Chip Archives - Gizmochina

MediaTek’s Upcoming Chip, the Tianji 8400 Reportedly Performs better than Qualcomm Snapdragon 8s Gen 3

Anubhav — Sun, 21 Jul 2024 01:03:36 +0000

MediaTek‘s upcoming smartphone chip, the Tianji 8400, is making waves with impressive benchmark scores. According to a post by tech insider @Digital Chat Station on Weibo, the Tianji 8400 achieves AnTuTu scores between 1.7 million and 1.8 million. This handily surpasses the anticipated score of its Qualcomm rival, the Snapdragon 8s Gen 3 (expected to reach around 1.7 million).

The Tianji 8400 will target devices under 1500 Yuan ($206)

The news suggests MediaTek’s mid-range chip might even challenge high-end processors. However, @Digital Chat Station highlights that the Tianji 8400’s true competition lies within MediaTek’s own lineup – the sub-flagship Tianji 9300. This chipset, along with the Snapdragon 8 Gen 3, is currently being used by various manufacturers to develop cost-effective flagship models. Notably, the Tianji 8400 offers a potential price advantage, targeting devices priced under 1500 yuan (roughly $223 USD).

The leak also sheds light on upcoming Redmi phones. Back in April, @Digital Chat Station revealed that Redmi is working on devices powered by the Tianji 9300+, Tianji 8400, Snapdragon 8 Gen 3, and even the next-generation Snapdragon 8 Gen 4. Interestingly, all three Redmi phones are expected to share some key features: a metal mid-frame paired with a glass body, a high-resolution display (either 1.5K or 2K), support for 100-watt fast charging, and a large capacity battery. One of these phones could potentially be the recently launched Redmi K70 Supreme Edition.

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Qualcomm & Foxconn Backed AI Chip Startup Kneron Unveiled a New NPU Chip and Server, Competing with Nvidia

Anubhav — Fri, 07 Jun 2024 01:14:40 +0000

At the 2024 Taipei International Computer Show, Kneron, an AI chip startup, unveiled its next-generation edge AI products: the KNEO 330 server and PCs equipped with their new KL830 NPU chip.

The company was founded in 2015, and it focuses on Edge Computing AI

Founded in 2015, Kneron focuses on providing edge computing AI (edge AI) technology. They boast big-name investors like Horizons Ventures, Qualcomm, and Alibaba. Kneron aims to offer an alternative to cloud-based AI solutions from tech giants. Their technology allows companies to build internal servers for specific AI applications, addressing data privacy and security concerns. This could make AI solutions more accessible to businesses hesitant to rely on external cloud services.

Two products were showcased:

KNEO 330 server: This server offers 48TOPS of AI computing power, supports up to 8 users simultaneously, and works with applications like LLM and Stable Diffusion. Kneron claims it can achieve cloud-like performance for RAG (Generative Adversarial Networks) at a lower cost, potentially reducing AI expenses for small businesses by 30-40%.
KL830 NPU-equipped PC: Specific details weren’t revealed, but a demonstration HP device showcased its capabilities. Kneron is partnering with major PC manufacturers to make them the first customers for this chip.

The KL830 is a neural processing unit (NPU) designed to work alongside CPUs and GPUs for AI tasks. It offers high computing power (10eTOPS@8bit) with low power consumption (2W) and handles various large language models efficiently.

Kneron also mentioned a USB AI accelerator stick powered by the KL830. This could transform any device, like routers, IoT cameras, or even traditional computers, into an edge AI device.

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MediaTek Kompanio 838 SoC for Chromebooks unveiled with an NPU to boost AI performance

Sudhanshu — Fri, 31 May 2024 20:51:20 +0000

At Computex 2024, MediaTek will showcase its new Kompanio 838 chipset for Chromebooks. The brand has released details of the chip ahead of the event, revealing that it uses a 6nm process and offers significant performance upgrades over its predecessor.

This new chip has a 66% faster CPU and 76% faster GPU. A key feature is support for dual 4K displays, perfect for both entertainment (streaming 4K content) and productivity (connecting to high-resolution monitors).

Connectivity is boosted with Wi-Fi 6 and 6E via MediaTek’s Filogic technology, ensuring faster and more reliable internet. Battery life is another focus, with the chipset enabling Chromebooks to last a full day on a charge.

The Kompanio 838 doesn’t neglect multimedia either. It features the MediaTek Imagiq 7-series ISP for professional-grade photo and video with dual camera support. The MediaTek NPU 650 is there to optimize AI tasks like voice recognition and image processing. You can check out additional details of the chip below.

MediaTek Kompanio 838 specs:

Processor

CPU: 2x Arm Cortex-A78 @ 2.6GHz + 6x Arm Cortex-A55 @ 2.0GHz
Cores: 8

Memory & Storage

Memory: LPDDR4x, DDR4 64-bit
Max Memory Frequency: 3733MTs / 3200MTs
Storage Type: eMMC 5.1

Graphics

GPU: Arm Mali-G57 MC3

Display Resolution

4K60 + 4K30

Video Encode

H.264, HEVC

Video Decode

H.264, HEVC, VP-9, AV1

Camera

ISP: 16MP + 16MP @ 30 FPS
Recording Resolution: 3840 x 2160

Peripherals

Connectivity: PCIe x1, 1x USB 3.0, 2x USB 2.0

Accelerator: Yes
Performance: 4 TOPS

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Leaked Benchmarks Expose China’s Secret Weapon Zhaoxin KX-7000! Should Intel and AMD Be Afraid?

Oğuz Çakır — Tue, 19 Mar 2024 21:44:47 +0000

While China is a global tech manufacturing leader, domestic processor development lags behind some competitors, particularly the US. However, China is actively closing the gap, with recent advancements like Zhaoxin’s 8-core Kaixian KX-7000 processor demonstrating progress. Here are the details…

Zhaoxin KX-7000 Benchmarks Reveal Performance Boost for Chinese Processor

It has been eight years since Zhaoxin, a company focused on developing domestic X86 processors, introduced its first product, the ZX-C+. The company’s greatest success has been its continued hard work since that time, refusing to rest on its laurels. These efforts have apparently paid off. The domestically produced Zhaoxin KX-7000 processor appeared on Geekbench, demonstrating twice the performance of its predecessor, the KX-U6780A.

In the Geekbench 6 test, the Zhaoxin Kaixian KX-7000 scored 824 in single-core and 3813 in multi-core performance. According to the test details, the KX-7000 processor utilizes the KX700M motherboard and features an 8-core design. It has a base frequency of 2.99GHz, 4MB of L2 cache, and 32MB of L3 cache. The test was conducted on Windows 11 Pro in balanced power mode, and the processor reached a maximum operating frequency of 3293MHz.

At first glance, the processor’s score might seem comparable to an 8th-generation i5, which could appear underwhelming. Especially considering Intel’s release of 8th-generation processors in August 2017. However, remember that Intel debuted its first processor in 1971, while Zhaoxin began in 2013. In this context, a seven-year difference highlights substantial progress.

Geekbench 6 scores on the Linux system show the previous-generation KX-U6780A processor achieved a single-core score of 344 and a multi-core score of 1873. The new KX-7000 offers 2.4 times the single-core performance and double the multi-core performance. Zhaoxin attributes this to the KX-7000’s “Century Avenue” microarchitecture and improved Chiplet design. The KX-7000 also features faster graphics and upgraded I/O interfaces like DDR5, PCIe 4.0, and USB4. Still, the company has a long way to go

China’s Chip Breakthrough: Light Speed Communication for Everyone?

Anubhav — Sat, 16 Mar 2024 00:59:37 +0000

Researchers at the JFS Laboratory in Wuhan, China have achieved a breakthrough in the development of high-performance photonic devices. Their innovation is a cost-effective chip that simplifies the manufacturing process for these devices.

