New data tracking CPU sales on Amazon US shows a sharp year-over-year decline in January 2026. According to figures compiled by analyst TechEpiphany, just 26,100 processors were sold during the month. That might not sound terrible on its own, but it represents a steep 51% drop compared to January 2025.

That’s a significant contraction for one of the largest online retailers, and it adds to a broader downward trend that’s been visible in recent months.

At the same time, prices are moving in the opposite direction. The average selling price of CPUs rose from $227 in January 2025 to $305 in January 2026, a jump of roughly 34%. That suggests buyers who are still upgrading may be choosing higher-end chips, or simply paying more across the board.

Despite the slowdown, AMD continues to lead by a wide margin. The company reportedly sold 23,050 Ryzen CPUs in January, accounting for more than 88% of total units. Revenue share was nearly identical. Intel, by comparison, moved just 3,050 units.

What’s interesting is where demand seems concentrated. AMD’s newer Zen 5-based Ryzen 9000 series performed well, but older Zen 4 (Ryzen 7000) and even Zen 3 (Ryzen 5000) chips continue to sell in meaningful numbers.

Building or upgrading a PC right now means paying more for nearly every major component. Memory prices have climbed noticeably in recent months, affecting both DDR4 and DDR5 kits. SSD pricing has also increased. Graphics cards haven’t helped the situation either. Even mid-range options have seen pricing pressure.

When RAM, storage, and GPUs all cost more, the appeal of upgrading “just the CPU” weakens. Most enthusiasts don’t upgrade in isolation; it’s usually part of a broader platform refresh. And right now, that refresh isn’t cheap.

Between higher component costs, platform transition expenses, and general economic caution, many consumers seem comfortable holding onto existing systems a little longer.

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(Sources: 1, 2)

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In 2026, the mini PC is no longer an underpowered alternative to full-sized towers. These machines have grown into serious AI workhorses, packing massive power into palm-sized enclosures.

But under the surface, there’s a deep divide in philosophy, one that boils down to Intel’s modular vision versus Apple’s vertically integrated approach. Picking the right mini desktop today is more about how you think than what you do.

Intel Ultra AI PCs

Mini PCs built around Intel’s Core Ultra Series chips push the boundaries of what a compact Windows machine can be. Brands like Asus, Geekom, and Minisforum are leading this charge, combining powerful AI acceleration with user-serviceable internals and open standards.

The biggest draw? Modularity. Most Intel-based mini PCs support up to 96GB of DDR5 RAM and include dual M.2 slots. That means you can build local AI datasets, train models, or edit 8K footage without ever touching the cloud. If you’re experimenting with open-source LLMs, the ability to expand RAM and storage as demands grow is a serious hedge against obsolescence.

You also get access to GPU freedom. Thanks to Thunderbolt 5 and Oculink support, these machines can connect to external graphics cards, turning a quiet productivity cube into a full-blown gaming or rendering rig. Apple still can’t match this level of expandability.

On the AI front, Intel leans into openness. Whether you’re working in PyTorch, TensorFlow, or ONNX, the ecosystem supports everything from Windows-native tools like DirectML to frameworks like OpenVINO on Linux. And for enterprise users in engineering or finance who still rely on legacy Windows apps, this is the no-compromise route.

Apple Silicon Mac Mini

Apple takes the opposite route: control everything, optimize everything. The M5-series Mac Mini, built on Apple’s newest unified silicon, isn’t modular, but it doesn’t need to be.

Unified memory is the ace here. Instead of separating RAM between CPU, GPU, and neural engines, Apple’s architecture allows them to share one high-bandwidth pool. The result is shockingly efficient performance across AI tasks, 4K editing, and music production, even at lower spec tiers.

Mac Minis also run cool and whisper-quiet under heavy workloads. Where Intel mini PCs crank up fans during AI image generation, Apple Silicon hums along silently. If you’re working in a studio or shared workspace, that matters.

Developers and creatives already embedded in Apple’s world will find even more polish. Final Cut Pro, Logic, Xcode, and Adobe’s Mac-optimized suite fly on these machines. And if you’re building for iOS or visionOS, a Mac is not just preferred, it’s essential.

Which One Should You Choose?

Both platforms are more powerful than ever, but your choice should reflect how you work, not just how fast a benchmark runs.

Go with an Intel Ultra Mini PC if you need customization, frequent upgrades, or a platform that supports everything from gaming to enterprise software. It’s the more flexible path, especially for those running local AI models or experimenting with external GPUs.

Choose the Apple Mac mini if you want a system that just works. The unified experience, quiet operation, and creative tool optimizations make it the ideal choice for video editors, musicians, and app developers.

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Tata Group and Intel Corporation have signed a Memorandum of Understanding to explore a strategic collaboration focused on semiconductor manufacturing, advanced packaging, and hardware enablement for consumer and enterprise markets. The partnership aims to strengthen India’s domestic semiconductor ecosystem and build a stable and geo resilient electronics supply chain based in India.

As part of the MoU, Intel and Tata will explore the manufacturing and packaging of Intel products for the local market at Tata Electronics’ upcoming semiconductor fabrication plant and OSAT facilities in India. The two companies will also evaluate opportunities for advanced semiconductor packaging within the country. These efforts are aligned with India’s long term goal of building local capabilities across the semiconductor value chain, including high value manufacturing and assembly.

The collaboration also includes plans to scale AI PC solutions designed specifically for Indian consumers and enterprises. India is projected to become one of the top five PC markets globally by 2030, supported by rising enterprise digitisation, consumer demand, and rapid adoption of AI based computing. Intel and Tata plan to combine Intel’s AI compute reference designs with Tata Electronics’ electronics manufacturing services expertise. Tata Group’s wide presence across industries and strong access to the Indian market will support distribution and adoption.

N Chandrasekaran, Chairman of Tata Sons, said the Tata Group is committed to building a strong and sustainable semiconductor industry in India. He stated that working with Intel would help accelerate this effort, support the growth of a broader technology ecosystem, and position India to benefit from the growing demand for AI driven computing.

Intel CEO Lip Bu Tan said India represents one of the world’s fastest growing compute markets. He highlighted increasing PC demand and rapid AI adoption as key drivers. He added that the collaboration with Tata would help Intel expand its presence, scale faster, and deliver greater value to customers in India.

Dr Randhir Thakur, CEO and Managing Director of Tata Electronics, said the MoU supports Tata Electronics’ plans across EMS, OSAT, and semiconductor fabrication. He noted that local manufacturing and packaging could improve cost efficiency, shorten time to market, and build a more reliable supply chain while meeting rising demand for next generation AI compute products in India.

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At Computex 2025, the tech industry’s biggest players put forward their boldest visions for the future of artificial intelligence, both at the cloud and at the edge.

But it wasn’t just the usual suspects like Nvidia and Intel grabbing attention. From MediaTek’s AI ambitions to a neuromorphic chip developed by German researchers, this year’s event revealed a diverse and evolving AI silicon landscape.

Here’s a closer look at the most compelling AI chips and architectures introduced at the show.

Nvidia Unveils Grace Blackwell and NVLink Fusion

Nvidia introduced its Grace Blackwell NVL72 architecture at Computex 2025, positioning it as a new standard for high-performance AI computing. The hybrid architecture combines GPUs and CPUs in a tightly fused package and is capable of running trillion-parameter models, real-time inference, and large-scale scientific workloads.

The company also launched NVLink Fusion, a next-generation interconnect designed to enable high-speed chip-to-chip communication. Nvidia confirmed that companies like MediaTek, Qualcomm, and Marvell will adopt NVLink Fusion for building semi-custom AI compute solutions. The move opens Nvidia’s ecosystem to external partners and expands the reach of its AI infrastructure technology.

MediaTek’s Custom AI Ambitions and 2nm Leap

MediaTek announced its plan to tape out its first 2nm chip with TSMC in September 2025. According to the company, the new chip will offer up to 15% better performance and 25% greater power efficiency than current 3nm chips. MediaTek aims to use the new node for both mobile devices and high-performance AI applications.

The company also highlighted its collaboration with Nvidia on the DGX Spark, a compact AI supercomputer for developers. MediaTek contributed a custom 20-core CPU architecture to the system and is using its ASIC expertise to design chips tailored for AI model training and inference. MediaTek’s IP in high-speed I/O, SerDes, and optical interfaces supports this initiative.

Intel Expands AI and GPU Lineup with Arc Pro and Gaudi 3

Intel introduced the Arc Pro B50 and B60 GPUs, designed for AI inference and workstation-grade computing. The B60 GPU includes 24GB of memory, while the B50 version ships with 16GB. Both models support multi-GPU scaling and are optimized for applications in architecture, engineering, and design.

Intel also showcased Project Battlematrix, a workstation-class platform supporting up to eight Arc Pro B60 GPUs and capable of running AI models with up to 150 billion parameters. The platform is based on Intel Xeon processors and targets AI developers and researchers.

