Samsung is now restarting the development of its 1.4nm process technology (codenamed SF 1.4), The Bell reported. However, the mass production target has been pushed back to 2029, originally planned for 2027.

TSMC and Intel are currently leading the development of 1.4nm-class foundry technologies. While both are designated as 1.4nm products, each process technology is fundamentally different from the other. TSMC’s 1.4nm node is called A14, and Intel refers to its 1.4nm-class node as Intel 14A.

Samsung is looking to narrow the gap with its rivals as it has reportedly asked its equipment suppliers, including Applied Materials and Lam Research, to begin early development on the equipment for the SF 1.4 process. Both are key equipment partners, with their tools used across the company’s foundry and memory processes. The first set of tools will be delivered to NRD-K, which is Samsung’s cutting-edge R&D center for semiconductors.

Samsung’s 1.4nm tech was originally planned to enter mass production next year, but the company later adjusted it to 2029 to strengthen its 2nm processes, such as SF2 and SF2P. Not only did the company achieve high yields in its 2nm process, but it also secured orders for Tesla’s next-generation AI chips. Having achieved that, Samsung is now moving forward with the preparations for its 1.4 process.

ASML has delivered its next-generation High NA Extreme Ultraviolet (EUV) to Samsung’s NRD-K. It will reportedly be used on select layers starting with the 1.4nm process. Samsung has also requested orders for equipment to develop its next-generation V12 NAND, which is expected to enter full-scale mass production around 2030.

Samsung’s rivals, Intel and TSMC, are ahead in the 1.4nm race. Intel plans to begin mass production of 1.4nm chips in 2027, while TSMC is eyeing full-scale production in 2028. That puts Samsung a year or two behind its rivals, but the South Korean giant has an advantage over TSMC since the latter isn’t using high-NA EUV tools just yet.

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Samsung’s overall chip business achieved a record-breaking operating profit in Q1 2026, and that’s only going to go up as the global chip buyers are turning to Samsung Electronics for manufacturing future chips, as reported by Nikkei Asia. The list includes big tech giants such as AMD, Google, NVIDIA-backed Groq, Tesla, and BYD, all of which are looking to diversify their chip production to Samsung as demand continues to soar beyond TSMC’s available capacity.

AMD is in talks with Samsung about manufacturing future CPUs starting in 2028. Google is also reportedly expanding ties with the South Korean giant to produce its next-generation Axion processors, set to launch around 2028, and has asked Samsung to build part of its key Tensor Processing Units (TPUs) for AI computing workloads as early as 2028.

BYD, the world’s largest electric vehicle maker, is also in discussion with Samsung for its next-generation autonomous driving chips, while Tesla has already confirmed that its next-generation AI6 chip will be produced at Samsung’s Texas facility. NVIDIA-backed Groq, which develops language processing units, is already using Samsung’s foundry for chip production and may also use it for its next version of specialized AI chips.

Samsung is witnessing a sharp rise in manufacturing inquiries from both existing and new clients, people familiar with the matter told Nikkei Asia. Companies are adopting dual-sourcing strategies, splitting orders between TSMC and Samsung, rather than relying on the foundry to reduce supply-chain risk.

With tech giants like Google, Tesla, BYD, and AMD aggressively securing what’s left of TSMC’s capacity, smaller companies are left with little choice but to look elsewhere, making Samsung their strongest alternative.

Samsung’s chip business gains momentum as demand outpaces TSMC

There are only three companies in the world that can produce advanced chips: TSMC, Samsung, and Intel.

TSMC makes the most advanced chips and therefore dominates the market, followed by Samsung, which has struggled to win over major outside customers, but things have started to shift. While Intel is a massive company, its contract manufacturing business is still in its infancy regarding external scale.

Due to unprecedented demand for AI and high-performance chips, TSMC’s production capacity is unable to keep pace with the demand, forcing companies to diversify orders across multiple foundries, and that’s where Samsung shines. It’s emerging as the main alternative for companies that are not able to secure capacity at TSMC and for those who want to diversify to ensure it’s not affected by the supply-chain crisis.

Also read:
1. Huawei aims to launch lithography equivalent to TSMC’s 1.4nm by 2031 in a major defiance of U.S. sanctions
2. Apple turns to Intel to manufacture its next-gen MacBook Neo chips as TSMC supply tightens
3. TSMC’s 2nm supply shortage forces smartphone brands to save the best for top-end models amid growing DRAM crisis

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TSMC CEO C.C. Wei took a subtle jab at Samsung this week, suggesting the company’s long-running goal of catching up to the foundry leader remains just that: a goal.

Speaking during a shareholder-related Q&A session, Wei expressed confidence that Taiwan’s dominance in contract chip manufacturing isn’t going anywhere. Without mentioning Samsung directly, he mocked a familiar pattern from a rival that has spent years promising to close the gap.

“Twenty years ago, our competitor said they would catch up with TSMC in 10 years,” Wei said. “Ten years ago, they said they would catch up in another 10 years; and recently, they said yet again that they would catch up in 10 years.”

The comment landed as demand for AI hardware continues to push the semiconductor industry into overdrive. While both TSMC and Samsung are investing heavily in advanced nodes, including 2nm production, the reality is that the two companies remain far apart in the foundry business.

TSMC controls roughly 70% of the global pure-play foundry market, according to recent industry estimates. Samsung sits closer to 7%, and despite years of investment, it has struggled to consistently challenge TSMC’s lead in advanced manufacturing and production scale.

A major reason is AI. Companies building accelerators for AI workloads increasingly rely on TSMC not only for leading-edge process technology but also for advanced packaging solutions such as CoWoS. Those capabilities have become just as important as transistor density, especially for customers like NVIDIA racing to deploy increasingly powerful AI hardware.

That’s not to say Samsung lacks strengths. The company remains a major force in memory and is widely viewed as a leader in High Bandwidth Memory (HBM), one of the most critical components inside modern AI systems. Wei himself acknowledged Samsung’s position in that segment.

Still, when it comes to foundry services, TSMC continues to benefit from something that’s difficult to replicate: execution. Consistent yields, deep customer relationships, and a manufacturing ecosystem built over decades have helped the company maintain a lead that rivals have yet to seriously threaten.

For now, Wei appears unconcerned. His message was simple: competitors can keep setting deadlines, but catching up is much harder than predicting it.

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(Source)

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TSMC may have avoided sparking widespread anger among its employees, which could have grown into a major strike, similar to what recently happened at Samsung. The Taiwanese chip giant has assured its employees that their bonuses will grow more strongly to exceed last year’s level.

For those uninitiated, a lot of TSMC workers recently expressed their fury in TSMC-related Facebook groups over rumors that the company plans to cut employee bonuses. The CEO’s statement further stoked the fire, as he reportedly said that TSMC’s employee bonuses are too high and create a negative perception in society. He also proposed a 20–30% reduction in bonus payouts, triggering a major backlash from employees.

These comments from TSMC’s CEO come at a time when the company’s financial position has never been this strong. The profits jumped 58% year-over-year in Q1 2026 to a whopping T$572.5 billion ($18.2 billion).

TSMC’s current fabs are not enough to meet the unprecedented demand for high-performance chips, so the company is building as many as 12 different fabs. This requires a huge CapEx, which is believed to be one of the primary reasons the company might be eyeing bonus cuts.

Also read:
1. TSMC pushes toward sub-1nm chips after 1.4nm breakthrough
2. TSMC’s 2nm supply shortage forces smartphone brands to save the best for top-end models amid growing DRAM crisis

TSMC is currently going through its best phase, and it surely can’t afford a strike. Not only will that cost millions of dollars, but it could also halt the expansion of its factories and the ongoing work on advanced nodes. In Samsung’s case, the stock fell 3%, and the government warned that a multi-week shutdown could cause up to $66 billion in economic damage.

TSMC quickly responded to the backlash it received from its employees. Just a few days later, the company issued a two-part statement, acknowledging the hefty contributions of its employees and assuring them that their bonuses would grow at a stronger pace.

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via: Wccftech

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Chip giant TSMC is aggressively expanding its advanced 2nm production capacity to meet the unprecedented demand for artificial intelligence (AI) chips and high-performance computing (HPC). The company has set up five state-of-the-art fabrication plants, all entering the ramp-up phase this year, gearing towards the most aggressive expansion in the company’s history.

At TSMC’s 2026 Technology Symposium held in Silicon Valley recently, Hou Yung-ching, Senior Vice President, Deputy Co-COO, and Chief Information Security Officer, revealed that the company is pushing forward with its expansion plan at “twice the speed.” He added that the 2nm process has officially entered mass production and its yield learning curve is superior to that of the 3nm generation, even though the newer node uses a more complex nanosheet architecture, demonstrating TSMC’s leadership in advanced processes.