This chip can simplify 5G communication, aerospace engineering and more

The key to this advancement lies in a technique called wafer bonding. In February, researchers successfully bonded an 8-inch silicon photonics wafer with a lithium niobate wafer. This combined structure forms a powerful new device capable of efficiently transmitting and receiving data-carrying light signals.

This technology is expected to have a huge impact on various fields. Applications include 5G wireless communication, optical communication infrastructure, and even aerospace engineering – any sector that relies on high electro-optical performance stands to benefit from this.

While the advantages of this new chip are clear, it’s important to understand why light signals are superior for communication compared to other methods. Here’s why:

Speed: Light travels significantly faster than electricity, allowing for much quicker data transmission over long distances.
Capacity: Light signals can carry a much larger volume of data compared to electrical signals, making them ideal for high-bandwidth applications.
Immunity: Unlike electrical signals, light signals are not susceptible to electromagnetic interference, ensuring reliable data transfer even in harsh environments.
Distance: Light signals experience minimal signal degradation over long distances, making them perfect for long-haul communication networks.

This research will pave the way for advancements in various technologies that rely on high-speed, reliable data transmission.

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Nvidia to Unveil a New Next-generation AI Chip at the Upcoming GTC Conference

Anubhav — Thu, 14 Mar 2024 14:52:20 +0000

Nvidia will take center stage at the upcoming GTC conference, the industry’s first in-person gathering since the pandemic. All eyes will be on the tech giant as they unveil their latest advancements, with a critical question looming over the heads of customers and investors alike: can Nvidia hold onto its leadership in the AI chip market?

The B100 chip’s price tag is expected to exceed $20,000 – more than its predecessor

Nvidia’s recent boom has been nothing short of meteoric. Their market cap skyrocketed to $2 trillion, putting them in close pursuit of Apple for the number two spot. Analysts predict revenue to double in 2024 driven by the demand for their top-tier AI chips.

But the focus isn’t just on present success; it’s on futureproofing that success. The GTC is expected to unveil the B100, the next generation of Nvidia’s AI processor. This powerhouse chip promises to be the heart of their future AI systems and push the performance bar even higher.

Current demand for Nvidia’s chips already outstrips supply, with developers facing lengthy wait times. The B100’s price tag is likely to climb past its predecessor’s $20,000 mark. However, analysts are concerned regarding Nvidia’s stock price. While it has soared in recent years, some of them are skeptical (and rightfully so) that overly optimistic future earnings projections could be detrimental to the company’s profile.

Beyond hardware, Nvidia’s software strategy is another area to watch. Their CUDA platform locks developers in by offering tools optimized for Nvidia chips. Upcoming CUDA updates are likely to solidify this developer loyalty. Their entry into cloud services will also be something to watch out. And then there’s the matter of China, which adds another layer of complexity. US restrictions on access to Nvidia’s most advanced chips have forced China to develop its own AI hardware. While Chinese rivals offer chips comparable to Nvidia’s A100, they haven’t caught up to the H100. Analysts predict the B100 will widen this gap even further.

One thing is for sure, the GTC conference will be a key event for the company. Stay tuned to Gizmochina for the latest Nvidia coverage when the conference is underway!

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Chinese Scientists Create a Brain-Analysis Chip by Learning from Space Research

Anubhav — Wed, 13 Mar 2024 00:43:38 +0000

It seems like scientists are getting creative as they try to understand the human brain! A team in China has developed a special chip inspired by how they study objects far, far away in space. This chip is designed to help them unlock the mysteries of the brain in real-time.

The new chip can analyze a lot of brain data really fast, and works on it right away

Here’s the problem: scientists can now take pictures of a whole zebrafish brain at once, but figuring out what all that information means takes way too long. It’s like having a giant puzzle without a picture on the box.

Image Credits: Dall-E

The Chinese researchers noticed something interesting. When astronomers study quick bursts of radio waves from space, they also need to analyze a lot of data fast. So, the scientists took a page out of the astronomer’s playbook and designed a chip with special processing power. This chip can handle a massive amount of brain data (like hundreds of movies playing at once) and start making sense of it right away.

Their research, published in a science journal, shows the chip actually works. It can track the activity of up to 100,000 brain cells in a tiny zebrafish. The scientists even used the chip to control the swimming of paralyzed zebrafish, which is reminiscent of the Neuralink chip – but it wouldn’t be wrong to compare the two of them.

Hopefully, this tiny chip turns out to be a big leap forward for brain research. It could help scientists understand how our brains work in real time, leading to new data – or even better, new medical treatments.

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Meet the Chip That Uses Light, Not Electricity, to Power AI

Anubhav — Wed, 21 Feb 2024 02:55:17 +0000

A team of engineers at Penn has just unveiled a technology that might just set a new course for the future of computing. Their creation, a chip that leverages light for artificial intelligence (AI) computations, stands to dramatically boost processing speeds while slashing energy use.

The new chip also promises enhanced privacy for the users

At the heart of this innovation is the field of silicon-photonics (SiPh), a domain where silicon, the abundant and cost-effective material at the core of traditional computer chips, meets the extraordinary capacity to manipulate light. This union draws upon the pioneering work of Penn Professor Nader Engheta, who has explored how materials can be fine-tuned at the nanoscale to carry out complex mathematical operations using light waves.

This chip isn’t just another step in technology’s march forward; it represents a potential paradigm shift. Traditional computing chips, despite their advancements, still hew closely to concepts established in the 1960s. The new chip, however, operates on an entirely different principle, performing calculations at the unparalleled speed of light.

The development of this chip was a collaborative effort, with significant contributions from Firooz Aflatouni, Associate Professor in Electrical and Systems Engineering at Penn. The team focused on enabling the chip to execute vector-matrix multiplication—a key process underpinning neural networks, which are vital for the AI applications that increasingly influence our daily lives.

One of the chip’s ingenious features is its design, which achieves computational magic by altering the height of the silicon wafer in certain areas. This allows light to scatter in precise patterns, facilitating the rapid execution of mathematical operations.

Beyond its potential for blazing-fast computation and reduced power consumption, the chip also promises enhanced privacy. Its capacity to perform numerous calculations simultaneously—without needing to store data in a computer’s working memory—could make future computers using this technology nearly impossible to hack. Now, all we can do is wait to see when this chip will start being incorporated in our daily devices, and one thing is for sure, that can take a lot of time.

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Snapdragon Reaches 3 Billion Devices Milestone, But MediaTek Still Leads in Market Share

Oğuz Çakır — Wed, 25 Oct 2023 20:16:29 +0000

Competition in the mobile processor market continues to intensify. Companies like Qualcomm, Samsung, and MediaTek are fiercely competing to have their chips used by more manufacturers and become the top choice for users. However, one company stands out as the first preference of Android enthusiasts. Of course, we’re talking about Qualcomm, with its Snapdragon series, which appears in every phone, from entry-level to flagship models. Recently, the company announced an increase in the number of devices powered by Snapdragon chips. Here are the details…

Snapdragon Chips Power Everything from Smartphones to Smartwatches, and Qualcomm Has Surpassed 3 Billion Devices

Qualcomm has proudly announced that over 3 billion devices are now running on Snapdragon chips. This remarkable achievement is no coincidence. The company has maintained a consistent track record of introducing new Snapdragon chips that bring enhanced performance, energy efficiency, and cutting-edge features. As a result, the popularity of Snapdragon chips has grown across various devices, including smartphones, tablets, wearables, and beyond.

Qualcomm’s Snapdragon processors are used in many of the world’s most popular smartphones, including the Samsung Galaxy S series, the Google Pixel series, and the OnePlus series. They are also used in many flagship smartphones from Chinese brands such as Xiaomi, OPPO, and Vivo.

In addition to smartphones, Snapdragon processors are also used in a variety of other devices, such as tablets, laptops, wearables, and connected cars. For example, the Snapdragon 8cx Gen 3 is a powerful chipset that is used in Windows 11 laptops. And the Snapdragon Wear 5100+ is a popular chipset for smartwatches.

