The ongoing battle between MediaTek and Qualcomm for mobile chipsets has been getting more fierce with each passing year. MediaTek’s Dimensity has often been looked at as a more affordable alternative to Snapdragon SoCs. But in 2025, does this sentiment still hold true? Read on to find out.

Performance

MediaTek’s latest flagship Dimensity 9400 closes the gap in terms of performance with Qualcomm’s premium offering, the Snapdragon 8 Elite. In synthetic benchmarks like GeekBench and AnTuTu, the Dimensity 9400 nearly matches the Snapdragon 8 Elite, promising high end performance. It is no longer just a cheaper alternative, which is why flagship phones like the Oppo Find X8 Pro and Vivo X200 Pro pack this processor.

Snapdragon still maintains an edge in areas like GPU performance with the Adreno series. However, MediaTek isn’t a market leader for no reason. Even in the budget to mid range segments, the brand has managed to dominate with most smartphones packing Dimensity 6000 or 7000 series processors. Even in the premium segment, it packs cutting edge tech and support for AI (Artificial Intelligence).

Gaming

As Dimensity chips have begun matching Snapdragon in performance, MediaTek is growing in popularity among mobile gamers as well. You can find various gaming comparisons between the Snapdragon 8 Elite and Dimensity 9400 online which clearly showcase comparable performance.

Even in the mid range segment, the Dimensity 8400 Ultra is one of the best chipsets for Android devices. To put things into perspective, this chip has managed to outperform the Snapdragon 8s Gen 3, which is a cutdown version of last year’s flagship Snapdragon chip.

MediaTek dominates the chip market

MediaTek dominated the chipset market back in 2024, shipping over 53.0 million units in the first quarter alone. The company held the throne in the market, with Apple and Qualcomm being close behind. Under a certain budget, Dimensity is by far a lot more popular among manufacturers, bringing great value to customers as well.

While Qualcomm is still popular in the ultra high end smartphone category, MediaTek leads in certain regions like India due to its more price-competitive chipsets. So it’s clear that One of MediaTek’s biggest advantages remains its pricing. Dimensity is a popular choice for not only mid range and budget friendly devices but even affordable flagship phones as well.

Conclusion

In 2025, MediaTek’s Dimensity chips have undoubtedly reached a level where they can compete directly with Snapdragon in most areas. For everyday users, it is practically impossible to tell the difference between single digit performance differences. Qualcomm still offers the most powerful mobile chip for Androids, but MediaTek is catching up.

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The post Are MediaTek Dimensity finally as good as Snapdragon chips in 2025? appeared first on Gizmochina.

Qualcomm has announced that its custom Oryon cores will come to its flagship Snapdragon 8 Gen 4 mobile SoC in 2024. This is the first time that Qualcomm will use its own CPU cores in a smartphone chipset since the Snapdragon 820 and 821 in 2016.

Qualcomm acquired Nuvia, a chip design company founded by former Apple engineers, in March 2021. Nuvia is developing custom Arm-compatible CPU cores, and Qualcomm has said that the Oryon cores are based on Nuvia’s designs.

Qualcomm has already announced the Snapdragon X Elite PC chipset featuring the Oryon CPU. The company claims that the Oryon cores offer better single-threaded performance than both the Apple Silicon M2 Max and the Intel Core i9-13980HX while consuming 70% less power than the Core i9-13960HX for the same amount of work completed.

However, it’s unlikely that the Oryon cores in their current computing-focused state will make it to mobile. Instead, Qualcomm is likely to use cut-down versions of the Oryon cores on mobile.

This will give Qualcomm more control over the design of its CPUs and could allow the company to differentiate itself from its competitors, which use modified Arm Total Compute Solutions (TCS) cores.

It’s not yet clear exactly what form the Oryon cores will take on mobile. However, the fact that Qualcomm is using its own custom CPU cores is an exciting development for the mobile industry. It could lead to more powerful and efficient mobile devices in the future.

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• Redmi Note 13 Pro Plus offers several premium features at mid-range price

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Qualcomm is reportedly skipping the release of a Snapdragon 8+ Gen 2 as a mid-cycle refresh and is instead focusing on developing its next-gen Snapdragon 8 Gen 3 chipset. According to leaks from RGcloudS, the new chipset will maintain the 1 + 4 + 3 core configuration of its predecessor, the Snapdragon 8 Gen 2, but will feature a new Cortex-X4 prime core that can be clocked up to 3.70GHz. This results in a 15% clock speed boost over its predecessor, the Snapdragon 8 Gen 2’s Cortex-X3.

The Snapdragon 8 Gen 3 is expected to be built on TSMC’s N4P 4nm node, with Apple’s A17 Bionic being the only flagship chipset to be manufactured on a 3nm process this year. Qualcomm is expected to catch up next year with Snapdragon 8 Gen 4.

While Qualcomm has not confirmed any details about the Snapdragon 8 Gen 3, rumors suggest that the new chipset could surpass the A17 Bionic in single-core performance, though the A17 Bionic is expected to retain an efficiency advantage. The Snapdragon 8 Gen 3 for Galaxy is said to be capable of outperforming the A17 Bionic on paper, but it remains to be seen how it will perform in real-world usage.

The Snapdragon 8 Gen 3 is expected to feature a Cortex-A715 and new Cortex-A515 cores, but the clock speeds of these cores are currently unknown. The potential increase in power consumption due to the higher clock speeds of the Cortex-X4 prime core could impact battery life and temperature, and it remains to be seen how Qualcomm intends to address this.

The Snapdragon 8 Gen 2 already saw significant improvements over its predecessor, and the Snapdragon 8 Gen 3 is expected to build on that foundation. While it is still early days, the leaks about the Snapdragon 8 Gen 3, and it will be interesting to see how the chipset performs when it is eventually released.

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• All Upcoming Smartphones Confirmed To Use Snapdragon 8 Gen 2

(Source, Via)

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Competition in the mobile processor market continues at full speed. Companies such as Qualcomm and MediaTek continue to work both to offer higher performance products and to find a place for processors in more smartphones. However, the real route to smartphones is through users’ demands. Being aware of this situation, Qualcomm has introduced the Snapdragon Insiders Access Program. Here are the details…

Exploring the Latest Tech with Qualcomm’s Snapdragon Insiders Access Program

Qualcomm has recently introduced the Snapdragon Insiders Access Program. A new initiative that aims to support up-and-coming creators in the technology industry. The program is open to anyone who is interested in technology and is a resident of the United States who is over the age of 18. The main goal of the program is to provide members with priority access to Snapdragon-powered devices and brands, as well as connect them with established influencers in the industry.

Members of the program will also be invited to test new devices with Snapdragon chipsets, attend events to share educational content with the community, and provide feedback on new technologies and experiences. To become a member of the program, all you have to do is sign up on Qualcomm’s website. Once accepted, your name will be added to the list of creators that the company reaches out to ahead of events. The company is also looking for diversity and underrepresented content creators to join the program.

As a member, you will be asked to share your experiences with your followers on your social media channels. However, it is important to note that while you will still own all of the content you create, Qualcomm does ask for a license to use your content commercially to promote the program to other Snapdragon Insiders.