Even with higher production capacity, there will still be a shortage of high-performance chips due to explosive demand. To counter that, major players including NVIDIA, Apple, Qualcomm, and AMD have reportedly secured large allocations of N2 capacity. Apple alone is reported to have secured more than half of the initial N2 capacity from TSMC.

Also read:
1. TSMC pushes toward sub-1nm chips after 1.4nm breakthrough
2. TSMC hits 5GHz speeds on smartphone processors, leaving Huawei generations behind

Hou Yung-ching pointed out that multiple fabs simultaneously introducing new processes in the same year has never happened before. With the five 2nm fabs in operation, TSMC is expected to increase output capacity by up to 45% compared to the same period for 3nm fabs, a significant increase in capacity utilization. TSMC also plans to upgrade or install nine new factories along with capacity expansion projects each year to significantly ramp up its production capacity, effectively doubling the company’s historical expansion rate. The production is also being expanded at existing fabrication plants in Arizona, USA; Kumamoto, Japan; and Dresden, Germany.

Supported by strong demand, TSMC’s wafer shipments for AI accelerators are increasing by 11x, and demand for large-size chips featuring advanced packaging technologies is going up by 6x. And with continuous upgrades to 3D packaging technologies, TSMC has shortened the mass production time for SoIC chips by up to 75%, resulting in faster chip production. The overall advanced packaging capacity is estimated to grow by 80% in 2027.

TSMC is witnessing explosive demand for its high-performance node, pushing the company to expand its production capacity at a pace never seen before while simultaneously advancing large-scale future expansion plans. The company will continue to strengthen its leading advantage and domination in the semiconductor industry.

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sources: 1, 2

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The push toward smaller and more advanced chips isn’t slowing down anytime soon. A new report suggests TSMC is already looking beyond 2nm, with early plans for sub-1nm manufacturing starting to take shape.

According to DigiTimes, the company is targeting trial production of sub-1nm chips around 2029. Before that, TSMC is expected to bring its 1.4nm process (A14) into mass production in 2028. That node alone is said to offer noticeable gains in both performance and efficiency, reportedly in the range of 30 percent.

The sub-1nm phase, at least initially, won’t be large-scale. The report mentions a starting output of around 5,000 wafers per month, which suggests this will begin more as a testing ground than full production.

To support all this, TSMC is expected to rely on its facilities in Tainan, including the A10 fab and related plants. The timing lines up with increasing demand from areas like AI and high-performance computing, where even small efficiency gains can make a difference.

Apple is likely to be part of that early wave, as usual. The company has consistently been first in line for TSMC’s newest nodes, partly because of the scale it operates at. If things stay on track, it’s possible we could see sub-1nm chips in future MacBooks toward the end of the decade.

That said, there are still quite a few hurdles. TSMC first needs to stabilize its upcoming 1.6nm and 1.4nm processes, and moving below 1nm brings additional challenges around yields, EUV lithography, and heat. None of this is straightforward.

So while the roadmap looks ambitious, it’s still early. Plans at this stage tend to shift, especially when the technology involved is this complex.

Still, if TSMC manages to get there on time, it could be a fairly big step forward. Smaller nodes don’t just mean faster chips, they also help with efficiency, which matters just as much now.

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(Source)

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The 2nm process node is the most advanced, cutting-edge node in the industry, and it’s none other than TSMC leading the next-generation wave of advanced chips. The Taiwanese chip giant has managed to achieve yields favorable for mass-producing 2nm wafers, but unfortunately, that is not enough to meet demand for AI chips and mobile SoCs, forcing smartphone brands to opt for silicon downgrades later this year.

According to a reliable Chinese tipster, Digital Chat Station, multiple smartphone brands will offer fully equipped SoCs only in their top-of-the-line “Ultra” or “Pro Max” models because of rising memory costs and the chip crisis. While the tipster doesn’t explicitly mention “TSMC,” it doesn’t take long to realize where the fingers are pointing to.

While the complexities of mass-producing advanced wafers at a larger scale pose a major challenge for the Taiwanese chip giant, AI and mobile are competing for the same advanced nodes, only worsening the supply crunch. According to industry reports, much of N2 capacity through 2026 is already effectively sold out, with Apple, Qualcomm, Nvidia, and AMD locking in large allocations. Apple alone is reported to have more than half of the initial N2 capacity.

Also read: TSMC hits 5GHz speeds on smartphone processors, leaving Huawei generations behind

Samsung is the most prominent alternative to TSMC, but it is struggling even worse in bringing up its 2nm GAA yields. That leaves smartphone brands with limited supply, so it wouldn’t be surprising to see high-end chips being reserved for top-end models. This explains why Qualcomm is rumored to launch Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Gen 6 Pro as part of its dual-chip launch strategy. Apple is also said to follow a similar approach with its A20 and A20 Pro.

Even MediaTek is reportedly adopting the same strategy, offering the Dimensity 9600 and Dimensity 9600 Pro. The more affordable SoC will be offered to less premium phones, and the more expensive silicon will be reserved for top-end phones. We can also expect smartphone prices to rise, with the DRAM crisis among the main culprits.

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source – Digital Chat Station | via: wccftech

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TSMC would hit another major milestone this year as its advanced nodes would allow smartphone chipsets to reach clock speeds up to 5GHz. Companies like Qualcomm, MediaTek, and Apple have already been greatly benefiting from TSMC’s cutting-edge technologies, and later this year, we’ll witness new chips reaching up to 5GHz of peak clock speeds for the first time in history, and that only makes it worse for Huawei to compete with.

Over the years, Qualcomm, MediaTek, and Apple have grown strongly to offer powerful chips with excellent performance and efficiency, and TSMC has been at the center of it. The chart below (shared by Kurnal) shows how these companies have gradually increased peak clock speeds, now pushing toward the 5.0GHz mark.

The latest flagship from Qualcomm, the Snapdragon 8 Elite Gen 5, can already reach a peak speed of 4.61GHz, and the upcoming Snapdragon 8 Elite Gen 6 Pro is said to reach 5.0GHz. MediaTek’s Dimensity 9600 Pro will reportedly achieve a similar feat, following the Dimensity 9500’s 4.21GHz peak clock speed. This increase enables SoCs to offer major improvements in both single-threaded and multi-threaded workloads.

Huawei’s Kirin chipsets, on the other hand, are nowhere near the performance and efficiency offered by Qualcomm, MediaTek, and Apple. Its downtrend on the above graph is due to U.S. trade sanctions that banned the company from doing business with TSMC. Huawei had no other option but to use China’s SMIC facility, which is still generations behind TSMC. Even today, SMIC is limited to the 5nm process because it’s restricted from using the most advanced EUV (Extreme Ultraviolet) lithography machines.

Huawei’s latest chip, Kirin 9030 Pro, hasn’t crossed the 3.0GHz mark. As things stand today, Huawei is still a long way behind Qualcomm, MediaTek, and Apple to even compete with them, and the difference is a foundry partner.

source/via: wccftech

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The world’s biggest chipmaker, TSMC, is raising red flags about new US tariffs that could throw a wrench into its massive $165 billion investment in Arizona. In a bold move, the company is urging the US Department of Commerce to keep chip imports duty-free.

In a letter sent on May 5 by TSMC’s Arizona subsidiary, the company laid out its case against new Section 232 tariffs on semiconductor imports. TSMC is already pouring $65 billion into three wafer fabs in Phoenix—one is up and running, another is almost done, and the third just broke ground. On top of that, they’ve committed another $100 billion for three more fabs, two advanced-packaging plants, and an R&D center, totaling a whopping $165 billion.

With all six fabs are fully operational, Arizona will reportedly churn out 100,000 wafers a month—about 30% of TSMC’s projected capacity for cutting-edge 2-nanometer chips and beyond. The company says this could spark $200 billion in economic activity and create tens of thousands of jobs.

But here’s the catch:

TSMC warns that tariffs could jack up prices for end products like phones and computers, which would likely crush chip demand. That would make it harder to justify the Arizona expansion, especially since the US doesn’t produce a lot of the specialized equipment and materials TSMC needs. The company is asking for duty-free access for firms with major US chip production to keep supply chains smooth.

This comes as the US Department of Commerce wraps up a Section 232 report, due soon after May 26, amid talk from former President Donald Trump about slapping up to 100% tariffs on Taiwanese chips, claiming Taiwan “stole” US business.

TSMC is pushing back hard, saying its Arizona plans—and America’s chipmaking ambitions—hinge on avoiding those tariffs. With so much at stake, all eyes are on how the US balances trade policy with its semiconductor goals.

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(Source)

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Back in June 2024, Samsung announced innovations in its foundry for 4nm, 2nm, and 1.4nm process nodes. Now, TSMC (Taiwan Semiconductor Manufacturing Company) has also shown off its latest cutting edge 1.4nm process technology, which will power future products from tech giants like Nvidia, Apple, AMD, and others.