In addition, Intel rolled out new deployment options for its Gaudi 3 AI accelerators. The Gaudi 3 PCIe cards support scalable inference in existing data centers, while rack-scale configurations support up to 64 accelerators per rack and 8.2TB of high-bandwidth memory.

TUM Introduces Cloud-Free AI Chip Inspired by the Human Brain

Researchers from the Technical University of Munich (TUM) revealed the AI Pro chip, a neuromorphic processor that does not require cloud connectivity or internet access. The chip performs real-time, on-device inference using a memory-compute integrated architecture. It employs hyperdimensional computing, allowing it to recognize patterns using limited training data.

Professor Hussam Amrouch led the development of the chip, which consumes only 24 microjoules per task, significantly less than conventional AI processors. The AI Pro chip targets specific applications in healthcare, robotics, and autonomous navigation where local processing and data security are essential.

Qualcomm Previews Snapdragon X2 and Teases September Launch

Qualcomm did not launch new chips at Computex but used the stage to confirm the dates for its next major event. The company announced that the annual Snapdragon Summit will take place from September 23 to 25 in Hawaii. Qualcomm is expected to launch the Snapdragon 8 Elite 2 for smartphones and possibly introduce the Snapdragon X2 Elite for Windows laptops.

CEO Cristiano Amon said Qualcomm plans to expand its presence in the PC market, aiming for more than 100 Snapdragon-powered laptop models by next year. He also highlighted the growth of native Arm-compatible apps, claiming that over 1,400 games now run on Snapdragon devices.

The AI Chip Race Isn’t Slowing Down

Between Nvidia’s rack-scale ambition, MediaTek’s 2nm plan, Intel’s workhorse GPUs, and TUM’s sci-fi-like brain chip, Computex 2025 made one thing abundantly clear: the AI chip market isn’t just booming — it’s evolving. Fast.

And the conversation is no longer about which chip is faster. It’s about where those chips live, how they connect, and what new kinds of intelligence they can unlock.

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In a surprising move that could reshape the semiconductor landscape, Qualcomm, the leading mobile chipmaker, has reportedly approached Intel, a once-dominant player in the PC processor market, about a potential takeover. While the deal is far from certain, its implications could be profound.

Ming-Chi Kuo Predicts Financial and Strategic Pitfalls

Intel, once the undisputed king of the PC processor market, has faced increasing challenges in recent years. The company has grappled with manufacturing setbacks, declining market share, and a shift in consumer preferences towards mobile devices. Qualcomm, on the other hand, has enjoyed significant success in the mobile market, powering smartphones from major brands like Apple and Samsung.

A Qualcomm-Intel merger would create a semiconductor giant with a formidable presence in both the mobile and PC markets. However, the deal would also face significant hurdles as per renowned Apple analyst Ming-Chi Kuo. Antitrust regulators would likely scrutinize the merger closely, given the combined market power of the two companies. Additionally, integrating two such large and complex organizations would be a daunting task.

For Qualcomm, the acquisition could offer several benefits. It could provide the company with a foothold in the data center and server markets, which are increasingly important for AI and cloud computing. Additionally, Intel’s manufacturing capabilities could help Qualcomm reduce its reliance on external foundries, such as TSMC.

However, the acquisition could also be a risky gamble. Intel has been struggling to regain its competitive edge, and it’s unclear whether Qualcomm can successfully turn the company around. The deal could also be a major financial burden for Qualcomm, which would likely need to issue a significant amount of debt to finance the acquisition.

The future of the Qualcomm-Intel deal remains uncertain. If the deal goes through, it could have a profound impact on the semiconductor industry. However, there are also significant risks involved. Only time will tell whether this ambitious move will pay off for Qualcomm.

(Source 1,2)

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Intel has just announced its most efficient family of x86 processors. The Intel Core Ultra 200V series processors brings breakthroughs in performance, efficiency, and AI computing. These new CPUs arrive with more powerful integrated graphics. So here’s everything you need to know.

Intel Core Ultra 200V Series: What’s New & What’s Improved?

The chipmaker’s latest Core Ultra 200V series aims to offer improved performance with better power efficiency. It is designed to deliver better low power performance for next-gen AI PCs. Intel claims that its latest processors consume up to 50 percent less power while achieving up to 120 TOPS in performance with the CPU, GPU, and NPU. The Core Ultra 200V series processors pack Intel’s fourth generation NPUs that offer up to 4 times faster than the last gen model.

With the Intel Core Ultra 200V series, the brand plans to make PCs great with every model being capable of productivity and battery life of up to 20 hours with typical work use. Thanks to the AI enhancements, the company can leverage over 500 optimized AI models to help in content creation, security, productivity, and gaming. These are the four main areas that will employ Intel’s cutting-edge tech.

Improved Graphics

Apart from making the new processors faster and more efficient, Intel has upgraded the graphics performance with the new Xe2 integrated graphics. Xe2 enhanced performance by 30 percent over its predecessors. Furthermore, the built-in Intel Arc GPUs now include up to 8x 2nd Gen Xe cores, 8x Ray Tracing units, and supports up to three 4K monitors. The new Intel Xe Matrix Extension AI delivers up to 67 TOPS that help applications in creative fields and gaming as well.

Can it outperform Apple M3, Ryzen HX 370, & Snapdragon X Elite?

To showcase the prowess of its new AI processors, Intel pits it against AMD’s new Ryzen HX 370 series, Qualcomm’s Snapdragon X Elite, and even Apple M3. Graphs showed that the Core Ultra 200V processors offer up to three times the performance per thread along with an 80 percent hike in peak performance. All of this while promising a battery life of up to 20 hours.

The top-end Core Ultra 9 2988V outclassed the Ryzen HX 370 and Snapdragon X Elite and Apple MC in speed and power efficiency. Intel showed off the efficiency of its new processors with a laptop that is powered by a 72Wh battery. This notebook managed to run for up to 14 hours while running productivity applications or 9.5 hours while running Microsoft Teams.

When can we expect them?

Intel Core Ultra 200V processors are currently available for preorder and will be released globally starting from 24th September 2024. LG Electronics will be the first to debut the new lineup with the LG Gram 16 Pro with the Intel Core Ultra processor (Series 2), during the Intel Core Ultra Global launch event. Other major brands like Acer, Dell, GP, MSI, Samsung, and others will also launch their offerings soon.

(Via)

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Intel is working on its 15th-generation Lunar Lake and Arrow Lake CPUs. While the Lunar Lake CPUs are said to be focused on power efficiency to compete with Qualcomm’s Snapdragon X series chips and will be used inside thin and lite laptops, the Arrow Lake CPUs are going to be optimized for performance and will mainly power Desktop computers.

Intel’s Arrow Lake desktop platform is expected to use both Intel’s 20A (or 2nm) process and TSMC’s 3nm process. Intel CEO Pat Gelsinger confirmed that Intel will use TSMC’s 3nm process for Arrow Lake’s GPU tiles, which are said to be upgraded to the Xe2 LPG architecture.

Judging from the current signs, Arrow Lake will also adopt a modular architecture, divided into four different Tile modules: CPU, SoC, GPU, and IOE. The CPU is expected to use Intel’s own 20A process.

The latest news comes from a statement from an internal communication meeting, where it has been revealed that Arrow Lake’s power consumption will be at least 100W lower while running at a relatively high frequency as compared to the 14th-generation CPUs. For context, the Arrow Lake CPUs were previously reported to feature a lower clock speed as compared to the i9 14900KS.

Thanks to the new 20A process, it no longer requires the previous high voltage to maintain stability. If true, it should solve the problems of the 13th and 14th generation CPUs that are related to high voltage and power consumption.

While the leak hints at an impressive performance, no detailed information is available about it yet and to be precise, it sounds too good to be true.

Although Intel hasn’t officially announced a release date for Arrow Lake, industry insiders predict a launch sometime in the second half of 2024. According to a previous report, Intel could launch Arrow Lake in October with the first batch of K series CPUs, which may include the high-end Core Ultra 9 285K. The company is expected to release more Arrow Lake products at CES in early 2025.

(Via)

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Geekbench score of the MSI Prestige 13 AI Evo laptop has leaked ahead of the launch, providing insights into Intel’s new Core Ultra 200V series.

We expect Intel’s upcoming Core Ultra 200V series to debut by the end of this year. Previous leaks revealed it will feature three processor series: Core Ultra 5, 7, and 9. The Lunar Lake is focused on efficiency and low-power mobile devices, and it will be featured with Intel’s new mobile processors. The Core Ultra 288V which appeared in Geekbench results, is part of this series and stands out as the best in Core Ultra 9 famiily.

