Qualcomm is working on three new mid-range mobile phone processors according to Android Headlines. These processors, identified by model numbers SM4635, SM6650, and SM7635, are expected to fall under the Snapdragon 4, 6, and 7 series respectively based on Qualcomm’s naming conventions.

The Xiaomi Redmi Note 14 Pro will be the first smartphone to sport the SM7635 chipset

The code name for the SM4635 is “pitti,” while both SM6650 and SM7635 share the code name “volcano.” Earlier information from Roland Quandt in February suggests SM4635 is the Snapdragon 4 Gen 3. Back then, he mentioned the “Kalpeni” project testing a memory configuration of 6GB LPDDR4X RAM and 256GB UFS 3.1 storage for this chip. For reference, the previous generations of Snapdragon 4 series processors, the 4 Gen 1 and 4 Gen 2, used model numbers SM4375 and SM4450 respectively.

For the “volcano” processors, SM6650 and SM7635, rumors suggest Qualcomm might be following a similar strategy as with the Snapdragon 6 Gen 1 (SM6450) and 7s Gen 2 (SM7435). These two processors, codenamed “parrot,” shared similar specifications. Here, Android Headlines predicts that the SM7635 might not outperform the Snapdragon 7+ Gen 3 but will still offer significant improvements, strengthening Qualcomm’s position in the mid-range SoC market. The Xiaomi Redmi Note 14 Pro is rumored to be one of the first devices equipped with this processor. While specific details about these processors remain unknown, we can expect more information to surface in the near future.

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(Source)

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OnePlus and Realme, two prominent Chinese smartphone brands, are set to exclusively incorporate Qualcomm Snapdragon chipsets into their upcoming devices, as per revelations by the known Chinese tipster, Digital Chat Station, on Weibo.

According to the tip, the forthcoming OnePlus 12 will feature the Snapdragon 8 Gen 3 chipset, while the OnePlus 12R and the Nord 4 or Nord 5 are expected to incorporate the Snapdragon 8 Gen 2 and Snapdragon 7 Gen 3 chipsets, respectively.

Snapdragon Chipsets: Powering the Next Generation of OnePlus Devices

Historically, OnePlus has demonstrated a trend towards using Snapdragon over MediaTek chipsets. For instance, its flagship smartphones, OnePlus 11 and Ace 2, both utilize Snapdragon processors. However, a few recent releases, such as the Nord 3 and Ace 2V, as well as OnePlus’s debut tablet – the OnePlus Pad, featured MediaTek chipsets.

The OnePlus 12, set to possibly be the debut phone with the Snapdragon 8 Gen 3 chip, is rumored to launch as early as November this year. Anticipated features include a 2K resolution OLED display with a 120Hz refresh rate, a maximum of 1TB UFS 4.0 storage, and robust camera specifications. Furthermore, the device is expected to support rapid charging capacities, both wired and wireless.

Recently, OnePlus’s Ace 2 Pro (Check out our full review here) smartphone showcased the brand’s dedication to high-performance devices, registering a staggering 150,000 units in pre-sales within 26 hours of its announcement. The company’s strategy aims at consolidating its leadership in the premium smartphone market, capitalizing on powerful chipsets like the Snapdragon 8 Gen 2 processor.

However, concerns have been raised regarding the potential cost increase of the Snapdragon 8 Gen 3 chipset, primarily due to its shift to the TSMC’s 4nm N4P process. This move might push some manufacturers towards MediaTek’s Dimensity range, but major players may still opt for Snapdragon for their flagship phones, prioritizing performance over cost concerns.

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(Source, Via)

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Exciting news has emerged from Intel, as reports indicate that the tech giant is gearing up to release the highly anticipated Granite Rapids-D peripheral chip in 2024. According to foreign technology media Computer Base, the chip will utilize the cutting-edge Intel Process 3, promising a significant leap in performance and capabilities.

The Granite Rapids-D Chip may be delayed until 2025

Leaked PPT slides of the Granite Rapids-D peripheral chip have provided a sneak peek into what we can expect. These slides reveal that the new chip will serve as the successor to the Xeon D-1700 and D-2700 (Ice Lake-D) models. Leveraging the power of the Intel 3 process, the Granite Rapids-D chip boasts a higher core density compared to its predecessors, promising enhanced processing capabilities and improved efficiency.

While specifics regarding the release date of the new Xeon-D chip (Granite Rapids-D) remain uncertain, reports suggest that Intel plans to launch the Granite Rapids-AP and Granite Rapids-SP server processors by the end of 2024. This leads to speculation that the release of the Granite Rapids-D chip may potentially be delayed until 2025. However, Intel’s commitment to delivering cutting-edge technology ensures that enthusiasts and professionals alike can expect an exceptional product whenever it becomes available.

The Granite Rapids-D chip holds immense promise for a range of applications, from high-performance computing to enterprise-level data centers. With its advanced architecture and increased core density, this chip is poised to revolutionize the computing landscape, delivering faster processing speeds, improved multitasking capabilities, and heightened energy efficiency.