Also one such technology is Snapdragon Seamless, which is designed to break down the barriers between devices and operating systems. “Snapdragon Seamless is a truly user-centric solution that will enable seamless experiences across multiple devices,” said Dino Bekis, vice president and general manager of wearables and mixed signal solutions at Qualcomm Technologies.

However, if you were to ask whether the 3 billion devices achieved as a result of all this effort are sufficient, the answer is no. Qualcomm is still trailing behind MediaTek in the mobile processor market share. Of course, price is one of the most important factors here, but it doesn’t change the fact that the company remains in second place.

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Samsung Could Produce Exynos 2500 and Qualcomm Snapdragon 8 Gen 4 with 1.4nm, 2nm Technology

Oğuz Çakır — Wed, 25 Oct 2023 19:44:03 +0000

While many of us may know Samsung for its consumer electronics products like smartphones and televisions, the company is much more than that. This South Korean tech giant has various departments responsible for producing displays, batteries, and, importantly, manufacturing chips. What’s impressive is that they excel in this aspect as well.

For instance, Samsung Foundry was the first company globally to introduce and commercially offer a 3nm chip fabrication technology. However, progress in technology never stands still, and Samsung claims that including themselves, will soon launch chips made using their 1.4nm and 2nm technology. Here are the details…

Samsung Foundry Claims Multiple Firms Will Launch Chips Made Using Its 1.4nm, 2nm Tech,

Samsung Foundry has been making significant advancements in semiconductor manufacturing technology. The company is now aiming to take chip fabrication technology even further with 1.4nm and 2nm processes. At the Semiconductor Expo 2023 event held in South Korea, the CTO of Samsung Foundry, Jeong Ki-tae, revealed that the company is already in discussions with major chip clients regarding the utilization of 1.4nm and 2nm processes.

Furthermore, Samsung Foundry is working on a second-generation 3nm chip fabrication process. This technology is expected to be used in the production of chips like the Exynos 2500 and potentially the Snapdragon 8 Gen 4, which could be available as early as late 2024. Of course, it’s worth mentioning that Samsung is not the only company working on this matter.

Many competitors, including TSMC, are also working to improve their production lines and produce the most powerful chips in a similar fashion. Nevertheless, the South Korean tech giant is doing its best to stay ahead, especially considering that the company’s profit margin has dropped by nearly 70% in the last quarter. This is quite significant.

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Nio Looks Beyond Cars, Trademark Application Hints at Broader Product Plans

Oğuz Çakır — Tue, 17 Oct 2023 10:47:12 +0000

Nio continues to expand its product line. When I say this, I’m not just referring to car models like Firefly, but also to diverse product categories like the recently introduced Nio Phone. This allows the company to not only strengthen its position in the industries it operates in but also to enter new markets. A recent surprising example of this is a chip. Nio has filed a trademark application for in-house chip production. Here are the details…

Nio Files Trademark Application for In-House Chips, Expanding Its Product Portfolio

Nio’s CEO, William Li, announced at the Innovation Technology Day last month that the company’s first self-developed chip will go into mass production in October. Now, according to the National Intellectual Property Administration’s Trademark Office website, NIO Automobile Technology filed a registration application for the “NIO Yang Jian” on September 21, 2023.

At first glance, Yang Jian appears to be just a chip that can process large amounts of LiDAR data in real time. However, the company has incorporated multiple subcategories into this trademark, such as computer software, chatbot software for simulated conversations, CPUs, AI-based interactive software, smart glasses for data processing, operating system programs, interactive computer systems, and more.

Based on this, we can say that Nio’s plans are much more extensive. In fact, this approach is a strategy employed by many tech giants, including Apple. Even though today’s world is very global and sourcing some components from abroad might seem cheaper, it can lead to significant disadvantages during challenging times.

Therefore, companies are opting to reduce their dependency on external sources in various areas, especially in chip manufacturing. It’s possible to say that Nio is also taking similar steps and is on its way to becoming a global technology giant.

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Qualcomm announces new Snapdragon G Series chips aimed at handheld gaming devices

Jeet — Thu, 24 Aug 2023 00:43:33 +0000

Qualcomm has announced a new lineup of chips — Qualcomm Snapdragon G-series, which is focused on handheld gaming devices. In the lineup, the company has unveiled three chips — Snapdragon G1 Gen 1, Snapdragon G2 Gen 1, and Snapdragon G3x Gen 2.

These three new processors from the company are intended to work with different form factors and handle specific gaming needs. They differ from each other in terms of power and performance.

Qualcomm Snapdragon G3x Gen 2

This is the flagship offering from the company and is a successor to the Snapdragon G3x Gen 1, which is powering the Razer Edge 5G. It is claimed to offer 30 percent faster CPU performance and twice the GPU performance than its predecessor. The chipset comes with Qualcomm Kryo octa-core CPU and Adreno A32 GPU.

It also supports hardware-accelerated ray tracing as well as game super-resolution, and XR glass tethering. It comes with support for low-latency premium Bluetooth audio and Snapdragon Sound Technology Suite. There’s also Wi-Fi 7 High-Band Simultaneous (HBS) as well as 5G sub-6 and mWaveray tracing.

Qualcomm Snapdragon G2 Gen 1

It has a Qualcomm Kryo octa-core CPU and a gaming-optimized Adreno A21 GPU along with a Snapdragon X62 5G Modem-RF System and 5G and Wi-Fi 6/6E connectivity via Qualcomm FastConnect 6700 Mobile Connectivity System. This chip sits between the G3x Gen 2 and the G1x Gen 1 and is claimed to be capable of full-featured mobile and cloud gaming.

Qualcomm Snapdragon G1 Gen 1

This is the base version in the lineup, offering Qualcomm Kryo octa-core CPU and Areno A11 graphics processor. The company has said that it is a designed for fanless gaming handhelds and is mostly intended to power devices for cloud streaming.

As of now, there’s no information about when devices powered by these chips will hit the market, but the company has revealed that several brands are already collaborating for handheld gaming devices powered by the Snapdragon G-series platforms, including AyaNeo, Thundercomm, and more.

TSMC’s 2nm Chips to Make Smartphones Cooler, Faster, and More Efficient

Oğuz Çakır — Thu, 22 Jun 2023 15:52:45 +0000

Processor technology is advancing rapidly. This means that chips are becoming more powerful, smaller, and more efficient. For example, the iPhone 14 Pro Max uses a 4 nm chip. Even though 3 nm chips have not yet been released, TSMC has recently started preparing to trial-produce 2 nm chips. Here are the details…

TSMC to start 2nm chip trial production for Apple and Nvidia

TSMC is preparing to trial-produce 2 nm chips. This is a major step forward for the semiconductor industry, as it means that even more powerful and efficient chips are on the horizon. The company has sent 1,000 R&D people to work at its new factory in Taiwan. This facility is still under construction, but soon, it will be a state of the art semiconductor manufacturing plant when it is completed. TSMC plans to start mass production of 2 nm products in 2025.

TSMC’s 2nm technology is expected to significantly outperform its previous 3nm chips in terms of both speed and power consumption. Specifically, the 2nm chips will be 10-15% faster than their 3nm counterparts while using the same power voltage. Furthermore, they will consume 25-30% less power than 3nm chips when operating at the same speed. These advancements are expected to boost the performance of devices using these chips, offering faster processing speeds while consuming less energ

TSMC’s move to prepare for 2nm production may seem insignificant at first, but it’s actually a very big deal. TSMC manufactures chips for dozens of tech giants, including Apple and Nvidia. This means that 2nm production could lead to much more powerful phones, computers, graphics cards, and gaming consoles. The smaller size and less energy consumption of 2nm chips could also help to overcome overheating issues. This could make handheld consoles and gaming laptops more stable and reliable.

