The Snapdragon 8 Gen 5 is the first non-Elite chipset to feature the powerful Oryon cores. The chipset offers solid gaming performance, a flagship-grade ISP, and reliable connectivity, making it a powerful choice among premium mid-range phones.

On the other hand, the Dimensity 9300 is two years older than the Snapdragon 8 Gen 5. Still, it offers smooth performance and excellent efficiency to be considered a reliable choice, and more importantly, at a lower price.

So, the real question is: does it make sense to go with the Snapdragon 8 Gen 5, or is the Dimensity 9300 a solid choice at a relatively lower price? Let’s find out in this detailed comparison.

Quick verdict:

Choose Snapdragon 8 Gen 5 if you want higher CPU performance, sustained gaming performance, flagship ISP, and modern connectivity features.
Choose Dimensity 9300 if you want reliable performance and excellent efficiency at a lower price point.

Snapdragon 8 Gen 5 vs Dimensity 9300: Spec sheet

Snapdragon 8 Gen 5 vs Dimensity 9300: Benchmark numbers

Note: To obtain the benchmark results, the tests were performed using these devices:
– OnePlus 15R (Snapdragon 8 Gen 5)
– Vivo X100 Pro (Dimensity 9300)

Geekbench score (v6)

The Snapdragon 8 Gen 5 outperforms the Dimensity 9300 in both single-core and multi-core tests. In both tests, the Snapdragon chip achieves about 27% higher score, suggesting a snappier performance, particularly in tasks that require greater CPU resources.

AnTuTu score (v11)

On the AnTuTu benchmark, the Snapdragon 8 Gen 5 scores 2.96 million, while the Dimensity 9300 sits below it with 2.32 million total score. That’s a solid 27% uplift for the Snapdragon chip.

The breakdown of the AnTuTu score paints a better picture, and unsurprisingly, the Snapdragon 8 Gen 5 dominates all aspects. The CPU gets 32% higher score, the GPU gets 19% higher score, memory performance is up by 13%, and the UX score is up by 44%.

3DMark score

Wild Life Extreme Stress Test

This is a widely popular gaming benchmark, where the Snapdragon 8 Gen 5 outperforms the Dimensity 9300 by a wide margin. It achieves a 23% higher best loop score and a whopping 71% increase in the lowest loop score. So, not just the performance, the Snapdragon chip also maintains higher stability.

While benchmarks offer great insights into performance and stability, they don’t focus on other key aspects, including connectivity, camera, and features. To give you a clearer picture, we’ve included them in the following section.

Snapdragon 8 Gen 5 vs Dimensity 9300: Key differences

Process node

The Snapdragon 8 Gen 5 uses TSMC’s newer 3nm node, which offers better performance and power efficiency than the 4nm node used in the Dimensity 9300.

Performance

CPU

Both chipsets feature octa-core CPUs, although their core configurations differ. The Snapdragon 8 Gen 5 uses a (2 + 6) layout, featuring two Oryon prime cores at 3.8 GHz and six Oryon performance cores at 3.32 GHz. The Dimensity 9300 features a (1 + 3 + 4) layout, which includes one Cortex-X4 prime core at 3.25 GHz, three Cortex-X4 performance cores at 2.85 GHz, and four Cortex-A720 efficiency cores at 2.0 GHz.

The Snapdragon 8 Gen 5 prioritizes performance by offering a higher peak clock speed of 3.8 GHz. In fact, all the CPU cores in the Snapdragon chip run at higher clock speeds than those in the Dimensity 9300. This is one of the primary reasons the Snapdragon chip easily outperforms the Dimensity 9300 in benchmarks.

GPU

As for the gaming and graphics rendering, the Snapdragon 8 Gen 5 uses a powerful Adreno 829 GPU featuring Qualcomm’s “sliced” architecture. The GPU offers excellent ray tracing performance, support for Unreal Engine 5, and AI-assisted upscaling. It also bundles a full suite of Snapdragon Elite Gaming features to deliver a smooth gaming performance with consistently high frame rates, low latency, and improved power utilization.

The Dimensity 9300 features a 12-core Arm Immortalis-G720 GPU, promising console-level global illumination effects. The GPU is equipped with a 2nd-gen hardware ray tracing, which is claimed to offer “fast, full raytracing experiences at a smooth 60 fps.” The chip also features MediaTek HyperEngine Adaptive Gaming Technology to deliver flagship performance without slowdowns for up to an hour in top titles, along with better cooling and improved power efficiency.

NPU

The Snapdragon 8 Gen 5 features a very capable Hexagon NPU, which integrates with an Oryon CPU and Adreno GPU to enable on-device agentic assistants, multimodal AI, and heavier gen-AI workloads in high-end devices. It is essentially a slightly binned-down version of the 8 Elite Gen 5 AI platform, with nearly all of the same features but lower peak clocks.

The Dimensity 9300’s AI stack is built around the MediaTek NPU 790, which delivers substantial efficiency and speed gains over the previous generation. It can run LLMs with up to 33 billion parameters and real-time generative AI. The AI stack enables the SoC to run multi-modal, multi-LLMs setups at usable latencies, entirely on-device.

Camera

The Snapdragon 8 Gen 5 features a 20-bit Spectra AI ISP with up to 320MP single camera and up to 4K/120fps video recording, although OEMs can enable up to 8K recording. The chip also supports limitless real-time semantic segmentation for precise optimizations. Plus, it offers a range of camera features (including AI-assisted features) to deliver greater quality with less noise.

On the other hand, the Dimensity 9300 is equipped with an 18-bit Imagiq 990 ISP, supporting up to 320MP single-camera and up to 8K video recording. The chip features an AI Semantic Analysis Video Engine with 16 categories of scene segmentation adjustments for enhanced cinematic video capture. It also features zero-latency video preview and 100% pixel-level autofocus + dual-lossless zoom.