Intel’s continuous innovation and dedication to pushing the boundaries of technology have solidified its position as a leader in the industry. The upcoming Granite Rapids-D chip serves as a testament to Intel’s commitment to delivering groundbreaking solutions that meet the ever-evolving demands of the market.

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(Via)

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Arm, a prominent technology company, has recently unveiled its highly anticipated computing solutions for 2023. The latest lineup includes a range of cutting-edge CPUs, such as the Cortex-X4, A720, and A520, as well as the fifth-generation GPUs, including the Immortalis G720, Mali G720, and Mali G620. These GPUs have undergone significant enhancements and optimizations, with the Immortalis G720 standing out as Arm’s most impressive GPU release to date, boasting exceptional performance improvements and breakthrough efficiency.

The new Immortalis G720 can deliver graphics rivalling those of a PC

The star feature of the Immortalis G720 lies in its revolutionary Deferred Vertex Shader (DVS) technology. This groundbreaking methodology tackles the issue of memory access and bandwidth consumption, resulting in notable power savings and significantly increased frame rates. Arm’s experts estimate that approximately one-third of the power consumed during high-performance gaming is attributed to memory access. However, with the implementation of DVS, bandwidth usage can be reduced by an astounding 40%. These advancements translate into remarkable benefits compared to its predecessor, the Immortalis G715. The Immortalis G720 delivers an impressive 15% improvement in performance per watt, a similar percentage increase in peak performance, and an average 15% boost in frame rate. In practical terms, Arm’s measurements indicate an extraordinary 20% improvement in real-world performance, largely attributed to the bandwidth savings achieved through the utilization of DVS.

Thanks to the Immortalis G720, mobile platforms can now deliver a truly immersive and high-fidelity gaming experience, rivaling that of PC-level special effects. Real-time dynamic lighting, floodlighting, depth of field, and screen space ambient occlusion are now within reach, transforming mobile gaming into an incredibly lifelike and captivating experience. Notably, Arm has also announced that Unreal Engine 5‘s desktop renderer will make its way to Android later this year, further revolutionizing the capabilities of mobile gaming devices.

In addition to the DVS technology, the Immortalis G720 boasts several other remarkable features. These include support for hardware-level ray tracing, variable rate shading, and 2x MSAA modules, ensuring seamless adaptability to diverse gaming scenarios and delivering enhanced realism, smoother gameplay, and extended battery life. The Immortalis G720 can be configured with up to 16 cores, while the Mali G720 offers a range of 6 to 9 cores (with or without ray tracing). For those seeking a more affordable option, the Mali G620 provides up to 5 cores.

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Taiwan’s leading chip design company, MediaTek, is shifting its focus to the automotive and computing industries as the smartphone market faces a supply glut and demand for consumer electronics drops due to inflation and macroeconomic uncertainty. The CEO of MediaTek, Rick Tsai, made this announcement during an earnings call, highlighting the need to allocate resources in these areas to ensure growth in the next few years.

The demand for High-Performance Chips in AI is increasing

As more automakers are integrating advanced driver-assistance systems (ADAS) and artificial intelligence (AI) technology into their vehicles, there is a growing demand for high-performance chips that can handle these complex systems. MediaTek is well-positioned to capitalize on this trend with its expertise in chip design and experience working with leading automakers.

In addition to the automotive industry, MediaTek is also targeting the AI computing market. Tsai mentioned that the company is confident in its ability to provide generative AI capabilities, such as those used by ChatGPT, to its customers. As AI becomes increasingly prevalent in various industries, including healthcare, finance, and logistics, there will be a growing need for powerful chips that can handle these tasks.

While the shift in focus is understandable given the current market conditions, it does raise questions about the future of the smartphone industry and MediaTek’s role in it. With smartphone sales slowing down and supply chains disrupted by the pandemic, it’s unclear how long it will take for the industry to recover. However, Tsai remains optimistic, stating that MediaTek is not reducing or increasing its workforce, but rather reallocating resources to where they are needed the most.

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The highly anticipated Dimensity 9200+ processor has been making headlines recently, as it achieved a groundbreaking performance on Geekbench V6. According to a Digital Chat Station, the Dimensity 9200+ reached a single-core score of 2121 points and a multi-core score of 5655 points, surpassing all previous Android CPU performance records.

Dimensity 9200+ specifications (rumored)

This impressive result, combined with the outstanding performance of the Dimensity 9200+ on AnTuTu, has established the Dimensity 9200+ as a powerful chipset. The Dimensity 9200+ features an octa-core architecture, with a 3.35GHz Cortex-X3 super large core, three 3.0GHz A175 large cores, and four A510 small cores. It also features the immortalis-G715MC11 core for its GPU. The large core’s power of 3.0GHz is one of the reasons for the processor’s strong performance.