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Intel to Build New Chip Plant in Germany with €10 Billion Government Subsidy

Oğuz Çakır — Mon, 19 Jun 2023 15:13:53 +0000

The COVID-19 pandemic has had a major impact on the technology industry. Many companies have realized the risks of relying on a single region for production, and are now looking to diversify their supply chains. For example, Apple has started manufacturing some of its iPhones in India. In a similar move, Germany and Intel have agreed on a deal that will see the US chipmaker receive €10 billion in subsidies to build a semiconductor manufacturing facility in Germany. Here are the details…

Germany, Intel Agree Chip Plant Subsidies Worth €10 Billion

As we mentioned before, technology companies are investing in production in different countries. This is good news for the regions where these companies invest, as it means economic development and job creation. Governments are signing agreements with tech giants to provide them with incentives and infrastructure facilities. The latest of these agreements was signed between Germany and Intel.

The agreement, which was signed by Chancellor Olaf Scholz and Intel CEO Pat Gelsinger on Monday, will see Intel build a new chip plant in the city of Magdeburg. The plant is expected to create thousands of jobs and cost around €30 billion to build. A significant part of this will be paid by Germany.

The subsidies will come in the form of both financial aid and price caps on energy. The financial aid will be used to help Intel cover the cost of building the plant, while the price caps on energy will help to keep costs down for Intel once the plant is operational. The agreement is a major boost for Intel, which has been looking to expand its manufacturing capacity in Europe.

The agreement is also a major win for Germany, which is looking to become a leading producer of semiconductors. The country has a strong manufacturing base, and the new chip plant will help to create jobs and boost economic growth. The new chip plant in Magdeburg is expected to be operational by 2027.

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The Thinnest Computer Chip: Researchers Develop World’s First Functional 2D Microchip

Oğuz Çakır — Mon, 05 Jun 2023 13:12:44 +0000

Semiconductors are tiny chips that are used in almost all electronic devices. They are essential to our modern technology, and they are used in everything from smartphones to TV remotes. During the pandemic, there was a global shortage of semiconductors. This caused production difficulties for many industries, and it led to higher prices for electronic devices. Thankfully, the chip shortage is now over. And researchers are already working on new ways to improve this technology. Most recently, researchers at King Abdullah University of Science and Technology department have developed a new microchip that uses two-dimensional (2D) materials to improve its performance. Here are the details…

2D Materials-Based Microchips Could Revolutionize Electronics

Researchers at King Abdullah University of Science and Technology (KAUST) have developed a new type of microchip that uses two-dimensional materials. 2D materials are incredibly thin, with some being only a single atom thick. This makes them very strong and lightweight, and they also have unique electrical and optical features.

However, integrating 2D materials into electronic devices has been challenging due to their fragility and the difficulty of fabricating them on a large scale. The KAUST team overcame these challenges by developing a new method for transferring 2D materials onto microchips. Researchers who made a statement on the subject describe their work as follows:

“Our motivation was to increase the technology readiness level of 2D material-based electronic devices and circuits by using conventional silicon-based CMOS microcircuits as a base and standard semiconductor fabrication techniques. The challenge, however, is that synthetic 2D materials can contain local defects such as atomic impurities that can cause small devices to fail. Also, it is very difficult to integrate the 2D material into the microchip without damaging it.”

“We produced the 2D material — hexagonal boron nitride, or h-BN, on copper foil — and transferred it to the microchip using a low-temperature wet process, and we then formed electrodes over the top by conventional vacuum evaporation and photolithograpy, which are processes we have in-house. In this way we produced a 5×5 array of one-transistor/one-memristor cells connected in a crossbar matrix.”

The team is now working to improve the performance and scalability of the microchips. They are also exploring new applications for the technology. The team believes that the microchips could be used in a variety of applications, including; Wearables, flexible displays, artificial intelligence chips, medical devices, energy harvesting sensors, and Security systems. However, let’s underline that we have a long time ahead of us for these developments.

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TSMC Preparing for 2nm Trial Production with Advanced AI System

Anubhav — Mon, 05 Jun 2023 08:59:35 +0000

Recent reports suggest that Taiwan Semiconductor Manufacturing Company (TSMC) is making significant strides in its efforts to sprint towards the next generation of process technology. TSMC has reportedly initiated preparatory work for 2nm trial production and plans to incorporate an advanced AI system to enhance energy efficiency, reduce carbon emissions, and accelerate trial production efficiency. Industry insiders anticipate that major players such as Apple and Nvidia will be among the first customers after TSMC achieves 2nm mass production, solidifying their lead over competitors like Samsung and Intel.

Apple and Nvidia Expected to be Early Customers

TSMC has refrained from commenting on the rumors surrounding its activities. However, the company emphasized that the development of 2nm technology is progressing smoothly, with mass production expected to commence in 2025.

Sources reveal that TSMC has dispatched engineers to the Zhuke research and development (R&D) plant to commence preliminary preparations for 2nm trial production. The company plans to assemble a dedicated R&D team of over 1,000 experts to spearhead global mass production at Zhuke Baoshan Wafer Fab 20. This advanced production base, planned to span six phases, will serve as TSMC’s primary 2nm facility in the future.

Industry insiders indicate that TSMC intends to establish a small-scale trial production line at Zhuke for initial 2nm research and development purposes. The goal for this year is to conduct trial production of nearly 1,000 pieces, followed by a risk trial production sprint in 2024 and mass production in 2025. TSMC’s 2nm technology will leverage a new gate-around (GAA) transistor architecture, which is expected to significantly enhance system performance compared to 3nm technology. This improvement has garnered strong investment interest from potential customers, allowing for greater customization of solutions.

A lower value of nm for chipsets refers to the size of the transistor’s gate length in nanometers. Smaller transistors result in increased performance, higher efficiency, more transistors on a single chip, reduced heat generation, and potential cost reduction. These advancements allow for faster data processing, improved energy efficiency, increased functionality, better thermal management, and cost savings in chip production. However, the nm value is just one factor influencing a chipset’s overall performance, with other aspects like architecture and design also playing important roles.

TSMC previously unveiled its 2nm family process blueprint, with plans to commence mass production of the N2 variant in 2025. The backside rail design of N2 is tailored for high-speed computing (HPC) products, set to debut in the latter half of 2025. The N2P and N2X versions of the 2nm family are projected to launch in 2026. Furthermore, Nvidia CEO Jen-Hsun Huang has also publicly revealed that TSMC will integrate an AI system developed in collaboration with Nvidia and other partners into the 2nm trial production operations.

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New Meta AI Chip to Power the Metaverse and Create a New Virtual World

Oğuz Çakır — Fri, 19 May 2023 16:45:22 +0000

Artificial intelligence is taking the internet by storm. Every day, more and more companies are integrating AI into their products and services. This is driving up demand for AI chips, which are used in the supercomputers that power AI applications. Meta, which has significant investments in AI, is developing its own AI chip to power next-generation AI applications. This chip is expected to be more powerful and efficient than current AI chips, which will allow Meta to develop even more advanced AI applications. Here are the details…

Meta Develops AI Chip to Power Next-Gen AI Applications

Meta, the parent company of Facebook, Instagram, and WhatsApp, is developing its own AI chip to power its next-generation AI applications. The chip, called the Meta Training and Inference Accelerator (MTIA), is designed to be more efficient and powerful than traditional AI chips.

MTIA is expected to enable Meta to develop more sophisticated AI models that can perform tasks such as natural language processing, computer vision, and machine learning. This could lead to a wide range of new AI-powered products and services, such as:

More accurate and personalized recommendations
Improved fraud detection and prevention
Enhanced customer service
New augmented and virtual reality experiences

MTIA is a significant development for Meta as it will allow the company to continue to push the boundaries of AI. The chip is expected to play a key role in Meta’s metaverse ambitions, as well as its efforts to develop new AI-powered products and services. Meta is not the only company developing its own AI chips. Other tech giants such as Google, Microsoft, and Amazon are also investing heavily in this area. The development of AI chips is a major trend in the tech industry, and it is likely to have a significant impact on the future of AI.

