MediaTek Dimensity 9000 Archives - Gizmochina

OnePlus Ace 2 Dimensity Edition Smartphone to Reportedly Launch Soon

Jeet — Fri, 17 Feb 2023 02:50:11 +0000

OnePlus, which recently launched the OnePlus Ace 2 smartphone in its home country China, is now gearing up to launch yet another Ace series model in the Chinese market.

According to the latest report, the OnePlus Ace 2 smartphone will soon get a new model powered by the MediaTek Dimensity processor instead of Qualcomm’s chipset.

OnePlus Ace 2

The report claims that the OnePlus Ace 2 Dimensity Edition will be powered by the MediaTek Dimensity 9000 processor. Further, the phone’s screen will be replaced by a 1.5K flat-screen display. It is also expected to be a bit cheaper than the current model.

This will be the first time OnePlus adopts Dimensity 9000 SoC in the Ace lineup. The chipset, which was announced last year, is a flagship offering from MediaTek, manufactured by TSMC using a 4nm process.

Apart from the processor and display, everything else will remain the same as the standard model. It features a 6.74-inch AMOLED display that offers a 1.5K resolution with 2772 × 1240 pixels, 1450 nits of peak brightness, 100 percent DCI P3 color gamut, 1440Hz high-frequency PWM dimming, and adaptive refresh rate up to 120Hz.

The device, currently available in the market, is powered by the Qualcomm Snapdragon 8+ Gen 1 processor, paired with up to 16GB of RAM and up to 512GB of internal storage. It comes with 5177mm² eight channel heat dissipation VC cooling, which the company claims is based on an exclusive black technology for an improved heat dissipation that is twice as effective as typical VC liquid cooling mechanisms.

In the camera department, there’s a 50-megapixel primary Sony IMX890 sensor that supports OIS (Optical Image Stabilization) and has a 1/1.56-inch size and f/1.8 aperture. It is paired with an 8-megapixel ultra-wide angle lens and a 2-megapixel macro camera. On the front side, the phone features a 16-megapixel snapper for taking selfies and video calling.

The smartphone runs the Android 13 operating system out-of-the-box with the company’s own ColorOS 13 custom user interface on top. It is powered by a 5,000mAh battery with support for 100W SuperVOOC charging.

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ASUS ROG Phone 6D with Dimensity 9000+ SoC appears on AnTuTu benchmark

Jeet — Thu, 25 Aug 2022 03:28:14 +0000

ASUS launched the ROG Phone 6 series gaming smartphones last month and the Pro model in the lineup was ranked at the top of the list on AnTuTu benchmarks. Now, the company is working on a new device in the lineup, which has surfaced on AnTuTu.

As per the listing, the upcoming smartphone carries model number ASUS AI2203D is named ASUS ROG Phone 6D and the device will come powered by the flagship MediaTek Dimensity 9000+ processor.

The phone has managed to score 1,146,594 points in AnTuTu benchmark, which means that it’s 2-3% more compared to the ROG Phone 6 Pro which is powered by the Qualcomm Snapdragon 8 Plus Gen 1 processor.

The listing reveals that the upcoming ROG Phone 6D scored 291,317 points for CPU, which is around 15 percent higher than the Qualcomm Snapdragon series chipset. In GPU, MEM, and UX testing, it scored 430,867, 218,270, and 206,140 points respectively.

The flagship ASUS ROG Phone 6D smartphone with model number ASUS_AI2203 has already passed through the 3C certification processor which has revealed that the device will come with support for 65W fast charging.

The device has already appeared on the ASUS website on the “China RoHS Compliance Mark” page, but the company is yet to officially announce the phone. While the launch date is not yet known, we expect the phone to soon get launched in China.

MediaTek Dimensity 9000+ flagship processor announced; comes with a performance boost

Jeet — Wed, 22 Jun 2022 03:25:03 +0000

Last year, MediaTek launched its flagship smartphone chipset in the form of MediaTek Dimensity 9000 and now the company has announced an upgraded version of the same, dubbed MediaTek Dimensity 9000+.

This newly announced smartphone chip is essentially the same as the Dimensity 9000 but comes with some key improvements. It supports a 144Hz refresh rate for WQHD+ resolution and up to 180Hz refresh rate for Full HD+ displays.

In terms of performance, the company claims that the MediaTek Dimensity 9000+ comes with a 5 percent improvement in CPU and about 10 percent faster GPU. It integrates ARM’s v9 CPU architecture with a 4nm process.

It packs one ultra-Cortex-X2 core clocked at 3.2GHz, three super Cortex-A710 cores, and four efficiency Cortex-A510 cores. As for the graphics processing, there’s a built-in ARM Mali-G710 MAC10 GPU.

The chip comes with an improved Image Signal Processor (ISP). It has Imagiq 790 ISP that supports 18-bit HDR video recording from three cameras at the same time and up to 320-megapixel sensor support for 4K HDR and AI noise reduction.

The network modem has also been updated and now it supports up to 7Gbps downlink. It also has support for 5G/4G Dual SIM Dual Active, enabling users to use both networks at once. It also has Bluetooth 5.3, Wi-Fi 6E, and the latest GNSS standard.

MediaTek Dimensity 9000+ will be released in the third quarter of this year but as of now, the company has not revealed which devices will be among the first ones to come powered by this new processor.