The program is currently open to all, with no limit on the number of people who can join. There is no deadline to apply, and you are not obligated to accept every product or invitation that you receive. The program also does not preclude you from other opportunities if you decide not to accept everything.

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(via)

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After switching over from Samsung’s 4nm foundry to TSMC’s 4nm semiconductor production foundry, the latest Qualcomm Snapdragon 8+ Gen 1 SoC manufactured on TSMC’s 4nm advanced node process showed significantly better CPU performance, better GPU performance alongside much-improved power efficiency, and thermals compared its peers, the Snapdragon 8 Gen 1, Snapdragon 888+ and Snapdragon 888 SoCs that were manufactured on Samsung’s 4nm and 5nm node process.

Thus, after getting flak and bad press coverage of the overheating and quality control issues for its previous flagship SoCs, Qualcomm did announce that it will be ditching Samsung and moving forward with TSMC only for its flagship SoCs, specifically the Snapdragon 8 series of SoCs. 

And in a recent report by Chinese technology leakster, Digital Chat Station on Weibo, they shared the news that Qualcomm and MediaTek’s upcoming next-generation smartphone SoCs will be manufactured via TSMC’s foundry.

The Weibo post states that there will be 4 upcoming smartphone SoCs that will be manufactured by TSMC, which are respectively the Qualcomm Snapdragon 8 Gen 2, MediaTek Dimensity 9100, the Qualcomm Snapdragon 7 Gen 2, and the MediaTek Dimensity 8200.

According to industry insiders, the development of the Qualcomm Snapdragon 8 Gen 2 is faster than the MediaTek Dimensity 9100 within TSMC, whilst the development of the Qualcomm Snapdragon 7 Gen 2 is faster than the MediaTek Dimensity 8200 within TSMC.

Both the Snapdragon 8 Gen 2 and Dimensity 9100 SoC are said to present in many Android flagships that are to be announced in 2023, while the Snapdragon 7 Gen 2 and MediaTek Dimensity 8200 SoCs will be catered to the mid-range Android market.

The report also states that the Snapdragon 7 Gen 2 is to be an iterative upgrade over the Snapdragon 7 Gen 1, with little to no changes to the core layout nor ISPs, and the major difference would be the switch from Samsung’s 4nm process on the 7 Gen 1, to TSMC’s 4nm process on the 7 Gen 2. And due to the fact that the next-generation Snapdragon 7 is an iterative upgrade, it could be instead called the Snapdragon 7+ Gen 1 instead of the Snapdragon 7 Gen 2.

As for the popularity of the Snapdragon 7 Gen 1, it is only featured on one smartphone in the market, which is the Oppo Reno 8 Pro mid-range smartphone that is exclusive to China. Presumably because of the bad reputation of Qualcomm’s SoCs that are manufactured by Samsung, the Snapdragon 7 Gen 1 isn’t garnering a lot of customers among Android smartphone manufacturers, whilst the Snapdragon 778G and 778G+ which are under TSMC’s 6nm foundry seem to be the more prevalent choice for Android smartphone makers instead.

If you fancy picking up a power-efficient Snapdragon 778G+ smartphone yourself, there are 3 options you should consider: the Honor 70 which was launched in IFA Berlin 2022 last week, the Nothing Phone (1) announced by OnePlus founder Carl Pei, and the Motorola Edge 30 which has stock Android software with minimal bloatware for users.

The Nothing Phone (1) is on sale today starting from only US$499 on Giztop.

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(Source)

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Qualcomm gave the contract to manufacture the Snapdragon 8 Gen 1 chips to Samsung Foundry but an order for the upgraded version of the processor, dubbed Snapdragon 8+ Gen 1 was given to TSMC.

Now, a new report coming from analyst Ming-Chi Kuo claims that Qualcomm is giving a contract to TSMC for exclusively manufacturing the next-generation Snapdragon 8 Gen 2 chip as well as the Snapdragon 8+ Gen 2 chips.

This is a major blow to Samsung Foundry which had Qualcomm as its most important customer for the advanced chips. With Qualcomm moving to TSMC, the Taiwan-based company will significantly increase its market lead.

While details about the next-generation flagship smartphone processor remain unknown, it likely that the company will stick to the 4nm node process for the upcoming chips, which is the same used in the Snapdragon 8 Gen 1 series.

Samsung’s issues with the yield is likely one of the major reason Qualcomm decided to switch to TSMC. As per the reports, the yield of the Qualcomm Snapdragon 8 Gen 1 manufactured by Samsung Foundry is 35%. This means that out of the 100 pieces that are made, only 35 are useful and 65 are defective.

The South Korean giant recently started production of 3nm chips. It uses the Gate-All-Around (GAA) transistor architecture for power-efficient and performance-enhanced chips.  It is also developing a second-generation 3nm process node that would offer significant improvements across several areas.

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• TSMC 3nm chips to launch in early 2023 and 2nm Technology is also on the Way

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Qualcomm officially launched its highly anticipated flagship SoC, the Snapdragon 8+ Gen 1 smartphone chipsets in China tonight. And it is great news for 2022 smartphone buyers because the company is promising much-improved performance, much-improved power efficiency and much better thermals for the Snapdragon 8+ Gen 1 announced today as the SoC is manufactured under TSMC’s industry-leading 4nm power-efficient process!

The Snapdragon 8+ Gen 1 is a revamped version of the Snapdragon 8 Gen 1 revealed in November last year. It features the same octa-core architecture setup with a single ultra high performance Cortex-X2 core, three Cortex-A710 cores, and four Cortex-A510 efficiency cores, but with a few minor tweaks to improve the premium smartphone experience for flagship Android users.

First, the Snapdragon 8+ Gen 1 has been overclocked. Mainly, the Cortex X2 core has been overclocked from 3.00 GHz to 3.20 GHz, providing CPU performance of up to 10% higher than the Snapdragon 8 Gen 1. The GPU was also overclocked as well to provide up to 10% better GPU performance in games.

Next are the power efficiency gains. By switching over from Samsung to TSMC, Qualcomm has managed to improve power efficiency by up to 30% for the Snapdragon 8+ Gen 1, meaning that the chipset consumes less power overall, leading to improved thermals and improved battery life, in addition to the performance gains that the new chipset brings.

As for the rest, the Snapdragon 8+ Gen 1 is identical to the Snapdragon 8 Gen 1. It supports up to 16GB of 3,200 MHz of LPDDR5 RAM and UFS 3.1 storage. The display driver can do QHD+ at up to 144Hz or 4K at 60Hz, complete with 10-bit rendering (Rec. 2020) and HDR10+ support.

The Snapdragon X65 modem can deliver peak 5G speeds of up to 10Gbps, while the FastConnect 6900 WiFi modem runs Wi-Fi 6/6E at up to 3.6GHz. The chipset also supports Bluetooth 5.3 connectivity that includes Qualcomm’s latest aptX Lossless technology and Bluetooth LE Audio.

The chipset houses the same triple 18-bit Spectra ISP that can handle up to 200MP sensors and 8K video capture at 30fps (4K at 120fps), plus image processing tricks like multi-frame noise reduction and staggered/DoL HDR. It even supports a dedicated bokeh engine and support for HLG, HDR10+ and Dolby Vision formats.