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Apple Is Hoarding TSMC’s 3nm Chips, and It Could Mean Trouble for Its Competitors

Oğuz Çakır — Tue, 16 May 2023 22:16:27 +0000

The 3nm process is the next big step in smartphone chip technology. It is expected to offer significant improvements in performance and power efficiency over the current 4nm process. This could lead to longer battery life and faster performance in upcoming products, such as the iPhone 15 and Galaxy S24. So, who will be the first manufacturer to use this technology and have an overwhelming advantage over its competitors? Apple is reportedly hoarding 90% of TSMC’s 3nm capacity this year. This could give it a significant advantage over its competitors. Here are the details…

What Does Apple’s 3nm Chip Hoarding Mean for Its Competitors?

Apple is reportedly hoarding 90% of TSMC‘s 3nm capacity this year, according to a new report from Taiwan. This means that the iPhone maker will have first dibs on the most advanced chip manufacturing process available, which could give it a significant advantage over its competitors. The 3nm process is expected to offer significant improvements in performance and power efficiency over the current 4nm process.

This could lead to longer battery life and faster performance in Apple’s upcoming products, such as the iPhone 15 and the M3 MacBook Air. The report also claims that Apple has been placing orders for 3nm chips since 2020, which suggests that the company is planning for the long term. This could mean that Apple is preparing to launch a new product category, such as a self-driving car, that requires the latest and greatest chip technology.

It is unclear what impact Apple’s hoarding of 3nm capacity will have on its competitors. Qualcomm, Samsung, and MediaTek are all expected to release 3nm chips in the coming years, but they may have to wait until 2024 or 2025 to get their hands on enough chips to meet demand. This could give Apple a significant advantage in the market.

It is also worth noting that TSMC is expected to increase its 3nm capacity in 2024. This could help to alleviate some of the supply constraints that Apple’s hoarding is causing. However, it is still unclear how much additional capacity TSMC will be able to add, and it is possible that Apple will still be able to secure a significant portion of it.

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Qualcomm Set to Acquire Israeli Auto-Chip Maker Autotalks

Oğuz Çakır — Mon, 08 May 2023 19:48:04 +0000

The competition in the processor market continues at full speed. As ARM-based mobile processors begin to take over the PC market, companies are doing everything they can to strengthen their positions. In line with this, Qualcomm has announced its plans to acquire Israeli auto-chip manufacturer Autotalks. Here are the details…

Qualcomm Acquires Autotalks: A Step Forward in Automotive Technology

Qualcomm, already one of the most successful companies in its field due to its current technologies, continues to take strategic steps to remain competitive in the market. For example, a few years ago, Qualcomm acquired an automotive tech company called Veoneer for $4.5 billion. Now, they have taken another step in this area.

Recently, the company announced plans to acquire Israeli auto-chip maker Autotalks. This strategic move aims to enhance Qualcomm‘s automotive portfolio and capitalize on the growing demand for advanced driver-assistance systems. With the increasing prevalence of electric vehicles and autonomous features in cars, the number of chips used by automobile manufacturers is rising, turning the automotive market into a significant growth area for chip producers.

Autotalks manufactures specialized chips used in vehicle-to-everything (V2X) communication technology for both manned and driverless vehicles, with the aim of enhancing road safety. Nakul Duggal, Senior Vice President of Automotive at Qualcomm Technologies, said in a statement, “Since 2017, we have been investing in V2X research, development, and deployment, and as the automotive market matures, we believe there will be a need for a standalone V2X security architecture for advanced driver safety and intelligent transportation systems.”

Last year, Qualcomm reported that its automotive business volume increased by over $10 billion, reaching $30 billion. The company attributes this surge to the Snapdragon Digital Chassis product used by car manufacturers and suppliers. Snapdragon Digital Chassis can provide both assisted and autonomous driving technology, as well as in-vehicle infotainment and cloud connectivity. It was announced that Autotalks’ solutions will be incorporated into the Snapdragon Digital Chassis portfolio. No financial details about the acquisition have been disclosed yet.

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Samsung’s New Texas Chip Plant Will Cost $8 Billion More Than Expected

Anubhav — Fri, 17 Mar 2023 06:40:00 +0000

According to insiders familiar with the matter, Samsung Electronics Co Ltd’s chip plant being built in Taylor, Texas, is expected to cost the company over US$25 billion, which is more than US$8 billion above initial projections. The increase in cost is primarily due to inflation, with construction expenses accounting for approximately 80 per cent of the cost increase. The cost of materials has also increased significantly.

The insiders, who declined to be identified, stated that the estimated cost could rise even further if the construction of the plant is delayed. Although Samsung has not commented on the matter, the increasing costs raise questions about how far the billions in grants being applied for by chip manufacturers from the Biden administration under the Chips Act will go.

According to the US Commerce Department, most government grants will only cover up to 15 per cent of the cost of new plants, and since the proposed Chips Act grants were introduced three years ago, the cost of labour and construction materials has risen sharply. As a result, chip makers’ significant spending plans could be pushed even higher.

Samsung, the world’s second-largest contract chip manufacturer, plans to create 2,000 high-tech jobs at the Taylor plant, which is expected to produce advanced chips for various functions such as artificial intelligence, 5G, and mobile phones. The company is rushing to complete construction by 2024, ahead of a 2026 deadline to secure investment tax credits on tools for the factory.

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Nvidia May Face Major Threat to Sales as US Plans More Sanctions on Huawei

Joane — Mon, 06 Mar 2023 12:29:13 +0000

American technology company Nvidia may face new challenges as the US plans to add more sanctions on trade with the Chinese tech giant Huawei. China is Nvidia’s second-largest trade partner with an annual revenue of $7111 million in 2022 alone and the Chinese company Huawei is an important customer of Nvidia.

source: Statista

According to Reuters, a draft report by the US government proposes to add more restrictions and sanctions on trade with Huawei. As per the draft report, the proposed 2023 amendment of (the Commerce Department’s) licensing will likely have a high economic impact on Nvidia.

Nvidia declined to comment on the matter and said that the company is in no position to comment on pending licenses. However, the company said that China was a very important market for the US semiconductor industry and the company would work globally with customers and partners to comply with all applicable export controls and meet market demand.

The US Department of Commerce did not provide an official comment on the report. A senior officer from the State Department said that the document was a preliminary draft prepared by an outside contractor and the government had still not reviewed or approved the contents of the report. He further added that the government had written and contracted multiple reports on this subject, based on different contingencies, which arrive at very different conclusions.

Though the draft is not approved by the government, it sheds light on the US government’s plan to impose additional sanctions on the Chinese technology conglomerate Huawei. Apart from Nvidia, it also mentioned the tech giant Qualcomm and its business with Huawei. However, the draft concluded that in the case of Qualcomm and Huawei, Huawei stood a chance to lose more than Qualcomm as it heavily relied on Qualcomm’s chips to power its smartphones.

In 2019, the Trump administration added Huawei to the infamous entity list. The current Biden administration has continued with the restrictions and is increasing the curbs on Huawei and other Chinese tech companies. Under the US sanctions, exports, re-exports, and transfers to Huawei and its listed affiliates of any items subject to the EAR (including EAR99 items) without a license are restricted.

Trump administration imposed the trade ban on Huawei, citing national security concerns, which barred the company from using Android OS for its new smartphones, among other critical U.S.-origin technologies. The sanctions caused its smartphone sales to plummet. However, Huawei continues to generate revenue via its networking equipment and cloud divisions and is now exploring the lucrative electric vehicle (EV) sector.