Connectivity

While both chips offer robust connectivity, there are several important differences to consider. On a 5G connection, the Snapdragon 8 Gen 5’s download speed can reach up to 10 Gbps, while the Dimensity 9300 peaks at 7 Gbps. The Dimensity chip bounces back with a higher peak Wi-Fi 7 speed, reaching 6.5 Gbps (vs. 5.8 Gbps on the Snapdragon 8 Gen 5). Another advantage of the Snapdragon 8 Gen 5 is its support for Bluetooth 6.0, while the Dimensity 9300 supports the older Bluetooth 5.3 standard.

Snapdragon 8 Gen 5 vs Dimensity 9300: Which is better?

The Snapdragon 8 Gen 5 is clearly a much better choice over the Dimensity 9300. It offers solid CPU performance, a more consistent gaming performance, and a modern connectivity stack. Plus, it features the advanced Spectra ISP from the Snapdragon 8 Elite Gen 5, integrating the latest camera features and advanced camera optimizations.

That said, the Dimensity 9300 is still a solid mid-range chipset in 2026. It can smoothly run your day-to-day apps while offering excellent efficiency. Gaming performance is also good, but for heavier games and longer sessions, you may want to prefer a more capable chipset like the Snapdragon 8 Gen 5. Perhaps the only advantage it offers over the Snapdragon 8 Gen 5 is its lower price. So, if you’re getting a hefty discount on a Dimensity 9300 phone that makes it much cheaper than a Snapdragon 8 Gen 5 phone, that may be a solid deal. Otherwise, the Snapdragon 8 Gen 5 is a no-brainer choice here.

The post Snapdragon 8 Gen 5 vs Dimensity 9300: Benchmark score, spec sheet, and more appeared first on Gizmochina.

Qualcomm released the Snapdragon 8 Gen 3 in October 2023, and a month later, MediaTek announced the Dimensity 9300. Both are the top-of-the-line flagship smartphone chips of their respective brands.

We already have many smartphones powered by these flagship chips from big brands like Samsung, OnePlus, Oppo, and Vivo. They are usually found at the top of benchmarking platforms. But which one has more power, features, and efficiency? Let’s find out the answer.

Snapdragon 8 Gen 3 vs Dimensity 9300: Specs

Snapdragon 8 Gen 3 vs Dimensity 9300: Benchmarks

Companies have different software optimizations, creating differences in the benchmarking results. To minimize that, we have taken two smartphones from the same brand for this comparison — the Vivo X100 Pro (Dimensity 9300) and the Vivo X100 Ultra (Snapdragon 8 Gen 3).

Geekbench 6

The Snapdragon 8 Gen 3 inside the Vivo X100 Ultra performs slightly better in the single-core test. However, the Dimensity 9300 inside the Vivo X100 Pro edges out the Snapdragon 8 Gen 3-powered X100 Ultra by a small margin in the multi-core test.

The Geekbench 6 CPU testing shows a close competition between the Snapdragon 8 Gen 3 and Dimensity 9300 chips. The differences in single-core and multi-core tests are so small that it can go either way with another manufacturer’s phone because of software optimizations.

Despite having four Cortex-X4 cores, MediaTek Dimensity 9300 doesn’t score big in the multi-core test compared to the Snapdragon 8 Gen 3. It’s because only one Cortex-X4 is clocked above 3GHz, while the remaining three max out at 2.85GHz. Qualcomm, on the other hand, has offered higher clock speeds for all the Snapdragon 8 Gen 3 cores.

AnTuTu 10

Snapdragon 8 Gen 3 and Dimensity 9300 have scored similar CPU points on AnTuTu 10, with the Dimensity chip leading by a small margin. However, the Snapdragon chip has a stronger GPU score.

The memory score on AuTuTu goes in favor of the Dimensity 9300 chip because of a higher frequency of 9600MHz (vs. 4800MHz in Snapdragon 8 Gen 3).

3D Mark WildLife

The Snapdragon 8 Gen 3 is ahead of the Dimensity 9300 in GPU testing on 3D Mark WidLife. The Vivo X100 Pro and Vivo X100 Ultra used in the testing aren’t really optimized for gaming, so the difference in results isn’t big.

However, when compared against the Red Magic 9 Pro (Snapdragon 8 Gen 3), the Wild Life test shows a massive 26% advantage. But the Dimensity 9300 still beats the iPhone 13 Pro (A17 Pro) and Galaxy S23 Ultra (SD 8 Gen 2).

Although the Dimensity 9300 closely competes with the Snapdragon 8 Gen 3 in GPU tests, the latter should be preferred for gaming.

Snapdragon 8 Gen 3 vs Dimensity 9300: CPU & GPU

The Snapdragon 8 Gen 3 features a 1+5+2 CPU layout consisting of one Cortex-X4 prime core, five Cortex-A720 performance cores, and two Cortex-A520 power-efficient cores. Comparing it with Qualcomm’s previous flagship chip, we’ve got one more performance core and one less power-efficient core.

Not just a new CPU layout, the new Snapdraon chip also brings improved CPU cores with increased clock speed. 

MediaTek, on the other hand, has an aggressive approach with the Dimensity 9300 chip. It has four Cortex-X4 cores and four Cortex-A720 cores. Interestingly, one Cortex-X4 core runs at above 3GHz (3.25GHz, to be precise) while the rest operates at 2.85GHz (max). The remaining four Cortex-A720 cores have a maximum clock speed of just 2GHz. So, the Dimensity 9300 has many performance cores, but they run at a lower clock speed.

Qualcomm’s Snapdragon 8 Gen 3 has upgraded cores and improved clock speed, which sounds better than MediaTek’s aggressive approach with Dimensity 9300. But both chips look good on benchmarking platforms, as we have seen already.

The Snapdragon 8 Gen 3 chip has an Adreno 750 GPU with features like hardware-accelerate ray tracing, global illumination, Game Super Resolution, game post processing accelerator, and Snapdragon shadow denoiser.

MediaTek has Immortalis-G720 MC12 inside the Dimenity 9300 for handling GPU tasks. Both are excellent GPUs for smartphones. However, Adreno has a better reputation for gaming performance, which is also reflected in the benchmarking results.