TSMC 1.4nm process officially announced

The world’s largest contract chipmaker has revealed that the 1.4nm A14 process will enter production in 2028 with various improvements over the 2nm process. This includes a 30 percent reduction in power draw, while boosting performance by around 15 percent. For those unaware, TSMC’s 2nm process is set to hit production later this year.

Since TSMC has a varied client list, the next gen process would likely power future iPhones, Nvidia GPUs, AMD chips, and much more. According to TSMC, there is a 20 percent increase in logic density, which allows for the performance boost over the 2nm process. Comparing it to the current TSMC 3nm process, the 1.4nm is basically up to 30 percent faster and makes it 60 percent more efficient.

To recall, Apple’s new iPhone 17 lineup is expected to use the latest N3P node (3nm) for the A series chips, so the shift to 2nm might arrive a couple of years after. In other words, tech from the 1.4nm process is still a few generations away as well. This is all the information we have at the moment, so stick around for more.

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U.S. President Donald Trump has stirred fresh debate on U.S.-Taiwan trade relations and semiconductor manufacturing policy. According to Reuters, Trump made assertive remarks at a Republican National Congressional Committee event, where he criticized government grants to foreign chipmakers and disclosed his firm approach during his presidency.

Trump warns TSMC over domestic investment

During the event, Trump revealed he had warned Taiwan Semiconductor Manufacturing Company (TSMC) of a potential tax of up to 100 percent if it did not establish its factories within the U.S.

Unlike the current administration, which has awarded TSMC’s U.S. unit a $6.6 billion grant for its Arizona-based manufacturing expansion, Trump said he offered no financial assistance but used taxation as a deterrent. TSMC had previously confirmed a $100 billion investment plan in the U.S., which includes five new facilities.

In response to the tariff threat, Taiwanese officials said they have already initiated discussions with Washington to resolve the matter diplomatically. Taiwan’s National Security Bureau Director-General confirmed ongoing “strategic communication” with U.S. officials, aiming to secure a negotiation process that avoids retaliation.

Taiwan has offered zero tariffs, more investment, and procurement in the U.S. to de-escalate the situation. Meanwhile, a report by Investing claimed that Taiwan’s stock market has been volatile amid the developments, prompting the government to activate a $15 billion stabilization fund to restore investor confidence. TSMC shares remained flat, but major suppliers like Foxconn experienced noticeable declines.

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Source 1, 2

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TSMC has officially commenced mass production of advanced 4nm chips at its Fab 21 facility in Arizona, marking a pivotal milestone in the U.S. semiconductor industry. Confirmed by CEO C.C. Wei during TSMC’s recent earnings call, the facility began high-volume manufacturing in Q4 2024, utilizing the N4P process technology with yields comparable to TSMC’s Taiwan operations.

TSMC’s Advanced 4nm Production Begins in Arizona

This achievement shows TSMC’s ability to deliver cutting-edge manufacturing quality outside its home base. However, chips produced at the Arizona fab are priced higher than those made in Taiwan due to factors such as elevated depreciation costs, a smaller production scale, an underdeveloped local ecosystem, and the added expense of shipping chips back to Asia for packaging. Wei highlighted the “geographic flexibility” offered by U.S.-produced chips, which customers reportedly value despite the premium pricing.

The Arizona facility, part of TSMC’s $65 billion investment in U.S. production, currently operates Phase 1A with a production capacity of approximately 10,000 wafers per month. Reports suggest Apple, AMD, and Nvidia are among the first customers, with Apple testing its A16 Bionic chip for iPhones and S9 processors for Apple Watches, manufactured at the Arizona site.

TSMC plans to expand its presence further, with Phase 1B expected to boost capacity by 14,000 wafers per month later this year. The company also aims to bring its 2nm process to Arizona by 2028, with a third fab planned for completion by 2030.

These developments align with the objectives of the U.S. Chips and Science Act, which seeks to localize semiconductor manufacturing. While chip packaging will remain reliant on Taiwan until Amkor’s U.S. packaging plant becomes operational, TSMC’s investment in Arizona reflects a shift toward strengthening advanced chip supply chains in the U.S.

The U.S. and Netherlands have tightened export controls to limit China’s access to advanced semiconductors and AI technology, citing national security concerns. This move targets companies like Nvidia, TSMC, and ASML, imposing stricter licensing requirements and increased oversight to prevent cutting-edge technologies from reaching China.

Meanwhile, according to reports, TSMC has reportedly declined a deal to manufacture Samsung’s Exynos chips, possibly due to concerns over technology sharing with System LSI and commitments to key clients like Apple and Qualcomm. Samsung is also grappling with 3nm production challenges, affecting its Exynos roadmap and device plans.

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(Source, Via)

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Taiwan Semiconductor Manufacturing Company (TSMC) is making a significant push to expand semiconductor production in the United States with a $65 billion investment in three factories in Arizona. These facilities are part of a broader strategy to bolster domestic chip manufacturing and reduce reliance on Asia for critical technology.

Challenges in the US

Despite the ambitious scale, TSMC has faced numerous challenges in its Arizona expansion. Regulatory and compliance hurdles have slowed progress, with permitting and construction processes taking at least twice as long as in Taiwan. Each step of construction requires approvals, adding layers of complexity that are unfamiliar compared to Taiwan’s streamlined processes.

Labour shortages have further complicated matters, prompting TSMC to relocate half of its workforce from Texas to Arizona. This has significantly increased costs due to relocation and accommodation expenses. Additionally, local supply chain gaps have hindered operations. For instance, the cost of sulfuric acid in the US is five times higher than in Taiwan, forcing TSMC to ship materials from Taiwan to Los Angeles and truck them to Arizona.

Technological and Cost Constraints

The Arizona facility will focus on producing slightly older chip technologies, such as the 4-nanometer chips now being supplied to Apple and Nvidia. Advanced chip production is expected to remain in Taiwan, where regulatory and operational efficiencies allow for faster adoption of cutting-edge technologies.

The high costs of building in the US are another challenge. TSMC has spent $35 million establishing 18,000 rules to navigate local regulatory requirements, and overall material and labour expenses are substantially higher than in Taiwan.

Progress and Support

Despite these challenges, TSMC has achieved a major milestone by starting production of 4-nanometer chips in Arizona. TSMC CEO C.C. Wei expressed confidence that the quality of chips produced in the US will match those made in Taiwan.

The project has also received substantial backing from the US government, including $6.6 billion in grants under the CHIPS Act. This funding underscores the strategic importance of domestic semiconductor manufacturing in reducing reliance on Asia.

While the Arizona plants represent a significant step in boosting US chip production, regulatory and logistical challenges continue to hinder progress. TSMC’s focus on slightly older technologies for its US plants highlights the difficulty of replicating Taiwan’s manufacturing efficiencies. However, with continued investment and support, the Arizona facilities have the potential to play a crucial role in the US semiconductor strategy.

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Samsung might be facing another hurdle with its Exynos series. Samsung Foundry is rumored to completely skip the Exynos chipsets for its Galaxy S25 series of flagship phones, and it seems that things are not getting better anytime soon. A new report has claimed that TSMC has rejected Samsung’s deal to outsource Exynos production.

No Next-Gen Samsung Exynos Made by TSMC

To recall, there were rumors last year of Samsung finally deciding to outsource the production of Exynos chips to TSMC. There were internal talks for this change, which would’ve helped Samsung Foundry’s chip product. But it seems that this deal might not be following through. According to tipster @Jukanlosreve, the South Korean tech giant’s deal for Exynos production has been rejected by TSMC (Taiwan Semiconductor Manufacturing Company).

Unfortunately, there are still no details available regarding why TSMC rejected the Samsung deal for Exynos. With Samsung as its client, TSMC would’ve added another major tech giant like Apple, Nvidia, and Qualcomm, among others under its belt. Jukanlosreve claimed that the world’s largest contract chipmaker might have turned down the deal to better protect its internal workings.

For those unaware, Samsung Foundry is capable of manufacturing chips unlike fabless chip brands like AMD and Nvidia. So this move might help prevent any leak of its process or technology. Based on what we know so far, the entire Galaxy S25 lineup will launch with the Snapdragon 8 Elite SoC. So it might be a while before we see Exynos chips surface on next gen Samsung Galaxy phones. So stick around for more updates.

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Samsung Semiconductor, the world’s second-largest chipmaker, is facing a pivotal moment as it races to mass-produce cutting-edge 2nm chips. The company’s success in this endeavor could determine its ability to compete against industry leader TSMC and regain market share.

Samsung Semiconductor’s Future Hangs in the Balance

Despite significant investments, Samsung has struggled to match TSMC’s profitability and scale. The Taiwanese chip giant currently holds a commanding 62.3% market share in the semiconductor foundry sector, compared to Samsung’s 11%. This disparity has resulted in substantial financial losses for Samsung, underscoring the urgent need for a technological breakthrough.