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Unisoc Competes for Global Market Share with MediaTek-Style Strategy

Oğuz Çakır — Mon, 06 Mar 2023 10:35:09 +0000

When we think of mobile processors, Qualcomm is often the first company that comes to mind. This is because their chips are widely used in high-end and mid-range devices. However, it may come as a surprise to many that MediaTek, a Taiwanese manufacturer, is actually the world’s top-selling chip producer, surpassing even Qualcomm. With a wide range of chips produced for all kinds of devices, MediaTek has secured a significant market share. Following in their footsteps, Chinese company Unisoc is also adopting a similar strategy to expand their market share, particularly in the low-end smartphone chip market. Here are the details…

At Unisoc’s Shanghai showroom, China’s chip ambitions remain strong in the mature technology arena

Chinese chip firm Unisoc is expanding its market share in low-end smartphone chips, The company’s success lies in its focus on less advanced chips, allowing it to remain relatively unscathed by US sanctions to date. In fact, Unisoc’s share of the global smartphone chip market was 10% in Q3 2022, according to market research firm Counterpoint, ahead of Samsung Electronics.

Unisoc’s success with 5G chips is notable, including the launch of the T820 chip in November 2022 and the subsequent launch of a 5G communication solution at the Mobile World Conference in Barcelona in March 2023. Unisoc’s T820 chip was made possible by a team of more than 200 engineers who slept at the office for nearly three months during Covid lockdowns last year.

Unisoc has not elaborated on plans for mass production of the chip, but the company has launched three 5G chips using a 6-nanometre extreme ultraviolet lithography process, with the other two chips achieving mass production and being adopted by low-end smartphone brands in China. Despite Unisoc’s success, the company remains exposed to US sanctions because China still lacks advanced fabrication plants of its own.

For example, Huawei’s chip design unit, HiSilicon, was hobbled by US trade sanctions on exports of advanced chips, which required Taiwan Semiconductor Manufacturing Co to stop doing business with it. Unisoc has ramped up efforts to diversify its operations, extending the application of 5G chips beyond consumer electronic products to industrial solutions such as medical services, logistics, electricity, and mining, among others. The company’s shipments of 5G Internet of Things (IoT) chips and modules also increased 146% last year.

Unisoc is conducting a new 10 billion yuan (US$1.45 billion) fundraising round, according to Reuters, and its business covers more than 133 countries, with 80% of its products sold to overseas markets. Unisoc’s success underscores the life in the domestic semiconductor industry, particularly the section that focuses on more mature chip technologies.

According to China’s chip design industry association, the country had 3,243 chip design firms by the end of 2022, with their combined sales up 16% from a year ago. While risks remain, Unisoc is a shining example of how Chinese semiconductor companies can survive and even thrive under US trade sanctions.

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Oppo Said to Release Its Own 4nm SoC in 2024

Soumyakanti — Tue, 21 Feb 2023 11:30:34 +0000

Chinese smartphone maker Oppo is looking to shake up the industry with reports indicating that the company has built its own in-house chipset. The move could make Oppo self-sufficient and competitive in the market in terms of both performance and pricing.

The first report of Oppo’s in-house chipset came from a MediaTek executive at a foreign investment meeting in Hsinchu, Taiwan. The executive revealed that Oppo is interested in acquiring a genuine chipset to maintain its position in the industry. An insider also claimed that the Guangdong maker has already started working on its chip, and it would hit the market in 2024.

Recently, @CellPhoneChipExpert, a reputable Weibo insider, revealed Oppo’s first-ever smartphone chipset is in the works. The chipset, expected to be manufactured by TSMC using a 4nm manufacturing process, would reportedly be compatible with 5G networks. Industry experts predict that Oppo’s in-house built processor will enter tape out in the second half of 2023, with the final product being released in 2024.

Oppo has reportedly invested over $1.4 billion in research and development to create its own SoC. In 2020, when US restrictions on Huawei goods became clear, Oppo began to adjust its approach. The company’s first custom-designed processor, MariSilicon X, was released in 2021. The MariSilicon X was a specialized 6nm imaging chip that showed that the company was not planning to rely on processors and parts made by current partners like MediaTek and Qualcomm. Oppo also has a connectivity chip called MariSilicon Y.

While Oppo has not confirmed the news of its in-house chipset, reports suggest that the announcement will be made soon. Acquiring its own genuine chipset could help Oppo maintain its position at the forefront of the industry, as companies like Google, Apple, and Samsung have already developed their own proprietary chipsets. With companies becoming self-sufficient, the industry could see a shift towards greater independence, keeping in mind the recent silicon shortages.

Overall, Oppo’s move towards building its own chipset is exciting news for the smartphone industry. As more information becomes available, we will make sure to keep you updated.

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TSMC Pushes Back Opening of European Factory by Two Years

Oğuz Çakır — Mon, 20 Feb 2023 19:13:00 +0000

TSMC, one of the world’s largest semiconductor manufacturers, has postponed its plans for a new factory in Europe due to the changing supply and demand of automotive semiconductors. Originally set to open earlier, the European factory will now be delayed for at least two years, and it’s not expected to be completed until 2025.

TSMC Pushes Back Opening of European Factory by Two Years

TSMC had been exploring the possibility of establishing a special process fab in Europe focused on automotive technology, based on customer needs and the support of governments in various countries. However, with the current correction of the semiconductor economy, major foundries are now dispatching more production capacity to produce automotive chips, resulting in an improvement of the chip shortage and even a balance between supply and demand.

The delay in TSMC’s European factory could mean that European automotive chip customers will continue to stay in TSMC’s Taiwan plant, or even move to new plants in Japan and the United States, which would help TSMC use the production capacity of its overseas plants. Meanwhile, Japanese officials are encouraging TSMC to set up a second fab in Japan, supported by the introduction of extreme ultraviolet light (EUV) machines. This could allow TSMC’s Japanese plant to support more advanced process needs of local and international automotive semiconductor customers.

Industry analysts believe that this shift could be beneficial for TSMC, especially given the fluctuating economic climate and high inflation pressure, which make the cost of setting up factories in Europe much higher than in the United States and Japan.

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Global Chip Shortage is Over! The Impact of Inflation on the Chip Industry

Oğuz Çakır — Mon, 30 Jan 2023 14:59:29 +0000

The global chip shortage has come to an end, as confirmed by the latest reports. The statement might seem overly optimistic, but the declining operation rates at South Korean chip foundries such as Samsung, DB Hitek, Key Foundry, Magnachip, and SK Hynix System IC supports the declaration. The chip industry is reportedly moving towards a more stable supply chain. Here are the details…

South Korean chip foundries to suffer low operation rate up to Q2

The global chip shortage, which began during the pandemic, has affected the entire world. The decrease in production capacity and simultaneous increase in demand resulted in a crisis that lasted for an extended period. Despite manufacturers operating at near full capacity to meet demand, both prices and product availability remained limited.

But that era has now come to an end. Recent reports indicate that many manufacturers in South Korea operate at 60-70%. Only Samsung is an exception, operating at 80% capacity. Unfortunately, the impact of global inflation and declining demand for IT products has resulted in a decrease in both chip prices and demand. Consumer electronics companies are also grappling with high inventory levels.

Unfortunately, this situation seems to affect the consumers negatively. People who paid high wages only a few months ago due to product and stock shortages will now buy products at low prices due to rising costs and inflation.

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ASML Expects to Continue Business with China Despite US Pressure

Joane — Thu, 26 Jan 2023 15:29:21 +0000

Europe’s largest semiconductor equipment manufacturer ASML Holding N.V. said that the company expected to continue exports to China at the same level as it did in 2022, despite the building pressure from the US to increase export sanctions on the country.

The company is expecting to earn around 2.2 billion Euro from China sales in 2023 and hopes that the ongoing diplomatic talks between US, Japan, and Netherlands did not end in any more sanctions against China, which can jeopardize the whole semiconductor industry.

Source: ASML

The Dutch company plays a vital role in the semiconductor industry as nobody else in the world can make the complex EUV (Extreme Ultraviolet Lithography) machine, required to create advanced semiconductors. All major chipmakers like TSMC, Samsung, and Intel depend on ASML for their lithography machines.