Snapdragon 8 Gen 3 vs Dimensity 9300: Camera

Qualcomm says Snapdragon 8 Gen 3 has the world’s smartest AI-powered camera. It features Spectra triple 18-bit ISPs with real-time semantic segmentation photo and video (up to 12 layers), Visual Analytics 4.0, and supports triple video capture from HDR image sensors with seamless switching between HDR modes.

The Snapdragon chip supports up to 200MP single camera, up to 108MP single camera with zero shutter lag, 64+36MP dual cameras with zero shutter lag, or 36+36+36MP triple cameras with zero shutter lag. It supports 8K HDR video recording at 30fps or 4K recording at 120fps. It also supports 720 slow-mo video recording at 960fps.

The MediaTek 9300 chip supports a higher camera resolution of 320MP, which is yet to be seen in any smartphone. It supports up to 8K video recording at 30fps or 4K at 60fps.

Snapdragon 8 Gen 3 vs Dimensity 9300: Connectivity

The Snapdragon 8 Gen 3 features an X75 5G modem with up to 10Gbps (downlink) and 3.5Gbps (uplink). The chip supports all necessary connectivity features such as Wi-Fi 7, Bluetooth 5.4, NFC, and positing systems (Galileo, Beidou, NavIC, GPS, GLONASS, QZSS).

The Dimensity 9300 chip also supports Wi-Fi 7, Bluetooth 5.4, and the same set of positing systems. It’s also equipped with MediaTek Xtra Range 2.0 technology, which improves the connection reach indoors by up to 4.5mm on a 5GHz connection. The integrated MediaTek 5G modem supports a 7Gbps downlink.

Snapdragon 8 Gen 3 vs Dimensity 9300: Which Is Better?

Snapdragon 8 Gen 3 and Dimensity 9300 are compelling smartphone chips with flagship performance. Both chips have exceptional CPU performance. However, the Dimensity 9300 can be a little bit disappointing when it comes to sustaining a heavy GPU workload.

The Dimensity 9300 is still one of the best choices for a high-end smartphone. It checks most boxes. However, those focusing primarily on performance and gaming should go for the Snapdragon 8 Gen 3.

Other Popular SoCs Comparison:
1. Dimensity 9300+ vs Snapdragon 8 Gen 3
2. Snapdragon 8s Gen 3 vs 8 Gen 3
3. Dimensity 9000 vs Snapdragon 8 Gen 1

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MediaTek, a prominent semiconductor company, has announced a partnership with Google to improve the artificial intelligence (AI) capabilities of smartphones powered by its Dimensity 9300 and 8300 chipsets. 

This collaboration centers on optimizing Google’s Gemini Nano, a large language model (LLM) designed for mobile use, to function more efficiently on these MediaTek processors.

Smartphones often rely on cloud-based solutions for complex AI tasks. The optimization of Gemini Nano for these Dimensity chipsets will allow phones to handle more AI processing directly on the device. 

This approach offers several benefits including enhanced privacy, improved security protocol, greater reliability, reduced latency (faster response times), and the ability to function even with limited internet connectivity.

Currently, there are only a handful of smartphones that are equipped with MediaTek Dimensity 9300 and Dimensity 8300 processors. The former is a premium SoC, so you will find it in flagship devices. While the latter is a mid-range / premium mid-ranger tier chipset. 

Below are the devices that use these chipsets:

MediaTek and Google will also release an application package (APK) running on Dimensity 8300 and Dimensity 9300 to extend compatibility with Gemini Nano. This will make it easier for developers and OEMs to deploy Gemini Nano applications.

Now that MediaTek has joined the AI movement, Google’s robust AI features will no longer be limited to a few select segments dominated by chips from Qualcomm, Samsung, and Google. 

Also, the emphasis on the Dimensity 8300 chipset means that soon, even more affordable mid-range devices will be able to enjoy advanced on-device AI experiences.

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(Via)

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Vivo is reportedly working on a new top end tablet model. The device in question is expected to be the Vivo Pad 3 and some of its key specs have just been leaked. But it seems like this isn’t the only tablet that the company is planning on launching soon. So here are all the details.

Vivo Pad 3 Specs

The latest leak was shared by known tipster Digital Chat Station. He claimed that the upcoming tablet from the Chinese tech giant is equipped with the MediaTek Dimensity 9300 SoC, which is a flagship grade processor. This is in line with our previous report from last month. DCS further added that the tablet will sport a tall screen that will feature rounded corners on every corner.

Apart from this, the device is expected to feature improved performance and fast charging compared to its predecessor. This is not the only tablet that the company is rumored to be working on. Vivo is apparently also planning on launching a new tablet from its iQOO sub brand. While the name of this device wasn’t revealed, the tipster claims that it will sport a large 8.8-inch display.

Earlier this week, we also covered another report that hints that the Vivo Pad 3 will be announced along with the Vivo X Fold 3. Based on what we know so far, the two devices are rumored to debut in the first quarter of next year. Unfortunately, this is all the information we have at the moment so stick around for more as we will be providing updates when additional details are available regarding the Pad 3.

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Oppo Find X7 series is all set to launch very soon with some exciting features. There’s already curiosity among Oppo fans about the device, and some features have already been part of the latest leaks and revealed by public certifications. In addition, the upcoming Oppo Find X7 smartphone is leaked again, and this time its camera specifications are revealed along with slight information about its SoC. The smartphone that is set to feature 100W charging will feature Dimensity 9300.

As per the Digital Chat Station, the smartphone appears to bundle a triple-rear camera module. It will consist of a 50MP Sony LYT-808 Primary camera, a 50MP ultrawide sensor, and 64MP OmniVision’s OV64B periscope telephoto lens. Furthermore, it will feature the recently announced Dimensity 9300 SoC, which is built on TSMC’s 4nm process and includes one Cortex-X4 core at 3.25GHz, three Cortex-X4 cores at 2.85GHz, and four Cortex-A720 cores at 2.0GHz.