Samsung‘s strategy is centered around its 2nm and below process technologies. The company is investing heavily in its fabrication facilities, with plans to install new production lines at its Hwaseong and Pyeongtaek plants. The goal is to achieve mass production of 2nm chips by 2025 and 1.4nm by 2027, mirroring TSMC’s timeline.

One of the major factors in Samsung’s success will be securing major customers for its 2nm process. The company is actively negotiating with Qualcomm, hoping that the US chipmaker will choose Samsung’s technology for its next-generation Snapdragon processors. If Samsung can secure such partnerships, it could significantly boost its foundry business and attract other customers.

However, the road ahead is fraught with challenges. Samsung has faced setbacks in the past, such as the delayed release of its 3nm Exynos processor. Additionally, reports suggest that the upcoming Samsung Galaxy S25 series will feature Qualcomm’s Snapdragon 8 Gen 4 globally, suggesting that Samsung may not be fully confident in its own Exynos chips compared to the Snapdragon alternative. Meanwhile, the Exynos 2500 is expected to power the Galaxy Z Fold 7 and Flip 7, which are slated for release later in 2024.

The success of Samsung’s 2nm process will have far-reaching implications for the global semiconductor industry. If Samsung can close the gap with TSMC, it could lead to increased competition and potentially lower prices for consumers. Moreover, it could strengthen South Korea’s position as a major player in the high-tech sector.

(Via)

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The iPhone 17 series has already entered the conversation before the launch of the iPhone 16 series. The iPhone 17 series was previously expected to come with a 2nm chipset fabricated by TSMC. While this could be great news for the iPhone 17 series this is reportedly not possible due to technological limitations.

The 2nm chips won’t be ready for mass production till the end of 2025

The news comes from Weibo tipster “Mobile chip expert” (translated), who claims that the 2nm chips won’t be ready for mass production till the end of 2025. The tipster further mentioned that the 2nm chips won’t be available until the iPhone 18 series. So it means that the iPhone 17 series will continue to use TSMC’s 3nm process node.

TSMC plans to start mass production of 2-nanometer chips next year, but multiple Taiwanese media reported that the company is accelerating the process to ensure stable output for mass production. Not to mention, Apple is a major customer of the contract manufacturer. The company occupies a significant production capacity of TSMC’s latest process nodes for Apple Silicon and smartphone chips. For example, in 2023, Apple received all of TSMC’s 3-nanometer chips for the production of iPhones, iPads, and Macs.

TSMC’s 2nm process node is expected to provide a 10% to 15% speed increase at the same power consumption, or a 25% to 30% reduction in power consumption at the same speed as compared to the chips fabricated in the company’s 3nm process.

The current A17 Pro chip (that powers the iPhone 15 Pro models) is fabricated on the company’s first generation 3nm process. In contrast, the more recent M4 chip (that powers the 2024 iPad Pro) is built using a second-generation 3-nanometer process node.

Speaking of the iPhone 16 series, code in iOS 18 has confirmed that all four models will use the next-generation A18 chip based on the second-generation 3-nanometer process. This is a shift from the past few generations, where Apple used the last generation’s chip in the non-Pro models of the successor.

(Source)

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Apple plans to use advanced 3D chip stacking technology in its upcoming MacBook series which is scheduled to be launched in 2025, which is said to be a breakthrough in chip packaging technology. The new packaging technology is capable of stacking multiple chips vertically making it more compact.

The industry is transitioning to glass substrates for chip packaging

However, the industry is transitioning to glass substrates to replace existing 2.5D and 3D packaging technologies. Giants like AMD, Intel, and Samsung have attracted much attention in the field of chip glass substrate supply. Samsung is actively investing resources in the research and development of glass substrates in chip manufacturing. The company reportedly has plans to use the technology in its products by 2026.

However, it is worth noting that TSMC is not absent in this field. Industry analysts have noticed signs that the company is developing similar solutions. The company is exploring new paths in the field of advanced chip packaging in an innovative way – turning to rectangular chip substrates.

According to a report, TSMC plans to switch from traditional round wafers to rectangular substrates. This move aims to improve the efficiency of the chip layout on each wafer, which significantly increases the number of chips that can be placed. Currently, this rectangular substrate is in the trial stage, with a size of 510 mm x 515 mm. It reportedly offers more than three times the usable area of ​​traditional round wafers. Also, the rectangular design significantly reduces the waste of edge space, further improving material utilization.

(Source | Via)

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The rise of artificial intelligence is causing major shifts on Wall Street, with Taiwan Semiconductor Manufacturing Company (TSMC) recently achieving a significant milestone by joining the elite trillion-dollar market capitalization club. This accomplishment places TSMC among the world’s top technology giants and highlights the growing importance of the semiconductor industry.

TSMC’s Market Surge

TSMC’s market capitalization briefly surpassed Tesla’s, making it the seventh most valuable technology company globally. The company’s shares have seen a remarkable increase, trading above the 50-day moving average of $158.00 and reaching a new 52-week high of $192.80. Year-to-date, TSMC shares have gained nearly 80%.

Growth of the Semiconductor Industry

The semiconductor industry has become the leading sector, driven by the increasing demand for chips used in AI technologies. Global semiconductor sales are projected to reach $611.2 billion in 2024, with a 16% increase in sales expected for that year, followed by a 12.5% increase in 2025. This surge in demand is largely due to advancements in generative AI, which require sophisticated and powerful chips.

The U.S. government has recognized the critical role of semiconductors in the modern economy, providing substantial financial support to boost domestic chip manufacturing. The Biden administration has allocated tens of billions of dollars for constructing chip factories in the U.S., aiming to strengthen technological infrastructure and reduce reliance on foreign manufacturers.

Analyst Insights and Investor Considerations

Analysts have raised their price targets for TSMC ahead of its second-quarter earnings report, with Morgan Stanley predicting an increase in TSMC’s full-year sales forecast. TSMC’s effective “hunger marketing” strategy suggests tight foundry supply in 2025, encouraging customers to recognize the company’s value. The anticipated increase in wafer prices due to AI advancements further strengthens TSMC’s position. For investors, key considerations include revenue growth, profitability, and valuation compared to peers. 

The AI boom is reshaping Wall Street, with TSMC’s entry into the trillion-dollar club marking a significant milestone. The semiconductor industry’s growth, driven by AI demand, highlights the crucial role of companies like TSMC and Nvidia in the global market.

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(via)

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TSMC will reportedly begin the trial production of 2nm chips next week, which will be first adopted by Apple for the iPhone 17 series and other Apple devices. Notably, the trial production is beginning significantly earlier.

Previously the trial production was expected to begin in Q4 (in October or later). This is interpreted as an attempt to speed up production in order to secure a stable yield before mass production. For those unfamiliar, the trial production is where the company tests out the planned production line processes to be used, ahead of mass production.

TSMC first demonstrated its 2nm fabrication process back in December last year.

Trial production will be carried out at TSMC’s Baoshan plant in northern Taiwan. The equipment necessary for the 2nm production has already been brought into and installed at the Baoshan plant since the second quarter.

The iPhone 15 Pro models equip the A17 Pro chipset, which is fabricated using TSMC’s 3nm process. This process allows more transistors to be packed into a smaller space, thereby improving performance and efficiency as compared to the predecessor. Apple’s M4 chip recently debuted with the new iPad Pro, which uses an enhanced 3nm fabrication process.

Getting a good enough yield rate (the percentage of chips that pass quality-control checks) is generally one of the biggest challenges for new process notes. Back in April last year, the 3nm chips from TSMC had a yield rate of around 50%.

Apple was previously believed to reserve the entire production capacity of TSMC’s 3nm chips for the A17 Pro and M3 chip. It could repeat with TSMC for the 2nm production capacity as well. A report from May last year says that the company was working on reserving all the production capacity of 2nm chips as well.

TSMC is expected to apply gate all around (GAA) technology starting with the 2㎚ processes, which will improve performance and power efficiency. TSMC also plans to introduce back-side power supply (BSPR) technology with the 2nm chips.

(Source)

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According to some previous rumors, Samsung has achieved success with its 3nm process nodes and the development of its 2nm process nodes is also progressing smoothly.

However, a recent report from Businesskorea indicates that Samsung Foundry’s 3nm process remains significantly inferior to TSMC’s, both in yield rate and power efficiency. For those unfamiliar, higher yield rates mean more functional chips per wafer, lowering the cost per chip and increasing profitability.

As a result, it is expected that most fabless manufacturers including NVIDIA, AMD, Intel, Qualcomm, MediaTek, and Apple will continue to rely on TSMC for their 3nm chips. It has also been reported that Google will switch to TSMC for its 2025 flagship chipset Tensor G5. Notably, the Tensor G4, which will power the upcoming Pixel 9 series, will still be manufactured by Samsung Foundry and will be based on an updated 4nm process.