Vivo X80 Series Launched Globally: First Dimensity 9000 and Sony IMX866 Flagship in the Global Market

Leo Wong De Quan — Sun, 08 May 2022 10:11:02 +0000

The Vivo X80 Series has been officially launched in its first global market outside of China today, in none other than the tropical Southeast Asian country of Malaysia.

Source: Vivo Malaysia

As an industry-leading flagship from Vivo, the Vivo X80 series brings in several firsts to the global smartphone market which include the 1st flagship to sport a MediaTek Dimensity 9000 processor, the 1st flagship to sport its Vivo V1+ imaging processor and the 1st flagship to sport a Sony IMX866 sensor.

Vivo X80

Starting with the design, the Vivo X80 features a curved AMOLED screen at the front and a flat glass back panel with a rectangular ceramic camera island on top. The front display is a 6.78-inch FHD+ 120Hz E5 Samsung curved AMOLED that goes up to 1000 nits of brightness covering 100% DCI-P3 colour gamut. The front display is then complimented with a centered hole punch housing the 32MP selfie camera.

Powering the standard Vivo X80 is MediaTek’s top-of-the-line Dimensity 9000 SoC, with 12GB of onboard LPDDR5 RAM, 4GB of extendable RAM and 256GB of blazing-fast 256GB UFS 3.1 storage. Keeping the lights on is the device’s generous 4,500mAh battery, paired with Vivo’s class-leading 80W fast charging. Vivo claims that its 80W fast charging will be able to charge from 0% to 50% within 11 mins and 0% to 100% within 34 mins.

Coming to the photography, besides the ISP on the MediaTek Dimensity 9000, the Vivo X80 also comes with Vivos first in-house ISP, the Vivo V1+. Vivo proudly exclaims that the Vivo V1+ ISP paired with the MediaTek Dimensity 9000 allows the company to produce newer and more advanced smartphone camera algorithms to ensure that the best camera shot comes out of your smartphone.

As for the cameras, the Vivo X80 features a triple rear camera setup. The main sensor is Sony’s latest 50MP IMX866 sensor. The 50MP sensor comes with a wide f/1.75 aperture, OIS stabilisation, and an RGBW colour arrangement. The setup is then supported with a 12MP ultra-wide-angle lens and a 12MP telephoto lens with 2x optical zoom. All lenses are also equipped with Zeiss’ T* coating technology to reduce ghosting and stray light to capture more natural colours and finer details when you are using the device.

Vivo X80

For haptics and audio, the Vivo X80 is included with a linear X-axis haptic motor and features dual top-bottom firing stereo speakers for an immersive mobile gaming experience. The device weighs in at a hefty 206g and is sporting Android 12 with Vivo’s Funtouch OS 12 user interface on top.

Vivo X80 Pro

The Vivo X80 Pro features a similar design as the Vivo X80 with the same curved AMOLED panel at the front, a flat matte glass panel at the back, and is rated for IP68 water and dust resistance. The display up front is upgraded to a 6.78-inch 2K 120Hz LTPO E5 Samsung AMOLED over the standard model and also houses a 32MP front camera in the punch hole at the top centre of the display. The display also supports up to 1500 nits of brightness, 10-bit colours and HDR10+ content.

Vivo X80 Pro

The Vivo X80 Pro is coming to global markets with only the Qualcomm Snapdragon 8 Gen 1 onboard, and with 12GB of onboard LPDDR5 RAM, 4GB of extendable RAM, and 256GB of UFS 3.1 storage. The Vivo X80 Pro is equipped with a larger 4700mAh battery, with 80W wired fast charging, and 50W Vivo FlashCharge wireless charging. In turn, the device weighs in at a heavier 219g.

As for the cameras, the Vivo X80 Pro is also equipped with the new Vivo V1+ ISP and features a more capable quad-camera setup on the rear. The main sensor is a 50 MP ultra-sensing Samsung GNV sensor with OIS stabilisation. As the first Android flagship to sport the Samsung GNV sensor, Vivo claims that with this new technology, the Vivo X80 Pro will be able to reveal the colours of the night, making the night look brighter and more natural.

The other 3 rear cameras are also flagship highlights as well, with the 48MP ultra wide-angle sensor being the Sony IMX598, the 12MP telephoto sensor being the Sony IMX663 sensor, and an 8MP periscope lens that boasts 5x optical zoom and 60x hybrid zoom. All lenses are equipped with Zeiss’ T* coating technology which aims to provide photos with true to life colours and finer details in the dark.

The Vivo X80 Pro is equipped with the same flagship linear X-axis motor and dual top-bottom firing stereo speakers as its X80 sibling and will run Android 12 with Funtouch OS 12 out of the box.

Pricing and Colour Options

For the Malaysia market, the Vivo X80 will be arriving in two gorgeous colour options: Cosmic Black and Urban Blue, meanwhile the Vivo X80 Pro will be only available in Cosmic Black.

The Vivo X80 series is available for pre-order starting May 8th in Malaysia starting from RM 3,499 (800 USD) for the standard Vivo X80 (12GB+256GB), and RM 4,999 (1,144 USD) for the Vivo X80 Pro (12GB+256GB). Both devices come included with free gifts and a 2-year local manufacturer warranty.

The Vivo X80 series is due to come to more global markets soon this month, with the Indian launch of the Vivo X80 series happening next week on May 18th.