Qualcomm has also announced that its partners, such as Xiaomi, Realme, Motorola and OnePlus will be bringing the Snapdragon 8+ Gen 1 to the smartphone market starting from Q2 2022. To stay tuned on the latest flagship releases, stay tuned to Gizmochina!

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As one of the world’s largest smartphone markets, China with its population of over 1 billion reflects several of the future trends that we may see in the smartphone industry, with one of them being the brand of the SoC (System on a Chip) used in our smartphones.

As we are almost halfway into 2022, data analytics firm, CINNO Research, has recently published a report on the Top 5 Smartphone SoC Vendors in the China market for Q1 2022, and it seems that MediaTek is the popular SoC brand used in smartphones for the quarter.

According to the report (via ITHome), smartphone SoC shipments in Q1 2022 were 74.39 million units, down 14.4% year-on-year, and down 0.7% quarter-on-quarter. And the top 5 vendors for the smartphone SoC vendors are MediaTek in the first place, Qualcomm in second, Apple in third, with Huawei’s HiSilicon and UNISOC in fourth and fifth respectively.

Let’s start from top to bottom, MediaTek saw 30.7 million smartphone chipsets shipped out in Q1 2022, which was higher than its 25 million shipments from last quarter, and 30.1 million shipments from Q1 2022. The rise in smartphone SoC shipments MediaTek can be mainly attributed to the semiconductor firm’s strategy and chipset catalogue that it had offered in the last 6 months, which included the brand’s popular Dimensity 920 5G chipset found on the Redmi Note 11 Pro+, Realme 9 Pro+ and Xiaomi 11i Hypercharge.

For Qualcomm, the brand remained relatively stable at second with 26.7 million smartphone SoC shipments in Q1 2022, higher than the 23.6 million figure from last quarter, but lower than the 27.9 million shipments from Q1 of last year. Coupled with the ongoing chip shortage, Qualcomm had earlier announced that it will gradually shift its focus to flagship chipsets instead of entry-level and mid-range chipsets due to flagship chipsets providing higher profit margins. However, the one caveat of this strategy is losing market share in mid-range and entry-level markets, which leads to lower shipments overall but higher revenues for the company.

Apple on the other hand, had only shipped 12 million smartphone SoCs in Q1 2022, down 15.8% from its 18.4 million figure from Q4 2021. As the iPhone nears the end of its release cycle, shipments are also expected to go down as well, because consumers are already expecting a new iPhone release soon, and therefore would hold off buying the current model and wait for the next iteration instead.

Huawei’s HiSilicon continues its gradual exit from the China smartphone SoC market as the firm had only shipped out 2.5 million units this quarter, down from 13.8 million in Q1 2021. As stocks for HiSilicon Kirin are not replenished due to the still ongoing supply sanctions against the company, the brand is expected to drop out of the top 5 as late as next year or as soon as the next quarter.

Squeezing just into the Top 5 is the rapidly growing UNISOC semiconductor company. UNISOC saw shipments of 1.9 million smartphones SoCs in Q1 2022, up 1760% from 0.1 million in Q1 2021. The main cause for the exponential growth behind UNISOC is the entry-level smartphone market. As the bigger players like Qualcomm and Apple’s main focus area is in the high-end, UNISOC aims to tackle the low end with its relatively much more affordable chipsets sold off to Realme, Motorola and Samsung to sell in their sub 100 dollar device market.

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(Via)

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Earlier it was announced that MediaTek had already led the Android smartphone SoC market in 2021 with a 46% share, exceeding its rival Qualcomm, which had a 35% share in the market in 2021. One might think this spell the end of Qualcomm’s dominance in the Android smartphone space. 

However, a follow-up report to the research has been published by Counterpoint Research. The report details the price brackets where Qualcomm, MediaTek, Exynos, HiSilicon and UNISOC are leading in the race for the Android chip supplier with the largest market share.

A closer examination of the report reveals that most of the market share growth for MediaTek in 2021 came from the low-mid tier wholesale price segment (sub-$299), driven by strong demand for the Dimensity 700, 800 and Helio series chipsets. Qualcomm on the other hand dominated the mid-range and premium flagship market with around 50% market share across all price brackets above $300, except for the $700-$799 price bracket, in which Samsung had a lead with 46% market share in the bracket.

But the question remains, why has Qualcomm shifted away from the low-end markets and how did MediaTek manage to win the low-end market after Qualcomm’s gradual exit?

The report mentions that the reason behind these changes of trends in the market is because of the global chip shortage. With Qualcomm unable to secure its chip supply from both TSMC and Samsung, the company instead prioritized focus on ramping up supply for its 700 and 800 series Snapdragon chipsets, driving higher revenue and profitability. 

However, with Qualcomm not providing much value-to-money in its 400 and 600 series Snapdragon chipsets in 2021, phone manufacturers decided to switch over to its competitor, MediaTek instead for their lower-end budget devices. MediaTek managed to put out capable and affordable 5G chipsets to the market in 2021 with their Dimensity 700 to 1200 series, which could provide performance on par and sometimes exceed competing processors in the same price bracket. And with the reveal of its Dimensity 8000 and 9000 series chipsets in 2022, it is expected that MediaTek could take the stake of the higher-end premium Android market as well in this coming year.

The report also shares some details about Samsung’s Exynos, Huawei’s HiSilicon Kirin and UNISOC chipsets in the industry in 2021. Besides the Samsung Galaxy S21 series equipped with Exynos, most of Samsung’s A, M and F series of smartphones were not equipped with Exynos. In the low-mid segment ($100-$299), its share decreased from 17% to 7%, and in the mid-high segment, its share decreased from 13% in 2020 to 6% in 2021.

UNISOC showed exciting growth in 2021 in smartphones priced less than $200. In 2020, UNISOC chipsets only catered to phones priced under $100. However, in 2021, realme, Motorola and Samsung have launched phones with the Tiger series SoC, citing better performance in the chipsets compared to its similarly priced competitors in the market.

Last but not least, HiSilicon’s SoCs had a 16% share in phones costing $500 and above in 2021, which was a decline from the 30% share in the previous year, due to the US trade ban. It is running on the inventory it added before the ban. By the end of 2022, HiSilicon’s market share is expected to continue to drop as its inventory gets depleted. Huawei has already started using Qualcomm SoCs in its new launches, but they are limited to 4G.

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(Via)

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While MediaTek maintained its lead, Qualcomm recorded 33% YoY growth in the global smartphone AP (Application Processor) / SoC (System on Chip) market in 2021. The market grew 5% YoY in Q4 2021 overall, with almost half of the SoC shipments being 5G smartphone SoC shipments, the latest Counterpoint figures show.

MediaTek led the smartphone SoC market in Q4 2021 with a 33% share. But its shipments declined due to inventory correction. Still, the company is expected to see growth in its revenues in the first quarter of 2022 driven by the Dimensity 9000 chipset. Lower seasonal demand will be offset by higher 5G penetration.