Recently surfaced Geekbench score reveals Intel Core Ultra 9 288V achieved a single-core score of 2790 and a multi-core score of 11048. While these numbers might not seem impressive at first glance, remember that the Core Ultra 9 288V’s maximum turbo power is just 30W. We rely on the processor’s power consumption based on previously leaked information, so it’s not actually official until Intel launches the new chips.

Comparing the Core Ultra 9 288V’s score to Intel’s currently available high-end Core Ultra 9 185H, we see a significant boost in single-core performance. A single-core score of close to 3000 points is quite impressive. If the leaked base and turbo power rates hold true, Intel appears set to introduce a processor that’s both powerful and efficient.

(source)

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Thomson has just announced a brand new lineup of laptops in the Indian market. The company’s Thomson Neo laptops are equipped with Intel processors and range from entry level to mid range models. So here are their specs, pricing, and more.

Thomson Neo Series Pricing & Availability

Thomson’s new laptops have been announced in India and are listed on Flipkart, a popular e-retailer in the region. There are multiple models and here are their pricing:

• Intel Celeron, 4GB RAM, and 128GB SSD – 14,990 INR
• Intel Core i3 12th Gen, 8GB RAM, and 256GB SSD – 26,990 INR
• Intel Core i3 12th Gen, 8GB RAM, and 512GB SSD – 27,990 INR
• Intel Core i5 12th Gen 1235U, 8GB RAM, and 512GB SSD – 37,999 INR
• Intel Core i5 12th Gen 1235U, 16GB RAM, and 512GB SSD – 37,990 INR
• Intel Core i7 12th Gen 1255U, 16GB RAM, and 512GB SSD – 43,999 INR

Thomson Neo Series Specs

The new laptops from the brand sport a 15.6-inch display that offers FHD resolution with slim bezels, except the Intel Celeron variant which features a 14.1-inch screen. Thomson’s Intel Core i3, Core i5, and Core i7 processor versions are paired with up to Intel Iris Xe graphics. All of these laptops run on the Windows 11 Home OS out of the box. Connectivity options include a USB-C port, a DC input charging jack, an HDMI port, an RJ45 Ethernet port, a USB-C port, a 3.5mm audio jack, and two USB 3.0 Gen 1 ports. Buyers also get a backlit keyboard on these laptops and a 2-megapixel webcam on the front for video calls.

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Intel‘s Sapphire Rapids-Refresh processors are picking up steam. These CPUs have been certified by Ubuntu, guaranteeing compatibility with a whole different operating system. The news gets better: Lenovo‘s upcoming ThinkStation P5 workstation is equipped with a Xeon W7-2595X processor, confirming customer shipments of these Sapphire Rapids-Refresh processors have begun.

The CPU boasts 26 cores and 52 threads, with a max turbo frequency of 4.8GHz

The Xeon W7-2595X CPU in the ThinkStation P5 boasts impressive specs: 26 cores, 52 threads, a maximum turbo frequency of 4.8GHz, and a 250W TDP. While this processor reigns supreme as the flagship of the Xeon W-2500 series, even more powerful options with up to 60 cores are on the horizon with the upcoming Xeon W-3500 series.

The ThinkStation P5 comes equipped with an NVIDIA T400 GPU in its base configuration, but users have the option to upgrade to dual RTX A6000 (Ampere) graphics cards for even more power. Future iterations of the ThinkStation P5 are expected to leverage the next-generation ADA series graphics cards.

An official release date for Sapphire Rapids-Refresh processors remains elusive, but SIGGRAPH 2024 (July 28-August 1), a computer graphics conference, is a strong possibility for Intel to officially unveil these new workstation products.

(Via)

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Following the recent US chip export ban, Qualcomm stated in its financial filing that it is not expecting any product revenue from Huawei after 2024.

The US Department of Commerce revoked Qualcomm’s license to supply “4G and certain other integrated circuit products” including “WiFi products” to Huawei and its affiliates and subsidies.

The move comes after American firms like Qualcomm were barred from selling its 5G chips to Huawei because of the US trade ban imposed in 2019. Now, with this new ban, Qualcomm is essentially unable to provide its main products, smartphone chipsets, to the Chinese giant.

Intel is also affected by the latest ban on chip exports to Huawei. Although Intel clarified that the revocation applies to “certain licenses for export of consumer-related items” to its customers in China. 

Since the ban targets consumer-related items, it’s likely that Intel will not supply chips for laptops to Huawei. However, it should still be able to export chips for non-consumer applications, such as those used in data center servers.

In response to the ban, the Chinese foreign ministry strongly objected, stating that China firmly opposes the United States stretching the concept of national security and misusing export controls to unjustly suppress Chinese companies.

Huawei has been under the radar of the US since 2019 when it was first placed on a trade ban list. It prevented American firms from selling their technology, including 5G chips, to the Chinese tech giant.

Further in 2020, the US mandated that foreign companies that are using American chipmaking equipment need to get a license before selling semiconductors to Huawei. These licenses have now been revoked for Qualcomm and Intel.

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(Via)

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Intel introduced its Meteor Lake processors towards the end of last year. The company is also expected to release the next Arrow Lake desktop CPUs later this year. According to a leak, the first Arrow Lake CPUs will be named Core Ultra 9 285K, Core Ultra 7 265K, and Core Ultra 5 245K.

Now the recent leak from tipster MebiuW on Weibo suggests that at least the Core Ultra 9 285K (which is considered as a successor of the i9 14900KS) will have a 700MHz lower clock speed than the 14900KS. The Core i9 14900KS reaches up to 6.2GHz, whereas the 285K will reportedly cap at 5.5GHz.

The Arrow Lake CPUs may offer better stability

While the 14900KS will reach a 12% higher clock speed as compared to the upcoming 285K, the new Arrow Lake CPU will reportedly still perform better. However, the difference won’t be much. The tipster noted that the 285K will have a less than 12% higher single-core performance (with a 12% lower clock speed) as compared to the 14900KS.

Actually, it could still be an overall improvement over the 14900KS. The 13th and 14th generation Core i9 CPUs are not really stable and power efficient. In fact, there have been numerous reports of the chips crashing while playing games or doing similar heavy tasks. It could be due to the high temperature.

The extremely high clock speeds give Intel chips a slight edge in performance against AMD‘s offerings. Now it seems that Intel is focusing on stability as well.

The Core Ultra 9 285K, is expected to feature 24 cores and 24 threads of which 8 cores will be based on the Lion Cove P-Core architecture & 16 cores will be based on the Skymont E-Core architecture. It is unclear at this point whether the unlocked K-series chips will also utilize 20A or go with TSMC’s 3nm process node.

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(Source, Via)

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Intel officially announced its 14th generation Meteor Lake series chips towards the end of last year. We have seen plenty of high-end laptops with Core Ultra chips since then. Aside from the performance-focused Meteor Lake chips such as the Intel Core Ultra 9 185H or Core Ultra 5 125H, the company has silently released another efficiency-focused chip – the Intel Core Ultra 5 115U. Surprisingly, the company didn’t even include it in its SKU release list.

Key details about Core Ultra 5 115U

This new Meteor Lake offering comes with a 2+4+2 configuration, that is two performance-cores, four efficient-cores and two more low power efficient-cores, with a total of 10 threads. These two performance cores offer a max turbo frequency of 4.2 GHz where their base frequency is only 1.5GHz.

The max turbo and the base frequency of the four efficient cores are 3.5GHz and 1GHz respectively. Speaking of the two low-power efficient cores their max turbo and base frequencies are measured at 2.1 GHz and only 700MHz respectively.

In comparison to the performance focused Core Ultra 5 125H (4+8+2 configuration), which powers recently launched laptops like the ThinkBook 14 2024 Core Edition and the ThinkBook 14+ 2024 SE, the Core Ultra 115U runs on lower peak frequencies for all cores. Notably, it is rated for a 300MHz higher base frequency for the E and LPE cores as compared to the 125H, probably to compensate for the less number of cores in certain scenarios.

The newly released processor comes with a 10MB cache. For context, the Core Ultra 5 125H boasts 18MB cache.

Speaking of graphics, the Core Ultra 115U can render up to 7680 x 4320 at 60Hz both with HDMI 2.1 and DP. Notably, the resolution output of this chip is exactly the same as the Core Ultra 125H.

Core Ultra 5 115U offers a base power consumption of 15W, which is nearly half of the 125H’s 28W. The maximum turbo power is also a lot lower at just 57W as compared to the 115W of the other.

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Gamers and Intel fanboys have an extra reason to celebrate today. Intel has unveiled the i9-14900KS, the crown jewel of their 14th generation desktop processor family. This unlocked beast came through the gate swinging, boasting a record-breaking turbo frequency of up to 6.2 GHz. It’s not just setting new records, it’s pushing the boundaries of desktop performance. The launch date of the processor was previously revealed in a report by VideoCardz.

The CPU supports up to 192GB of DDR5 memory & is compatible with Z790 and Z690 motherboards.