Xiaomi 12S Pro with Dimensity 9000 SoC is in the Works, Spotted on Mi Code

Anurag — Sat, 07 May 2022 09:10:03 +0000

We recently got to know that Xiaomi will launch its upcoming flagship phone- Xiaomi 12S Pro with a Snapdragon 8 gen 1 plus processor. Now a report reveals that the smartphone will also come with a MediaTek Dimensity 9000 Soc. The features of the phone are expected to be the same except for the processor.

According to Xiaomiui, Xiaomi 12S Pro with Dimensity 9000 SoC is in the works and they have spotted its traces on the Mi code. The publication first found the phone’s model number- 2207122MC in the IMEI database.

From the model number, they discovered that the device is codenamed “dauimer”. After further research, they found out that “dauimer” is Xiaomi 12S Pro Dimensity 9000 edition.

With this news, it is now evident that the upcoming Xiaomi 12S Pro will come in 2 SoC variants- Snapdragon 8 gen 1 plus and MediaTek Dimensity 9000. We currently have no news about the launch date of the smartphone, but the appearance of the phone in the Mi code indicates that Xiaomi may launch the handset soon.

We are in the dark about other specifications of the phone. However, you can check out the rumored specs below.

Xiaomi 12S Pro specifications (expected)

The handset is expected to have a 6.55 inches AMOLED display offering 1080 x 2400 pixels resolution and 402 PPI. The smartphone could feature a triple 64 MP (wide) + 8 MP (ultrawide) + 5 MP (macro) camera set up in the back. On the front camera, it could have a 16 MP snapper for video chats and selfies.

The smartphone is likely to be fueled by a 4500 mAh battery and is expected to carry support for 67W fast charging, Power Delivery 3.0, and Quick Charge 4+. The phone will run on Android 12 + MIUI 13 operating system out of the box.

Xiaomi 12S Pro is said to be equipped with sensors such as optical under-display fingerprint (under display, optical), accelerometer, gyro, and compass + Virtual proximity sensing.

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vivo X80 Pro to be the most powerful vivo flagship, imaging chip will allow impressive videography

Zohaib Ahmed — Fri, 25 Mar 2022 12:20:55 +0000

The vivo X80 Pro will be equipped with the MediaTek Dimensity 9000 flagship processor, tipster Digital Chat Station revealed through a post on Weibo today. The device uses a 6.78-inch 2K+ OLED curved screen and has a battery capacity of 4,700mAh with support for 80W wired and 50W wireless charging.

The Dimensity 9000 adopts TSMC’s superior 4nm fabrication process and uses a (1+3+4) implementation similar to that of the Snapdragon 8 Gen 1 (via My Drivers). It consists of 1x Cortex-X2 super core, 3x Cortex-A710 large cores, and 4x Cortex-A510 small cores. Graphics are handled by the ARM Mali-G710 GPU and the entire thing manages to cross the 1 million mark on AnTuTu.

The same tipster had earlier revealed that the vivo X80 series is equipped with vivo’s self-developed V1 imaging chip, built to meet the needs of the devices’ photography capabilities. When shooting videos facing a large number of complex operations, the V1 chip has an exponential improvement in energy efficiency compared to DSPs and CPUs.

Similar behavior is seen when shooting images too, with the dedicated algorithms of the chip cutting down power consumption by 50% by handling processing.

Like last year, the vivo X80 series could be made of three models, namely the vivo X80, vivo X80 Pro, and the vivo X80 Pro+. All of these may debut in April.

Redmi K50 Pro+ AnTuTu score revealed, Dimensity 9000 crosses 1 million mark

Zohaib Ahmed — Thu, 10 Mar 2022 09:27:43 +0000

Redmi on Thursday officially announced that its flagship K50 series will be launched on March 17. The series comprises four models, namely Redmi K50, Redmi K50 Pro, Redmi K50 Pro+, and Redmi K50 Gaming Edition. From these, the Redmi K50 Pro+ is making headlines today for its exceptionally high AnTuTu score.

Notable industry insider Digital Chat Station just revealed the AnTuTu benchmark score of the Redmi K50 Pro+ with a Weibo post, and it crosses the 1 million mark. The device, which is powered by the Dimensity 9000 chip, has achieved a score of 1,041,818, out of which the CPU scores 265,743 and GPU scores 394,078.

First announced in late 2021, the MediaTek Dimensity 9000 adopts TSMC’s 4nm process, sports the all-new ARMv9 architecture, and has 1x 3.05GHz Cortex-X2 super core, 3x 2.85GHz Cortex-A710 large cores, and 4x Arm Cortex-A510 small cores.

Netizens also spotted that the screenshot’s resolution was 1440p, meaning the Redmi K50 Pro+ will most likely sport a 2K display with a resolution of 2560*1440.

The Redmi K50 series is all set to be the most extensive and diverse lineups ever, with processors from both Qualcomm and MediaTek. In addition to the Redmi K50 Pro+ with its Dimensity 9000, there’s also the Redmi K50 Gaming with the Snapdragon 8 Gen 1, Redmi K50 Pro with the Dimensity 8100, and the Redmi K50 with the Snapdragon 870.

Along with revealing the launch date of the Redmi K50 series, Redmi today for the first time officially teased the camera design of the phones, which you can check out from here.