Meanwhile, Qualcomm recorded a strong quarter, growing 18% QoQ in the fourth quarter of last year despite component shortages and inadequate foundry capacities. The chipmaker was also able to prioritize high-end Snapdragon processor sales, which come with higher profitability. It was also able to increase supplies from its major foundry partners by dual-sourcing orders.

Apple stood third in the smartphone SoC market in the fourth quarter of 2021 with a 21% share, with shipments driven by iPhone 13 launch and festive season demand.

UNISOC recorded growth this year and reached an 11% share in Q4 2021, with shipments more than doubling in 2021. It has expanded its customer base and currently supplies to companies like HONOR, realme, Motorola, ZTE, Transsion, and Samsung.

Samsung dropped to fifth place while Hilisilicon saw its market share drop to just 1% as its inventory of Kirin SoCs ran out.

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Qualcomm recently launched the Snapdragon 8 Gen 1 flagship chipset which comes manufactured using the 4nm process node from Samsung. The order for making the Snapdragon chips was a big win for the Samsung Foundry.

However, it is being reported that the South Korea-based technology giant has lost the business for manufacturing Qualcomm’s Snapdragon series chips.

As per the report, Samsung is facing a major issue with the production of Snapdragon chips as the yield rate for the chip Snapdragon 8 Gen1 is about 35 percent. This means that out of 100 chips produced, only 35 are good enough to be used by the phone manufacturers.

The yield rate is quite poor and it is being said that Qualcomm is in talks with the TSMC to move its business back to the Taiwan-based foundry. It is said that the yield rate for the 4nm chips from TSMC is about 70 percent, twice that of what Samsung is offering.

It is also being reported that along with Qualcomm, NVIDIA is also moving away from Samsung to TSMC for the 7nm graphics chip which was originally planned to be manufactured by the South Korean company.

There are reports about Qualcomm planning to launch the “Plus” version of the Snapdragon 8 Gen 1 chipset earlier than usual, sometime in the second quarter, and this new chipset will be manufactured by TSMC and not Samsung.

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After the confirmation of the existence of a Xiaomi 12 Ultra, the device is now officially into the next stage of the flagship release life cycle: leaks and rumours. And this new leak is regarding the processor powering the Xiaomi 12 Ultra, which is rumoured to be the upcoming Qualcomm Snapdragon 8 Gen 1+.

The news comes from the popular Chinese leakster, Digital Chat Station on Weibo. In the Weibo post, they mention that the Xiaomi L2S, model number 2206122SC, is sporting the unannounced Qualcomm SM8475 chipset under the hood. The leaker also reveals that the launch date of the device is happening in Q3 2022.

For those unaware, in an earlier leak, the Xiaomi L2S was spotted to be the Xiaomi 12 Ultra in the IMEI database and the Qualcomm SM8475 chipset is the successor to the Qualcomm SM8450(or more commonly known as the Qualcomm Snapdragon 8 Gen 1 processor). The Qualcomm SM8475 is rumoured to be called the Snapdragon 8 Gen 1+, and it is expected to be manufactured under TSMC’s 4nm process this time instead of Samsung’s 4nm node.

This leak serves as a welcome surprise to those who were holding off buying the Xiaomi 12 and 12 Pro and decided to wait for the Xiaomi 12 Ultra instead. To elaborate, the reviews of the Xiaomi 12 and 12 Pro were all-around positive. Whether it be the cameras, the displays or the audio experience, both the phones had it all. However, both phones have a major Achilles’ Heel that could not be solved via a software update, which is the Snapdragon 8 Gen 1 chip powering both devices.

The Snapdragon 8 Gen 1 chip was prone to overheating, battery drain issues, and even thermal throttling on many devices such as the Xiaomi 12, 12 Pro, Motorola Edge X30, and the Realme GT 2 Pro. Many attributed the shortcomings of the chip to the reason of being fabbed under Samsung LSI’s 4nm process. This is because previous Qualcomm flagship chipsets like the Snapdragon 870, Snapdragon 865, and Snapdragon 855 didn’t exhibit these issues as strongly as the 8 Gen 1, as all 3 of them were fabbed under TSMC. 

And with ever-increasing complaints from both phone manufacturers and consumers, Qualcomm is reportedly going back to TSMC for its Snapdragon 8 Gen 1+ chipset, and it will be fabbed on TSMC’s latest 4nm process which claims to bring better thermals, better power efficiency and better performance than its predecessor.

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(Source, Via)

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In a recent video, Youtuber Marques Brownlee has revealed that Google had plans to introduce their Tensor chips back in 2020 with the Pixel 5 but didn’t at the last moment.

The smartphone community has always wondered why the Google Pixel 5 featured a Qualcomm 765G SoC, weaker than Pixel 4‘s Snapdragon 855. Well, we might have an answer for you. In a recent video discussing every Google phone, the famous Youtuber Marques Brownlee revealed that Google was working on Tensor for a long time and wanted to release it earlier.

“They were actually planning on Pixel 5 being the first phone with Tensor. But then with Covid and the supply chain issues and a bunch of things getting in the way, at the last second they kinda had to bail on that,” Brownlee claimed.

“But they still wanted to drop a new phone, so they just put a Snapdragon 765G in it, shipped it, called it a day, and kept putting their heads down for Pixel 6.”

Brownlee claimed that through his talks with people at Google, he learned that Google was planning to release the Pixel 5 with a Tensor chipset. But with the global pandemic going on, supply chain and many other issues arose, forcing Google to equip the phone with the midrange Qualcomm Snapdragon 765G SoC and wait out the release of their Tensor chip till next year.

So what would a Tensor-equipped Pixel 5 have looked like? For starters, the processor would’ve been a significant improvement over the Snapdragon 765G’s allowing for a smoother performance. We could expect around twice the performance in the GPU department thanks to the Mali-G76 GPU on the Tensor chip.

Alas, the Tensor-based Pixel 5 didn’t see the light of day, but on the other hand, it gave Google more time to mature and optimize the Tensor chip which they offer in the Pixel 6 lineup.

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(Via)

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Earlier today, OPPO launched the OPPO A55s in the Japanese market. The smartphone is tailored for the Japanese market, with specific features usually not found in budget OPPO smartphones sold globally, like IP68 rating.

OPPO A55s Specs and Features

The OPPO A55s features a 6.5-inch full HD+ LCD display with a 90Hz refresh rate and 180HZ touch sampling rate. The phone also features an IP68 rating, making it resistant to dust and submersion up to a maximum depth of 1.5m underwater for up to thirty minutes.

Under the hood, the OPPO A55s houses a Qualcomm Snapdragon 480 SoC, with 4GB RAM and 64GB onboard storage. The device is capable of memory expansion via a microSD card slot. The phone runs Android 11 out of the box with OPPO’s own ColorOS 11 custom skin and packs a 4000mAh battery with support for up to 18W fast charging.

OPPO A55s camera

In terms of camera, the OPPO A55s sports a dual-camera setup on the back, with a primary 13-megapixel camera with an f/2.2 aperture paired with a 2-megapixel depth sensor and a LED flash. There is an 8-megapixel camera on the front for video calls and selfies. The camera app offers various modes like Ultra Night Mode, Portrait Mode, AI Scene Enhancement, and AI beauty filters.

