The first products hit the shelves in 2021.

However, the recent news suggests that the life of these products may not be very long. On the 4G side, Intel collaborated with Fibocom for 4G LTE modems. The latest statements suggest that the company may be planning to transfer its 4G and 5G businesses to these two firms. Intel is expected to exit the 5G market by July and the entire WWAN market by 2025.

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Recently, rumors have surfaced about Intel and Microsoft seemingly gearing up for the launch of Windows 12, which has not yet been officially announced. @leaf_hobby, a known hardware leaker who previously revealed the specs of Intel’s Xeon chips, has disclosed information about Intel’s Meteor Lake desktop platform, which is expected to support Windows 12. However, Intel and Microsoft have declined to comment on these rumors.

While Microsoft has not announced any plans for Windows 12, there are indications that the company is looking to incorporate AI-powered features in future versions of Windows. Yusuf Mehdi, Microsoft’s head of consumer marketing, recently commented on the potential for AI in the Windows experience. Mehdi discussed the latest Windows 11 update, which includes AI-powered features such as Bing integration and recommended content for business users. Microsoft is also reportedly working on AI-powered smart snapping features for Windows 11.

If Microsoft intends to make more extensive use of AI in the next version of Windows, it would need to work closely with hardware partners such as Intel and AMD to optimize chips that can handle AI workloads. AMD has recently launched its Ryzen 7000 mobile processors, which are the first x86 chips to contain a dedicated AI engine that can support Microsoft’s Windows Studio Effects. Similarly, Intel’s Meteor Lake is expected to include AI capabilities similar to those introduced by AMD in its Ryzen 7000 mobile CPUs.

Both AMD and Intel are racing to catch up to Apple and its latest M2 chips, which have a dedicated AI chip that can handle 15.8 trillion operations per second. Microsoft has reportedly shifted back to a three-year release cycle for Windows, meaning that the next major version of Windows could be due in 2024.

Microsoft has also begun to focus on updating Windows 11 more frequently than the original annual updates it promised at the launch of the operating system in 2021. The latest update includes AI-powered Bing integration, improvements to widgets, touch mode, screen recording, and more.

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Intel had recently launched its 13th generation Core processors and today, the company has announced a new top-end model in the lineup, dubbed Intel Core i9-13900KS.

It is touted to be the fastest desktop processor to date, with a clock speed of 6.0GHz without overclocking. It is now available for purchase for the price of $699.

The Intel Core i9-13900KS is based on the 13900K chip, which peaked at 5.8GHz turbo frequency. The newly released 13900KS reaches 6GHz without overclocking using Intel’s Thermal Velocity Boost technology. It does it by using more electricity, using 250 watts at the max turbo power instead of the regular 150 watts, and peaks at 320W in a new Extreme Power Delivery Profile.

Apart from the power consumption and turbo frequencies, the Intel Core i9-13900KS is almost similar to the 13900K. The base frequency for the performance core has been increased to 3.2GHz from 3GHz. It comes with 24 cores, which include eight performance cores and 16 efficiency cores.

There are 32 threads, 36MB of Intel Smart Cache, and 20 PCIe lanes, including 16 PCIe 5 and four PCIe 4 lanes. As for compatibility, the Z790 and Z690 motherboards will support this new 13900KS chip with a BIOS update.

The launch of this Intel Core i9-13900KS flagship desktop chipset comes just weeks before AMD is all set to launch the Ryzen 7000 X3D CPUs. AMD has claimed that its flagship Ryzen 9 7950X3D chip will be the ultimate processor for gamers and creators, promising up to 25 percent better performance.

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The latest 13th Generation Intel Desktop chipset has shown excellent performance and was able to compete with its competitor. The chipset does deliver good performance. Raptor Lake, the newest mobile chipset from Intel’s 13th generation, will soon be unveiled, according to the manufacturer. The highlight of the event is Intel’s Core i9-13980HX, which has 24 cores and a 5.6GHz turbo frequency. The 24-core combination has never been supported by a laptop CPU before, and Intel calls it the “fastest mobile processor in the world.”

In comparison to the same 12th Gen CPUs, Intel claims the end result is up to 11 per cent faster single-thread performance and up to 49 per cent quicker multitasking performance. It is also claimed that gaming performance will be up to 12 per cent faster compared to its predecessor. Additionally, up to 128GB of RAM is available along with support for DDR4 (up to 3,200MHz) and DDR5 (up to 5,600MHz). The most recent 13th Gen mobile HX CPUs from Intel also enable Bluetooth 5.2, Thunderbolt 4, and Wi-Fi 6E. 

The flagship Core i9-13980HX from Intel features eight performance cores and 16 efficiency cores on the same chip that it uses for its 13th Generation of desktop processors. It has twice as many efficiency cores as the preceding Core i9-12950HX but the same amount of performance cores. All of this is included in a 55-watt chip that is made to function with the most recent discrete mobile GPUs for high-performance tasks and gaming.

The 13th Gen variants of Intel’s 28W P-series for thin and light laptops and the 15W U-series for ultralight laptops, foldable, and beyond are being released for laptops with less demanding performance requirements. With a maximum turbo speed of 5.2GHz and support for both DDR4 and DDR5, the P-series can accommodate up to 14 cores (six performance/eight efficiency). The flagship U-series processor (i7-1365U) has a maximum turbo frequency of 5.2GHz and a total of 10 cores (two performance and eight efficiencies).

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