Apart from the new information, the new series will consist of two new smartphones, which are the Oppo Find X7 and Oppo Find X7 Pro. Both are expected to feature 100W fast charging and are expected to launch alongside the OnePus 12 globally. The Find X7 Pro is expected to bundle the Snapdragon 8 Gen 3 SoC. It could come with a 6.82-inch AMOLED display with 2K resolution and a 120Hz refresh rate. Further, the rumors claim it will feature Sony’s 1-inch LYT900 sensor while featuring a 2x periscope sensor offering 2.7x zoom with the Sony IM890 and 6x zoom with the Sony IMX858 sensor.

Oppo Find X7 and Find X7 Pro Details

On the flip side, the Oppo Find X7 will come with a Dimensity 9300 SoC, as per AnTuTu and Geekbench benchmarks. It will have a 120Hz refresh rate, 16GB of LPDDR5x RAM, and up to 1TB of UFS 4.0 storage. Both smartphones will run Android 14.

Details about its design are also public, as live images of both the front and rear panels have emerged. It is also said to arrive with support for satellite communication. 

However, other details about the device are not yet available.

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The post Oppo Find X7 Camera Specifications Detailed in a New Leak appeared first on Gizmochina.

The Vivo X100 Pro flagship smartphone was put under a stress test recently, which showed some bleak figures. Although, the issue could be rooted in the device’s SoC, which is MediaTek’s Dimensity 9300.

Vivo X100 Pro takes a massive performance hit in stress test

For those unaware, the X100 Pro is a high end device and the Dimensity 9300 is the chipmaker’s latest flagship processor. However, the smartphone was recently put through a stress test by Sahil Karoul (Via NotebookCheck), who shared the results on X. During the test, it was found that the X100 Pro faced a notable thermal throttling, with a massive drop in performance.

The Dimensity 9300 on the device throttled down to just 46 percent of its max performance after just two minutes of the benchmark. Due to this throttling issue, the performance on one of the cores dropped down to 0.6GHz (max clock speed of 3.25GHz). A separate NotebookCheck report talked about how the Dimensity 9300 doesn’t feature any efficiency cores, which could lead to throttling since the high powered cores (Cortex-X4) draws more power.

While this enables impressive raw performance, the downsize was the thermals. So this stress test might be reflecting that. But keep in mind that a stress test is just to check the CPU’s performance on high loads and does not directly reflect real world performance. Everyday users would typically never hit such extreme loads.

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Vivo is getting ready for a major launch cycle that will have it unveil various different products. This includes foldable phones, flagship devices, and much more. One of these devices includes the Vivo Pad 3 tablet, and now, a tipster has hinted at one of its key specifications.

Vivo Pad 3 may feature Dimensity 9300

The news arrives from known tipster Digital Chat Station who shared the information on Weibo (a Chinese microblogging website). In the online post, DCS claimed that the upcoming Vivo Pad 3 will be equipped with the MediaTek Dimensity 9300 SoC. This would mean that the tablet is a high end flagship grade product. It is also the direct successor to the Vivo Pad 2, which was launched with the Qualcomm Snapdragon 8+ Gen 1 SoC earlier this year.

It is worth noting that the Dimensity 9300 is the same chipset that powers the recently unveiled Vivo X100 and X100 Pro smartphones. For those unaware, the X100 series is the Chinese tech giant’s latest flagship devices. Unfortunately, the tipster did not reveal any other finer details regarding the Vivo Pad 3.

The brand is expected to announce the Vivo X100 Ultra model sometime in April 2024. This will be the top end model of the X100 lineup and is reportedly powered by the Snapdragon 8 Gen 3 SoC. So there is a chance that the Pad 3 could be announced alongside this device. However, it is unclear if Vivo will announce the tablet along with the X100 Ultra, X Fold 3, and X Flip 2 during the same launch event. So stick around for more updates.

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(Source, Via)

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MediaTek has finally unveiled its latest flagship chipset, the Dimensity 9300. The Vivo X100 and X100 Pro, launching on Nov. 13, will be the first phones to feature the said chip. Soon after the announcement, Oppo also confirmed that its next Find-series phone will feature the Dimensity 9300 chip. In all likelihood, the Find X7 phone, which is expected to launch in Q1 2024, will be equipped with the newest Dimensity flagship chip.

OPPO Find X7 likely to feature Dimensity 9300

The Find X7 series will replace the Find X6 and Find X6 Pro, which came equipped with the Dimensity 9200 and Snapdragon 8 Gen 2 chipsets, respectively. As per reports, the X7 lineup will have two models, such as the Find X7 and Find X7 Pro.

Recently, an upcoming Oppo phone with model number PHZ110 was spotted in the database of the Geekbench benchmarking platform. The listing revealed that the device is equipped with the Dimensity 9300 chip, 16 GB of RAM, and Android 14. In the single-core and multi-core tests of Geekbench 6, the device scored 2139 and 7110 points, respectively. It is speculated that the PHZ110 will debut in the market as the Oppo Find X7.

The Find X7 Pro, on the other hand, is expected to feature the Snapdragon 8 Gen 3 chipset. A recent report revealed that the Pro model will be equipped with a 1-inch LYT-900 camera sensor, which will also be seen on the Vivo X100 Pro+ and Xiaomi 14 Ultra premium flagship phones that are expected to launch next year.

A report from August claimed that the Find X7 Pro would be built to meet the shortcomings of the Find X6 Pro. It is also said to come with incremental upgrades, including an enhanced design. The X7 Pro is expected to feature a 2K-resolution display, a 32-megapixel front camera, and a 50-megapixel (LYT-900) + 50-megapixel (LYT-700 ultra-wide) + 50-megapixel (LYT-700) periscope telephoto camera. It may come with other specifications, such as 16 GB of LPDDR5x RAM, 1 T of UFS 4.0 storage, and a big battery with 100W wired and 50W wireless charging support.