“This processor showcases the raw power of our 14th Gen lineup,” says Intel’s Roger Chandler. “Gamers and creators can expect a whole new level of performance, taking their experiences to the next level.”

The i9-14900KS packs a serious punch with 24 cores (8 performance-oriented and 16 efficiency cores), 32 threads, and 36MB of Intel Smart Cache. Official benchmarks claim a 15% gaming performance leap over the previous generation, while content creators will enjoy significant efficiency gains in demanding workflows like 3D rendering.

The i9-14900KS boasts a flagship set of features: a record-breaking 6.2 GHz turbo frequency fueled by Thermal Velocity Boost technology, 24 cores, 32 threads, 150W base power, 36MB Intel Smart Cache, and 20 PCIe lanes (including 16 PCIe 5.0 lanes). Gamers can expect an extra edge with Intel Gaming Optimizer (APO), delivering up to an 11% performance boost in supported titles (currently 14 games). Additionally, it supports up to 192GB of DDR5 memory and is compatible with Z790 and Z690 motherboards.

The i9-14900KS will be priced at $689, and it will be available for purchase boxed at retailers or pre-integrated into high-end systems from Intel and its partners.

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(Via)

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Intel is set to release the Core i9-14900KS processor on March 14, according to reports from VideoCardz.

The Core i9-14900KS is expected to hit a boost clock of 6.2 GHz

The Core i9-14900KS joins the lineup alongside its predecessors, the Core i9-12900KS and Core i9-13900KS, which were released on April 5, 2022, and January 12, 2023, respectively. Unlike its predecessors, the i9-14900KS reportedly boasts a higher clock speed of up to 6.2 GHz (instead of 6.0 GHz) on two cores, which was previously spotted in a leak in late February along with Lunar Lake Laptop CPUs. The Core i9-14900KS is also expected to reach up to 5.9 GHz on all P cores and 4.5 GHz on the E cores.

One notable aspect of the Intel Core i9-14900KS is its pricing, which is reported to be around $740, approximately 30% higher than the current flagship i9-14900K. Despite the higher price tag, the i9-14900KS promises significant performance improvements, making it an attractive option for enthusiasts and power users.

In terms of specifications, the i9-14900KS is based on the Raptor Lake Refresh architecture and features 8 performance cores (P) and 16 efficient cores (E), resulting in a total of 24 cores and 32 threads. It comes equipped with 36MB of L3 cache and 32MB of L2 cache, providing ample memory for demanding tasks and multitasking scenarios. Additionally, the maximum thermal design power (TDP) has likely been bumped up from the i9-14900K’s 125W to 150W for the upcoming i9-14900KS.

Notably, this processor will be the final addition to Intel’s LGA-1700 platform and marks the end of an era with the last CPU to utilize the old naming convention for Desktop CPUs. Going forward, it will be replaced by the LGA-1851 socket starting with the 15th-generation Arrow Lake CPUs by the end of this year.

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Intel continues to expand its product family. In this regard, the company recently showcased its new 14th-Gen mobile and desktop CPU lineup at CES 2024. However, competition with AMD is more intense than ever. Consequently, Intel aims to achieve success in different markets through diverse marketing strategies and products. The latest example of this is the release of the Core i7-14790F and i5-14490F processors, available exclusively in China. Here are the details…

Unveiling the Core i7-14790F and i5-14490F Processors for China

Intel recently released a new processor, the Core i7-14790F, featuring 16 cores and a maximum frequency of 5.40 GHz. It’s specifically available in China and can be identified by its black packaging. Despite its higher numerical designation compared to the i7-14700F, it has 4 fewer CPU cores. The cache increases by 3MB in line with the usual series. On the JD platform’s official store, these processors are priced at 2,909 yuan.

In addition, Intel also released the i5-14490F with a lower configuration, which has 10 cores and 16 threads, a turbo frequency of 4.9 GHz, and 24 MB of cache. It is priced at 1,659 yuan. The i5-14400F with a turbo frequency of 4.7 GHz and 20 MB of cache is also priced at 1,659 yuan.

• The Core i7-14790F has a base frequency of 3.60 GHz and a TDP of 125 W
• The Core i5-14490F has a base frequency of 3.20 GHz and a TDP of 65 W
• Both processors are based on the Alder Lake-S architecture and use the LGA 1700 socket

The release of these processors is a sign that Intel is continuing to invest in the Chinese market. The company has been facing increasing competition from AMD in recent years, and these new products could help it regain market share.

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Intel, the global technology leader, is making waves in the artificial intelligence (AI) landscape by establishing Articul8 AI, a new independent company dedicated to advancing generative AI. In collaboration with DigitalBridge Group, a digital-focused asset manager, and several prominent investors, Intel is set to revolutionize the enterprise AI sector.

While the financial intricacies of the deal, including the valuation and Intel’s retained stake, remain undisclosed, the establishment of Articul8 AI signals a strategic move by Intel to consolidate its focus on AI software development. The venture, born out of a fruitful two-year research collaboration with Boston Consulting Group (BCG), boasts a generative AI system capable of processing text and images, developed using Intel’s powerful supercomputer and a combination of open-source and proprietary technology.

A key player in Intel’s enterprise AI ambitions, Articul8 AI is strategically positioned to address the challenges of transitioning generative AI from proof of concept to production safely and cost-effectively. Arun Subramaniyan, former Intel vice president with a wealth of experience in the data center and AI domain, takes the helm as the CEO of Articul8, emphasizing the company’s commitment to overcoming obstacles in the rapidly evolving AI landscape.

The generative AI system, now ready for deployment, is tailored to meet the diverse needs of enterprise customers in sectors such as financial services, aerospace, semiconductors, and telecommunications. Operating within BCG’s data centers, the platform prioritizes privacy and security, offering a compelling solution to concerns raised by potential customers reluctant to entrust their data to large cloud computing companies.

Intel’s strategic approach involves attracting external capital, following a model similar to its successful spin-off of Mobileye Global and its plans for an eventual IPO for its programmable chip unit. Notable investors in Articul8 include DigitalBridge Group, Fin Capital, Mindset Ventures, Communitas Capital, GiantLeap Capital, GS Futures, and Zain Group.

Despite its ambitious goals, Articul8 faces challenges tied to ethical considerations, transparency, accountability, and the evolving definition of responsible AI development. However, with Intel’s vast resources, experienced leadership, and a robust generative AI system ready for deployment, Articul8 AI is poised to make a significant impact in the realm of enterprise AI, competing with industry giants such as Nvidia, OpenAI, Google, Stability AI, and Anthropic. 

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Israel’s government has agreed to provide Intel with a grant of $3.2 The Israeli government has approved a grant of $3.2 billion, to Intel for the establishment of a chip plant in southern Israel with no connection to the ongoing tensions involving Hamas. This move by Intel is seen as a step towards strengthening the global supply chain and enhancing resilience in the face of challenges. In addition to this investment, Intel has also made plans for manufacturing expansions in Europe and the United States.

The grant, amounting to 12.8 percent of the total investment, is part of Israel’s effort to foster economic growth and innovation. Intel has additionally committed to procuring goods and services worth 60 billion shekels from Israeli suppliers over the next decade. The new facility is expected to create several thousand job opportunities.

Intel, which already operates four development and production sites in Israel, employing nearly 12,000 people, had its investment plans in Israel confirmed following Prime Minister Benjamin Netanyahu’s earlier announcement. Construction is underway for the expansion, with progress in the development of clean rooms and support buildings, including pile casting and initial floors.

The projected opening of the new plant is set for 2027, with operations expected to continue through 2035. Intel’s investment not only solidifies its presence in Israel but also marks a significant contribution to the nation’s economic landscape and employment sector. The tech giant’s forward-looking approach aligns with its global strategy and underscores its role in the evolving technology supply chain.

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As the chip packaging industry gets more advanced, so do the aspirations of Intel. The company aims to make a chip with a trillion transistors by 2030. The chips should double the number of transistors every year in accordance with Moore’s law, which Fairchild Semiconductor and Intel developed. But it got worse over time, and the rate of doubling transistors slowed down to three years.

Well, a big performance upgrade seems on the way for Intel chipsets, as Intel CEO Pat Glesinger confirms that Intel could surpass Moore Law’s pace by 2031. Instead, he talked about pushing the “Super Moore’s Law” concept or “Moore’s Law 2.0” for increased transistor counts. TSMC and Samsung Foundry are going to play an exceptional role in bringing Intel’s new chips built on a 2nm node. Even Qualcomm is switching to TSMC and Samsung Foundry.

Gelsinger said during his talk, “I think we’ve been declaring the death of Moore’s Law for about three to four decades.” And while that might be true, he did admit that “we’re no longer in the golden era of Moore’s Law, it’s much, much harder now, so we’re probably doubling effectively closer to every three years now, so we’ve definitely seen a slowing.”