Redmi K50 Pro Plus hinted to run Dimensity 9000 by Lu Weibing

Sudhanshu — Mon, 07 Mar 2022 13:38:17 +0000

Redmi has already launched its first smartphone in the K50 series dubbed the Redmi K50G aka the Redmi K50 Gaming Edition which runs the latest Snapdragon 8 Gen 1 SoC. However, the flagship Redmi K50 Pro Plus is said to come with a MediaTek Dimensity 9000 SoC which may have indirectly been confirmed by Redmi’s General Manager.

Redmi K50 Pro CAD renders

According to a GizChina report, Lu Weibing who is Redmi’s General Manager has recently stated in an Interview that the upcoming Redmi K50 smartphone powered by the Dimensity 9000 chipset performs quite smoothly. From earlier leaks, we know that the Redmi K50 Pro will be getting the Dimensity 8100 chipset, leaving only the K50 Pro Plus to receive this top of the line MediaTek SoC.

The Redmi K50 Pro Plus is expected to launch soon in China and will likely come as a rebranded POCO device (POCO F4 Pro) in other parts of the world. It would be exciting to see the new chipset’s performance on the Redmi K50 Pro Plus especially since we know that it beats Qualcomm’s flagship Snapdragon 8 Gen 1 SoC in benchmarks like Geekbench.

The Dimensity 9000 SoC’s performance is said to be superior to the Snapdragon 8 Gen 1 as the chip has been manufactured using TSMC’s 4nm process rather than Samsung’s, resulting in better power efficiency and lower thermals. The processing unit consists of a single Cortex-X2 super core, three Cortex-A710 large cores, and four Cortex-A510 small cores. This system is paired to the Mali-G710 GPU.

It will also be interesting to compare the K50 Pro Plus’s performance with the already released Redmi K50 Gaming Edition which comes equipped with the SD 8 Gen 1 SoC.

So far, the latest Dimensity 9000 SoC is only available to buy on an OPPO Find X5 Pro, which for now remains exclusive to China.

Customers can opt for Dimensity 9000-powered OPPO Find X5 Pro in China

Sudarshan Ravichandran — Fri, 25 Feb 2022 07:21:06 +0000

Yesterday, OPPO unveiled the OPPO Find X5 series globally. The Pro model offers all the bells and whistles for a premium price tag. Interestingly, in China, customers can opt for a cheaper version of this smartphone with some minor changes in its specs. This variant of the device is officially called OPPO Find X5 Pro Dimensity Edition.

As the name suggests, the OPPO Find X5 Pro Dimensity Edition arrives with a MediaTek chipset instead of Qualcomm. Precisely, it is powered by the latest Dimensity 9000 SoC rather than Snapdragon 8 Gen 1 SoC.

Further, this version of the phone lacks the company’s in-house MariSilicon X image processing silicon. It also misses out on Hasselblad tuning and 5-axis OIS. Finally, it arrives in a single 12GB + 256GB memory configuration and only two color options (black, white).

Apart from the aforementioned differences, the OPPO Find X5 Pro Dimensity Edition is the same as the standard OPPO Find X5 Pro inside out. The handset is priced at ¥5,799 ($918). It will be available for pre-order starting March 14, followed by sale on March 18.

For comparison, the original OPPO Find X5 Pro costs ¥6,299 ($998) for the 12GB + 256GB variant. Its base model (8GB + 256GB) is priced at ¥5,999 ($950), while the top version (12GB + 512GB) goes all the way up to ¥6,799 ($1,077).

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MediaTek confirms the Dimensity 9000 will debut on the Find X5 series

Jed John Ikoba — Fri, 18 Feb 2022 17:08:28 +0000

MediaTek‘s take on Qualcomm‘s flagship Snapdragon 8 Gen 1 chip is already confirmed to be the Dimensity 9000. Already, we have seen the flagship chipset show some promise over the Snapdragon 8 Gen 1 and Samsung’s Exynos 2200. But as they say, the taste of the pudding is in the eating. MediaTek’s flagship chip is yet to find its way into a smartphone. Well, we may soon see a Dimensity 9000-powered smartphone.

MediaTek has now released a couple of teasers on its official Weibo account confirming that the MediaTek Dimensity 9000 chipset will launch first on the OPPO Find X5 series. The company categorically stated that the Dimensity 9000 will be launched onboard the OPPO Find X5 series on February 24.

MediaTek’s Dimensity 9000 will be based on TSMC’s 4nm process with a 3.0GHz Cortex-X2 super core, three 2.85GHz A710 large cores, and four 1.8GHz A510 mid-core architecture.

In terms of benchmark performance, the Dimensity 9000’s AnTuTu score exceeded 1,017,488 points which is higher than the Snapdragon 8 Gen 1’s score. On GeekBench, the flagship processor scored 1273 points on the single core test and 4324 points on the multi core test. The multi-core test score exceeds that of the Snapdragon 8 Gen 1, which falls between 3,800 and 3,900 points.

We’ll find out more about the Dimensity 9000 when the Find X5 series go official on February 24.

MediaTek’s January 2022 revenue totalled $1.55 billion, YoY increase of 23.1%

Zohaib Ahmed — Sat, 12 Feb 2022 09:02:01 +0000

MediaTek today announced that its consolidated revenue in January 2022 was NT$43.502 billion (about $1.55 billion), which is a year-on-year increase of 23.1% but also a month-on-month decrease of 5.8%. While it’s kind of a bumpy start compared to December 2021, MediaTek is optimistic about the quarter as a whole.