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Qualcomm unveiled its flagship Snapdragon 8 Gen 3 processor last month. Now, the American chipmaker’s rival MediaTek has announced its flagship chipset. The Dimensity 9300 is the successor to the Dimensity 9200 / 9200+. It arrives with a host of improvements and changes. The processor is expected to power premium smartphones from various brands. Let’s delve into the technicalities of the Dimensity 9300. 

MediaTek Dimensity 9300 SoC details

The Dimensity 9300 is based on TSMC’s third-generation 4nm process. The configuration comprises of a prime Cortex-X4 core clocked at 3.25GHz, three Cortex-X4 cores at 2.85GHz, and four Cortex-A720 cores ticking at 2.0GHz. The single-core and multi-core performances are said to be improved by 15 and 40 percent respectively. The chipset has an Immortalis-G720 GPU onboard that is claimed to offer 46 percent increased performance in hardware ray tracing compared to the previous generation. 

The Dimensity 9300 supports a hardware-based ray tracing engine and variable rate rendering technology. MediaTek also said that it has worked with game developers to optimize ray tracing in games to offer an immersive visual experience. The processor also has an APU 790 for AI processing power 

The Dimensity 9300 is capable of supporting WQHD display resolution at 180Hz and 4K up to 120Hz. In terms of photography, the processor will support up to 320MP camera sensors. It will also support always-on HDR video recording up to 4K resolution at 60fps and 4K at 30fps with cinematic mode. There is an Imagiq 900 ISP. The Dimensity 9300 is also said to support Ultra HDR format in Android 14. On the hardware front, the processor supports LPDDR5T RAM and UFS 4 storage technology. 

The MediaTek Dimensity 9300 comes with WiFi-7 with an integrated Xtra Range Technology for better long-range connectivity. It also supports sub-6GHz, mmWave, 5G, 4×4 MIMO, and Bluetooth 5.4.  

Vivo’s upcoming X100 series is confirmed to be powered by the MediaTek Dimensity 9300 processor. It is expected to be on the standard X100 variant.

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Like every major smartphone OEM, Vivo is also planning to debut a new generation of flagship smartphones soon. This time, it will be called the Vivo X100 series and is scheduled to debut on November 13th in China. Ahead of its launch, the Vivo X100 has appeared on Geekbench revealing some key details.

Vivo X100 powered by Dimensity 9300

The Vivo X100, identifiable by the model number “V2309A,” will run Android 14 out of the box, with the Chinese version expected to incorporate the new Origin OS 4.

Under the hood, the phone is equipped with a motherboard identified as “k6989v1_64,” built on ARMv8 architecture. The processor is an octa-core system-on-chip (SoC) with a configuration of four cores running at 2GHz, three cores operating at 2.85GHz, and one high-performance core clocked at 3.25GHz. This SoC is none other than the MediaTek Dimensity 9300, a flagship-grade processor, and it comes paired with a Mali-G720-Immortalis MC12 GPU.

The listing also confirms that the Vivo X100 will feature 12GB of RAM, though it’s expected that the device will offer various RAM and storage configurations. Moving on to the benchmark results, the device has managed to score 1642 points in the single-core test and 7199 points in the multi-core test of Geekbench 5. It’s worth noting that the multi-core score of the smartphone is unusually high.

Previously, the smartphone was also spotted on AnTuTu Benchmark with a mind-blowing score of 2,249,858 points, which is significantly higher than the Xiaomi 14 series which features the new Snapdragon 8 Gen 3 SoC. A recent leak has also revealed that the smartphone will debut with a new Sony camera sensor.

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(via)

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MediaTek has announced the upcoming launch of its next flagship mobile chipset on Nov.  6. Although the chip’s official name has not been confirmed, it seems likely that it will be named the Dimensity 9300, succeeding last year’s Dimensity 9200. The D9300 has made appearances on benchmarking platforms like AnTuTu and Geekbench, indicating strong performance capabilities.

Dimensity 9300 specifications (rumored)

MediaTek is yet to reveal the technical details of the Dimensity 9300. Reports have revealed that the chip will not have efficiency as it will only feature performance cores. The AnTuTu listing of the chip revealed it has four Cortex X4 cores, four large Cortex A720 cores, and an Immortalis G720 MC12 GPU. Like the D9200, it will come with support for LPDDR5x RAM and UFS 4.0 storage.

The test device featuring the D9300 chip, 16 GB of RAM, 512 GB of storage, a 120Hz refresh rate display, and Android 14 that appeared on AnTuTu achieved the highest-ever score of 2,055,084 points on the benchmarking platform. It is a total of CPU, GPU, memory, and UX tests, in which the device scored 485,064, 899,463, 357,691, and 312,866 points, respectively.

As per reports, Vivo will unveil the Vivo X100 and X100 Pro smartphones in the third week of November. The X100 lineup also includes the X100 Pro+, which will feature the Snapdragon 8 Gen 3 chipset. This device is expected to launch in the first quarter of 2024.

Recently, an Oppo device with model number PHZ110 was spotted in Geekbench’s database. The D9300-powered device was spotted with 16 GB RAM and Android 14. It scored 2139 and 7110 points, respectively, in the single-core and multi-core tests of Geekbench 6. It is speculated that the PHZ110 will debut in Q1 2024 with the Oppo Find X7 marketing name.

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The next generation flagship mobile chip from MediaTek is the Dimensity 9300 SoC. This chipset will likely power upcoming premium grade smartphones, and now, it has been spotted on a popular benchmarking platform, that showcases its performance.

MediaTek Dimensity 9300 on AnTuTu

The Dimensity 9300 recently surfaced on the AnTuTu 10 benchmark. Looking at this listing, we can see that the high end processor managed to get a score of over 2 million. The score of 2,055,084 points on AnTuTu 10 is a notable upgrade in performance compared to its predecessor, the Dimensity 9200 series. With these results, the chipset has managed to top the benchmark charts for Android devices.