Other features

In terms of connectivity options, the OPPO A55s offers Bluetooth 5.0, dual-band Wi-Fi, 4G with VoLTE, and, of course, 5G. The device also has NFC with support for NTT DoCoMo Osaifu-Keitai and Sony FeliCa. The phone also provides an accelerometer, proximity sensor, compass, gyroscope, a USB-C port for charging and data transfer alongside a 3.5mm headphone jack.

Price and availability

OPPO A55s is priced at JPY 33,800 ($296). The phone will be going on sale in Japan starting November 26, but pre-orders for sale started earlier today. The phone is available in two color variants, namely Green and Black. The phone could launch in other markets in South Asia, but OPPO has not made any announcements regarding the device’s launch outside Japan yet.

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All eyes are on Qualcomm‘s next flagship chipset – Snapdragon 898 (SM8450), which will be powering a bunch of upcoming premium devices. It has already been confirmed that the chipset is going to be manufactured using Samsung’s 4nm process and will have a 20% increment in performance. Well, to corroborate the earlier claims, we now have the first Geekbench scores and it runs on an imminent flagship from Vivo with model name, Vivo V2102A.

With a score of 720 for single-core and 1919 for multi-core, Snapdragon 898 appears to be on top of the realm in this fierce competition. If we go by Geekbench benchmarks for multi-core, Snapdragon 898 will have a comfortable win over the others. Among other specifications are a dual Part 3400 architecture, and an Adreno 730 GPU. The current run-point version, though, is the same as the original SM8350.

Additionally, Snapdragon 898 chipset has a total of 8 cores, and for now, the main frequency appears to be just 1.78Ghz, the renowned leakster Digital Chat Station is hopeful that these numbers will certainly rise as soon as the mass production kicks off. And with improvements this radical, expect power consumption to be on the higher side, too.

As learned earlier, the production will be split between Samsung and TSMC, and it appears that the Plus variant of the Snapdragon 898 processor may hit the market as early as the second quarter of 2022. Interestingly, Vivo will be among the first few brands to launch a smartphone powered by Snapdragon 898. We will have more information in this regard when the processor gets officially unveiled in December Qualcomm Summit.

Related:

• Xiaomi Mi 12 and Redmi K50 models revealed by tipster, could board Snapdragon 898 SoC – Gizmochina
• Lenovo Mobile GM confirms Legion Phone 3 Pro will have a Snapdragon 898 processor – Gizmochina
• Samsung Galaxy Tab S8, S8+, and S8 Ultra may feature Snapdragon 898 – Gizmochina

[embedyt] https://www.youtube.com/watch?v=5IRY-_IjDkg[/embedyt]

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Qualcomm Snapdragon 888 chipset is the flagship smartphone processor from the brand and after that, the company has launched several new mid-range and premium chips for mobile phones. Now, we have information about the upcoming flagship SoC.

Well-known leakster Evan Blass has revealed information about the Qualcomm SM8450 chip, which will be launched as the successor of the Snapdragon 888 SoC, powering the next generation of flagship phones.

"SM8450 is Qualcomm's next-gen premium system-on-chip (SoC). It has an integrated Snapdragon X65 5G Modem-RF system. It is fabricated on a 4nm process." pic.twitter.com/u1GXMhOWBf

— Evan Blass (@evleaks) June 3, 2021

Evan Blass claims that the chipset will be manufactured using the 4nm process. For those who are unaware, the current-generation Snapdragon 888 SoC is manufactured using the 5nm process.

It is said that the processor will come packed with a Snapdragon X65 5G Modem-RF system. Launched in February this year, the modem promises to bring superior speed and support for up to 10Gbps speeds on both standalone and non-standalone 5G networks.

The chipset will have Kryo 780 CPU built on ARM Cortex v9 technology along with Adreno 730 GPU, Adreno 665 Video Processing Unit (VPU), Adreno 1195 Display Processing Unit (DPU). For image processing, the chipset will come with Spectra 680 ISP.

It will support quad-channel package-on-package LPDDR5 RAM. It will also support up to 1GHz mmWave downlink and 400MHz Sub-6 D along with support for Qualcomm FastConnect 6900 subsystem. It is said to have Qualcomm secure processing unit (SPU260) as well as Qualcomm Aqstic WCD9380/WCD9385 audio codec.

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Qualcomm‘s next-generation Snapdragon 888 chipset was announced this month and is expected to feature on flagship models in January 2021. MediaTek is also expected to unveil its next-generation flagship SoC soon. The company’s CEO Rick Tsai has now disclosed that the next-gen MediaTek chip will be released in Q1 2021.

MediaTek is Taiwan’s biggest semiconductor supplier used in smartphones. The company’s chief executive Rick Tsai disclosed this in a speech entitled “Accelerating the Digital Economy post the COVID-19 pandemic” at the IEEE Global Communications Conference in Taipei yesterday. He unveiled plans to launch its new flagship 5G chip by February.

The announcement is an indication that the Taiwanese chipmaker is becoming more confident about the rollout of its new 5G chip designed for premium smartphones. Two months back, MediaTek gave a vague schedule, saying that new phones powered by its new Dimensity 5G chip would enter mass production early next year.

MediaTek expects replacement demand to take off next year as shipments of 5G handsets worldwide are expected to double from more than 200 million units this year. The growth momentum of 5G phones is projected to continue into 2023 with the 5G penetration rate expected to climb to about 60 percent from 49 percent in 2022. This year, the 5G smartphone penetration rate is expected to reach 18 percent, according to Tsai.

The CEO also disclosed that the company’s strategy is to build a comprehensive product portfolio for smartphones with different price points. He also confirmed plans by the chipmaker to roll out a new 5G processor for entry-level smartphones.

MediaTek’s flagship Dimensity 1000 SoC as well as the Dimensity 800 chip have been utilized by a number of OEMs on their flagships.

UP NEXT: Exclusive: Xiaomi’s Mi Watch Lite to launch tomorrow; priced under $60

(source)

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Researchers have found that Snapdragon series smartphone chipsets from Qualcomm, which is widely being used in Android devices, has over 400 instances of vulnerable code that puts millions of users at risk.

Check Point, a cybersecurity firm has found that the DSP (Digital Signal Processor) used in Qualcomm Snapdragon chipset has the vulnerable code which it is calling “Achilles” and is claimed to impact phones to be used as a spying tool.

An app can bypass the usual security measures and can then access phone’s photos, videos, GPS, and location data, that too without the owner knowing about it. The attacker can also lock the phone with all the data stored, rendering it useless. It can also be used to store unknown and unremovable malware on the device.

The research firm has said that it has notified Qualcomm about its findings, as well as government officials and affected vendors. Given that millions of Android devices are at risk, the company has not published the details about its findings.

EDITOR’S PICK: iQOO 5, iQOO 5 Pro launched with 120W fast charging, 120Hz curved display, and 50MP triple cameras

It is also being reported that Qualcomm has now fixed the issue but the affected devices can only be secured once the phone manufacturers start pushing the relevant updates and security patches to the affected phones, which is likely to take time.