Samsung talked about the mass production of their 3nm chips 3 years ago. Back in June 2022, Samsung Foundry was the first in the industry to apply the 3nm gate-all-around (GAA) process to mass production. However, due to the limitations, the company is still struggling to secure customers for the end product. The first generation 3nm process node (SF3E) has performed below the company’s expectations when it comes to performance and power efficiency. It has reportedly been adopted by some niche scenarios like chips for cryptocurrency mining. However, a widespread adoption will still require more improvements in power efficiency and yield rates.

The relatively lower yield rates and power efficiency of Samsung Foundry’s process nodes have long been problematic and are considered the main reasons for the performance gap between Snapdragon (those that are fabricated by TSMC) and Exynos-powered Galaxy devices.

According to a previous report, Qualcomm is considering a dual-sourcing strategy by partnering with Samsung Foundry alongside TSMC. While this is aimed at securing the company’s business by not relying on a single manufacturer, the company’s CEO mentioned “the current focus must be on the foundry production at TSMC.”

(Source)

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TSMC, the world’s leading chipmaker, downplayed the threat posed by Huawei’s recent advances in chip development during its shareholder meeting. Citing a technological gap and US export restrictions, TSMC executives expressed confidence in maintaining their market dominance.

Chairman Mark Liu addressed a shareholder’s query about Huawei and other competitors, stating, “TSMC considers every competitor very carefully. We will always have competitors. But it has nothing to do with Huawei or not.”  He downplayed Huawei’s threat, suggesting it, and China by extension, are far behind.

TSMC President Wei Zhejia also claimed that “it’s impossible” for Huawei to catch up to their chip fabrication technology. The confidence is likely due to TSMC’s established position at the forefront of the semiconductor industry. 

Huawei is particularly affected by US government restrictions that limit its access to advanced chipmaking equipment, hindering its ability to compete at the highest level. As a result, while TSMC is planning to start 2nm chip production by next year, Huawei is still working with 7nm processors, with rumors suggesting that their 5nm SoC may debut soon.

Huawei which was blacklisted by the US in 2019 has attempted a comeback with the Mate 60 Pro and its new Kirin 5G processors. However, their 7nm technology puts them at a disadvantage in terms of performance and efficiency compared to the latest offerings from other chipmakers.

While Huawei’s efforts towards self-sufficiency are noteworthy, the gap in technology and the limitations imposed by US restrictions is a significant challenge. The question remains: can any competitor, including Huawei, overcome TSMC’s established lead and strict export controls? Only time will tell if a challenger emerges to dethrone the current leader in the chipmaking race.

(Via)

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ASML (Advanced Semiconductor Materials Lithography) is a Dutch corporation that designs and manufactures lithography machines for the semiconductor industry. The lithography machines are one of the most important equipment in chip building.

Access to ASML’s cutting-edge lithography technology is one of the reasons behind TSMC‘s massive success as a contract chip manufacturer that works with most of the big giants in the industry such as NVIDIA and Qualcomm.

The high-NA lithography technology is expected to reduce the transistor size by 66%

Now the latest news is that ASML is going to ship its most advanced lithography machine worth US$ 380 million (~2.753 billion yuan) to TSMC this year. ASML Chief Financial Officer Roger Dassen revealed in a recent conference call that the company’s two largest customers, TSMC and Intel, will obtain its high numerical aperture (high-NA) extreme ultraviolet (EUV) lithography technology within 2024.

Reportedly, ASML has already delivered the world’s first commercial high-NA EUV lithography machine to Intel, starting with the first unit delivered to a factory in Oregon in late December. The exact time when TSMC will get the latest and most advanced tool from ASML is unclear at this point.

The high-NA lithography technology is expected to reduce the transistor size by 66%. So, it could enable chip manufacturers to fit more of them in a same-sized piece of silicon. Obviously, there is much more than just the transistor count (such as power efficiency) when it comes to sustained performance. But the power efficiency also improves with the reduction of the size.

Reportedly, the high-NA EUV system achieves a numerical aperture of 0.55. Compared with the previous EUV systems equipped with a 0.33 numerical aperture lens, the accuracy will be improved and will enable more sophisticated patterning on the silicon.

The machine is also 30% larger than the predecessors which are already so large that they require three Boeing 747s to carry them.

Speaking of TSMC, the development of the 2nm nodes is reportedly progressing smoothly. The company has plans to start the development of N3X and N2 process in Q2 2025. Mass production of N2P and A16 will begin in Q2 2026. Its 2nm process will use Gate-all-around FETs (GAAFET).

TSMC expects its 2nm process could bring 10% to 15% performance improvement along with 25% to 30% lower power consumption.

(Source)

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A reported explosion at the Taiwan Semiconductor Manufacturing Company (TSMC) plant in Phoenix on Wednesday sparked concerns, though no injuries or facility damage were reported, according to the company’s statement.

The incident involved a waste disposal truck, with the driver rushed to the hospital. TSMC confirmed that neither employees nor construction workers were harmed during the event. Firefighters responded promptly to the scene, although further details from fire officials were not immediately available.

TSMC’s significance in the global semiconductor industry cannot be overstated. As a leading manufacturer of advanced semiconductors worldwide, the company recently secured a significant grant of $6.6 billion under the CHIPS and Science Act from the Biden administration.

Efforts to bolster chip manufacturing in the United States have seen TSMC expand its operations beyond its traditional stronghold in Taiwan. Recent expansions include facilities in Japan, Germany, and notably, Arizona, USA, where the Phoenix campus is located.

The Arizona expansion, part of TSMC’s broader initiative to bring cutting-edge chip manufacturing to the US, is poised to create thousands of jobs in both manufacturing and construction sectors. However, the project has faced challenges, including initial construction delays due to safety concerns from local unions and objections to bringing in workers from Taiwan.

Despite these challenges, Arizona’s role in the semiconductor industry has been steadily growing, with significant investments pouring into the state, exceeding $100 billion since the introduction of the CHIPS Act.

The incident at the TSMC Arizona facility comes at a critical juncture, as the company recently announced plans to expand its investment by an additional $25 billion, bringing the total to $65 billion. This expansion includes the addition of a third factory by 2030, showcasing TSMC’s commitment to US-based manufacturing.

Technological advancements are also on the horizon, with the second Arizona factory set to produce the world’s most advanced 2-nanometer technology, with production expected to commence in 2028.

Market response to the incident was initially mixed, with TSMC’s shares rising before paring gains upon news of the incident. Nevertheless, the company remains optimistic about its expansion plans and technological advancements despite the temporary setback.

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TSMC, the world’s leading semiconductor manufacturer, has announced that its advanced packaging capacity is fully booked for the next two years. This development comes as Nvidia, AMD, and Guanghuida secure TSMC’s cutting-edge packaging technologies for their high-performance computing (HPC) ventures.

The focus on high-performance computing stems from the crucial role it plays in powering artificial intelligence (AI) tasks. TSMC anticipates a significant surge in revenue from AI processors, with projections indicating a doubling this year alone. Over the next five years, the compound annual growth rate for AI chips is expected to hit 50%, with AI processors projected to contribute over 20% of TSMC’s revenue by 2028.

Both Nvidia and AMD have secured TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) and System-on-Integrated-Chip (SoIC) advanced packaging capacities for their products. Nvidia’s flagship H100 chip, built on TSMC’s 4nm process, utilizes CoWoS packaging. Meanwhile, AMD’s MI300 series, manufactured using TSMC’s 5nm and 6nm processes, leverages SoIC for CPU and GPU integration before employing CoWoS with High Bandwidth Memory (HBM).

Guanghuida, a rising player in the AI chip market, has also booked TSMC’s packaging capacity. Their H100 chips, powered by TSMC’s 4nm process and CoWoS packaging, boast SK Hynix’s HBM for enhanced performance. Moreover, Guanghuida’s latest Blackwell architecture AI chip, based on TSMC’s advanced 4nm process, features upgraded HBM3e memory, doubling computing power compared to its predecessors.

The soaring demand for AI chips is fueled by global cloud service giants such as Amazon AWS, Microsoft, Google, and Meta, all vying for superiority in the AI server domain. With shortages from major manufacturers like Nvidia, AMD, and Guanghuida, these cloud behemoths are turning to TSMC to fulfill their orders, contributing to the chipmaker’s optimistic revenue projections.

To meet this escalating demand, TSMC is ramping up its production capacity for advanced packaging. By the end of this year, CoWoS monthly production is set to triple, reaching 45,000 to 50,000 wafers, while SoIC capacity is expected to double, reaching 5,000 to 6,000 wafers. By 2025, SoIC monthly production is projected to double again, hitting 10,000 wafers.

TSMC’s fully booked advanced packaging capacity signifies the accelerating pace of innovation in AI-driven computing, with key players strategically positioning themselves to capitalize on this potential market.

