Chinese manufacturer Rouyu (Royole) Technologies has claimed the title of the first manufacturer to release a foldable phone with a flexible display. The phone which is called the FlexPai was unveiled at an event yesterday.

We didn’t get the full specifications of the device yesterday. Thankfully, an official page for the device is now up on the manufacturer’s website and it has the full specifications and some other details.

The FlexPai has a display that measures 7.8-inches diagonally. It is an AMOLED panel with a 1920 x 1440 resolution and a 4:3 aspect ratio. Powering the device is Qualcomm’s next-gen Snapdragon 800 series processor which is clocked at 2.8GHz.

I guess they are trying not to explicitly call it the Snapdragon 855 or the Snapdragon 8150 until Qualcomm officially announces the chipset. Thanks to the FlexPai’s spec sheet, we know the processor will have an Adreno 640 GPU.

The spec page says the processor is paired with 8GB of RAM and 256GB of storage. However, we know from yesterday’s launch that there is also a 6GB RAM + 128GB version and an 8GB RAM + 512GB version.

The FlexPai has a 16MP + 20MP camera with a f/1.8 aperture size. The page doesn’t specify if that’s the aperture for both sensors or just the primary one. Although it does mention that there is optical image stabilization.

The device packs a 3,800mAh battery with support for 5V/5A fast charging via their proprietary Ro-Charge technology. It also has support for dual SIM (nano only), storage expansion (256GB max), Bluetooth 5.1, GPS, and Wi-Fi. Supported LTE bands are 1, 3, 4, 7, 8, 12, 34, 38, 39, 40, and 41. There is a USB-C port for charging and audio.

The FlexPai weighs 320g and measures 134 x 190.35 x 7.6 mm. Royole says the phone will ship with the 5V/5A fast-charging adapter, a pair of USB_C headphones, a USB Type-C cable, a Type-C to 3.5mm cable, and a carrying case.

https://youtu.be/ZjdGhHLQIH4

READ MORE: Lenovo and LG Display reportedly working on a 13-inch foldable tablet

The site also has videos showing the device in action. Apparently, you will be able to drag files from one window to another when in split-screen mode and also be able to use the device in tent mode.

The post Complete specifications and details of the FlexPai foldable smartphone appeared first on Gizmochina.

In 2016, Microsoft and Qualcomm announced that there’ll be Windows 10 PCs powered by Qualcomm’s ARM processors. Later, we saw the first wave of such devices, powered by Snapdragon 835 SoC. In June this year, Qualcomm announced the Snapdragon 850 Mobile Compute Platform, which is based on the Snapdragon 845 Mobile Platform.

Now, Lenovo has launched the Lenovo Yoga C630, which is the first laptop powered by Qualcomm Snapdragon 850 mobile computing platform. With the new chipset, the company claims up to 30 percent better performance compared to the first generation of Snapdragon-powered Windows laptops.

The new chipset has also come with an upgraded CPU cores and a more capable GPU compared to the older Snapdragon 835. It also has a SIM card slot and packs Qualcomm’s X20 cellular modem for speeds of up to 1.2Gbps, compared to 1Gbps on previous Snapdragon laptops.

The Lenovo Yoga C630 is a convertible 13.3-inch laptop with Full HD display, full-sized keyboard, and roomy & responsive trackpad. It comes with 4GB or 8GB LPDDR4X RAM, and 128GB or 256GB UFS 2.1 storage. It device comes with two USB 3.0 Type-C ports, a headphone jack, and a fingerprint scanner.

Another feature of the Lenovo Yoga C630 that catches the attention is the battery life. The company is promising over 25 hours of battery life that no one else is offering. The laptop comes in a chassis that’s about 12.5mm thin and weighs 1.2kg.

Read More: Xiaomi and Lenovo could be working on a 5G smartphone powered by Qualcomm chipset

The Lenovo Yoga C630 will be available for purchase in November, with a starting price of $849.99. While Lenovo has already announced its device powered by Snapdragon 850, the South Korean manufacturer Samsung is also currently working on a laptop powered by the Snapdragon 850.

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Most of the 2018 Android flagship phones feature the Snapdragon 845 mobile platform. It will be succeeded by the 7nm Snapdragon 855 SoC that is rumored to be debut by the end of this year. Qualcomm has another chipset called Snapdragon 850 that offers slightly better performance than SD845 since it has been designed for Always-Connected PCs. The U.S. based chip maker had unveiled it the Computex 2018 tech event in June. A mysterious Lenovo device with Snapdragon 850 has been spotted on Geekbench benchmarking site. It reveals that Snapdragon 850 powered laptops and 2-in-1 devices will deliver better performance than devices powered by Snapdragon 835.