Following the advancements, Intel could achieve the magic number of 1 trillion transistors on a chip by 2030. This is not the first time that some Intel officials have mentioned such a big development. Even Ann Kelleher, who is executive vice president and general manager at Interl’s Technology Development, revealed, “As Moore’s Law has been progressing, traditional scaling has been slowing down.”

There are a couple of different technologies that could help Intel achieve a trillion-dollar mark on a chip. The company aims to do advanced packaging and heterogeneous integration to pack more transistors into a chip. Additionally, the company plans to use the RibbonFET that Samsung uses for 3nm production. It covers all four sides, which reduces current leakage. There is another way via PowerVIA Power Delivery, which moves the power supply lines to the rear of the chip, improving performance.

However, the advancements would cost Intel a lot. Talking about the same, Gelsinger said, “Seven or eight years ago a modern fab would have cost about $10 billion,” he said. “Now, it costs about $20 billion, so you’ve seen a distinct change in the economics.”

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Intel has officially launched its latest Intel Core 14th Generation desktop processor family, with the flagship Intel Core i9-14900K leading the pack. This new lineup features six unlocked desktop processors, delivering up to 24 cores, 32 threads, and an impressive frequency of up to 6 GHz straight out of the box.

The i9-14900K has laid claim to the title of the world’s fastest desktop processor, providing gamers with a substantial edge through its 6 GHz speeds from the start. For creators, the Intel Core i7-14700K offers 20 cores and 28 threads, a 25% increase over its predecessor, ensuring significant performance gains in multi-threaded workloads.

Intel introduces the new AI Assist feature in its Extreme Tuning Utility (XTU), offering one-click AI-guided overclocking for select unlocked Intel Core 14th Gen desktop processors. This feature brings simplicity to the overclocking experience, catering to both experts and beginners.

The Intel Core 14th Gen processors leverage Intel’s advanced performance hybrid architecture, prioritizing compute performance for day-to-day workflows. The lineup promises an immersive gaming experience, delivering up to a 23% performance uplift compared to “leading competitor processors”. Enhanced gaming-focused features, including Intel Application Optimization (APO) and Thread Director application thread scheduling, aim to improve application threading. Moreover, these processors support DDR5 XMP speeds well beyond 8,000 megatransfers/second (MT/S).

Intel’s latest desktop processor family comes equipped with integrated support for Wi-Fi 6/6E and Bluetooth 5.3, as well as discrete support for new Wi-Fi 7 and Bluetooth 5.4 wireless technologies. The processors maintain compatibility with both Intel 600 and 700 series chipsets, allowing enthusiasts to easily upgrade existing systems and enjoy the latest-generation gaming and creator performance.

The Intel Core 14th Gen desktop processors are set to hit retail outlets and OEM partner systems starting October 17, 2023.

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Intel has introduced the latest Core Ultra mobile processors at the “AI Everywhere” event, signaling a transformative phase in personal computing. These processors, built on Intel’s 4 process technology, employ Foveros 3D advanced packaging, representing a significant architectural shift with dedicated AI acceleration across CPU, GPU, and the newly integrated neural processing unit (NPU).

Supporting over 100 independent software vendors (ISVs) and boasting more than 300 AI-accelerated features, Intel aims to position AI PCs as the dominant force in the PC market by 2028, reshaping the way users work, learn, and create.

Key features of the Core Ultra processors include the Performance-core (P-core) architecture, offering up to 11% better multi-threaded performance for ultrathin PCs. The Intel Arc GPU, featuring up to eight Xe-cores, promises double the graphics performance of its predecessor. The Intel AI Boost NPU enhances power efficiency by 2.5x for longer-running AI workloads.

In addition to these features, the processors support up to 16 cores, 22 threads, and the next-gen Intel Thread Director. With a maximum turbo frequency of 5.1 GHz, they provide a substantial performance boost. Memory capacity reaches up to 64 GB LP5/x and an impressive 96 GB DDR5. Supporting Wi-Fi 6E and discrete Intel Wi-Fi 7, the processors ensure seamless connectivity. Intel Bluetooth LE Audio enhances the audio experience, while Thunderbolt 4 connectivity offers speeds of 40 Gbps for lightning-fast data transfer. OpenVINO toolkits support further enhances AI performance, making these processors ideal for AI-driven applications.

The Intel Core Ultra mobile processors are now globally available, set to power over 230 AI PCs from leading partners like Acer, ASUS, Dell, HP, Lenovo, and more. This marks a significant advancement in personal computing, where efficiency, computation, and AI converge to redefine the user experience.

Acer has already announced its Predator Triton Neo 16 laptop powered by the new Intel Core Ultra CPUs. The machine is tailored towards both gamers and content creators.

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Intel is scheduled to unveil its Meteor Lake processors on December 14th. Following closely, Samsung is reportedly planning to launch its Galaxy Book 4 series on December 15th. This reported launch, according to Korean media outlet Yonhap News, is a month earlier than its predecessor, in a bid to claim the title of “first AI laptop.”

The Meteor Lake processors boast Intel’s first integrated neural processing unit (NPU), enabling them to handle a range of AI-related tasks. Samsung is expected to utilize silicon capability to power its own AI model, Samsung Gauss, to implement on-device AI in the Galaxy Book 4 series.

As the name suggests, on-device AI refers to devices that can run artificial intelligence capabilities locally, meaning all AI processing happens on the device itself, rather than in the cloud. This eliminates the need to upload data or maintain an internet connection.

The outlet also confirms that the upcoming Galaxy Book 4 lineup will feature Intel Core Ultra processors, the new Meteor Lake CPUs that no longer carry the ‘i’ branding.

Current Galaxy Book 3 devices offer up to a Core i7 processor. With the new naming scheme, we expect Samsung to primarily utilize Core Ultra 7 chips, such as the Core Ultra 7 155H, in the Galaxy Book 4 series. However, considering the Galaxy Book 3 Ultra’s Core i9 option, Samsung may also introduce the Core Ultra 9 185H or another high-end chip in the Galaxy Book 4 lineup.

Likewise, leaked renders suggest that the Galaxy Book 4 series will retain a similar design to its predecessors, with notable internal upgrades such as an AMOLED display and Nvidia 40-series GPUs.

Yonhap News also reports that LG and HP are also working on Meteor Lake laptops, but they are “weighing the timing.” This suggests they may not be as quick to market as Samsung and may only announce or launch their own devices in 2024.

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In a significant setback to Vietnam’s aspirations in the global semiconductor industry, Intel has abandoned its plans to double the size of its operations in the country. The decision dealt a blow to Hanoi’s hopes of becoming a prominent player in the chip manufacturing market. Vietnam already hosts Intel’s largest factory worldwide for assembling, packaging, and testing chips, but further expansion dreams have been shattered.

The move follows US President Joe Biden’s visit to Vietnam in September, during which he announced deals to support the country’s burgeoning chips industry. However, US officials recently informed a select group of businessmen and experts that Intel had put its expansion plan on hold. The company cited concerns about the stability of power supplies and excessive bureaucracy as reasons for its decision.

While Intel did not specify the exact reasons for the cancellation, it expressed apprehensions about Vietnam’s power supply stability and bureaucratic hurdles. The Southeast Asian nation had hoped to position itself as an alternative to chip manufacturing giants like China and Taiwan, but political risks and trade tensions with the United States posed challenges to its ambitions.

Intel’s withdrawal coincides with the company’s substantial investments in Europe and comes amid power shortages in Vietnam. These shortages have led to temporary production suspensions for numerous manufacturers in the country, exacerbating the challenges faced by the local industry.

Despite this setback, Vietnam continues to actively seek investments from chipmakers, aiming to diversify their supply chains and carve out a larger role in the global semiconductor arena. The Vietnamese government had initially planned to attract $3.3 billion in additional investment from Intel, but references to this were later removed from official documents following media reports.

In the wake of this development, Intel and other multinational firms have been pressing the Vietnamese government for subsidies, particularly in light of a global tax overhaul. Ongoing discussions are centered on the implementation of the new tax and subsidy policies slated for the coming year.

The cancellation of Intel’s expansion plans highlights the challenges faced by emerging players in the semiconductor industry, emphasizing the need for stable infrastructure and favorable business environments to attract major investments. Vietnam, despite this setback, remains determined to bolster its position in the global semiconductor landscape, exploring avenues to attract further investments and navigate the evolving dynamics of the industry.

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Technology continues to advance rapidly. While this often benefits consumers, even billion-dollar tech giants can sometimes struggle to keep up with this pace. It appears that Intel is currently facing a similar challenge. Nvidia, AMD, and Qualcomm are all working on ARM-based PC platforms, and Apple’s success with ARM-based technology has demonstrated its potential across the PC landscape. If Intel doesn’t adapt to this change, the company could face some serious challenges. Here are the details…

Intel’s PC chip ship is sinking with ARM-ada on the horizon

Intel is facing a number of serious challenges, including the rise of ARM-based PCs and Apple Silicon. Nvidia, AMD, and Qualcomm are all developing ARM-based PC platforms, which could pose a major threat to Intel’s dominance in the PC chip market. ARM-based chips are known for being more energy-efficient and less expensive than x86 chips, which are the type of chips that Intel uses.