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• U.S. to grant TSMC $5 billion for Arizona Chip Plant

(via)

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After the powerful 7.5-magnitude earthquake near Taiwan, worries have emerged regarding possible interruptions to the worldwide chip supply chain. Taiwan is a major hub for semiconductor manufacturing, and so speculations have risen about the condition of the semiconductor factories in the aftermath of the earthquake. However, NVIDIA, one of the largest companies in the AI sector, has assured stakeholders that its chip supply remains unharmed.

US-based NVIDIA, which heavily relies on Taiwan Semiconductor Manufacturing Co. (TSMC) for its chip production, has confirmed that the earthquake has not impacted its supply chain in the country. TSMC, responsible for fabricating chips for numerous tech giants like Apple, AMD, Qualcomm, and NVIDIA, has reported no damage to critical chip-making equipment, including the Extreme Ultraviolet Lithography machines.

Although some tools were damaged at certain TSMC facilities, the core machinery remains intact. TSMC temporarily evacuated some production facilities as a precautionary measure, to ensure the safety of its employees. However, within just 10 hours after the earthquake, operations have resumed at 70-80% capacity.

TSMC said that it could resume its operations quickly thanks to its preparedness for such events. For instance, TSMC has used building dampers and conducted regular earthquake drills to mitigate the impact of any seismic activity on semiconductor production.

Semiconductor manufacturing requires precise and uninterrupted operations in controlled environments. Even small issues or interruptions can cause major losses, such as discarding entire silicon wafers. However, TSMC’s readiness for earthquakes, and protective measures, helped in safeguarding its production line.

The last notable disruption experienced by TSMC was in 2016 when manufacturing facilities in Tainan suffered damage, resulting in the loss of wafers. Since then, TSMC has continually refined its strategies to ensure minimal disruptions during natural disasters.

NVIDIA cannot survive without TSMC’s Chip Supply

TSMC is NVIDIA’s primary chip manufacturer and supplier of the latest semiconductor technology. NVIDIA relies on TSMC’s cutting-edge manufacturing processes to produce high-performance GPUs such as the latest Blackwell architecture models. 

The collaboration between NVIDIA and TSMC ensures efficient chip designs and supply. However, TSMC’s contributions span beyond GPUs and include other essential semiconductor technologies for NVIDIA’s products. This partnership guarantees a reliable chip supply, crucial for meeting market demands and maintaining NVIDIA’s competitive advantage.

TSMC is the biggest chip maker globally, with more than half of the global market share. If anything happens to TSMC, it would not only affect NVIDIA but also other leading AI and technology firms as it would affect their chip production and potentially disrupt their supply chains. Any risk to TSMC is concerning for NVIDIA and the global tech sector, as it could significantly affect technological progress worldwide.

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(via)

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A powerful earthquake in Taiwan has rattled nerves in the tech industry, raising concerns about potential disruptions to global chip production. The 7.4-magnitude tremor, the strongest to hit the island nation in decades, forced major chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) to evacuate some factory personnel.

Chip Shortage Fears Rise After Taiwan Earthquake

While TSMC assures its workers are safe and initial inspections revealed no major damage, a full assessment is still underway. The company’s safety protocols triggered evacuations, potentially causing production delays.

This news comes at a time when the world is already grappling with a chip shortage. The COVID-19 pandemic exposed vulnerabilities in the global supply chain, leading to a scarcity of semiconductors used in everything from smartphones to supercomputers. Any production hiccups at TSMC, the world’s largest contract chipmaker, could further strain the already stretched supply chain.

The impact on major tech companies like Apple and NVIDIA, who rely on TSMC for their chips, remains to be seen. However, a prolonged disruption could lead to price hikes for consumers as chip scarcity worsens.

The earthquake also highlights the risk of overreliance on a single region for chip production. Taiwan’s geographical location on a major fault line makes it susceptible to frequent earthquakes. Calls for diversification of manufacturing locations have been growing in recent years, especially in light of the ongoing tensions between Taiwan and China.

While the immediate impact of the earthquake appears to be minimal, the tech industry is watching closely as TSMC assesses the situation. Any production delays could exacerbate the existing chip shortage and have a ripple effect on consumers worldwide.

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TSMC‘s massive factory in Arizona is reportedly hitting the gas pedal. According to a tech news outlet, the factory is in a “sprint” mode and aiming to kick off trial production for its first production line by mid-April this year. If everything runs smoothly, mass production for Apple chips could even be brought forward to the end of 2024, a significant improvement from the original target of first half 2025.

TSMC’s financial report conference call is scheduled for April 18

Taiwan Semiconductor Manufacturing Company (TSMC), hailing from Taiwan, is a giant in the world of technology. Nicknamed the “world’s largest chipmaker,” TSMC isn’t designing the devices you use every day, but rather the brains behind them. They’re a foundry, which means they manufacture the semiconductors, or chips, that power countless electronic devices, from smartphones and laptops to gaming consoles and even cars.

This news comes on the heels of TSMC’s official statement on April 1st, confirming they’re accelerating construction of the Arizona facility. With trial production on the horizon, it seems things are moving swiftly. Industry watchers are buzzing with anticipation, especially considering TSMC’s upcoming financial report conference call on April 18th. This positive development is likely to be a major talking point during the conference.

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(Via)

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Apple is constantly trying to revolutionize its iPhone lineup via R&D, and past leaks have informed us that the company is planning on integrating the advanced 2nm processor technology developed by TSMC. This development, though expected by many, is a significant step forward in Apple’s roadmap to enhance the performance and efficiency of its devices. Another piece of information has surfaced and is now backing up the previously leaked information.

The mass production of these chips will kick off in 2025

The revelation that Apple is actively designing these next-generation chips was hinted at through a leaked LinkedIn profile of an Apple employee. This leak, while not groundbreaking, offers a glimpse into Apple’s strategic moves in the tech landscape. TSMC’s announcement to kick off mass production of 2nm chips by 2025, with Apple reportedly securing the first batch – this is quite an exciting time to be an Apple fan.

The LinkedIn profile in question, though heavily redacted, mentioned involvement in “TS2nm” technology, alongside previous work on 5nm and 3nm chips. This indicates a deep-rooted expertise in chip development, with a background that spans several tech heavyweights including Google, AMD, Samsung, and Qualcomm.

This news could suggest that Apple is preparing to push the envelope with its iPhone 17 Pro and iPhone 17 Pro Max models, expected in 2025. The shift to 2nm technology will offer significant advancements in terms of processing speed and energy efficiency, potentially transforming user experiences with faster, more capable devices that don’t compromise on battery life. And let’s be honest, Apple’s past few iterations have shown us what optimization can achieve in a flagship device.

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(Via)

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TSMC, the world’s leading chipmaker, is reportedly ramping up production of its advanced 3nm chips. The expansion is said to be done due to the increased demand from tech giants seeking cutting-edge processors for their products.

In 2023, Apple was TSMC’s primary customer for 3nm chips, utilized in its iPhone 15 Pro smartphones.  However, major players like Qualcomm, MediaTek, NVIDIA, and Intel have since expressed interest and placed orders. 

To accommodate this influx, TSMC is reportedly eyeing to boost its monthly 3nm wafer production to 100,000 units by 2024. The company is also making efforts to improve its production yields for higher efficiency.

The initial version of TSMC’s 3nm process (N3B) reportedly faced yield challenges and carried a high cost.  These factors may have deterred some companies from adopting the technology in its early stages. 

However, TSMC’s improved second-generation 3nm process (N3E) will offer better performance while being affordable. This has likely led to an increase in client interest, which in turn means demand. 

This year will likely see heightened competition in the semiconductor market as major tech companies begin releasing their first 3nm-powered devices.  

Whether TSMC can successfully meet this surging demand, while addressing potential production challenges, will significantly impact the success of these upcoming devices and the companies behind them.

In related chip news, SMIC, China’s semiconductor giant is reportedly beginning the production of its 5nm chipsets for Huawei. SMIC has also set up a new semiconductor line in Shanghai specifically for making chips designed by Huawei.

The move comes as the Biden administration has imposed stricter export restrictions on advanced chipmaking equipment citing national security concerns. You can learn more about it here.

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(Via)

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Taiwan Semiconductor Manufacturing Co (TSMC) is taking a big step forward in Japan, announcing the construction of a second semiconductor plant. With Toyota Motor Corp coming on board as a new investor, the companies are clear that there will be signals a significant shift in the landscape of global chip manufacturing.

Construction will start later this year, and the factory will be operational by 2027

TSMC, recognized as the leading contract chip maker globally, is expanding its presence in Kumamoto Prefecture, Japan. This initiative is a strategic move, aligning with Prime Minister Fumio Kishida’s vision of enhancing Japan’s semiconductor production capabilities.