In a statement, Qualcomm said that it has worked hard to validate and fix the issues. It also added that the company has not found any evidence of the Achilles vulnerability being exploited in the wild.

UP NEXT: United States reinforces restrictions put on Chinese giant Huawei’s access to chips and other technologies

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Qualcomm recently unveiled its latest flagship chipset — Snapdragon 865 Plus, which as the name indicates, is an upgraded variant of the Snapdragon 865 SoC that was launched by the company last year.

Now, the company is gearing up to launch its next-generation flagship chipset, which is likely to be named Snapdragon 875. While the company is yet to officially acknowledge this, the leaked future chips roadmap has revealed some information.

A Weibo user has shared an image showcasing Qualcomm‘s product planning for the upcoming chipsets. It reveals that the Snapdragon 662 and Snapdragon 460 SoC will be launched in this fourth quarter of this year.

Further, the Snapdragon 875G and Snapdragon 435G will be unveiled in Q1 2021. Apart from these, the Snapdragon 735G is expected to get launched in Q1 or Q2 next year.

Interestingly, the standard Qualcomm Snapdragon 875 SoC is missing from the list. If the company plans to launch it, we expect it to get announced in December this year, similar to the previous flagship chipset launch from the company.

EDITOR’S PICK: AnTuTu’s top 10 best performing flagship and mid-range phones for June 2020

The leak reveals that the SD875G and SD735G are the flagship and mid-range chipsets from Qualcomm, set to launch in 2021. Both of them are manufactured using Samsung’s 5nm EUV process which increases performance by 10 percent and reduces power consumption by 20 percent.

Qualcomm is expected to use the combination of Cortex X1 Super Core + Cortex A78 Large Core for the upcoming Snapdragon 875G chipset. With such architecture, the chipset could break the performance records when it comes to chipsets powering Android smartphones.

The leak also reveals that Qualcomm’s rival MediaTek is set to launch Dimensity 600 chipset in the third quarter of this year, i.e. in Q3 2020. It has been reported that the Taiwan-based company has received a large number of orders for the upcoming chipset.

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A petition has been filed on Change.org aimed at putting pressure on Samsung to stop releasing its flagship models with Exynos chipsets. The petition is also seeking to stop Samsung from using its own camera sensor instead of the ones manufactured by Sony. The petition claims the Exynos-powered phones are slower and have worse battery life. The camera sensors are also said to be worse than what obtains on the Qualcomm version. They also get hotter and throttle faster, it claims.

Over the years, Samsung has kept up with the practice of releasing its flagship models with two different processors, a Snapdragon SoC and an Exynos chipset. The Korean tech giant usually launches its flagship models in Europe and Asia packing the latest Exynos flagship SoC while buyers in North America get the latest Qualcomm Snapdragon SoC.

Ordinarily, this won’t have been a problem if both chipsets were on par with each other. Instead, the Snapdragon processors are usually more powerful than Samsung’s own Exynos processor. Using the latest Snapdragon 865 and Exynos 990 as reference points, the Snapdragon 865 packs Cortex A77 cores which is said to bring up to 20% boost in performance compared to the Cortex A76 on the Exynos 990 chipset. The SD865 chipset also tags along an Adreno 650 GPU which outpaces the Mali G77 GPU onboard the Exynos flagship SoC.

It is left to be seen if the petition will make any headway. As at the time of filing this report, it had only attracted 258 signatories. Even if it gathers thousands and even millions of supporters, that won’t guaranty that Samsung will take any action.

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(source)

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An emerging report claims Qualcomm has opened new relationship talks with TSMC to develop a 7nm system-on-chip (SoC). Since the past few years, Qualcomm has collaborated with Samsung to produce its chips, such as the Snapdragon 820 and 835-series. However, judging by the reporter, it appears Qualcomm has lost interest in prolonging their partnership and have turned to TSMC to draw up a new business relationship, the same company that previously manufactured the Snapdragon 810.

There isn’t any clarification why Qualcomm has made a switch to TSMC, speculation indicates that Samsung’s in-house Exynos chipsets’ success may have played a decisive role in the change in Qualcomm’s tactics. We do know that Samsung has been pushing other third-party chips out of their system and replacing them their own ones, note: the Samsung S8’s CPU chip in one of the variants is a Samsung Exynos.

There are also rumors that Samsung has a GPU under the works, if this is true, this would place Samsung and Qualcomm directly head to head; and with Samsung currently making Qualcomm’s chips, this makes the relationship’s situation quite troublesome.

RELATED: Samsung could be developing its own S-GPU

Other factors, affecting Qualcomm’s decision, could be the fact that TSMC has increased the development process of the 7nm, contrary to the 10nm process. With a schedule set at late 2018 to produce the 7nm chips, Qualcomm would like to jump ahead of the processor game and take advantage of the potential benefits that competitors like Samsung could be behind in development.

If any of the rumors happen to be true, we are likely to see the first TSMC-manufactured chips available at the beginning of 2019, on schedule for the announcement of the year’s early flagship phones.

How do you feel about Qualcomm and TSMC reunion? In consideration with the Snapdragon’s 810 issues. Share your thoughts and comment below.

(Source, via)

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Nokia’s new phones are probably the most anticipated phones of 2017. Leaks have been pouring in non-stop about the new devices said to be about 6 or 7 in total. Today, what we have is a leaked image of the package box of one of the upcoming phones codenamed Nokia 6 and which appears to be a flagship device.

While the specs are in Chinese which hints that this model will probably hit China first, it isn’t difficult to make out the key specs.

First, if you take a look at the top left corner, you will see ”Nokia 6” written there which means that this should probably be the 6th Nokia phone coming out later this year.

The Nokia 6 phone will be launching with Android 7.0 Nougat, so you need not worry about updates. It will support 4G LTE have 4GB of RAM and have 64GB of built-in storage which can be expanded via a MicroSD card slot. The primary camera is a 16MP shooter and there is an 8MP camera in front.

The display of the Nokia 6 is a 5.5-inches 1080p screen and the processor is an unspecified Qualcomm Snapdragon chip. The Nokia 6 phone will also come with Dolby ATMOS.

READ MORE: Nokia Entry-Level Smartphone Specs Leaked

The phone on the pack is black but it’s difficult to make out the features of the phone. The rear of the phone however has a pill shaped housing that contains the camera sensor and LED light. We can’t see any fingerprint scanner, so there is a chance that it is located upfront on the bottom bezel.

Are you excited about the specs of this new Nokia phone? Will you be picking up a unit when it launches later this year? Let’s know what you think in the comment box.

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According to the leak, the Snapdragon 653 will be manufactured using the same 28nm process as the 652, which is kind of disappointing. Further, in the specs department, the leak reveals some changes. So, the new 653 (MSM8976Pro) chip is expected to come with the same octa-core architecture as its predecessor, however, it will be 4 x Cortex A73 @ 2GHz + 4 x Cortex A53 @1.4GHz. Another upgrade will be in the GPU department, this time coming with Adreno 515 clocked at 550MHz. Other rumored features include LTE Cat. 9 3 x 60MHz CA, Bluetooth 4.1, 802.11 ac Wi-Fi support, LPDDR4 RAM, Dual ISP and 24MP Camera sensor support.