The Taiwanese chipmaker has predicted that the revenue for the first quarter of 2022 would be between NT$131.2 billion (around $4.7 billion) to NT$141.5 billion (around $5.1 billion), which is an increase of about 2% to 10% over the previous quarter, and an increase of 21% to 31% year-on-year (via IT Home).

MediaTek CEO Cai Lixing says that the revenue is driven by the increased 5G penetration and the shipment of the flagship chip Dimensity 9000, which can also offset the impact of low seasonal demand for some consumer products.

The financial report from 2021 shows that MediaTek’s annual revenue reached NT$493.4 billion (around $17.6 billion) last year, which is a YoY increase of 53.2% and also a new record high. Similar growth was recorded in the fourth quarter of 2021, with the revenue standing at NT$128.6 billion (around $4.7 billion), which is an increase of 33.5% over the same period last year.

All in all, MediaTek is doing quite well for itself, even shipping more smartphone chips than Qualcomm in China last year. MediaTek shipped 110 million units in 2021 compared to 77.4 million units in 2020 in the country.

MediaTek Dimensity 9000 apparently crushes Snapdragon 8 Gen 1 and Exynos 2200 on Geekbench 5

Zohaib Ahmed — Mon, 24 Jan 2022 08:53:04 +0000

The Dimensity 9000 is MediaTek’s very first true flagship mobile processor, and as such, is expected to go neck to neck with Snapdragon 8 Gen 1 in terms of performance. However, what most probably didn’t expect was that the MediaTek flagship will actually be beating the Qualcomm flagship, that too by a significant margin.

Prominent industry insider Ice Universe on Twitter today shared Geekbench 5 benchmark scores for the latest and greatest smartphone chips and they’re quite surprising, to say the least. In it, the Snapdragon 8 Gen 1 manages to beat only its predecessor and the Exynos 2200, with the Dimensity 9000 and Apple A15 absolutely crushing it in both single and multi-core tests.

The Snapdragon 8 Gen 1’s scores of 3752 and 1231 in multi-core and single-core tests, respectively, seem to be only marginally better than those of last year’s Snapdragon 888. In comparison, the Dimensity 9000 scores 4410 in multi-core and 1278 in single-core Geekbench tests, which is dangerously close to the A15’s figures.

Needless to say, something is definitely fishy here, especially when considering that Qualcomm’s each new flagship chip iteration usually brings along at least 15% higher benchmark scores — something that isn’t seen here.

It could be possible that heating issues are the culprit. Reports of the Snapdragon 8 Gen 1 overheating during benchmark tests and throttling as a result have been doing rounds, and they could’ve resulted in the aforementioned underwhelming scores.

Or it could be that the MediaTek Dimensity 9000 is simply better. If that’s indeed the case, then MediaTek has become the new king in the Android world, at least in terms of Geekbench 5. Of course, real-world performance is something else entirely.

Regardless, it is recommended to take these early benchmarks with a pinch of salt as they have likely been run on pre-release models. Fairer comparisons can only be performed once both Dimensity 9000 and Snapdragon 8 Gen 1 SoCs reach retail phone units, so stay tuned.

OPPO Find X5 Pro may be the first to feature Dimensity 9000 SoC

Sudhanshu — Sat, 15 Jan 2022 14:33:46 +0000

Earlier this week we reported that the MediaTek Dimensity 9000 SoC is expected to launch in the first half of 2022 and will be featured in upcoming Redmi and OPPO devices. Now, a new report has emerged giving a more precise time frame for the SoC launch as well as the first device that is expected to come with the Dimensity 9000 chip.

According to a report by ITHome, MediaTek will be launching their Dimensity 9000 flagship SoC sometime in the month of February-March. OPPO’s upcoming flagship is expected to be the first device to house the new SoC.

Previous leaks have revealed that OPPO is working on its next flagship dubbed the Find X4 Pro; however, the upcoming flagship might be named the OPPO Find X5 Pro due to number 4 being considered an unlucky number in China

OPPO Find X5 Pro Specifications (rumored)

OPPO Find X5 / X5 Pro renders by OnLeaks / Prepp.in

So far, the rumored specs of the upcoming OPPO Find X5 Pro reveal that the phone will come with a 6.7-inch AMOLED LTPO 2.0 display that offers a Quad HD+ resolution of 1440 x 3216 pixels and a 120Hz refresh rate.

The rear camera setup of the device is fitted with a 50-megapixel Sony IMX766 primary camera with OIS support. It is coupled with a 50-megapixel ultrawide lens and a 13-megapixel tertiary camera. For selfies, the display punch-hole of the X5 Pro will house a 32-megapixel Sony IMX709 camera.

It will be packed with a 5,000mAh battery that supports 80W fast charging and 50W wireless charging. The device is likely to run on the latest Android 12 with ColorOS 12 on top. For security, it will feature Goodix G7 in-screen fingerprint scanner.

Earlier reports state that the Snapdragon 8 Gen 1 SoC will be powering the device along with OPPO’s MariSilicon X chip. However, if the latest leaks are to be believed, the OPPO X5 Pro might ditch the SD 8 Gen 1 in favor of the upcoming Dimensity 9000 chipset.