The collaboration between TSMC and Toyota is noteworthy. It highlights a cross-industry effort to strengthen the semiconductor supply chain, a critical component for a wide range of technologies from vehicles to smartphones. The investment, capped at US$5.26 billion for the new facility, underscores the importance of advancing semiconductor technology, with the addition of 6- and 7-nanometre process technologies at the new site.

Scheduled to start construction by the end of this year and operational by 2027, this project is more than a manufacturing expansion. It’s a commitment to innovation and technological advancement, with the potential to produce over 100,000 12-inch wafers monthly and create more than 3,400 high-tech jobs.

This development comes at a time when countries are keenly aware of the need for a robust semiconductor supply chain, highlighted by recent global shortages that impacted everything from automotive to consumer electronics.

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(Via)

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Apple may be the first company to utilize TSMC’s upcoming 2-nanometer chip technology, according to DigiTimes. 

TSMC, a major chip manufacturer, is expected to begin production of 2nm chips in the second half of 2025. The smaller transistor size associated with this technology allows for more transistors to be packed onto a single processor, which could mean faster performance and less power use.

Apple has a history of being an early adopter of TSMC’s leading-edge chip technologies. This year, for example, both the A17 Pro chip in the iPhone 15 Pro and the M3 series chips in Macs utilize TSMC’s 3-nanometer process.

Apple is again expected to be the first to try TSMC’s new 2nm process. The new node will also adopt a new manufacturing process known as gate-all-around field-effect transistors (GAAFET) with nanosheets. 

The technology should enable faster speeds and lower power consumption compared to the FinFET transistors used in current chips.

However, the shift to GAAFET comes with its own set of challenges. Specifically, TSMC will need to build new fabs and invest heavily in adapting its production process. 

Apple, as a key TSMC customer, will also likely need to make adjustments to its chip designs to accommodate the new technology.

Besides the up-and-coming 2nm node, TSMC is also refining its current 3nm process. The company has already improved its fabrication process in the new N3E and N3P chips, while it’s also working on other chips like N3X and N3AE for high-performance computing and automotive applications, respectively.

Looking even further ahead, rumors suggest TSMC is already exploring even more advanced 1.4-nanometer chips. They are expected to arrive as early as 2027. Apple, unsurprisingly, is reportedly interested in securing early access to this cutting-edge technology as well.

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Google appears to be taking steps towards independent chip development as it’s said to be testing a “self-developed” Tensor chip in collaboration with Taiwanese company KYEC. 

KYEC provides testing services for new chips headed to manufacturing in Taiwan. Google is reportedly buying equipment for testing these chips at KYEC, with tests starting around the middle of this year and increasing over time (via 9to5Google).

This development could mean Google is moving away from using Samsung’s processors for its Pixel phones.

Sources suggest the chip in question is likely the Tensor G5, codenamed “Laguna.” And it is slated for a potential 2025 release. Likely to be manufactured on TSMC’s 3nm process, this chip is expected to prioritize artificial intelligence (AI) capabilities, aligning with Google’s focus on AI-powered features in its Pixel devices.

The switch would mark Google’s first fully custom chipset design, as the company has thus far been relying heavily on a foundation provided by Samsung’s Exynos chips.

Shifting production to TSMC could offer Google several advantages. Bypassing Samsung’s Exynos chip base, which currently lags behind Qualcomm’s Snapdragon series in terms of performance and efficiency, could give Google more control over its chip design and potentially lead to more powerful and efficient Pixel phones in the future.

However, in the immediate future, Google’s partnership with Samsung will continue. The Tensor G4, destined for the upcoming Pixel 9 series, will be built using Samsung’s 4nm process and will likely offer minor improvements over the G3 found in the Pixel 8 series.

The technology Google is using for its Tensor G4 is said to be similar to what Samsung employs in its Exynos 2400 SoC. So we can expect a decent amount of improvements in CPU and GPU gains. 

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Tesla has confirmed its participation in TSMC’s (Taiwan Semiconductor Manufacturing Company) 3nm NTO chip design finals for the upcoming year. This surge in TSMC’s 3nm chip production, scheduled for 2024, reflects the growing demand for advanced semiconductor solutions. Notably, Tesla’s inclusion as an N3P customer signals its intent to leverage TSMC’s cutting-edge technology for the production of next-generation Full Self-Driving (FSD) smart driving chips.

About TSMC’s N3P process

TSMC‘s ambitious plan for the N3P process involves commencing production in 2024. Compared to the N3E process, N3P aims to deliver a 5% improvement in performance, a 5% to 10% reduction in power consumption, and a remarkable 1.04 times increase in chip density. TSMC has emphasized that N3P’s performance, power, and area (PPA) metrics, along with technology maturity, outpace Intel’s 18A process.

Tesla’s collaboration with TSMC is not new, with the electric vehicle manufacturer having placed multiple orders in the past. Previous ventures include the Dojo D1 chip utilizing the 7nm process and the HW 4.0 chip featuring the 5nm process. The addition of Tesla to the N3P customer list marks a strategic move for both companies.

Analysts foresee this partnership propelling Tesla to the status of TSMC’s seventh-largest customer, injecting fresh momentum into TSMC’s revenue growth trajectory. As Tesla continues to lead the automotive industry in innovative technologies, the collaboration with TSMC underscores the pivotal role semiconductor advancements play in shaping the future of electric and autonomous vehicles.

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Taiwan Semiconductor Manufacturing Co (TSMC), the titan of the global chip industry, is poised for a significant transition with its chairman, Mark Liu, announcing his retirement next year. Stepping into Liu’s shoes will be the current CEO, C.C. Wei, a move that symbolizes continuity and stability for this tech giant.

C.C. Wei will replace Mark Liu as the CEO of the company

Liu’s journey with TSMC has been remarkable. Joining the company in 1993, he witnessed its rise to become the world’s largest contract chipmaker. As he prepares to bid adieu, focusing on his family and new endeavors, there’s an air of confidence that TSMC’s legacy is in safe hands.

C.C. Wei, a Yale alumnus with a doctorate in electrical engineering, isn’t new to the game. With his board membership since 2017 and a long tenure at TSMC starting in 1998, Wei represents both experience and innovation. His leadership will be crucial as TSMC navigates a rapidly evolving tech landscape.

TSMC’s role is central in the tech world. It’s not just a major supplier for behemoths like Apple and Nvidia; its influence extends across the globe. The company’s stock has seen impressive growth, reflecting its critical role in the burgeoning sectors of AI, high-performance computing, and 5G technology.

The company’s future plans are as ambitious as its past achievements. With most of its manufacturing rooted in Taiwan, TSMC is branching out. New facilities in Germany, Japan, and Arizona signify a strategic move to diversify its manufacturing base. This is not just about meeting global demand; it’s a smart play in a world where supply chain risks are more apparent than ever.

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Major chip making giants like Nvidia, Qualcomm, MediaTek, and others are apparently turning to TSMC for the fabrication of its next generation of high end chipsets. These chips will be based on TSMC’s advanced 3nm process.

Qualcomm & MediaTek opt for TSMC, not Samsung

For those unaware, Qualcomm was initially rumored to sourced the 3nm chips from both Samsung and TSMC. These foundries would be used for the Qualcomm Snapdragon 8 Gen 4 SoC. But now, a new report from China Times claims that chip giants MediaTek and Qualcomm are turning to TSMC for its second generation 3nm process (N3E). This will be used to fabricate the Dimensity 9400 and Snapdragon 8 Gen 4.

Notably, Apple is another major client of TSMC and its 3nm process line for its next gen M series and A series chipsets. As of right now, the company is relying on TSMC’s first gen 3nm process (N3B) for its A17 Pro processor, which powers the iPhone 15 Pro series. the report adds that Samsung Foundry has yet to receive major clients for its 3nm chip fabrication technology.

Typically, brands like Qualcomm, MediaTek, Apple, and Nvidia also place orders with Samsung Foundry to make their chipset. Although, these are not always flagship processors. Since the South Korean company began offering advanced 3nm process tech, it was hoping to have some brands place orders with its foundry. But this shift might take longer than expected.

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Morris Chang, the 91-year-old retired founder of the Taiwan Semiconductor Manufacturing Company (TSMC), voiced a deep concern that’s probably shared by many in the tech industry: the possible decoupling of the United States and China, the world’s two largest economies. In an event at the Asia Society in New York, he warned that such a separation would “slow down everybody,” reflecting on the complex web of global supply chains that both countries are part of.

TSMC, which is worth over $400 billion, is suffering from this US-China Chip War

While Chang touched on concerns of an emerging superpower challenging an existing one, as described in Graham Allison’s book “Destined for War,” there’s more to the narrative. The tech industry is at the epicenter of this geopolitical earthquake, where the tremors could be felt across the globe, affecting companies like TSMC, which is worth over $400 billion and supplies key components to tech giants like Apple.