The Lenovo 81JL device that is powered by Snapdragon 850 is running on Windows 10. In single-core test, the Lenovo device has scored 2263 points and in multi-core test, it has recorded a score of 6947 points. In comparison, the ASUS NovaGo TP370QL that is driven by Snapdragon 835 had respectively scored 1802 and 6475 points on Geekbench. This shows the Snapdragon 850 offers improved single-core performance and its multi-core performance is not very different from Snapdragon 835.

To say again, the Snapdragon 850 offers around 25 percent improvement in single-core performance and, but the multi-core performance has increased by 7.3 percent against the SD835 chipset. However, it is advisable to take the benchmark scores of the new Lenovo device with a pinch of salt as it could be a prototype device. The final benchmarking scores of the actual device could be different.

According to Qualcomm, the Snapdragon 850 SoC can deliver 30 percent better performance than SD835. Since the above benchmarks suggests that the SD850 will offer improved single-core performance, it means that users will notice better performance on such devices as most of the apps normally make use of single-core processor. In fact, the Snapdragon 850 is similar to the Snapdragon 845 SoC that powers flagship phones running on Android OS. The main difference between them is that the former produces higher clocking speeds of 2.95 GHz instead of 2.7 GHz.

Read More: Is Lenovo’s ZUK brand about staging a comeback?

The Lenovo 81JL seems to be one of the forthcoming Snapdragon 850 powered Always-Connected PCs. Other manufacturers such as ASUS, HP and Samsung are also working on SD850 devices. Rumors have it that the first devices fueled by Snapdragon 850 may hit the market by the end of this year.

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Rumors about the existence of Snapdragon 1000 SoC had surfaced in the previous month. The chipset is expected to be aimed towards powerful Windows 10 PCs. Fresh information on the features of the upcoming Qaulcomm Snapdragon 1000 has surfaced today.

The previous report had claimed that the Snapdragon 1000 may include Cortex A76 performance cores and lightweight Cortex A55 cores. Fresh report on WinFuture.de reveals that the developer platform of the Snapdragon 1000 that is codenamed Project Poipu was recently spotted with specs like 16 GB of LPDDR4X RAM and a pair of UFS 2.1 storage of 128 GB. It also includes Gigabit WLAN (also available on Snapdragon 850) and a new power management chip.

The TDP which stands for Thermal Design Power of the Snapdragon 1000 is around 12 watts. This suggests that it could rival with the U series chipset from Intel that has a TDP of 15 watts. The higher the TDP, the more stable is the processor. Hence, it seems that the Snapdragon 1000 will be able to deliver better performance than Intel’s Atom and Celeron chips. The U series chips are used for powering Ultrabooks. So, there is a possibility that the Snapdragon 1000 may power thin-sized laptops with small form factor.

The newly introduced Snapdragon 850 as well as the Snapdragon 845 SoC measure 12.4 x 12.4mm. The dimensions of the upcoming Snapdragon 1000 are 20 x 15mm which shows that it is bigger than the recent flagship chipsets by Qualcomm. Even though it is a large-sized chipset, it is still smaller than 15-watt Intel chips, claims the report.

Read More: TSMC To Soon Start Mass Producing Qualcomm Snapdragon 7nm Chipsets

The new report also claims that the Snapdragon 1000 will be a socketed chipset. In other words, the SoC will not be soldered to the motherboard. This will make it possible for the user to easily swap the chip. Hence, users may have the power to replace their old Snapdragon processor with the newest one on their Windows 10 PC.

Qualcomm is known for selling processors that are soldered to the motherboard. However, rumors surrounding the SD1000 suggest the U.S.-based chip maker could be venturing a new territory of manufacturing swappable processors.

There is no information available on the launch date of Snapdragon 1000. ASUS could be one of the first companies to launch SD1000 powered PC as it is rumored to be working on a device called Primus that features the same SoC.

(source|via)

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Few days ago, Qualcomm had unleashed the Snapdragon 850 chipset as an overclocked edition of the SD845. The SD850 is expected to offer 30 percent better performance than SD835 powered devices like Hp Envy x2 and ASUS NovaGo. The new chipset has mainly designed to power ARM computers. Fresh information revealed by reliable tipster Roland Quandt states that Qualcomm is also working on a more powerful chipset called Snapdragon 1000 for Windows 10 ARM PCs.

Even though the upcoming processor is being referred to as Snapdragon 1000, it may arrive in the market with a different name. Preliminary information suggests that it is designed to take Intel powered laptops.

The tipster has revealed that the Snapdragon 1000 is likely to deliver a TDP (Thermal Design Power) of up to 12W. It is nearly twice more than SD850 that has a maximum TDP of 6.5W. The U-series processors from Intel such as 8250U and 8550U have 15W TDP and are equipped with quad cores with two threads each.