The AnTuTu benchmark listing also reveals the core structure of the Dimensity 9300. It features four Cortex X4 cores and four large Cortex A720 cores. These are paired with the Immortalis G720 MC12 GPU. This chipset supports LPDDR5x RAM and UFS 4.0 storage. In the synthetic benchmark, the device that featured the Dimensity 9300 also included 16GB of RAM, 512GB of internal storage, a 120Hz refresh rate, and ran on Android 14 OS.

The new chipset is expected to launch in flagship phones like the Vivo X100. Apart from this, the Oppo Find X7 series is also rumored to feature some models that feature this chipset. MediaTek’s Dimensity 9300 is expected to be announced early next month, so stick around for more updates regarding this chipset.

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An Oppo phone with the model number PHZ110 has appeared on Geekbench 6, powered by the upcoming MediaTek Dimensity 9300 SoC. The phone, which is believed to be a prototype model of the Find X7, has 16GB of RAM and runs Android 14.

The Geekbench 6 listing reveals that the Dimensity 9300 has a 1+3+4 architecture with up to 3.25 GHz Cortex-X4 Prime core, 3 x Cortex X4 Performance cores at 2.85GHz, and 4 x Cortex A720 power efficient cores at 2GHz, and Immortalis G720 MC12 GPU.

The phone scored 2139 in the single-core test and 7110 in the multi-core test. While the Dimensity 9300’s multi-core score is impressive, the single-core score is slightly lower than the Snapdragon 8 Gen 3, which allegedly surfaced on Geekbench 6 in the Galaxy S24 Ultra.

The Snapdragon 8 Gen 3 is rumored to use a 1+5+2 architecture with 1 x Prime Cortex-X4 CPU core at 3.3GHz, 3 x Performance Cortex-A720 CPUs at 3.15GHz, 2 x Performance Cortex-A720 CPUs at 2.96GHz, and 2 x Efficiency Cortex-A520 CPUs clocked at 2.27GHz.

According to Digital Chat Station, the regular version of Snapdragon 8 Gen 3 will also see an increase in CPU frequency. Additionally, reports suggest that the GPU performance in the Snapdragon 8 Gen 3 for Galaxy could increase by up to 35%.

It is important to note that these are just early benchmarks, and the final performance of the Dimensity 9300 and Snapdragon 8 Gen 3 could vary. However, the results do suggest that both chipsets will be very powerful and offer significant performance improvements over their predecessors.

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Chinese tipsters are claiming that the Xiaomi 14 and 14 Pro will debut as the first Snapdragon 8 Gen 3 phones on Oct. 27 in China. Qualcomm is expected to announce the new chip at the 2023 Snapdragon Summit, which will be held between Oct. 24 and Oct. 26. MediaTek, too, is said to be working on launching its next flagship chip, dubbed the Dimensity 9300. In a new Weibo post, tipster DCS revealed when the first D9300-powered phones will be released in the Chinese market.

According to the tipster, MediaTek will unveil the Dimensity 9300 chip in the next month (November). The Vivo X100 and X100 Pro are poised to become the first line of smartphones powered by the Dimensity 9300 mobile platform. Both phones are expected to debut in the same month. The X100 Pro+, featuring the Snapdragon 8 Gen 3, is likely to launch in Q1 2024.

Dimensity 9300 specifications (rumored)

The MediaTek Dimensity 9300 chipset is crafted using TSMC’s advanced 4nm process and boasts a configuration of 1 x ARM Cortex-X4 prime core, 3 x Cortex-X4 cores, and 4 x Cortex-A720 cores, delivering improved power efficiency compared to its predecessor. Notably, the Cortex-X4 ultra-large core, based on Armv9 architecture, pushes the boundaries of smartphone performance, offering a 15 percent boost over the X3, while also reducing energy consumption by 40 percent.

On the other hand, the Cortex-A720 is set to become the mainstream large core in the coming year, enhancing the sustained performance of mobile devices and serving as the primary core in the new CPU cluster. It is expected to offer maximum clocking speeds of 3.25 GHz. For graphics, the chip is said to be equipped with the latest ARM Immortalis G720 MC12 GPU.

The leaked specifications of the Dimensity 9300 chipset indicate a substantial advancement in both performance and power efficiency. This positions it as a strong contender to compete with Apple’s chips in the realm of performance, challenging the recently unveiled A17 Pro that powers the iPhone 15 Pro series.

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MediaTek is rumoured to launch its highly anticipated MediaTek Dimensity 9300 flagship processor this month, just right before the launch of Qualcomm’s Snapdragon 8 Gen 3 on 26 October 2023. And the latest info from a reputable leaker reveals that the CPU clock speeds, structure and GPU of the upcoming MediaTek Dimensity 9300 are much better than we initially expected.

Shared by popular leakster, Digital Chat Station on Chinese social media platform Weibo, the MediaTek Dimensity 9300 is set to be an octa-core CPU processor featuring 8 CPU performance cores, and no CPU efficiency cores, the first of its kind in the Android smartphone space. The CPU core structure seems to be a 1+3+4 structure with 1 ARM Cortex X4 Prime core, 3 ARM Cortex X4 cores, and 4 ARM Cortex A720 cores. 

The peak clock speed of the CPU clock speed is expected to break 3.25 GHz as per the Weibo post stated, and the GPU under the hood is the latest ARM Immortalis G720 MC12 GPU for mobile processors. Digital Chat Station also shared that he has seen the MediaTek Dimensity 9300 surpass the Snapdragon 8 Gen 3 in the Antutu v10 benchmark scores, both in the CPU and GPU departments. As for the power efficiency of the Dimensity 9300, Digital Chat Station mentions that he is keeping his mouth shut on the matter until the official launch of the flagship SoC by MediaTek this month.

The MediaTek Dimensity 9300 was earlier confirmed to be manufactured on TSMC’s famous N4P process, which is a 4 nm process node offering a performance increase and notable power efficiency improvements over the other N5 and N4 processes. In addition, the Dimensity 9300’s Cortex-X4 cores are predicted to offer a 15% performance improvement and a 40% reduction in power consumption. Additionally, the Cortex-A720 cores are expected to achieve a 20% increase in energy efficiency.