The U.S. has taken steps to shift semiconductor production stateside with measures like “onshoring” and “friendshoring,” incentivized by federal subsidies. These moves are aimed at making the U.S. less dependent on Taiwan, a self-governed island that China views as a part of its territory. It’s a security-driven move aimed at securing supply chains and reducing dependency on regions that could become hotspots due to their geopolitical standing.

However, there’s a flip side to this strategy. The U.S.’s push for independence in semiconductor production might undermine the very global ecosystem that has been responsible for technological innovations. It also risks making things more expensive and less efficient for everyone involved. Chang’s TSMC, for instance, has already faced hurdles in its Arizona plant, including a shortage of skilled labor and disputes with local unions.

Moreover, China’s demographics give it an edge as a future tech leader, as pointed out by Joe Tsai, co-founder of Alibaba Group. With 800 million people in the labor force, 200 million of whom are highly skilled, the U.S. and its allies might find themselves playing catch-up in the long run.

In a world that’s becoming increasingly “dangerous and unpredictable,” according to Tsai, the U.S.-China decoupling seems like a double-edged sword: a move toward security could be a step back for global progress. And both countries need to come to a consensus soon to put everyone’s worries to rest.

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As tensions rise between China and Taiwan, some equity investors are rethinking their commitment to Taiwan Semiconductor Manufacturing Co (TSMC), the world’s top contract chipmaker. Names like Martin Currie’s Zehrid Osmani and Shelton Capital Management’s Bruce Kahn have reduced or sold off their TSMC stakes in recent months. Instead, they are moving towards ASML Holding, an essential supplier to TSMC.

TSMC’s stock surged by 22% this year, which seems counterintuitive

This shift in investment behavior seems counterintuitive, given that TSMC’s stock surged by 22% this year, outpacing ASML’s near 10% gain. Nonetheless, the underlying factor for this is heightened geopolitical volatility surrounding Taiwan, a region of vital interest in the U.S.-China dynamics. Investors like Warren Buffett, for instance, find the risk of a geopolitical flare-up outweighing TSMC’s market prowess.

ASML Holding, based in the Netherlands, is an appealing alternative. The company manufactures lithography machines crucial in chip production and has a diversified client list featuring industry giants like Intel and Samsung. According to David Allen of Plato Investment Management, ASML stands as a more geopolitically insulated choice, offering an “investor safe haven” of sorts.

This investor sentiment suggests a disconnect between market valuations and geopolitical risks. Bruce Kahn opines that current market valuations of TSMC do not adequately factor in the geopolitical tensions, drawing parallels to the investor unpreparedness seen during Russia’s invasion of Ukraine.

The pivot toward ASML is not without its hurdles. The company saw a slump in orders in the last quarter, while TSMC exceeded quarterly sales expectations. Both remain vulnerable to the ongoing U.S.-China chip feud. Still, ASML stands to gain from TSMC’s expanding global footprint, particularly in Germany and the U.S., which will require more of ASML’s equipment.

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Taiwan Semiconductor Manufacturing Co Ltd (TSMC) is expected to announce a 30% decline in third-quarter profit on Thursday, reflecting a slowdown in the chip industry. Analysts had anticipated this slump, with the company’s profit estimated at $6 billion for July-September. This marks the second consecutive quarter of profit decline for the world’s largest contract chipmaker, attributing it to the weakened global demand for semiconductors since the latter half of the previous year.

TSMC’s revenue for the third quarter stood at approximately $17 billion, down 20% from the previous year, a figure well within the company’s projected range. This downturn mirrors the industry’s trend as inventories at smartphone and computer manufacturers diminish, paving the way for an expected uptick in restocking demand.

Despite these challenges, TSMC’s stock price has surged due to increased chip demand for artificial intelligence applications. Investors, however, remain cautious as the company navigates uncertainties in customer demand. Reports suggest that TSMC has urged its major suppliers to delay the delivery of high-end chip-making equipment, although the delay is anticipated to be short-term.

Analysts are closely monitoring TSMC’s outlook for the fourth quarter and beyond and have predicted a slow start to the next year, with a 10% growth expected in the first quarter. Concerns loom over potential order cancellations towards the end of the year and mild restocking demand. The fate of TSMC’s partnership with major customer Apple remains pivotal, with analysts expressing worries that Apple might revise its orders.

TSMC reported its net revenue for September 2023 at approximately NT$180.43 billion, reflecting a 4.4% decrease from August 2023 and a 13.4% decrease from September 2022. The cumulative revenue for January through September 2023 amounted to NT$1,536.21 billion, indicating a 6.2% decrease compared to the same period in 2022.

The semiconductor industry’s recovery hinges on various factors, including the global economic climate, consumer demand, and technological advancements. Analysts remain cautiously optimistic about TSMC’s future, emphasizing the need for adaptability and strategic planning in the face of evolving market dynamics. TSMC’s performance in the coming quarters will undoubtedly be closely watched by industry stakeholders and investors alike.

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Taiwan Semiconductor Manufacturing Co (TSMC), the world’s largest contract chip maker, has received an indefinite exemption from US trade sanctions on mainland China. This exemption enables TSMC to continue acquiring advanced chip equipment for its operations in China, marking a pivotal moment amid ongoing global supply chain challenges.

The United States Department of Commerce’s Bureau of Industry and Security (BIS) has advised TSMC to apply for the “validated end-user” (VEU) program. Under this program, the chipmaker can receive exports without separate approvals, easing restrictions on foreign chipmakers operating in China. TSMC expressed confidence in obtaining a permanent authorization through the VEU process, streamlining its operations.

This move follows the Biden administration’s October 2022 export controls, which aimed to limit China’s access to certain semiconductor chips made worldwide with US tools. Last year, TSMC secured a one-year authorization, covering its factory in Nanjing, China, producing 28-nanometer chips. The recent waiver extension alleviates uncertainties surrounding TSMC’s operations, enabling the company to plan its manufacturing processes effectively.

South Korea’s Samsung Electronics and SK Hynix have also received similar indefinite waivers, allowing them to supply US chip equipment to their China factories without separate approvals. These developments reflect a nuanced approach by the United States, balancing national security concerns with the complex interdependence of the global technology sector.

TSMC’s operations in mainland China, including its facilities in Shanghai and Nanjing, will continue without disruption. While specific details about the waiver’s duration were not disclosed, the industry anticipates a year-long extension, aligning with previous patterns.

This decision comes in the wake of the Biden administration’s efforts to address the challenges posed by emerging technologies.

In a bid to bolster domestic semiconductor manufacturing, the administration removed stringent curbs on expansion in China by companies receiving federal funds to build plants in the US. Both TSMC and Samsung are poised to benefit from US subsidies for their new facilities, enhancing their competitive edge and strengthening the US technology ecosystem.

TSMC’s Taipei-listed shares closed higher following the announcement, indicating positive market sentiment. As the global technology landscape continues to evolve, these developments underscore the delicate balance between international cooperation and safeguarding national interests in the realm of advanced semiconductor technologies.

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MediaTek is rumoured to launch its highly anticipated MediaTek Dimensity 9300 flagship processor this month, just right before the launch of Qualcomm’s Snapdragon 8 Gen 3 on 26 October 2023. And the latest info from a reputable leaker reveals that the CPU clock speeds, structure and GPU of the upcoming MediaTek Dimensity 9300 are much better than we initially expected.

Shared by popular leakster, Digital Chat Station on Chinese social media platform Weibo, the MediaTek Dimensity 9300 is set to be an octa-core CPU processor featuring 8 CPU performance cores, and no CPU efficiency cores, the first of its kind in the Android smartphone space. The CPU core structure seems to be a 1+3+4 structure with 1 ARM Cortex X4 Prime core, 3 ARM Cortex X4 cores, and 4 ARM Cortex A720 cores. 

The peak clock speed of the CPU clock speed is expected to break 3.25 GHz as per the Weibo post stated, and the GPU under the hood is the latest ARM Immortalis G720 MC12 GPU for mobile processors. Digital Chat Station also shared that he has seen the MediaTek Dimensity 9300 surpass the Snapdragon 8 Gen 3 in the Antutu v10 benchmark scores, both in the CPU and GPU departments. As for the power efficiency of the Dimensity 9300, Digital Chat Station mentions that he is keeping his mouth shut on the matter until the official launch of the flagship SoC by MediaTek this month.

The MediaTek Dimensity 9300 was earlier confirmed to be manufactured on TSMC’s famous N4P process, which is a 4 nm process node offering a performance increase and notable power efficiency improvements over the other N5 and N4 processes. In addition, the Dimensity 9300’s Cortex-X4 cores are predicted to offer a 15% performance improvement and a 40% reduction in power consumption. Additionally, the Cortex-A720 cores are expected to achieve a 20% increase in energy efficiency.

What do you think about MediaTek’s upcoming Dimensity 9300? Let us know your thoughts in the comments below.

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