According to MediaTek’s official announcement, the Dimensity 9200+ will be launched on May 10th. Judging from the “strength depends on flagship+” poster, the Dimensity 9200+ has not disappointed in terms of performance. Moreover, considering MediaTek’s trend of launching “Plus” versions of its flagship processors every six months, the flagship smartphone market is about to heat up again. According to benchmark listings, the iQOO Neo 8 Pro is expected to be the first smartphone to feature the Dimensity 9200+ processor.

Other major players in the industry, such as Qualcomm, are also working on new processors. Qualcomm’s upcoming Snapdragon Gen 3 is expected to feature a new architecture and a powerful 3.7GHz prime core, which would potentially outperform the Dimensity 9200+ in terms of performance.

It will be interesting to see how these two processors compare and which one will come out on top. Nonetheless, with its impressive benchmark scores and promised performance capabilities, the Dimensity 9200+ is poised to be a major player in the high-end smartphone market.

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(Source)

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Qualcomm is gearing up to launch its latest Snapdragon chipset, the Snapdragon 8 Gen 3, and it’s generating a lot of excitement in the tech industry. After the successful production of the Snapdragon 8 chips by TSMC last year, the performance and power consumption have been greatly improved, and the popular Snapdragon 8 Gen 2 has helped the series overcome its reputation in the flagship market.

Higher clock speeds and advanced GPU: What to expect from Snapdragon 8 Gen 3

The next-generation Snapdragon 8 Gen 3 is now in the final stages of development, and some core OEM partners have reportedly received early engineering samples for designing end-user phones. One of the most significant changes in the Snapdragon 8 Gen 3 is its new CPU architecture.

For the first time, Qualcomm’s Snapdragon 8 Gen 3 will feature a 1+5+2 architecture, as reported by Digital Chat Station. The new design consists of one large core, five large cores, and two small cores, with the model number SM8650. This new architecture replaces one small core with a large core, significantly boosting performance compared to the 1+4+3 architecture of the Snapdragon 8 Gen 2.

Previous reports suggest that the Snapdragon 8 Gen 3’s large core will be upgraded to the advanced Cortex-X4, boasting a maximum frequency of 3.7GHz, which is a significant improvement over the 3.36GHz of the Snapdragon 8 Gen 2. Additionally, the GPU will be upgraded to Adreno 750.

Improved performance and power efficiency with Snapdragon 8 Gen 3

It is likely that TSMC will continue to produce the Snapdragon 8 Gen 3, with the process technology being upgraded from N4 to N4P. Although it does not utilize the more advanced N3 process technology, N4P offers a 6% performance improvement compared to N4. Furthermore, N4P reduces the number of mask layers, simplifying the process and accelerating chip production cycles, making it more cost-effective and efficient than N3.

With the enhanced architecture and process technology, the Snapdragon 8 Gen 3 is expected to achieve an AnTuTu benchmark performance of around 1.5 million points, providing users with smoother and more responsive experiences, especially when running demanding applications and games.

As for which manufacturer will be the first to launch a device featuring the Snapdragon 8 Gen 3 platform, contenders include Xiaomi, OnePlus, and Vivo. MediaTek is also preparing to compete with Snapdragon flagship chips with their upcoming flagship chipset Dimensity 9200+.

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Samsung, the South Korean technology giant, has reported a massive 95% decline in its operating profit in the first quarter of 2023. This has been largely attributed to the weakening demand for its semiconductor products, which is its largest source of revenue. The company’s chip division incurred a loss of 4.58 trillion won ($3.41 billion) for the quarter, mainly due to the falling memory chip prices and the declining demand for chip products.

Samsung’s Q1 2023 earnings report highlights a significant profit decline

Samsung has reported a revenue of 63.75 trillion Korean won ($47.6 billion) for the quarter, which is down 18% compared to the same period last year. This is the smallest profit for any quarter in 14 years for the company. However, Samsung is optimistic about the future and expects a slight recovery in the current quarter, with the possibility of companies accumulating chips ahead of the third quarter.

Despite the significant decline in the company’s chip division, Samsung’s mobile division has performed well, with a 22% increase in revenue compared to the previous quarter. This has been attributed to the success of the Galaxy S23 series, which has brought in strong sales. Samsung plans to continue supporting the sales of its premium models while also boosting sales of its new mass-market devices like the Galaxy A54 and A34.

Samsung has experienced losses in its memory chip division due to a variety of factors, including the stockpiling of chips by smartphone and PC makers during the pandemic. With consumer demand dropping off amidst high inflation and global economic uncertainties, these stockpiles have left excess inventory that has yet to be depleted.

Overall, Samsung’s Q1 2023 earnings reflect the ongoing challenges in the global semiconductor market. However, the company’s strong performance in the mobile division and its optimism about the future provide a glimmer of hope for investors and technology enthusiasts alike. Samsung is also planning to reintroduce Exynos chipsets in the upcoming Galaxy S flagships.