The MediaTek Dimensity 9000 SoC adopts the combination of TSMC’s 4nm process + Armv9 architecture and has a high-performance Cortex-X2 super core. The SoC also consists of three Arm Cortex-A710 cores clocked at 2.85GHz and four Arm Cortex-A510 energy-efficient cores. Additionally, the Dimensity 9000 supports LPDDR5X memory.

Genshin Impact optimized for Snapdragon 8 Gen 1 and upcoming Dimensity 9000 devices

Sudhanshu — Thu, 13 Jan 2022 17:24:41 +0000

Genshin Impact is one of the most popular games on the Android Playstore right now and has become somewhat of a benchmarking tool for smartphone reviewers due to its high CPU and GUP demands.

Reviewers and tech enthusiasts have reported that the smartphones with the new Snapdragon 8 Gen 1 SoC have not been able to run the game on desired settings due to them being locked at ‘default’ but that reportedly changes now.

According to a new report by ITHome, the game developers have released a new update for Genshin Impact that adds support for the new Snapdragon 8 Gen 1 SoC and upcoming MediaTek 9000 SoC devices. The changelogs show that post update, the settings will no longer be stuck at “default” and can be changed according to the user’s needs for the best experience.

This means that owners of devices that host the Snapdragon 8 Gen 1 SoC like the Xiaomi 12, the Realme GT 2 Pro, and the Moto Edge X30 can now play the game at a higher resolution in contrast with the previously locked resolution of around 600p.

For those unaware, Genshin Impact is a free-to-play action role-playing game developed by Chinese developer miHoYo, and first published in 2020. The game features an anime-style open-world environment and an action-based battle system using elemental magic and character-switching.

The vast fantasy world features seven countries which you can freely explore, meet companions with different personalities and unique abilities and fight against powerful enemies with them.

The top three chips for this year’s flagship phones reportedly have overheating issues

Jed John Ikoba — Mon, 03 Jan 2022 20:52:01 +0000

Overheating of chips is an important part of their production process and chip makers continue to seek ways of keeping their chips cool while not affecting overall performance. There are reports that three top-of-the-line chips which will be debuting in some of this year’s flagship smartphones could be having overheating problems. The chips are the Qualcomm Snapdragon 8 Gen 1, Samsung’s Exynos 2200, and MediaTek’s Dimensity 9000, which are all top-end super-functional chips of their various manufacturers.

Taiwanese company TSMC is the producer of the Dimensity 9000 while Samsung Foundry assembled both the Exynos 2200 and the Snapdragon 8 Gen 1. All three chips are produced using the 4nm node process and there had been some tweets by a few tipsters pointing to the presence of the overheating problem in these top-end chips. The leaks related to the Snapdragon 8 Gen 1 which was observed to overheat when put through the paces in the Motorola Edge X30, one of the few models sporting the flagship chip.

Tested the new A510 small cores in #Snapdragon8Gen1
Compared to the A55 in SD888:
Performance +15%
Power consumption +69%
Efficiency -33%
A710 and A510 are really not looking good https://t.co/6ttZ8bOIVP pic.twitter.com/TuVFiE0Dce

— Golden Reviewer (@Golden_Reviewer) December 25, 2021

TSMC has a superior 4nm process than Samsung Foundry, hence the Dimensity 9000 could perform better and experience less overheating than the other two chips. Although the views by the tipsters are not definitive, it remains to be seen how the demand for these high-end chips pans out this year. The global chip shortage is still projected to persist beyond the first half of 2022.

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(via)

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OPPO Find X4 to be released in February or March, Dimensity 9000 and Snapdragon 8 Gen 1 variants in the cards

Zohaib Ahmed — Mon, 20 Dec 2021 06:57:00 +0000

The OPPO Find X4 series, comprised of the Find X4 and Find X4 Pro, will be released in February and March after the Chinese spring festival, although the exact date has yet to be determined.

The info comes from notable industry insider Digital Chat Station who further revealed that the two models will be powered by the latest MediaTek’s Dimensity 9000 and Qualcomm’s Snapdragon 8 Gen 1 processors. While the former will likely be powering the vanilla Find X4, the latter will be featured on the Pro variant.

Both models have also been revealed to stick to ordinary telephoto solutions for the cameras, without the use of any periscope technology. However, the tipster also hinted at the existence of an OPPO Find X4 Ultra/Pro+ variant that may make up for the lacking.

Lastly, it was stated under the same Weibo post that the OPPO Find X4 series may both feature 80W fast charging. OnePlus will also likely be adopting the charging tech, although some realme phones will be upgraded to ultrafast 150W charging solutions.

Recently on December 16, MediaTek held a press event for its Dimensity 9000 5G mobile platform wherein it was announced that the next-generation Find X flagship series will be launched with the Dimensity 9000 5G mobile platform for the first time.

2021’s Find X3 Pro

The processor was first announced back in November and uses TSMC’s 4nm process paired with the latest Arm v9 architecture combination, making it a highly energy-efficient yet performant offering.

As for the OPPO Find X4, alleged specifications of the device have already emerged well before launch and you can check them all out from here.

MediaTek Dimensity 9000 is over 4 times faster than Snapdragon 888 in AI Benchmark results

Sean — Wed, 15 Dec 2021 07:24:56 +0000

A new benchmarking result has just showcased some interesting information regarding the upcoming MediaTek Dimensity 9000 SoC. The chip managed to easily outclass almost every other chipset in the high end smartphone market, and even managed to achieve a score many times higher than others in some tests.