Apple Silicon has also shown that ARM can be best-of-breed across the PC landscape. Apple’s M1 chip has outperformed Intel’s chips in a number of benchmarks, and it has helped to make Apple’s MacBooks some of the most popular laptops on the market. Intel also has a history of innovation failure. In the past, Intel has misread the market with the i860, the Itanium, and the Atom processors. These failures have cost Intel billions of dollars and have allowed its competitors to gain ground.

In the past, Intel has been able to use its dominance in the PC chip market to force its own standards on the industry. However, this approach is no longer sustainable. Intel needs to collaborate with other companies and be more flexible in order to meet the needs of its customers. It is too late for Intel to get back into the mobile market, and the dynamics that lost it the mobile market are spreading to commodity PCs and laptops. This is because the market is demanding more energy-efficient and less expensive devices.

Intel needs to improve its innovation process and focus on customer needs. If Intel can do these things, it may be able to survive in the new era of computing. However, if Intel fails to change, it could be left behind by its competitors.

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Intel recently introduced its 14th-gen Raptor Lake processors. These eagerly anticipated processors have once again managed to impress with their performance. For instance, the P-cores on the 14th-gen processors can reach up to 6 GHz, which is 200 MHz higher than the 12th-gen processors. However, in addition to all this performance and innovative features, the new processors have a significant drawback. According to Intel’s announcement, the 14th-gen desktop processors do not support Thunderbolt 5. Here are the details…

Intel 14th-Gen Desktop Processors Do Not Support Thunderbolt 5

If there are those among you who don’t know, Thunderbolt 5 is the newest version of the Thunderbolt interface developed by Intel. This technology is a universal bus interface that merges PCI Express and DisplayPort into one serial signal. It’s capable of transmitting both data and video through a single cable.

Thunderbolt 5 supports a bi-directional bandwidth of up to 80 Gbps, which is double the speed of Thunderbolt 4. With Thunderbolt 5, you can mirror displays, transmit data, and use it for many different tasks. In fact, we often see this technology being frequently used in laptops. However, the 14th-gen Intel desktop processors do not support Thunderbolt 5.

This was a surprise to many, as Intel had initially stated that the 14th-gen processors would support the new connectivity standard. However, the company has since clarified that this technology will only be supported on upcoming laptop processors based on the Meteor Lake architecture.

While it is disappointing that the 14th-gen desktop processors do not support Thunderbolt 5, it is important to note that the technology is still in its early stages of development. It is not expected to be widely available until 2024, and it is likely that only high-end laptops will support it at first.

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Xiaomi is reportedly working on a new laptop with an unannounced Intel Meteor Lake processor. The device was spotted on the benchmark platform Geekbench with an Intel 14th Gen Core Ultra 7 155H processor, revealing key details about it.

The Geekbench result shows that the Intel Core Ultra 7 155H processor is equipped with 16 cores and 22 threads, with 6 performance cores and 10 efficiency cores. In the benchmark test, the laptop managed to score 1567 points in single-core and 8228 points in multi-core. 

This is relatively lower than the average score of Core i7-13700H, which is 2610 in single-core and 12989 in multi-core in Geekbench. However, it is important to note that these are early benchmarks and the performance may differ when the system makes its final debut.

Besides this, the Xiaomi laptop is equipped with 32GB of memory (should be dual-channel), the storage is unknown, and it runs Windows 11 system.

Intel is betting hard on Meteor Lake’s capabilities. It will be built on the Intel 4 process and will feature XPU (Intel’s device abstraction for CPU, GPU, FPGA, and other accelerators) enhancements with integrated AI and a tiled GPU architecture that, according to Intel, should deliver discrete graphics-level performance.

Intel has also announced that beginning with Meteor Lake, it will use new branding for the Intel Core Processors. The letter “i” will be dropped from the tiering (e.g. Intel Core 5 processor) and the preferred method to put the processor number after the word “processor”, such as Intel Core 5 processor ##xx.

Intel also mentioned that Meteor Lake will be an exclusively mobile architecture and processors on this architecture will be referred to as Core Ultra, while regular Core will be on the Raptor Lake Refresh architecture.

We are excited to see how the Xiaomi laptop with the Intel Meteor Lake processor performs when it is finally launched.

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Intel continues to expand its product line. The latest addition to the company’s successful processors is the recent Arc graphics card series. Now, the company has launches the Arc A580. Priced at $179, this graphics card targets users seeking a cost-effective solution and a smooth gaming experience at 1080p with medium to high graphics settings. Here are the details…

Intel Launches Arc A580: A $179 Graphics Card for 1080p Gaming

Intel has launches its Arc A580 graphics card, a budget-friendly gaming GPU for $179. The new Arc A580 is based on Intel’s top-tier ACM-G10 GPU, but it has a few features disabled in order to hit the lower price point. For example, it has 24 Xe-Cores instead of 32, and it doesn’t support Intel’s XeSS upscaling technology. However, it still supports ray tracing and has a number of other features that make it a good value for the price.

In terms of performance, the Arc A580 is comparable to the AMD Radeon RX 6600 and the Nvidia GeForce RTX 3050. It can handle most popular games at 1080p with high settings, and it can even play some games at 1440p with medium settings. Here are some of the key features of the Intel Arc A580:

• 24 Xe-Cores
• 8GB GDDR6 memory
• 185W board power
• Supports ray tracing
• Supports Intel Deep Link
• Supports Intel XeSS

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Intel has officially launched high-volume manufacturing on the Intel 4 process technology at its Fab 34 facility in Leixlip, Ireland. The event, graced by Intel CEO Pat Gelsinger, marks a significant leap forward in semiconductor technology. 

The Intel 4 process, employing extreme ultraviolet (EUV) lithography, represents Intel’s foray into a future brimming with cutting-edge products, from processors revolutionizing artificial intelligence in PCs to chips fueling the world’s largest data centers.

Central to this achievement is the integration of EUV lithography technology, a marvel of precision, enabling the definition of smaller and more intricate chip features. The EUV machines, provided by Dutch manufacturer ASML, represent a pinnacle of engineering, boasting mind-boggling accuracy. Each of these colossal machines, resembling a bus in size, costs around $150 million and plays a pivotal role in Intel’s quest for technological supremacy.

Ann Kelleher, Intel’s General Manager of Technology Development, emphasized the company’s progress, stating that two manufacturing processes have been successfully completed, with a third swiftly underway. The Leixlip facility stands as a testament to Intel’s unwavering commitment to innovation, boasting an intricate network of overhead robots navigating a 22km track, ensuring the seamless transport of silicon wafers from one advanced tool to another. 

The Irish plant is now gearing up to produce chips, including the highly anticipated Meteor Lake PC processors. Intel’s investment in this venture has been substantial, with a staggering $18.5 billion USD spent on doubling the manufacturing space in Leixlip. This expansion aligns with Intel’s ambitious plans to deliver five generations of technology within just four years, reaffirming the company’s commitment to regaining process leadership by 2025.

The commencement of high-volume production on the Intel 4 process in Leixlip heralds a new era of innovation, where the boundaries of what’s possible in computing technology are continually pushed.

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If you follow technology and Gizmochina closely, you’ve heard of Thunderbolt many times by now. If you haven’t heard of it or don’t know what it is, Thunderbolt is a high-speed input/output technology developed by Intel. It combines the features of several other technologies, including USB, DisplayPort, and PCIe, into a single connector and cable.

This makes it possible to connect a wide variety of devices to a computer with a single port, such as the popular Type-C port. Now, Intel has announced Thunderbolt 5, the next generation of its high-speed connectivity standard. Here are the details…

Thunderbolt 5: The Next Generation of High-Speed Connectivity

Thunderbolt 5 will deliver 80 Gbps of bi-directional bandwidth, which is twice the speed of Thunderbolt 4. It will also support Bandwidth Boost, which can temporarily increase the bandwidth to 120 Gbps for video-intensive applications. In addition to its increased speed, Thunderbolt 5 also doubles the PCI Express data throughput for faster storage and external graphics.

It is also built on industry standards including USB4 V2, DisplayPort 2.1, and PCI Express Gen 4, making it fully compatible with previous versions of Thunderbolt and USB. Thunderbolt 5 is also designed to be more power efficient than previous versions. It can deliver up to 240 watts of power, which is enough to charge a laptop or power an external GPU.

The bandwidth needs of content creators, gamers, and professionals are increasing significantly. These users want high-resolution displays and low-latency visuals while working with increasingly larger video and data files. Thunderbolt 5 has been designed to meet these needs, providing the performance and bandwidth required for the most demanding applications.