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Taiwanese-based chip maker MediaTek has announced that it will be launching its latest flagship chipset, the Dimensity 9200 Plus, on May 10 in China. This upcoming chipset is expected to be an enhanced version of its predecessor, the Dimensity 9200, which is currently powering several flagship devices from Vivo and OPPO.

Enhanced performance and speed with Dimensity 9200 Plus chipset

The first smartphone to feature the Dimensity 9200 Plus is likely to be the iQOO Neo 8 Pro, which was recently spotted on benchmarking platforms with the upcoming chip. The listing confirmed some of the key specifications of the Dimensity 9200+, which includes a 1 x Cortex-X3 core operating at 3.35GHz, 3 x Cortex-A715 cores working at 3.00GHz, four Cortex-A510 cores clocking at 2.00GHz, and Immortalis-G715 MC11 graphics.

According to reports, the Dimensity 9200+ achieved an impressive score of 1,368,597 on AnTuTu benchmarking platform, which is higher than Qualcomm’s most powerful chip, the Snapdragon 8 Gen 2. This suggests that the Dimensity 9200+ may offer better performance than its competitors.

The iQOO Neo 8 Pro is expected to be the first device to feature this new chipset, followed by the iQOO 11S and Vivo X90 Plus in the second half of the year. Additionally, according to a Weibo post by AnTuTu, Redmi, and ROG will also release smartphones powered by the Dimensity 9200+.

The launch of the Dimensity 9200 Plus is expected to bring significant improvements in performance and speed to the smartphone market. It will be interesting to see how this upcoming chipset stacks up against its competitors and how it will affect the market share of its major competitors such as Qualcomm and Samsung.

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(Source)

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At Computex Taipei 2022, AMD had revealed that the company will be launching its entry-level Ryzen and Athlon 7000 series mobile processors, codenamed “Mendocino”, that are aimed towards the Chromebooks and affordable Windows devices crowd.

And according to several reports online (via ITHome and wccftech), we have gathered several leaks and rumours that we know about AMD’s “Mendocino” processors so far.

AMD’s upcoming “Mendocino” 7000 series mobile entry-level APU family will be consisting of 3 members – the AMD Ryzen 3 7420U, AMD Athlon Gold 7220U and the AMD Athlon Silver 7020U.

Not much is known about the Athlon 7000 series mobile APUs, but recently ITHome reported that the news organisation had gathered info that the highest-end among the “Mendocino” processors – the Ryzen 3 7420U, will be sporting a quad-core CPU setup with 8 threads. All 4 CPU cores will be built on AMD’s older Zen 2 architecture, which turns 3 years old in 2022.

GPU-wise, The integrated graphics of the Ryzen 3 7420U APU will be featuring 1 WGP (2 CUs) of RDNA2 Graphics.

However, compared to its predecessor – the Ryzen 3 5400U, the upcoming Ryzen 3 7420U APU seems rather underwhelming. For comparison, the Ryzen 3 5400U also has a 4 core 8 thread CPU, but the cores are built on newer Zen 3 architecture. Meanwhile, the GPU on the Ryzen 5400U is a 6 CUs Vega Integrated Graphics.

As revealed earlier in leaks online, the AMD “Mendocino” APUs will be supporting dual-channel x32 LPDDR5 RAM, which can go up to 32GB, and the APUs will support VP9 and AV1 video encoding as well.

In Computex, AMD announced that “Mendocino” APUs will be launched in Q4 2022 and arrive in markets by the end of the year. The company expects “Mendocino” APUs to be available in mainstream notebooks priced from US$ 399 to US$699. 

In addition to the improved APU design, “Mendocino” is also manufactured on TSMC’s 6nm process, which translates to better power efficiency. AMD had announced that it believes that with Mendocino, Windows laptops can deliver more than 10 hours of battery life. On stage at Computex 2022, AMD revealed that Lenovo’s upcoming 2022 IdeaPad 1 series of entry-level laptops will be among the first to feature the APU.

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Computex Taipei 2022 has officially kicked off today, from May 23rd to May 27th at the Taipei Nangang Exhibition Center in Taiwan. And the first official event of the week-long programme is headed by semiconductor giant, AMD with its 2022 AMD Keynote Conference for the audience. 

At the Computex 2022 Keynote event today, AMD had finally pulled the sheets of its latest breakthrough products to the technology industry – its Ryzen 7000 desktop series processors and the company’s long-awaited AM5 socket motherboards.

Ryzen 7000 Desktop Processors

The Ryzen 7000 Series Desktop Processors are the successors to last year’s Ryzen 5000 series desktop processors. They are built on AMD’s latest Zen 4 architecture fabbed on TSMC’s industry-leading advanced 5nm node manufacturing process. For context, TSMC 5nm was found earliest on ARM-based devices like Apple’s iPhone 12 series, but for x86-based systems, AMD is the world’s first chip supplier to bring TSMC 5nm technology to the desktop PC scene.

As for the specifics, the AMD Ryzen 7000 series processors based on Zen 4 architecture are built just like Zen 3, in a chiplet-based design, but this time with the two Core Complex Dies manufactured on TSMC’s 5nm node. 