What do you think about MediaTek’s upcoming Dimensity 9300? Let us know your thoughts in the comments below.

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[Update] MediaTek has reportedly contacted NotebookCheck, asserting that the mentioned report is “completely false and has no source or basis in fact”. The original story continues….

Rumors suggest that MediaTek is set to unveil its Dimensity 9300 SoC in October. This cutting-edge chip will utilize TSMC’s N4P process and is poised to compete with the upcoming Snapdragon 8 Gen 3 and Apple A17 Bionic. However, it appears that the new chip has encountered some challenges along the way.

Known leaker Evan Blass (via Android Headlines) has stated that the upcoming Dimensity 9300 SoC is apparently overheating when running at its expected clock speeds. To recall, the Dimensity 9300 made waves by opting to forgo efficiency cores, instead featuring a configuration of 4x Cortex-X4 and 4x Cortex-A720 cores, arranged in a 3+1 layout. This inclusion of only high-performance cores is most likely the reason for the SoC overheating.

A lose-lose situation

Looking at what happened with the Snapdragon 8 Gen 1 chip, it’s clear that phone makers are really focused on keeping phones from getting too hot. They quickly switched to the cooler Snapdragon 8+ Gen 1 when it came out. So now, MediaTek is in a tough spot. If they send out the chips as they are, most phone companies might not want to use them. But if they slow down the chip’s performance, it won’t be as attractive either. Additionally, it throws a wrench into MediaTek’s plans to surpass the competition.

Previous reports have mentioned that the upcoming Dimensity 9300 is rumored to have a 3 GHz minimum clock speed. It was also said to be 50% more power-efficient than the Dimensity 9200.

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MediaTek is gearing up to launch the Dimensity 9300 chipset, a move that’s drawing attention for its unique all-big-core architecture. According to Digital Chat Station, the chipset is expected to launch in October.

All-Big-Core Architecture Aims to Outperform Apple A17

The tipster also reveals that the chipset will feature an 8-core CPU design consisting of 4 Cortex-X4 and 4 Cortex-A720 cores along with Immortalis G720 GPU. The departure from smaller cores is expected to boost performance and reduce power consumption.

The Dimensity 9300’s Cortex-X4 cores are predicted to offer a 15% performance improvement and a 40% reduction in power consumption. Additionally, the Cortex-A720 cores are expected to achieve a 20% increase in energy efficiency.

Built using TSMC’s N4P process, the Dimensity 9300 aims to outperform Apple’s A17 chip by cutting paper-based power consumption by over 50%. The transition to pure 64-bit processing will likely result in smoother smartphone performance and reduced power usage.

SK Hynix’s LPDDR5T mobile DRAM has demonstrated its capabilities on the Dimensity 9300 platform, achieving speeds of 9.6Gbps – a 13% increase over the previous generation. This advancement could debut in Vivo’s X100 series, potentially enhancing Android performance.

The Dimensity 9300 is set to launch before Qualcomm’s 2023 Snapdragon Summit, where the Snapdragon 8 Gen 3 chipset is anticipated. Rumors suggest that the vivo X100 series might host the global debut of the Dimensity 9300. As the release date approaches, the chipset promises notable smartphone performance and efficiency advancements.

DCS also suggests that Snapdragon 8 Gen 3 will be expensive so some manufacturers might use older Snapdragon 8 Gen 2 or Dimensity platforms in new devices. This way, they can save money while still being efficient.

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The upcoming MediaTek Dimensity 9300 is turning out to be a mobile chipset to watch out for. The chip is claimed to outmatch both the Snapdragon 8 Gen 3 and Apple A17 Bionic with its four X4 super-large cores based on the Armv9 architecture. However, a popular tipster claims that MediaTek has tentatively set the frequency of the cores to 3Ghz and is waiting for the landing frequency of Qualcomm’s Snapdragon 8 Gen 3 to make the final adjustments.

Dimensity 9300 could be a hit

The Dimensity 9300 is a high-end chipset that is expected to be released in the second half of 2023. It should have a 4+4+1 octa-core CPU architecture, with four X4 super-large cores based on the Armv9 architecture and clocked at a minimum of 3.0GHz. The four A720 large cores are also based on the Armv9 architecture, clocked at 2.0GHz. This frequency is not final and MediaTek is looking forward to Snapdragon 8 Gen 3’s landing frequency before making it final, claims Digital Chat Station on Weibo.

Qualcomm has announced that it will hold the 2023 Snapdragon Summit from October 24 to 26 and that’s where we can expect the new Snapdragon 8 Gen 3 chip to be released. The chipset may have a higher clock speed than the Dimensity 9300. So, by adjusting the clock speed of the Dimensity 9300’s CPU cores, MediaTek can ensure it offers comparable performance to Qualcomm’s upcoming flagship chip.

Reports suggest the chip will be built on TSMC’s N4P process, which is a 4 nm process node offering a performance increase and notable power efficiency improvements over the N5 and N4 processes. The MediaTek Dimensity 9300 is also confirmed to feature the Immortalis-G720 GPU.

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Last year, Vivo launched the Vivo X80 series in the first half of the year and the Vivo X90 lineup in the second half. Report have claimed that the company will only release the X100 lineup at the end of this year. Last week, tipster Digital Chat Station revealed the names of the chipsets that will power the Vivo X100, X100 Pro, and X100 Pro+

Vivo X100, X100 Pro chipsets revealed

According to DCS, the Vivo X100 and X100 Pro will come equipped with the Dimensity 9300 chipset. Some reports have claimed that the X100 duo will be the first phone in the world to feature the said chipset. To recall, the X90 and X90 Pro debuted as the first Dimensity 9200 phones in November 2022.