At this moment, we can’t verify the authenticity of this leak, so it’s best to take it with a pinch of salt.

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The company has confirmed that the chip comes with 10% faster boot loads and 10% faster app loads. The chip supports Snapdragon VR SDK, which means it supports Google’s Daydream platform. The SoC also supports dual phase detection, which should improve the AF as compared to the regular PDAF. There are improvements in the ISP as well to better work with Laser AF. Finally, the company surprisingly adds that the energy efficiency is improved by 5%.

While these are minor updates, what’s really interesting is the bumped up clock speed of Snapdragon 821’s Power Clusters. They are now clocked at 2.19GHz instead of 1.59GHz as seen on the SD820 chip. The performance clusters get a gentle speed up, from 2.15GHz on SD820 to 2.34GHz. The upgrade in GPU speed is also not much, from 624MHz to 653MHz in the new chipset. But then, Adreno 530 is already a great smartphone GPU, so there was hardly any need for significant upgrades in this department.

We can expect SD821 phones in September (although the first SD821 phone was announced a while back by ASUS) from companies like Xiaomi and LeEco. In case you missed, we spotted a new LeEco phone on AnTuTu with Snapdragon 821 which scores an impressive 163K. You can read more about the phone from here.

(Source)

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Qualcomm has just announced a new reference platform for drones called as the Qualcomm Snapdragon Flight. The company is looking to transfer its years of experience with smartphones into the drones and robotics industry with this new platform.

Drones have really caught the attention of a lot of customers in the past couple of years. As a result, there are more and more companies who are trying to build their own unique drone. Qualcomm aims to make this process extremely simple by providing a feature rich board using which companies can design their drones.

The Qualcomm Snapdragon Flight Reference Platform will be an all-in-one board combining the power of Snapdragon 801, robust connecitivity and advanced software and development tools. The board enables real time flight control on the Hexagon DSP. It features advanced connectivity options like Wi-Fi, Bluetooth etc. Finally, the platform gives you access to the global navigation satellite system (GNSS) for accurate location tracking.

One of the highlights of the board is its size. It measures just  58x40mm offering such high-tech capabilities. In fact, thanks to the 4K video support of the Snapdragon Flight, the company managed to demo one of the world’s smallest 4K drone.

Other interesting features include Barometer sensor, additional ports for new sensors, Qualcomm’s Quick Charge technology and dual cameras for depth sensing.

Overall, the Snapdragon Flight is a feature rich board for anyone who wants to build a drone. You no longer have to contact multiple suppliers for different parts of your device. Everything is included in the board including the communication as well as camera components.

The company adds that one of the leading drone manufacturers, Yuneec will be releasing its first drone based on Snapdragon Flight in 2016. Select manufacturers already have access to this board and the first drones will be available to purchase in the first half of 2016.

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The transition to a pricier range of Nexus devices have lead to lower sales for the line this quarter. For the first half of 2014, Google was still offering the economically-priced Nexus 5 smartphone at the starting price of $349 and the similarly-affordable Nexus 7 tablet at $229. This quarter, Google is offering their latest devices, the Nexus 6 smartphone and Nexus 9 tablet at $649 and $399 respectively. The law of supply and demand would dictate that people would be unlikely to accept the price hike, and that’s taking into consideration even the high popularity of these devices running stock Android.

This could be stemming from a few possible reasons: The specifications offered for the Nexus 6 and 9 devices could simply be an insufficient upgrade for some to justify the price increase, which is understandable. Take the Nexus 6, for instance. Some might find the 6 inch display of the Nexus 6 and thus larger physical size to be unfeasible for practical daily usage in a smartphone. The new 64 bit Qualcomm Snapdragon 805 quad-core processor isn’t going to be much of a difference in real-world scenarios for some mainstream users, especially given that the next-generation Qualcomm Snapdragon 810 is already making headway. Also, It doesn’t help public perception much that the price hike is almost up to 50% more from last year’s huge-selling Nexus 5 to the latest Nexus 6.

On the Tablet side, the increase of price would not be such a major factor, but, instead, the fact that people do not upgrade their tablets as often as they do phones. Apple clearly dominates the Tablet market, but even the Cupertino giant is experiencing a sales slump with their iPads. Tablets in general would surely be no more influential than Smartphones in this recent swing towards lower Nexus device sales for Google. Neither would the Nexus Player, considered by many to be a minor product in the line.

While it is easy to see how insignificant overall Nexus sales would factor into the bigger picture at Google, the search giant actually stands to gain a few positives moving forward.

1. Google knows their limits a little better now

No other time has Google ever got all of the five major U.S carriers, AT&T, Verizon, Sprint, T-Mobile and U.S. Cellular in on the Nexus ‘action’, but Google accomplished it with the Nexus 6 for the first time. The closest Google has gone is with Samsung’s Galaxy Nexus, on which AT&T and Verizon were the only collaborators. Various other Carriers have offered certain Nexus phones from time-to-time, but Google now has the experience of offering a truly high-end flagship phone with every major carrier in the U.S. This gives Google invaluable experience and knowledge when it comes to pricing future Nexus Phones, no matter what distribution method it chooses in the future.

2. They have finally reached the pinnacle of screen sizes

With an uncommon screen of 6 inches, the Nexus 6 breaks new ground for an Android phone. Some have rejected the Nexus 6 on size alone, but the essential point to take away would be that Google pushed the boundaries of what is physically feasible for phone sizes. 6 inches may very well be the utmost limit when it comes to smartphones, and we would know that to be true simply because Google has attempted it and lived to tell the story. When it comes down, consumers can buy a 6 inch phone because Google has made the choice possible.

3. Google knows first-hand what it means to scale with phone manufacturers now

Google actually produced the Nexus 6 with Motorola still under their direct charge. They already know the struggles of domestic manufacturing, despite weak sales of the Moto X with its 2013 and 2014 editions, but they will forever have the experience of building smartphones under the belt. One little point in all of the mix is how Google has gained its fair share of experience producing a Motorola-branded Nexus as well. Google should have the best foot moving forward with future partnerships when it comes to providing inputs on the components that would yield the best balance of power and cost in future Nexus devices.

Conclusion:

With reports that LG would be producing the next Nexus Smartphone, it is clear the product line is far from dead. If anything, coming from the recent slump in sales for Nexus devices, a wiser, stronger Google would emerge and potentially be unstoppable for its next iteration of the Android operating system, and the devices that would be birthed along with it.

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A few weeks back, we came to know that Qualcomm has no plans to release Snapdragon 815 chipset. The company confirmed this news, which meant that the next flagship chipset would probably be the Snapdragon 820.

But today, our source reveals that the upcoming Snapdragon 620 chipset could be using a 14nm FinFet LPE process instead of the 28nm process that was rumored earlier. This news is a bit hard to swallow because even the latest Qualcomm Snapdragon 810 chipset is using the less efficient 20nm processs. And the upcoming Snapdragon 820 flagship SoC is expected to use the same 14nm process.