In addition, AMD is also introducing a new 6 nm I/O die (IOD) for Ryzen 7000 series desktop processors. Unlike the 14 nm Global Foundries IOD used in previous Zen 3 designs, AMD has now gone to TSMC for its 6nm manufacturing process for its IOD in Ryzen 7000 series desktop processors. 

With the manufacturing partner change, AMD is also incorporating an integrated GPU, to what is supposed to be just the Ryzen 7000 series desktop CPUs. And the GPU is not the Vega-based GPUs you would find in entry-level AMD models, this GPU will be built on AMD‘s RDNA2 architecture, the same architecture for the company’s dedicated graphic cards.

Thus, all of AMD‘s Ryzen 7000 series CPUs will technically be APUs as well, as graphics are now woven into the CPU’s construction. As Anandtech reports, “What this means for the future of AMD‘s monolithic desktop APUs is uncertain, but at a minimum, it means that all (or virtually all) of AMD‘s CPUs will be suitable for use in systems without discrete graphics, which although not a huge deal for consumer systems, is very much a big deal for corporate/commercial systems”.

AMD also showed off an unannounced 16-core Ryzen 7000 CPU at the keynote today running on the PC game Ghostwire: Tokyo, and the performance numbers have been shocking as the event showed off the unannounced Ryzen 7000 CPU running at over 5.5GHz, which is higher than not only AMD’s own top-end Ryzen 5000 processors from last year but also higher than Intel’s current 12th Gen Core i9 Processors.

Last, AMD disclosed that Zen 4 will come with 1MB of L2 cache per CPU core, which is twice the amount of L2 cache as found on Zen 3 (and Zen 2) CPU cores, and together with the company’s claims of 15% IPC uplift in single-core performance, the Ryzen 7000 series will be leading the competition.

No specific models of Ryzen 3, 5 or 7 models of Ryzen 7000 series desktop series processors were announced in today’s event, but AMD CEO, Dr Lisa Su confirms that the company will be holding a launch event for its Ryzen 7000 series desktop processors coming this fall in the upcoming months.

AM5 Socket Motherboards

Coming to AM5 Socket Motherboards, the new AM5 motherboards have an LGA-type socket with 1718 pins,  and introduces DDR5 and PCIe 5.0 support, as well as higher processor TDPs to the Ryzen 7000 family. The Ryzen 7000 desktop series processors will be the company’s first-ever Ryzen processors to run on AM5, which also means that AMD is officially retiring its 5-year-old AM4 motherboard technology.

The new AM5 socket motherboards come with native support for up to 170W of TDP, DDR5 and PCIe Gen 5.0 support, and are surprisingly compatible with AM4 motherboard coolers as well.

AMD unveiled the 3 new AM5 motherboard chipsets at the Computex 2022 today – the X670E, X670, and B650. All three models support the latest PCIE Gen 5 standard but for a more detailed look on how PCIE Gen 5 works on all 3 motherboards, you can refer to the table below.

AMD have revealed that with the collaboration with its motherboard partners, the company is ready to provide AM5 motherboards to the general public which include the ASRock X670E Taichi, the ASUS ROG Crosshair X670E Extreme, the Biostar X670E Valkyrie, the GIGABYTE X670 Aorus Xtreme, and the MSI MEG X670E Ace motherboards.

The AM5 motherboards are also coming this fall together with AMD’s Ryzen 7000 series desktop processors.

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(Via 1, Via 2)

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Qualcomm officially launched its highly anticipated flagship SoC, the Snapdragon 8+ Gen 1 smartphone chipsets in China tonight. And it is great news for 2022 smartphone buyers because the company is promising much-improved performance, much-improved power efficiency and much better thermals for the Snapdragon 8+ Gen 1 announced today as the SoC is manufactured under TSMC’s industry-leading 4nm power-efficient process!

The Snapdragon 8+ Gen 1 is a revamped version of the Snapdragon 8 Gen 1 revealed in November last year. It features the same octa-core architecture setup with a single ultra high performance Cortex-X2 core, three Cortex-A710 cores, and four Cortex-A510 efficiency cores, but with a few minor tweaks to improve the premium smartphone experience for flagship Android users.

First, the Snapdragon 8+ Gen 1 has been overclocked. Mainly, the Cortex X2 core has been overclocked from 3.00 GHz to 3.20 GHz, providing CPU performance of up to 10% higher than the Snapdragon 8 Gen 1. The GPU was also overclocked as well to provide up to 10% better GPU performance in games.

Next are the power efficiency gains. By switching over from Samsung to TSMC, Qualcomm has managed to improve power efficiency by up to 30% for the Snapdragon 8+ Gen 1, meaning that the chipset consumes less power overall, leading to improved thermals and improved battery life, in addition to the performance gains that the new chipset brings.