There is no information available on the specs of the Snapdragon 1000. However, it is likely to arrive with Cortex-A76 architecture that was recently unveiled by ARM. It is designed to produce a maximum clocking speed of up to 3 GHz and 35 percent better performance compared to predecessor Cortex A75. The Cortex A76 is expected to be aimed towards smartphones. However, it may deliver higher clocking speed in laptop-like devices and it may be able to produce the same clocking speed for longer duration through advanced cooling.

Read More: Snapdragon 429 and Snapdragon 439 SoCs Coming, For Android Go Devices

Quandt has claimed that the Cortex A76 inside the SD 1000 could be coupled with Cortex A55 that was announced at the beginning of this year. It is speculated to be built with 7nm manufacturing process by TSMC. Also, devices powered by it will be running on ARM version of Windows which carries support for x86 apps.

The tipster has added that ASUS could be the first manufacturer to launch Snapdragon 1000 powered laptop. The prototype of the ASUS device is named as Primus and it is speculated to come with 1080p display and WiGig wireless connectivity.

(source)

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Qualcomm is focused on expanding its chipset business and along with making chips for mobile phones, the company is also making chips for the Internet of Things devices, VR headset, among others. Now, at Computex 2018 in Taiwan, the company unveiled the Snapdragon 850 processor, which is specifically designed for Windows devices.

The chip is supposed to drive a new generation of Windows devices on Snapdragon chipset, made by Qualcomm‘s numerous partners. Samsung has already announced that it will be making a 2-in-1 PC powered by the Snapdragon 850.

The chipset features ARM processors, integrated LTE, long battery life, and an instant-on resume with no hibernation. As the Snapdragon 850 is meant to be used in devices bigger than a smartphone, it can run at higher clock speeds without overheating. It has a faster 2.96GHz clock speed, which makes the processor about 30 percent faster than the SD835.

The Snapdragon 850 is built on the same second-generation 10nm process as the Snapdragon 845, and it’s paired with the same X20 modem for cellular connectivity. The company says that the Snapdragon 850 includes both hardware and software tuning to make it better at performing PC activities compared to the Snapdragon 845.

The Snapdragon X20 modem can now reach speeds of 1.2 Gbps, and Qualcomm will be leveraging the AI capabilities of their Hexagon DSP a lot more with the new platform. The new platform, according to Qualcomm, along with improved performance, should provide +20% battery life, and +20% wireless speeds.

The Qualcomm Snapdragon 850 also uses the upgraded audio and video codec features and include support for H.264 and HEVC 4K encode and decode for video playback services. It has extended support for 4K video capture from integrated cameras.

On the audio front, it has improved dynamic range and reduced harmonic distortion metrics on its audio codec, and both analog and digital audio output is supported with Qualcomm’s Aqstic and aptX technologies.

Read More: Qualcomm Snapdragon 710 vs Snapdragon 660 vs MediaTek Helio P60: Best Midrange SoCs Compared

For the new platform, Qualcomm is offering more assistance to the OEMs and vendors when it comes to reference designs and components, such as reference modem design and layout.

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A few days ago, we reported that Snapdragon 845-powered Windows 10 on ARM devices were coming soon. There was even a Geekbench listing that showed the chipset was clocked higher than the regular SD845. New reports say that chipset is actually the Snapdragon 850.

According to Winfuture.de, Qualcomm will release the Snapdragon 850 early but there is a catch. The SD850 chipset is just a higher clocked Snapdragon 845 (just the way the SD821 is a higher clocked version of the 820) but one that will be used for Windows 10 devices powered by ARM.

Although the chipset will be clocked higher, it will come with the same X20 modem and offer Gigabit LTE. Below are Geekbench results of a test device from Qualcomm and one from Lenovo.

New Devices That Will Be Powered By The Snapdragon 850 Chipset

Winfuture.de was able to get info on the devices in development that will come with the new chipset. HP is said to be working on its second device which is codenamed Chimera 2. The Snapdragon 835-powered HP Envy X2 was codenamed Chimera. Production for the Chimera 2 will be handled by Taiwan’s Quanta.

Lenovo is also working on a new device codenamed ELZE1. Its first ARM PC, the Lenovo Miix 630 is still listed as coming soon. Taiwanese ODM, Compal, is said to be handling production for Lenovo. ASUS is also working on a new device codenamed Thanos.

While the aforementioned manufacturers are returning for the second-gen models, a new player is joining the game. It has been reported that Dell is also making a Windows 10 on ARM device.

READ MORE: Snapdragon 710 Pops Up on GeekBench With Impressive Flagship-grade Score

With respect to release dates, documents are said to have mentioned a summer arrival. We presume they may actually be announced this summer but won’t go on sale until autumn or maybe even winter.

(Sources: 1, 2, 3)

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