He further revealed that the Snapdragon 8 Gen 3 will power the Vivo X100 Pro+. For those who don’t know, Qualcomm recently confirmed that its 2023 Tech Summit will be held between Oct. 24 and Oct. 26. It is speculated that the SD8G3 chip will be announced at the said event.

Reports have claimed that the Vivo X100 Pro+ will continue to feature a 1-inch Sony IMX989 primary camera, which was made available on the Vivo X90 Pro+. A fresh Weibo post released by DCS today has revealed a few additional details about what appears to be the Vivo X90 Pro handset.

Vivo X100 Pro key specs (rumored)

It appears, as per the leak, that the Vivo X100 Pro will also feature a 1-inch primary camera, which will be accompanied by a periscope telephoto camera for a higher optical zoom. DCS further revealed that the device will come with 100W charging and a glass back.

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MediaTek is set to challenge Qualcomm’s Snapdragon 8 Gen 3 with their upcoming flagship chipset, the Dimensity 9300. Leaks suggest that the Dimensity 9300 will feature a configuration similar to Qualcomm’s offering and is expected to launch in October 2023, following the release of the Dimensity 9200+ in May 2023.

MediaTek Dimensity 9300 will mimic Snapdragon 8 Gen 3’s Cortex-X4 prime cores

Rumors indicate that the Dimensity 9300 will adopt a 2+4+2 configuration, consisting of two powerful Cortex-X4 cores, four Cortex-A7xx cores, and two Cortex-A5xx cores. However, specific clock speeds and information about the incorporation of Arm’s latest Cortex-A cores are still undisclosed. The details regarding the GPU are also unknown, but it’s reasonable to assume that a successor to the Immortalis G715, such as the Arm Immortalis G720, may be included.

MediaTek seems to be drawing inspiration from Qualcomm’s strategy with the Snapdragon Gen 3. Previous leaks suggested that Qualcomm’s upcoming chipsets would offer different CPU core layouts for two different versions which will include the 2+4+2 and 1+5+2 CPU layout configurations. Both MediaTek’s Dimensity 9300 and Qualcomm’s Snapdragon Gen 3 will be manufactured on TSMC’s advanced N4P node, placing them on similar technological footing.

One challenge MediaTek may face with the Dimensity 9300 is managing thermal performance. The inclusion of two Cortex-X4 cores is likely to generate additional heat, requiring careful balancing of clock speeds to maintain low power consumption. Furthermore, a microarchitecture redesign may be necessary to effectively distribute workloads among the two Prime cores.

The Dimensity 9300 is expected to make its debut alongside the Vivo X100 series in late 2023, following the pattern set by its predecessor. MediaTek will need to address these technical aspects and compete with Qualcomm’s Snapdragon Gen 3 in order to gain a foothold in the competitive mobile chipset market.

While specific details about the Dimensity 9300 are still limited, MediaTek’s track record with the Dimensity 9000 series, including the popular Dimensity 9200 and 9200+, suggests that the upcoming chipset will offer significant improvements in performance and power efficiency. MediaTek has been successful in establishing itself in the premium smartphone market, and the Dimensity 9300 is expected to further enhance its position, particularly in the high-end and mobile gaming sectors.

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According to Digital Chat Station, the upcoming flagship processor from MediaTek will be named the Dimensity 9300 and will be manufactured using TSMC’s N4P process. The chip is expected to be co-developed by Vivo and MediaTek and could debut on the Vivo X100.

The N4P process used in the Dimensity 9300, promises significant performance improvements over the original 5nm technology (N5). This includes an 11% increase in performance compared to N5, a 6% improvement compared to N4, a 22% improvement in power efficiency, and a 6% increase in transistor density. These improvements make the Dimensity 9300 a major player in the mobile SoC market.

The chip is designed with an ultra-large core + big core + small core layout, with the ultra-large core expected to be the Cortex X4, the big core likely being Cortex A715, and the small core possibly being A515. This design enables efficient and optimized processing of different workloads, providing users with a smooth and seamless experience.

What’s more, the N4P process allows for easy migration of products based on the 5nm platform, reducing customer R&D costs and providing faster and more energy-efficient updates for 5nm platform products.

The Dimensity 9300 is scheduled to debut in the second half of 2023 and will compete with Qualcomm’s Snapdragon 8 Gen 3, which is also set to launch during the same period.

This competition promises to bring even better mobile devices to consumers, with both chips offering significant performance improvements and optimizations. It will be interesting to see how they stack up against each other, but one thing is for sure – the mobile SoC market is heating up, and users can look forward to even more powerful and efficient devices in the near future.

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iQOO unveiled the iQOO 11 and 11 Pro flagship phones in China in December 2022. While the Pro model has remained exclusive to the Chinese market, the vanilla model has been released in several markets outside of China. Now tipster Paras Guglani has teamed up with a publication to leak the key specifications of the iQOO 11s.

As per the leak, the iQOO 11s will have the model number V2304 for China. The smartphone will release in the global market, but its international variant will have a different model number. The device is expected to be released in the third quarter of 2023. There is a possibility that it may debut around July or August this year.

iQOO 11s specifications (rumored)

According to the report, the iQOO 11s will be powered by the world’s first Dimensity 9300 chipset, or the Dimensity 9000-series chipset. The device is expected to arrive in two variants, such as 8 GB RAM + 256 GB storage and 12 GB RAM + 256 GB storage.

The iQOO 11s will come equipped with a 6.78-inch E6 AMOLED display that offers a Quad HD+ resolution of 1440 x 3200 pixels. The leak has no information on the cameras, battery, or fast charging capabilities of the iQOO 11s.

In related news, iQOO has recently launched the iQOO Z7, iQOO Z7x, and iQOO Z7i smartphones in the Chinese market. Reports have revealed that iQOO will unveil the iQOO Neo 8 and Neo 8 Pro smartphones in May for the home market. The vanilla model is likely to feature the Snapdragon 8 Plus Gen 1 chipset, whereas the Pro variant will be powered by the upcoming Dimensity 9200 Plus chipset.

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