As for the rest, the Snapdragon 8+ Gen 1 is identical to the Snapdragon 8 Gen 1. It supports up to 16GB of 3,200 MHz of LPDDR5 RAM and UFS 3.1 storage. The display driver can do QHD+ at up to 144Hz or 4K at 60Hz, complete with 10-bit rendering (Rec. 2020) and HDR10+ support.

The Snapdragon X65 modem can deliver peak 5G speeds of up to 10Gbps, while the FastConnect 6900 WiFi modem runs Wi-Fi 6/6E at up to 3.6GHz. The chipset also supports Bluetooth 5.3 connectivity that includes Qualcomm’s latest aptX Lossless technology and Bluetooth LE Audio.

The chipset houses the same triple 18-bit Spectra ISP that can handle up to 200MP sensors and 8K video capture at 30fps (4K at 120fps), plus image processing tricks like multi-frame noise reduction and staggered/DoL HDR. It even supports a dedicated bokeh engine and support for HLG, HDR10+ and Dolby Vision formats.

Qualcomm has also announced that its partners, such as Xiaomi, Realme, Motorola and OnePlus will be bringing the Snapdragon 8+ Gen 1 to the smartphone market starting from Q2 2022. To stay tuned on the latest flagship releases, stay tuned to Gizmochina!

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As one of the world’s largest smartphone markets, China with its population of over 1 billion reflects several of the future trends that we may see in the smartphone industry, with one of them being the brand of the SoC (System on a Chip) used in our smartphones.

As we are almost halfway into 2022, data analytics firm, CINNO Research, has recently published a report on the Top 5 Smartphone SoC Vendors in the China market for Q1 2022, and it seems that MediaTek is the popular SoC brand used in smartphones for the quarter.

According to the report (via ITHome), smartphone SoC shipments in Q1 2022 were 74.39 million units, down 14.4% year-on-year, and down 0.7% quarter-on-quarter. And the top 5 vendors for the smartphone SoC vendors are MediaTek in the first place, Qualcomm in second, Apple in third, with Huawei’s HiSilicon and UNISOC in fourth and fifth respectively.

Let’s start from top to bottom, MediaTek saw 30.7 million smartphone chipsets shipped out in Q1 2022, which was higher than its 25 million shipments from last quarter, and 30.1 million shipments from Q1 2022. The rise in smartphone SoC shipments MediaTek can be mainly attributed to the semiconductor firm’s strategy and chipset catalogue that it had offered in the last 6 months, which included the brand’s popular Dimensity 920 5G chipset found on the Redmi Note 11 Pro+, Realme 9 Pro+ and Xiaomi 11i Hypercharge.

For Qualcomm, the brand remained relatively stable at second with 26.7 million smartphone SoC shipments in Q1 2022, higher than the 23.6 million figure from last quarter, but lower than the 27.9 million shipments from Q1 of last year. Coupled with the ongoing chip shortage, Qualcomm had earlier announced that it will gradually shift its focus to flagship chipsets instead of entry-level and mid-range chipsets due to flagship chipsets providing higher profit margins. However, the one caveat of this strategy is losing market share in mid-range and entry-level markets, which leads to lower shipments overall but higher revenues for the company.

Apple on the other hand, had only shipped 12 million smartphone SoCs in Q1 2022, down 15.8% from its 18.4 million figure from Q4 2021. As the iPhone nears the end of its release cycle, shipments are also expected to go down as well, because consumers are already expecting a new iPhone release soon, and therefore would hold off buying the current model and wait for the next iteration instead.

Huawei’s HiSilicon continues its gradual exit from the China smartphone SoC market as the firm had only shipped out 2.5 million units this quarter, down from 13.8 million in Q1 2021. As stocks for HiSilicon Kirin are not replenished due to the still ongoing supply sanctions against the company, the brand is expected to drop out of the top 5 as late as next year or as soon as the next quarter.

Squeezing just into the Top 5 is the rapidly growing UNISOC semiconductor company. UNISOC saw shipments of 1.9 million smartphones SoCs in Q1 2022, up 1760% from 0.1 million in Q1 2021. The main cause for the exponential growth behind UNISOC is the entry-level smartphone market. As the bigger players like Qualcomm and Apple’s main focus area is in the high-end, UNISOC aims to tackle the low end with its relatively much more affordable chipsets sold off to Realme, Motorola and Samsung to sell in their sub 100 dollar device market.

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(Via)

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AMD’s upcoming release of its Ryzen 7000 series of desktop CPUs is one of the most highly anticipated announcements by PC and tech enthusiasts alike. This is because the Ryzen 7000 series of CPUs will be the first lineup of Ryzen CPUs to run AMD’s latest AM5 platform, as opposed to the Ryzen 1000 to 5000 series CPUs that were running on AMD’s older AM4 platform.

As we are inching nearer close to the launch of Ryzen 7000, more leaks and rumours have started to surface online about Ryzen 7000 and a recent leak this week shows concerning details of the SoC lineup as it shows off the high voltage draw of a supposed member from the Ryzen 7000 lineup. 