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British chipmaker ARM is gearing up for an initial public offering (IPO) as its parent company SoftBank plans to raise money from the public after the failed acquisition by Nvidia. Last month, a report said that Apple and Samsung are planning to buy shares of ARM when the IPO opens. Now a report by Reuters suggests that Arm customers, including Apple, and Samsung are set to be among the investors in the chip designer’s IPO. 

Apart from Apple and Samsung, ARM’s IPO has attracted many notable investors from the technology and chip industry, including AMD, NVIDIA, Intel, Cadence Design Systems, Synopsys, and Alphabet. These investors have agreed to invest in the IPO at a valuation of between $50 billion and $55 billion, Reuters reported earlier on Friday. SoftBank, ARM’s parent company, is hoping to hit this target valuation.

While the investment amounts of individual companies have not been disclosed, NVIDIA, Apple, and others have agreed to invest in Arm’s IPO. The report says that the investment amount could be between $25 million and $100 million. Arm and SoftBank are keeping aside 10% of the shares to be sold in the IPO. Amazon was also in talks to invest but has since pulled out for undisclosed reasons.

It is no surprise that Samsung and Apple are investing in ARM’s IPO. Both companies are major users of ARM chips, and they will benefit from having a say in the company’s future. However, investing in ARM’s IPO does not guarantee any special treatment, such as a seat on the board of directors or the ability to dictate strategy, reports Reuters. Still, the involvement of these companies makes it more difficult for a competitor to acquire ARM in the future.

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Industry expert Ming-Chi Kuo claims that Intel Foundry Services (IFS) is ceasing to produce Qualcomm SoCs using the 20A fabrication process. Qualcomm will most likely go with TSMC and Samsung Foundry instead.

Kuo did not provide much information as to why Qualcomm is making such a decision. But according to recent reports, the reason may be due to high production costs. This decision may have a negative effect on RibbonFet (transistor architecture) and PowerVia (backside power delivery method), as this will put Intel’s upcoming 18A mass production at a high level of risk.

It is also highly anticipated that Qualcomm will go to TSMC Foundry for its upcoming Snapdragon 8 Gen 3 production, which is set to launch in October. For the Snapdragon 8 Gen 4, though, Qualcomm might have to dual source from both TSMC and Samsung. Recently, it was said that Samsung’s custom version of the Snapdragon 8 Gen 4 will be manufactured using its own 3GAP node. While the standard Snapdragon 8 Gen 4 chip will be manufactured using TSMC’s node.

Aside from this, rumors suggest that the upcoming Snapdragon 8 Gen 3 SoC will feature a more modernized architecture. It is expected to have a more powerful prime core with a higher frequency. It will likely be manufactured using the TSMC N4P process. Snapdragon 8 Gen 3 may include one Cortex-X4 core, Five A720 cores for enhanced performance, two A520 power-efficient cores, and an Adreno 750 GPU.

We can expect more leaks and official news on Snapdragon 8 Gen 3 SoC as the launch date grows near.

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Intel has been losing ground to rivals in the chip manufacturing race. You read that right. Even though many of us know Intel from the processors we use in our computers, the company also makes chips for other companies. Intel was actually the world’s leading chipmaker for many years, from 1971 to 2021. But in the past few years, it’s been falling behind rivals like TSMC and Samsung. However, Intel wants to turn things around. That’s why they’ve teamed up with Ericsson. They’re planning to make a special 5G chip using Intel’s cutting-edge production methods. Here are the details…

Intel and Ericsson Unveil Plans for Custom 5G Chip

Intel has been losing ground to competitors in the chip manufacturing competition for some time now. The main reason for this is that rivals like TSMC and Samsung have heavily invested in new production technologies. As a result, they are now capable of creating chips that are smaller, more powerful, and use less energy. However, Intel has been working hard not to let this continue. Over the past few years, the company made serious investments in both their production facilities and acquisitions like Tower Semiconductor. Now, these investments are paying off with the Ericsson deal.

Intel and Ericsson are planning to work together to create a special 5G chip. This chip will be built using Intel’s 18A technology and is planned to be used in Ericsson’s 5G network equipment. It is expected to be available in 2025. The chip they’re making is designed to match the specific requirements of 5G network equipment. These include performing tasks quickly, using less power, and being able to adjust to different sizes or scales. This chip should also be able to work with many types of 5G standards.

Unfortunately, there is not much information about the deal yet. The main thing we’re curious about is whether this agreement will truly change things for Intel. What do you think about this? Do you believe Intel can regain its title as the world’s leading chipmaker?

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Exciting news has emerged from Intel, as reports indicate that the tech giant is gearing up to release the highly anticipated Granite Rapids-D peripheral chip in 2024. According to foreign technology media Computer Base, the chip will utilize the cutting-edge Intel Process 3, promising a significant leap in performance and capabilities.

The Granite Rapids-D Chip may be delayed until 2025

Leaked PPT slides of the Granite Rapids-D peripheral chip have provided a sneak peek into what we can expect. These slides reveal that the new chip will serve as the successor to the Xeon D-1700 and D-2700 (Ice Lake-D) models. Leveraging the power of the Intel 3 process, the Granite Rapids-D chip boasts a higher core density compared to its predecessors, promising enhanced processing capabilities and improved efficiency.

While specifics regarding the release date of the new Xeon-D chip (Granite Rapids-D) remain uncertain, reports suggest that Intel plans to launch the Granite Rapids-AP and Granite Rapids-SP server processors by the end of 2024. This leads to speculation that the release of the Granite Rapids-D chip may potentially be delayed until 2025. However, Intel’s commitment to delivering cutting-edge technology ensures that enthusiasts and professionals alike can expect an exceptional product whenever it becomes available.

The Granite Rapids-D chip holds immense promise for a range of applications, from high-performance computing to enterprise-level data centers. With its advanced architecture and increased core density, this chip is poised to revolutionize the computing landscape, delivering faster processing speeds, improved multitasking capabilities, and heightened energy efficiency.

Intel’s continuous innovation and dedication to pushing the boundaries of technology have solidified its position as a leader in the industry. The upcoming Granite Rapids-D chip serves as a testament to Intel’s commitment to delivering groundbreaking solutions that meet the ever-evolving demands of the market.

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The COVID-19 pandemic has had a major impact on the technology industry. Many companies have realized the risks of relying on a single region for production, and are now looking to diversify their supply chains. For example, Apple has started manufacturing some of its iPhones in India. In a similar move, Germany and Intel have agreed on a deal that will see the US chipmaker receive €10 billion in subsidies to build a semiconductor manufacturing facility in Germany. Here are the details…

Germany, Intel Agree Chip Plant Subsidies Worth €10 Billion

As we mentioned before, technology companies are investing in production in different countries. This is good news for the regions where these companies invest, as it means economic development and job creation. Governments are signing agreements with tech giants to provide them with incentives and infrastructure facilities. The latest of these agreements was signed between Germany and Intel.

The agreement, which was signed by Chancellor Olaf Scholz and Intel CEO Pat Gelsinger on Monday, will see Intel build a new chip plant in the city of Magdeburg. The plant is expected to create thousands of jobs and cost around €30 billion to build. A significant part of this will be paid by Germany.

The subsidies will come in the form of both financial aid and price caps on energy. The financial aid will be used to help Intel cover the cost of building the plant, while the price caps on energy will help to keep costs down for Intel once the plant is operational. The agreement is a major boost for Intel, which has been looking to expand its manufacturing capacity in Europe.

The agreement is also a major win for Germany, which is looking to become a leading producer of semiconductors. The country has a strong manufacturing base, and the new chip plant will help to create jobs and boost economic growth. The new chip plant in Magdeburg is expected to be operational by 2027.

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For the longest time, Intel Core CPUs came with an iconic “i” in their names— Intel Core i3, Core i5, and Core i7. But moving forward, the company may get rid of the “i” from the names of its processors, branding them to a simpler “Core 3/5/7/9” concept. This rebranding will apparently make Intel’s products better align with customer requests. Additionally, the company is introducing an Ultra tier for higher-end chips.

Say goodbye to the “i” and hello to “Ultra”

Benchmarks of the upcoming “Meteor Lake generation” of CPUs have leaked, revealing the name “Core Ultra 5 1003H,” as reported by VideoCardz. The absence of the “i” in the processor’s name suggests that Intel is indeed abandoning the iconic letter. The reasoning behind this decision is intriguing—Intel believes that the name “Intel” is becoming overshadowed, and customers primarily identify the company through terms like “Core i5” or “Core i7.”

“When we looked at how the tech press, how our retailers, our OEMs, our partners talk about it, it was interesting to see how we got shortchanged all the way to a letter and a number,” Christopher Hirsch, Intel’s director of product branding, told The Verge.