So, it would really be surprising if both the mid-range Snapdragon 620 and the flagship high-end Snapdragon 820 use the same 14nm FinFet manufacturing process. However, our source claims that although the Snapdragon 620 will use 14 FinFet, it will be on the LPE (Low Power Enhanced) process. On the other hand, the Snapdragon 820 will most likely use the 14nm FinFet LPP (Low Power Plus) process which is much more power efficient than the LPE.

While our source is not exactly sure why Qualcomm decided to go with the same manufacturing node for both the 620 and 820 processors, it could be probably because Samsung made the first move way earlier than Qualcomm by announcing its 14nm chipset. Also, the company could be confident in the custom cores that will be used in the Snapdragon 820 to differentiate itself as the true powerful flagship.

So to sum up, this is what the new chipset looks like: SD620 with Adreno 510 on 14nm FinFet LPE node (Samsung/GloFo).

Remember that some of this information could turn out to be different, according to company decisions. So, make sure you take this news with a grain of salt.

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A few months back, we had revealed the possible specs of the upcoming Kirin 900 series processors. Now, our source has some information about the Qualcomm’s upcoming Snapdragon 815 chipset.

According to our source, the Snapdragon 815 will come with four Cortex A72 cores and four Cortex A53 cores on the big.LITTLE architecture. Unsurprisingly, it will feature the next generation Qualcomm Adreno GPU and will be manufactured using the new FinFet process. So, it could most likely use the 16nm FinFet. Our source also said that Qualcomm may tweak the cores to boost performance.

So, the upcoming Snapdragon 815 will be similar to the Snapdragon 620 which is already launched, but will be manufactured on a smaller node and will have all the features that you can expect from a top end Snapdragon 800 series chipset.

He also says that Qualcomm is delaying the launch of Snapdragon 815 mainly because the company doesn’t want to hurt the sales of the 810 powered smartphones in the market such as the HTC One M9 and the LG G Flex 2.

So what do you think about the new Snapdragon 815?

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Just yesterday, ARM announced the most powerful processor core for smartphones and tablets till date, the Cortex A72. This particular Cortex core will be replacing the current cores for the high end market, i.e. the Cortex A57. However, the announcement failed to mention any details about the upcoming processors from Samsung or even Qualcomm.

Luckily, we didn’t have to wait too long to get more details about Qualcomm’s upcoming processors that will use this high end core. According to the latest industry sources, Qualcomm has at least two SoCs that will be using the Cortex A72 core. This two SoCs will be surprising from the 600 series Snapdragon processors. A recent image leaked online showed off the details of these two SoCs along with the architecture used by them.

In the image, the MSM8976 which is probably the Snapdragon 620, comes with an eight core architecture. The image reveals that the SoC will have four Maia cores clocked at 1.8Ghz and four Cortex A53 cores clocked at 1.2Ghz. Now we know that Maia is the code name for the new Cortex A72 cores, so this particular SoC will have four such powerful cores.

Coming to the MSM8956 which is probably the Snapdragon 618, it comes with two Cortex A72 cores and four Cortex A53 cores. Since, this is an hexa-core processor, it will be slightly slower than the Snapdragon 820 but expect it to be more power efficient.

Given that the upper mid-range processors are coming with this high-end core, it would be interesting to see what Qualcomm packs into its top end SoCs like the upcoming Snapdragon 815 or the 820. Logically, they should be much more powerful than the 600 series processors.

Anyways, Qualcomm is yet to confirm this news, so make sure you take this leak with a pinch of salt.

Stay tuned for more updates.

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A few days back, a leakster called as @leaksfly revealed that Qualcomm had kept an event for January 23. The leak was right indeed as the company’s event did happen today. However, couldn’t play around with any Snapdragon 810 devices as predicted. Instead, the event was all about the features and the technical specifications of the ultra fast Qualcomm chipset.

This probably means that the mass production of the chipset is still a few days away and fans will have to wait for a few more days before they see a real device running this processor.

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Coming to the event, Qualcomm’s Vice President of Marketing said that the new Snapdragon 810 is targeted at all high-end smartphones and tablets and will redefine the user experience with super fast chipsets.

The he went on to explain a few features of the new processor. The Snapdragon 810 will support 4K Ultra High definition videos and will produce professional level sound quality. The chip has microphone built in so that the audio recorded comes out realistic and much louder than competitors.

Moreover, in the imaging department, the new chipset brings over 14 pairs of image processors for the first time in the industry which will be able to produce ulra-high resolution high quality pictures up to 55MP in size.

Moreover, it comes with the latest Adreno 430 GPU which will reduce power consumption as compared to other GPUs without sacrificing on the power output. As for connectivity, the chip comes with Cat. 9 LTE network support with theoretical download speeds of up to 450 Mbps. Also, it supports the new MU-MIMO Wi-Fi ac 2.0 technology for three times faster data transfers. Finally, the company showed off the processors, WiPower Wireless Charging technology.

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As expected, Qualcomm Snapdragon 810 turns out to be one of the most advanced processors currently available in the market. Unfortunately, even though we have seen some 810 powered devices announced in the last few weeks, we probably won’t be able to see it in action until the end of Q1 2015.

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While we’ve covered the news about the upcoming LG G3 varian which offers with more powerfull specs, and now we has the new information that the new LG G3 varian is confirms with model number LG-F460L.

The LG-F460L will comes with 3GB of RAM and the interssting point is the using of Snapdragon 805 processor on board, this is the new processor from Qualcomm and with this processor the phone will has more powerfull performance.

The information about LG-F460L has been leaked from LG community website, as we can see on the image above, the image seems taken from database like UAProf. While we writing this, we are unable to confirm about how the accurate the information is.

According tothe rumor, the upcoming LG device with model number LG-F460L will powered by Qualcomm Snapdragon 805 MSM8084 and will has codename Tiger. The phone will packs with 2K display, sports with 3GB of RAM and 16GB of internal storage and the phone will also has 16 megapixel main camera. The different between LG-F460L and LG G3 is only in the processor. Those phone is ready to compete with Apple iPhone 6 and Samsung Galaxy Note 4.

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While we have released the news about the Qualcomm Snapdreagon 808 and 810 processor, while for now there is no Android phone that adopt this processor yet, but ZTE could be the first smartphone which using those 64-bit mobile processor.

Although 64-bit processor has alaready launched, Snapdragon has alaready release the Snapdragon 410, Snapdragon 610 and Snapdragon 615, biut there is no Android phone that adopt those chipset, and now ZTE is ready to release the ZTE Apollo Android smartphone that using the 64-bit mobile processor from Qualcomm.

According to the Qualcomm, the upcoming Snapdragon 808 and Snapdragon 810 is ready to hit the market in 2015, but ZTE has preparing the new phone that called as ZTE Apollo that adopt those two kind of processor.

There is some choice from Snapdragon 410,610 and 615 for the quad-core processors, tose chips are targeting for low-end devices, running at 1.2GHz and 1.6GHz clock-speed, respectively, with Adreno 306 and Adreno 405 GPU. While Snapdragon 615 for the eight-core processor, running at 1.8GHz clock-speed with Adreno 405 GPU support.

If ZTE released Apollo, then it is the possibility of using a larger Snapdragon 610 or Snapdragon 615, these two processors can be shipped in autumn. So, what do you think?

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