The leak comes from Twitter user @9550pro, as the tweet shares a screenshot of an off-screen BIOS menu screen which shows off the motherboard and Vcore voltage draw of the chipset. 

Starting from the motherboard, it is examined that the motherboard is a member of the MAG family of motherboards that are exclusive to MSI. Next is the B650 moniker, which means that the CPU is running on an AMD AM5-based motherboard. And since the AM5 platform was designed specifically for the Zen-4 based Ryzen 7000 CPUs to replace the AM4 platform, it is apparent to see why this could be a member of the upcoming Ryzen 7000 series lineup of desktop CPUs.

Moving onto the next detail, VCore. The image shared also details of the VCore voltage draw of the CPU which is at 1.532 V, which is quite concerning for an AMD CPU, as normally the average voltage draw of AMD CPUs is at 1.3-1.4V voltages. 

In simpler terms, higher voltage draw leads to higher power draw, which leads to lower power efficiency, and higher temperatures and leaves the CPU more prone to thermal throttling.

Despite the concerns, the above statements only hold true if the finalised retail version of the Ryzen 7000 series is presented with the high voltage draw. The shared photo may be a Ryzen 7000 early test sample or engineering sample running in AMD’s research and development team to optimise its power efficiency and performance before its planned launch date in 2H 2022.

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(Source)

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ARM Processors are the foundations for all mobile chipsets we see today. Whether it be a Qualcomm Snapdragon, MediaTek Dimensity, Apple Silicon or Samsung Exynos chipset, chances are that all the aforementioned technologies are using ARM’s technology which includes its wildly popular ARM Cortex CPU Cores and ARM Mali GPUs.

In the early 2020s, Nvidia initially had plans to acquire the British semiconductor design company, ARM Limited, from its parent company, Softbank Group, the Japanese technology conglomerate headquartered in Tokyo for over 40 billion USD. However, Nvidia’s plan was disrupted due to rising regulatory conflicts with the US government and the acquisition was terminated in February 2022.

The aftermath of this was that Softbank now values its ARM chip-making business as more crucial to the entire tech industry. So valuable in fact, that Softbank is actually considering listing its ARM business as an entity on the US NASDAQ Stock Market to gain more funding to further develop the company.

According to Nikkei Asia, industry sources say that SoftBank wanted the NASDAQ IPO(Initial Public Offering) to take place by the end of March 2023, meaning that ARM needs to complete auditing between June and September this year, as per NASDAQ listing procedures.

However, ARM has one problem that has yet to be resolved to complete its internal organisation auditing, which is its tense relationship with ARM China, the Chinese subsidiary of ARM.

Ever since 2020, ARM has struggled to regain control of ARM China as the subsidiary’s head, Allen Wu, has refused to relinquish power despite a 7-1 board vote in June 2020 to kick him out. The spat has made it difficult for ARM to audit the financials of the company, creating a major stumbling block to an initial public offering in the US.

Because of this, ARM decided to now transfer its shares in its wayward China joint venture to a special purpose vehicle that it jointly owns with its parent SoftBank Group Corp. A partner at the U.S. law firm Katten Muchin Rosenman, Han Lijie, commented that creating a special purpose vehicle that will not be part of the offering will allow ARM to indirectly hold ARM China shares. That means it can treat ARM China as an investment rather than a subsidiary when reporting financials.

The move by ARM is seen to be clever, as it is now able to speed up its plans to go public if it decides to list in the US.

RELATED:

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(Via)

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According to the report, MediaTek grabs 31% of the Global Smartphone chipset market share in Q3 2020. Although it didn’t top the 5G category, it overtakes Qualcomm by 2% and also clocks a 5% YoY growth. With this, it gets the crown of biggest chipset vendor for the first time.

Previously, a report on the Application Processor market revealed that MediaTek was trailing behind Qualcomm at a 26% share in Q2. That said, it has gained a lot of grounds on Smartphone chipsets. And it has reportedly happened due to the sale of $100-$250 phones in India and China.

Anyway, the rest of the share is occupied by giants like Samsung, Huawei’s HiSilicon, Apple, and UNISOC. Among this, Apple, HiSilicon, Samsung’s share sits at 12% each while UNISOC gets 4% of the market share. Also, if you notice closely, Huawei’s HiSilicon remains unchanged from 2019 despite showing a declining trend due to the US ban.

Coming back, the report says Qualcomm was the biggest 5G vendor for Q3. Although only 17% of the devices sold in Q3 were 5G, the company gets a resounding share of 39%. With Smartphone production reviving in Q3, and other equipment sales jumping by 30%, companies have managed to outsell themselves compared to previous quarters.

Research Director Dale Gai says MediaTek has raised the bars with its mid-range chipsets and has managed to power 3x more Xiaomi phones compared to 2019. This, along with good performance in LATAM(Latin America) and MEA(Middle East, Africa), leveraging the ban on Huawei meant it’s progress steered faster.