Furthermore, the US tech giant will introduce a new tier called “Ultra” in its branding, positioned before the number. This means the future high-end processors may be referred to as “Intel Core Ultra X.” Intel has clarified that generational information will still be included at the end, such as “Intel Core X processor 1300AB.” The company has stated that both the standard Core and Core Ultra processors will be compatible with its Intel Arc graphics (Via Engadet).

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Intel has just launched a couple of new workstation grade graphics cards for its Arc series. The company has unveiled the new Arc Pro A60 and Pro A60M that are made to handle hefty workloads and features up to 12GB of VRAM and other capable specs. So here are all the details.

Intel Arc Pro A60 & Pro A60M GPUs launched with up to 12GB VRAM

The American tech giant has announced the two new GPU models that are built specifically to meet professional workstation requirements. These new GPUs offer 12GB of VRAM and can handle up to four monitors with HDR and Dolby Vision. The company’s new GPUs offer various improvements over their predecessor and promise to offer enhancements to handle various tasks that will be ideal for professional environments. The new Intel Arc Pro A60 and A60M offer 16 PCIe lanes and 384 gigabytes per second memory bandwidth for improved data transfer speeds.

Furthermore, the advanced AI Xe matrix helps the GPUs complete AI related tasks while 16 ray tracing units enable realistic graphics and better visual effects. Lastly, there is even full media encode and decode support including the AV1 standard for media processing. The new Intel GPUs are optimizing for workstation applications, which means taht it works well with Blender and other rendering tools. These can even run rendering and ray tracing libraries from the Intel oneAPI Rendering Toolkit.

The new Arc Pro A60 GPU for desktop PCs will be available via authorized retailers soon. On the other hand, the Arc Pro A60M is a mobile graphics card. Meaning, we can expect it to arrive in the upcoming months through OEM partners. Intel Arc Pro GPUs will also come with 3 year limited warranty. Notably, the news also arrives as the brand is rumored to be working on Intel Meteor Lake-S chips that may debut soon.

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The competition in the CPU market continues at full speed. Intel, which has been struggling due to complacency from being at the top for a while and falling behind its rival AMD, is working to widen the gap with the red team. According to the latest information, Intel’s 14th Generation Meteor Lake processors may soon enter the desktop market, as an LGA1851 Meteor Lake-S interposer was recently discovered. Here are the details…

Intel Meteor Lake-S CPU Tool Surfaces for Desktop PC

Intel’s 14th Generation Meteor Lake processors might make their way into the desktop market. While Intel‘s commitment to a socket isn’t as steadfast as AMD’s, the appearance of these leaks may imply that the company is preparing Meteor Lake-S desktop chips. However, without access to technical specifications or documentation, the exact purpose and features of the Meteor Lake-S processors remain speculative.

The leaked information indicates a potential increase in contacts compared to the current LGA1700 socket. This could lead to improved performance and compatibility with future hardware. Another leak suggests that the 14th Generation moniker is designated for the upcoming Meteor Lake processors, but it remains unclear whether these processors are intended for mobile, desktop, or both.

An unverified Intel roadmap casts doubt on the possibility of Meteor Lake coming to desktops in the near future, as it suggests that Intel is preparing a Raptor Lake Refresh (RPL-R) for a Q3 release. This could indicate that the rumored RPL-R will be the last to utilize Intel’s LGA1700 socket. With recent developments in Meteor Lake, including Linux patches and the confirmation of an L4 cache, it’s plausible that if a desktop variant is planned, it may not arrive until 2024.

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The competition in the processor market has never been higher. With the increase in performance of mobile processors and the success Apple has achieved with its M-series Mac models, traditional manufacturers like Intel and AMD are compelled to adapt. Intel, recognizing this situation, is taking early steps to adjust. By optimizing its fabs for ARM chip production, the company is opening new opportunities in the global supply chain. Here are the details…

Intel Optimizes Fabs for ARM Chip Production, Opening New Possibilities for Global Supply Chain

Intel and ARM announced an agreement that will optimize Intel’s 18A fabrication process for use with ARM designs and intellectual property. While the deal doesn’t involve “Intel Foundry Services” division producing chipsets for ARM, it will significantly simplify the process for ARM licensees, such as Qualcomm and MediaTek, to commission Intel for future chip production.

Initially, the partnership will concentrate on optimizing Intel’s 18A process for mobile system-on-a-chip (SoC) designs. However, both companies anticipate that the collaboration could expand to encompass silicon designed for the automotive industry, Internet of Things (IoT) devices, and data centers. Additionally, Intel will extend its support to ARM licensees beyond wafer production, offering services related to packaging, software, and chiplets.

This comprehensive support highlights Intel’s vision to become a one-stop solution for ARM-based chip manufacturing. Intel has also emphasized the geopolitical implications of the agreement. By optimizing its fabs for ARM chip production, the company aims to create a more balanced global supply chain for foundry customers working on mobile SoC designs with ARM-based CPU cores. As of July last year, Taiwan Semiconductor Manufacturing Company (TSMC) was responsible for manufacturing nearly 70% of all critical chipsets used in modern smartphones, as reported by Counterpoint Research.

The recent military exercises by China, involving the encirclement of Taiwan, have raised concerns over potential conflicts on the island and the stability of the semiconductor supply chain. By collaborating with ARM, Intel is positioning itself as a viable alternative to TSMC, offering a more geographically diverse and secure chip production option for ARM licensees. This partnership is expected to have far-reaching effects on the global chipmaking landscape, potentially alleviating supply chain bottlenecks and fostering a more competitive market.

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Intel has reportedly chosen to partner with TSMC to produce its next-generation Battlemage and Celestial GPUs, set to release in the second half of 2024 and 2026, respectively. According to Taiwanese media outlet ctee.com.tw, the Battlemage GPU will use the Xe2 architecture and be manufactured using TSMC’s 4nm process node, while the Celestial GPU will use the Xe3 architecture and be manufactured using TSMC’s N3X (3nm) process node.

This report is not surprising given that Intel used TSMC for its first-gen GPUs, Alchemist (Xe), which launched in mid-2022. The leaked product plan shows that the Battlemage Xe2 and Celestial Xe3 GPUs will come in both HPG and LPG flavors, with the HPG versions targeting the 75-250W segment.

Despite facing challenges in operations and pressure to reduce inventory in the production chain, Intel remains committed to its GPU R&D plans. The company has invested heavily in constructing 4nm and more advanced process wafer fabs but will continue to maintain its business model of cooperation with wafer foundries, with TSMC being its sole partner.

Intel’s focus on gaming and AI segments is driving demand for discrete GPUs, and the company is poised to continue improving its GPU offerings with the upcoming launches of the Battlemage and Celestial GPUs. The next-gen discrete Arc graphics card lineup is also expected to receive a refresh under the Alchemist+ family, as rumored for some time now.

Overall, this partnership between Intel and TSMC marks an exciting development in the world of GPUs, and we can expect to see continued advancements and innovations in the future.

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Intel plans to release its first energy-efficient data center chip, Sierra Forest, in early 2024. The company has faced a challenging period marked by product delays but still holds over 70% market share in the PC and server processing chips sector, down from 90% in 2017. Here are the details…

Intel Gears Up to Launch Power-Efficient Sierra Forest Chip in 2024

Sandra Rivera, head of Intel’s Data Center and AI Group, admitted the company’s recent struggles but affirmed that Intel is now on track, hitting key engineering milestones. The fourth-generation Xeon processor, Sapphire Rapids, faced delays, allowing AMD to narrow the gap. Rivera confirmed that the fifth-generation Xeon processor, Emerald Rapids, will be delivered by 2023’s end. The next-generation Granite Rapids processor is set for a 2024 release, followed by Sierra Forest. Clearwater Forest, another energy-efficient chip, is planned for a 2025 launch.

Intel is also developing the Intel Developer Cloud, featuring 256 Xeon chips and 512 Gaudi chips for AI applications. AI startups Hugging Face and Stable Diffusion are already using Intel chips. With a robust lineup of upcoming products, Intel aims to strengthen its data center market presence and focus on power efficiency and innovation. The company’s commitment to improving its product portfolio and meeting crucial engineering milestones highlights a renewed emphasis on addressing data center customers’ needs and maintaining a competitive edge in the rapidly evolving tech landscape.

Intel’s upcoming releases, including the power-efficient Sierra Forest and Clearwater Forest chips, demonstrate the company’s dedication to creating innovative, eco-friendly solutions for data centers. By offering energy-efficient options, Intel can cater to the growing demand for sustainable technology and attract environmentally conscious clients.

The Intel Developer Cloud, which offers AI developers access to powerful Xeon and Gaudi chips, exemplifies Intel’s commitment to advancing artificial intelligence. By collaborating with AI startups like Hugging Face and Stable Diffusion, Intel is supporting the growth of the AI industry and ensuring its products remain relevant in this dynamic sector.

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