In an interview with Financial Times, ASML CEO Peter Wennik said that he hoped the Dutch Government would choose sensible sanctions which would not affect the key industries that are completely dependent on semiconductors. He further added that the geo-political bifurcations and increasing trade restrictions could create more friction in the industry which can lead to an increase in the pricing or worse, a reduction in the availability of chips.

The semiconductor or chip is one of the hottest technological device of the decade as it is a crucial component found in almost all electronic devices that make modern living possible. Semiconductors are needed in almost all sectors of modern life like communication, health, smart living, military, medicine, computing, clean energy, transportation, infrastructure, and more.

Source: ASML

China is the world’s biggest semiconductor consumer and accounts for 15% of the backlog orders of ASML. Last year US introduced increased restrictions on semiconductor exports to China to stop its advancement in AI and disrupt its progress in chip making.

These restrictions stopped ASML from providing machines, tools, personnel, and technical know-how to Chinese companies. At first, the company thought that this would affect its business drastically. However, CEO Wennik said that the actual impact of trade restrictions was not as bad as they thought, as the Chinese customers decided to make older chips using ASML products that did not fall under the purview of sanctions.

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Apple To Start Transitioning Away From Qualcomm Modem Chips Next Year

Jeet — Wed, 11 Jan 2023 05:44:09 +0000

Apple has been trying to replace the Qualcomm modems from its devices with the company’s own modems and for this, the company also acquired a division of Broadcomm.

The transition was pushed back due to some reasons, but now the Cupertino-based tech giant is back on track and is gearing up to use its in-house developed modem and chips.

A new report coming from Bloomberg claims that Apple plans to start replacing Qualcomm modem chips on its iPhones as soon as 2024, for which the company has been working for years.

Apple had initially planned to use its own modem chips on iPhones this year, i.e. 2023, but its development efforts didn’t produce the results it wanted and, thus, pushed back the transition and decided to keep using Qualcomm until its own solution is developed.

Modem chip development has seen delays, and Apple will use a slow rollout to end its reliance on Qualcomm. Apple will start by using its modem in a single device before expanding the rollout to other devices. The transition away from Qualcomm could take up to three years.

Apart from this, the company also wants to stop using wireless components from Broadcom in 2025. For this, Apple is working on a Wi-Fi and Bluetooth chip that would replace the components that it is currently sourcing from Broadcom. A couple of years ago, Apple signed a three and a half-year deal with Broadcom for wireless components and modules, which is set to expire midway this year.

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MediaTek Genio 700 IoT Chip With Dual Display Support Announced At CES 2023

Jeet — Tue, 03 Jan 2023 03:52:15 +0000

MediaTek, one of the leading smartphone chips manufacturer, has announced its new MediaTek Genio 700 IoT chip at the Consumer Electronics Show (CES) 2023.

The MediaTek Genio 700 is an octa-core processor which the company says is designed for smart home, smart retail, and industrial IoT products and is focused on power efficiency.

It is manufactured using the N6 (6nm) process and has two ARM Cortex-A78 cores running at 2.2GHz, along with six ARM Cortex A-55 cores running at 2.0GHz while providing 4.0 TOPs AI accelerator.

The chips also come with support for dual displays, as well as an ISP for better images. The company says that it allows makers to customize products using Yocto Linux, Ubuntu, and Android, allowing customers to easily develop their own products with a minimal amount of effort, regardless of application type.

It supports high-speed interfaces, including PCIe 2.0, USB 3.2 Gen1, and MIPI-CSI interface for the camera. Along with dual display support (Full HD at 60Hz and 4K at 60Hz), it also comes with AV1, VP9, H.265, and H.264 (video decode) support. It has ARM SystemReady certification for providing a standard and easy way to integrate the platform and ARM PSA certification for increased security.

Samsung Expands Chip Production at Largest Plant Despite Economic Slowdown

Oğuz Çakır — Mon, 26 Dec 2022 12:25:38 +0000

Samsung Electronics is reportedly planning to increase its chip production capacity at its largest semiconductor plant, the P3 factory in Pyeongtaek, South Korea, next year, despite forecasts of an economic slowdown. The move stands in contrast to other chipmakers, such as Micron Technology and TSMC, which have scaled back investment amid falling demand and a glut of chips.

According to the Seoul Economic Daily, Samsung will add 12-inch wafer capacity for DRAM memory chips at the P3 factory, as well as additional 4-nanometer chip capacity for foundry contracts, which are chips produced according to clients’ designs. The P3 factory, which is Samsung’s largest chip manufacturing facility, began production of cutting-edge NAND flash memory chips this year and the company plans to add at least 10 extreme ultraviolet machines in the coming year.

Analysts have said that Samsung’s persistence with its investment plans will likely help the company take market share in memory chips and support its share price when demand recovers. In October, Samsung said it was not considering intentionally cutting chip production, defying the broader industry’s tendency to scale back output to meet mid- to long-term demand. “We plan to stand behind our original infrastructure investment plans,” said Han Jin-man, executive vice president of memory business at Samsung.

In contrast, Micron Technology said last week it would adjust down its investments in fiscal 2023 to between $7 billion and $7.5 billion, compared with $12 billion in fiscal 2022, and would also be “significantly reducing capex” plans in fiscal 2024. Taiwanese chipmaker TSMC also cut its 2022 annual investment budget by at least 10% in October and struck a more cautious note than usual on upcoming demand.

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TSMC Considers Building First European Plant in Germany

Oğuz Çakır — Fri, 23 Dec 2022 11:56:30 +0000

TSMC, the world’s largest chipmaker, is considering building its first European plant in Dresden, Germany. The plant, which could begin construction in 2024, would meet the growing demand for locally-manufactured chips from Europe’s car industry. A team of senior executives from TSMC will visit Germany in the new year to discuss government support and the local supply chain’s capacity to meet the company’s needs.

A final decision on whether to invest billions of dollars in the plant will be made soon after the visit. TSMC is in talks with several materials and equipment suppliers to determine if they can invest in the company’s proposed chip plant in Dresden, Germany. If the plant is built, it will focus on producing 22-nanometer and 28-nanometer chips using over 50 types of equipment and more than 2,000 materials, such as chemicals and industrial gases.

These chip technologies will be similar to those that TSMC plans to make at a factory in Japan with Sony. Nanometers refer to the size of the transistors on a chip, with smaller nanometers indicating more advanced and powerful semiconductors. As global chipmakers like Intel and Samsung expand their capacity, TSMC is considering entering the European market. The three largest chipmakers in the world have committed to investing at least $380 billion over the next decade to build new factories in Taiwan, South Korea, the US, Japan, Germany, Ireland, and Israel.

The Chips Act, passed by Congress in the US last year, has attracted around $200 billion in private investment in the country’s chipmaking capacity, according to the Semiconductor Industry Association. The rapid expansion of the semiconductor industry has raised concerns that there could be an excess supply of chips if the global economy experiences a significant slowdown. However, market research firm Mordor Intelligence predicts that the global semiconductor market will grow at a rate of around 6% per year between 2021 and 2025, indicating that demand for chips is likely to remain strong.

Taiwan Semiconductor Manufacturing Company’s (TSMC) decision to build a plant in Dresden would be beneficial for the European Union, which is trying to reduce its reliance on importing semiconductors from Asia. The EU approved 43 billion euros in subsidies in 2021 to encourage chipmakers to locate in Europe.

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iPhone 15 Series Prices May Be Higher Than Expected Because of TSMC

Oğuz Çakır — Wed, 23 Nov 2022 14:43:53 +0000

The 3 nm era has officially started in chip production. Manufacturers such as Samsung and TSMC have started the production process for chips that develop with this technology. It looks like TSMC will start shipping 3nm chips to Apple for the iPhone 15 series. Although this situation is good in terms of performance and energy efficiency, its reflection on costs has already begun. TSMC’s wafer prices double from 7nm production to 3nm.