Just like Research Analyst Ankit Malhotra says, MediaTek also managed to power the World’s cheapest 5G-smartphone realme V3, and Europe’s cheapest 5G-device realme 7 5G. However, it still has a lot of ground to capture in the area where its rival Qualcomm has been dominating. Despite the pressure from Apple’s 5G iPhone 12 series and MediaTek, Report says Qualcomm has the potential to get back in Q4.

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The Indian Government has reached out to MediaTek to mediate discriminatory allegations by Indian companies. A report says the company has been diverting the majority of its supplies to Chinese vendors. As a result, companies like Micromax and Lava are reportedly facing shortages of chipsets.

Citing its sources, ET reports that the Indian Govt’s intervention to solve the issue is to avoid further complications. Pankaj Mohindroo, Chairman of ICEA(India Cellular and Electronics Association) says the govt is reaching out through proper channels to MediaTek. Apparently, it is doing this to negotiate the issue that has resulted in about 95% shortage of components for Indian companies.

However, MediaTek denies these allegations. It says the entire industry is experiencing shortages globally. It adds that the main reason is the supply chain disruption due to COVID-19 in addition to demand, 5G rollout. After the outbreak of the virus, companies faced a lot of issues and even started importing devices from China. Although reports predict a revival in 2021, the market is still yet to balance the demand and supply crisis.

Anyway, while the seriousness of the allegations isn’t clear, experts believe that it could also be due to Huawei stockpiling MediaTek’s chipsets in Q2. Back in May, after realizing the extension of the US ban, it reportedly increased orders to MediaTek by 300%. Later, as the September 15 deadline was approaching, it entered survival mode by stockpiling chipsets for the next 2 years.

Coming back, the report says that if Govt doesn’t intervene, it will affect Indian companies’ goals for the PLI scheme. Previously, the govt announced incentives worth ₹50,000 crores ($6.6 billion) including PLI, SPECS, EMC 2.0 schemes. Out of this PLI(Production Linked Incentive) requires companies to manufacture high-end phones for a period of 5 years locally and achieve yearly goals to get 4-6% incentive.

That said, experts say that Indian companies will be able to reach the first-year target of the PLI scheme only if they get supplies till March 2021. And if the issue persists, it isn’t going to be a smooth ride for them. Let’s wait and see how the situation pans out after the involvement of the govt.

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Last week, chipset maker MediaTek found itself at the centre of a controversy related to the benchmark cheating. A report alleged that MediaTek purportedly allowed OEMs to enable a “sports mode” in benchmark apps.

The so-called “sports mode” on the devices is believed to ramp up things like the memory controller and scheduler in order to facilitate faster performance.

In its defence, the company said that this was a common industry practice and that its “key competitor” was also guilty of this practice. While MediaTek didn’t directly name its arch rival Qualcomm, the “key competitor” part clearly hints at Qualcomm.

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The US-based Qualcomm has now issued a statement to Android Authority regarding this controversy. In the statement, the company denies whitelisting such benchmarking apps hack. It says: “Whitelisting refers to the technique of using the app name to determine whether to put the device into performance enhancement mode. The action of whitelisting a benchmark app is generally considered by the industry as cheating since it defeats the purpose of a benchmark, which is to reflect user experience for day to day use. Qualcomm does not whitelist.”

There’s a possibility that MediaTek could be referring to other chipset makers — Huawei and Samsung. However, both of them mostly make chipsets for their own smartphones and Samsung occasionally sells its chips to others. Thus, the only major direct competitor to MediaTek remains Qualcomm.

The controversy comes at a time when Taiwan-based MediaTek is making a comeback into the market with some great chipsets such as MediaTek Helio G-series and the new Dimensity 1000 flagship processor.

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(Source)

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Huawei, one of the leading smartphone makers, is among the very few companies that make their own mobile processors. However, the company has not limited itself to just mobile chipsets but is also making chipsets for PC under Kunpeng brand.

Now, Huawei and Tencent Games have announced a strategic partnership at the Huawei Developer Conference 2020 that was held online amid coronavirus pandemic. Hou Jinlong, President of Huawei Cloud and Computing BG, says that Kunpeng ecology is an important opportunity for the gaming industry.

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Both the companies plan to make several joint innovations and it is said that Huawei will also establish a joint innovation laboratory with Tencent Games. Commenting on the development, Ma Xiaoyi, senior vice president of Tencent Group said: “We are very glad to have reached a strategic cooperation with Huawei and set up a joint innovation laboratory. We will advance the cooperation in mobile cloud games, game engines and other aspects with the advantages of both parties.”

He further adds that for the cloud gaming, the company has created Tencent Cloud Game GameMatrix platform and says that the company will make full use of Huawei Kunpeng processors with powerful computing to build industry-leading, high quality and low-cost mobile cloud gaming solutions.

Huawei executive Hou Jinlong believes that the next ten years will be the golden decade of innovation in computing architecture and the diversified computing architecture innovation requires participation of more developer. At the conference, the company announced that Huawei will invest $200 million to promote the development of Kunpeng.

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