According to data from AI Benchmark, the Dimensity 9000 chipset beats every other chipset in almost every test. These results for the latest flagship chipsets were obtained with the AI Benchmark V5 Preview. In these tests, the Taiwanese chipmaker’s upcoming high end chip was pit against notable contenders like Google Tensor, Exynos 2100, HiSilicon Kirin 9000, Snapdragon 888, and even other Dimensity chips.

While the Dimensity 9000 lead the list in most categories the most notable achievement was its AI Score. Looking at the results, the new chipst easily outperformed its rival by a large margin. With a score of 692.5 on AI scores, it was 2.7 times higher than the Google Tensor, 3.7 times higher than the Exynos 2100, 3.9 times higher than the Kirin 9000, and a whopping 4.2 times higher than the Snapdragon 888.

While these results look good on paper, average users might be hard pressed to see the difference in performance based on just AI related tests. As of right now, this aspect helps in areas like face recognition, photography, AR, voice recognition, smart voice assistants, and more. In other words, it doesn’t mean that the chip is faster in terms of computing, but “smarter” in terms of AI based tasks.

MediaTek Dimensity 9000 will cost nearly twice as much as its predecessor

Zohaib Ahmed — Mon, 29 Nov 2021 11:17:25 +0000

The MediaTek Dimensity 9000 chip will cost nearly twice its predecessor – the MediaTek Dimensity 1200 – and devices equipped with it will hence likely be pricier than usual. However, it will still be cheaper than Qualcomm’s upcoming Snapdragon 8 Gen1 processor, expected to be announced this week during Tech Summit.

The info comes from industry insider Digital Chat Station who has also revealed that the Dimensity 9000 will begin shipping from Q1 2022. It will be joined by the Dimensity 7000 upper-mid-range chip not long after, which is expected to put an end to the dominance of the Snapdragon 870 chip in the market.

The Dimensity 9000 chip will be MediaTek’s new flagship when it goes live and will be superseding the Dimensity 1200 from this year. It will be built on the 4nm fabrication process, which should improve performance while also being more power-efficient. The new sub-6GHz 5G chipset is the first in the smartphone world to use a Cortex-X2 core clocked at up to 3.05Ghz and is the world’s-first smartphone chip to include Bluetooth 5.3.

There’s a 1+3+4 setup for the cores, with a single Cortex-X2 “ultra core” joined by a cluster of 3X Cortex-A710 “super cores” clocked at up to 2.85Ghz. The two are complemented by a cluster of 4 efficiency Cortex A510 cores clocked at 1.8Ghz. The chipset supports LPDDR5x RAM speeds of up to 7500Mbps and has 14MB of cache.

The Dimensity 9000 is expected to arrive on the market in February and the upcoming Redmi K50 series may be one of the first to feature it.

MediaTek Dimensity 9000-powered smartphone to reportedly launch in February 2022

Jeet — Fri, 26 Nov 2021 07:54:24 +0000

MediaTek recently took the wraps off its Dimensity 9000 chipset which is a flagship offering from the company for premium smartphones and will be competing against the upcoming Qualcomm Snapdragon 8 Gen1.

Now, a tipster from China has revealed through Weibo (via MyDrivers) that the first smartphone powered by the MediaTek Dimensity 9000 will be launched in February 2022. However, more details related to this is not yet available.

If this turns out to be true, then it means that while MediaTek became the first brand to launch its flagship chipset made using TSMC’s 4nm process, the devices powered by this chip won’t be the first one as Qualcomm will likely grab that opportunity.

The MediaTek Dimensity 9000 features a single Cortex-X2 performance core clocked at 3.05GHz, three Cortex-A710 cores at 2.85GHz, and four Cortex-A510 efficiency cores at 1.8GHz. It packs a 10-core Arm Mali-G710 that takes care of graphics processing.

The chipset also comes packed with MediaTek’s fifth-generation APU with six total cores for AI processing. It is claimed by the company to offer four times the performance and power efficiency compared to its previous generation.

It supports LPDDR5x memory at bandwidths of up to 7,500 Mbps. It can handle screens with up to a 180Hz refresh rate at FHD+ resolutions. It is also the first chipset to have an 18-bit image signal processor, offering the ability to capture 4K HDR video using up to three cameras at the same time, or still photos using up to a massive 320MP sensor.

MediaTek Dimensity 9000 supports Wi-Fi 6E as well as Bluetooth 5.3 and supports 3CC carrier aggregation for sub-6HZ 5G with top data speeds of up to 7Gbps.

MediaTek’s VP claims the Dimensity 9000 squares up with Apple A15 Bionic in benchmark tests

Jed John Ikoba — Mon, 22 Nov 2021 20:39:45 +0000

Chipmaker MediaTek is leaping into the high-end segment of smartphones with its innovative Dimensity 9000 chip. The SoC is the company’s first real foray into the production of highly powerful chips that could compare with the leading lights used in flagship models.

Ahead of MediaTek’s Annual Summit, the company has highlighted the features of the Dimensity 9000 which is seen as its most technically advanced chipset so far. MediaTek’s Vice President of Corporate Marketing, Finbarr Moynihan, threw more light on the new flagship chipset during an interview with DigiTrend. Importantly, the Dimensity 9000 is the first chip to be produced using the advanced 4nm process. It is also the first chip that uses the ARM Cortex X2 core, based on the innovative ARM V9 architecture. The ARM Cortex X2 offers up to 3.05 GHz and combines with up to seven lower Cortex A710 and A510 cores. The GPU of the Dimensity is ARM’s Mali G710 Graphics Processing Unit.

The MediaTek VP claims the flagship chipset is expected to pair up with the Apple A15 Bionic in multi-core benchmark tests. Curiously, Apple’s own flagship chipset is built using a 5nm process. Moynihan also made reference to the Dimensity 9000’s recent feat of hitting an AnTuTu score of over a million points for the first time.

The Dimensity 9000 has enjoyed substantial upgrades from MediaTek’s previous highest chip. It will have a 14MB total cache which is as high as it can get for any smartphone. The all-around innovation in the MediaTek Dimensity 9000 chip also includes camera resources, display capabilities and it could be well-primed for gaming applications. The Dimensity 9000 will support Bluetooth 5.3 connectivity and will have a 5G modem operating at the latest quality, 3GPP Release 13.

The 4nm process is a massively complicated process leading to the production of the cutting-edge 4nm chips. It requires close collaboration, according to MediaTek, and the company’s proximity with the TSMC foundry in Taiwan where the chips were built, helped a lot. It is expected that the MediaTek Dimensity 9000 chip will compete favorably with the flagship offerings in the field, it will be more power-efficient among several other performance metrics.

Overall performance of the smartphone powered by the Dimensity 9000 chip is expected to be substantially higher. The company’s partners are already developing smartphones that will be powered by the chipset and the first smartphones could be launched by the end of Q1, 2022. It remains to be seen if the Diemnsity 9000 can indeed be compared with the current league of flagship processors. Only time will tell.

MediaTek Dimensity 9000 flagship chipset built using TSMC’s 4nm process goes official

Jeet — Fri, 19 Nov 2021 01:58:02 +0000

MediaTek has announced its latest flagship smartphone processor — the Dimensity 9000 which is the company’s most powerful chip so far and is aiming to compete against the best chips from companies like Qualcomm and Samsung.

The MediaTek Dimensity 9000 is the world’s first chipset to be manufactured using TSMC’s 4nm process and is also the first to use ARM’s new v9 architecture. Not just that, it is also the first chipset announced with ARM’s new core designs.

It comes with a single Cortex-X2 performance core clocked at 3.05GHz, three Cortex-A710 cores at 2.85GHz, and four Cortex-A510 efficiency cores at 1.8GHz. For graphics, the chipset features a 10-core Arm Mali-G710.

There’s also MediaTek’s fifth-generation APU with six total cores for AI processing. It is claimed by the company to offer four times the performance and power efficiency compared to its previous generation.

The Dimensity 9000 will support LPDDR5x memory at bandwidths of up to 7,500 Mbps. It is also said to be able to handle screens with up to a 180Hz refresh rate at FHD+ resolutions.

Coming to the photography department, the chipset supports the first 18-bit image signal processor, which offers the ability to capture 4K HDR video using up to three cameras at the same time, or still photos using up to a massive 320MP sensor.

For connectivity, the Dimensity 9000 supports Wi-Fi 6E as well as Bluetooth 5.3. There’s no integrated modem with mmWave 5G support but the company says it supports 3CC carrier aggregation for sub-6HZ 5G with top data speeds of up to 7Gbps.

Devices powered by this new Dimensity 9000 SoC are expected to be available in the market as soon as the first quarter of 2022. To know for sure how the chipset performs, we will have to wait to test a real smartphone powered by this new SoC.

The launch of the MediaTek Dimensity 9000 flagship chipset comes when the Taiwan-based company has seen impressive results in the year 2020 and 2021 and is now the world’s largest smartphone chipset maker with around 40 percent of the market share. It is also claimed to be growing at 28 percent in the 5G SoC market.

Noted tipster reveals MediaTek’s Dimensity 2000 will bear a different moniker

Jed John Ikoba — Mon, 15 Nov 2021 12:57:33 +0000

Taiwanese semiconductor manufacturer MediaTek made a grand return to the high-end mobile chip segment with the launch of the Dimensity 1000 series. The company is planning to unveil a successor to the Dimensiity 1000 SoC and earlier rumors tip the next-generation premium chipset to bear the moniker Dimensity 2000.

However, a new leak has emerged showing the device will be known by a different name. Noted tipster Ice Universe has disclosed via a Weibo post that MediaTek’s next-gen chipset will be known as Dimensity 9000 instead of the expected Dimensity 2000 naming.

This comes at the same time it is rumored that Qualcomm’s next-generation Snapdragon 898 chipset will bear a different naming scheme viz-a-viz Snapdragon 8 Gen1. There may be no reason other than the need to tweak things a bit for this rumored name change.

The alleged Dimensity 9000 is reportedly based on TSMC’s 4nm process. The CPU consists of a 3.0GHz Cortex X2 super core + three Cortex A710 cores + four Cortex A510 small cores, while the GPU is expected to be the Mali-G710 MC10 which should be behind the Adreno 730 GPU that the Snapdragon 898 will feature.

The Dimensity 9000 will likely not be as powerful as the Snapdragon 898 but will likely not be too far behind. Since it uses TSMC’s 4nm process, it may provide better power consumption than the Qualcomm chip which will be built on Samsung’s 4nm process.

MediaTek’s next-gen premium chipset is expected to make its debut in early 2022.