TSMC’s wafer prices double from 7nm production to 3nm

The A17 Bionic chip developed by Apple for the iPhone 15 series will be produced by TSMC, the world’s leading chip foundry, using a state-of-the-art process node. Simply put, the lower the process node number, the smaller the transistors used in a chip allowing more transistors inside a chip, the more powerful and energy-efficient it is. This process causes more advanced processors to emerge every year.

For Example, iPhone 11 had 7nm A13 Bionic SoC, released in 2019 that carried 8.5 billion transistors in each chip but iPhone 14 Pro and iPhone 14 Pro Max had the A16 Bionic chipset under their hoods. Unfortunately, maintaining the progress we’ve seen in the past is getting harder and harder each year.

Both TSMC and Samsung have plans for 2nm chips starting in 2025 and it is even possible that we will see 1nm by 2030. Although these developments have many advantages, they also come with costs. According to the latest reports TSMC plans on charging more than $20,000 for 3nm wafers. When the foundry moved from 7nm to 5nm, wafer pricing rose 60% from $10,000/wafer to $16,000/wafer.

At first glance, these costs do not make sense for the end user, but the increase in prices is inevitable. Based on this, it is possible to say that the iPhone 15 and other flagship models will come out at a higher price than expected. Especially considering that the cost increase is not limited to wafers.

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Black Sesame Technologies and ZTE Join Forces for Self-Driving Cars

Oğuz Çakır — Mon, 21 Nov 2022 12:06:39 +0000

Partnerships between technology companies continue to increase, resulting in better products and less time and money wasted. The last of these partnerships is between ZTE and autonomous driving computing processor developer Black Sesame Technologies. The two companies will work together on ZTE’s first autonomous driving chip and shape the future together.

Black Sesame Technologies partners with ZTE for self-driving cars

Self-driving and other modern features continue to spread in the auto industry. This situation attracts the attention of big tech companies. Companies like Apple and Huawei are entering the auto industry, challenging decades-old manufacturers, one of these brands is ZTE. While the company has been investing in self-driving technologies for a while, it will speed up the process thanks to its collaboration with Black Sesame Technologies.

Black Sesame Technologies and ZTE partnership announcement

According to the agreement between Black Sesame Technologies and ZTE, the two companies will use their accumulated knowledge in autonomous self-driving computing chips and vehicle operating systems to develop ecosystems. This will result in local chips and software that meet market demands. Currently, Black Sesame Technologies has a comprehensive product portfolio that supports automakers in every step of production.

Including proprietary automated image processing ISP, auto-grade deep neural network accelerator NPU, Huashan series high-performance autonomous driving computing chip, Shanhai artificial intelligence development platform, Hanhai autonomous driving middleware, auto-grade integrated detection algorithm, BEST Data closed-loop solution and BEST Drive autonomous driving solution.

These technologies have been very useful for the company as well. Earlier in August, Black Sesame Technologies closed its C+ funding round, raising over $500 million in the combined C and C+ rounds. Based on this, it is possible to say that ZTE has chosen a strategically successful partner. It is a question of interest when this partnership will bear its first fruit.

(Source)

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Samsung partners with Google and AMD to make a new chip for future Galaxy S-series smartphones

Jeet — Fri, 18 Nov 2022 01:34:34 +0000

Samsung has been making Google’s Tensor chips, and now it appears that the South Korean technology giant has increased involvement with Google and will be working on making a new chipset for its upcoming flagship smartphones.

As per the new report from tipster Connor, Samsung is working with Google’s Tensor team and AMD’s graphics team to create a new chipset that will be powering the Samsung Galaxy S-series flagship smartphones, most likely from 2025.

It is being said that the chipset will consist of two high-performance Cortex-X cores, four performance-focused cores running at a lower clock speed, and four energy-efficient cores. The diagram shared indicates that AMD GPU will be included in the chipset for processing grahpic-intensive tasks.

Google and Samsung have already teamed up to produce Google Tensor chips for the Pixel series smartphones. The Tensor and Tensor G2 chips powering the Pixel 6 and the Pixel 7 series smartphones are manufactured by Samsung. They are basically Exynos chips but with AI features on top from Google’s team.

Recent reports indicate that both these companies have already started working on the third-generation Google Tensor SoC, which will be debuting with the Pixel 8 series smartphones next year. The chip is reportedly codenamed “Ripcurrent” and carries model number S5P9865.

Most of the chips for smartphones nowadays are manufactured using the 5nm or 4nm process, but since this new chipset for the future Galaxy S-series phones is expected to go official a couple of years from now, it could be manufactured using a more advanced 3nm process and there’s a high possibility of that happening given that Samsung has already started working on 3nm chips.

Qualcomm Snapdragon AR2 Gen 1 chipset announced for high-performance AR Glasses

Jeet — Thu, 17 Nov 2022 07:17:38 +0000

Soon after announcing the Snapdragon 8 Gen 2 flagship smartphone processor, Qualcomm has taken the wraps off yet another chipset, dubbed Qualcomm Snapdragon AR2 Gen 1, which is built for Augmented Reality devices.

The new chip is a part of Qualcomm’s Extended Reality (XR) offerings and is claimed to deliver “groundbreaking AR technology that will unlock a new generation of sleek, highly capable glasses.”

With this new chipset, which is built from the groups up, the company is aiming to revolutionize the head-worn glass form factor and usher in a new era of spatial computing experiences for the real-world/metaverse mix.

It is built on a multi-chip distributed processing architecture combined with customized IP blocks. The company says that the new platform delivers 2.5x better AI performance than the Snapdragon XR2 Gen 1 and consumes 50% less power, making it ideal for AR glasses that consume less than 1W power.

The chipset consists of an AR processor, an AR co-processor, and a connectivity platform. The AR processor is optimized for low motion-to-photon latency while supporting up to nine concurrent cameras for the user and environmental understanding. The AR co-processor aggregates data from connected cameras and sensors, enabling features like eye tracking and iris authentication for foveated rendering.

As for connectivity, the chip uses the FastConnect 7800 system and brings support for the latest Wi-Fi 7 technology with less than 2ms latency between the AR glasses and the smartphone or host device. It is also capable of offloading complex tasks to Snapdragon-powered smartphones, PCs, or other compatible host devices to reduce latency and offer a smoother visual experience.

Qualcomm says it is working with several OEMs, including Lenovo, LG, Oppo, TCL, Xiaomi, Pico, QONOQ, Rokid, Sharp, Tencent, and Vuzix, among others, to bring a new generation of AR smart glasses featuring the Snapdragon AR2 to the market. As of now, details about the availability of any AR devices from these brands aren’t known, but we expect to know more in the coming months.

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Qualcomm Snapdragon 8 Gen 2 flagship smartphone chipset goes official

Jeet — Wed, 16 Nov 2022 01:31:03 +0000

Qualcomm, one of the leading smartphone chipset makers, has today officially announced its next-generation Snapdragon series flagship processor for high-end smartphones — Qualcomm Snapdragon 8 Gen 2.

As the name itself indicates, the newly announced Qualcomm Snapdragon 8 Gen 2 is a successor to the last year’s Snapdragon 8 Gen 1 processor, and it comes with a focus on better and more efficient performance, especially when it comes to AI-related tasks.

The Kryo CPU on the Snapdragon 8 Gen 2 includes one prime core based on the ARM Cortex-X3 clocked at 3.2GHz, as well as four performance cores at 2.8GHz and three efficiency cores at 2.0GHz. Compared to last year’s chipset, these are 200MHz to 300MHz faster. The company says the CPU is 35 percent faster than the previous generation and 40 percent more power efficient.

Its latest Adreno GPU is claimed to offer 25 percent higher performance while being 45 percent more power efficient. It also brings support for hardware-accelerated ray tracing to the Snapdragon platform. There’s support for faster memory technologies, including LP-DDR5X RAM at up to 4,200MHz and new UFS 4.0 storage.

Similar to the SD8 Gen 1, the newly announced Qualcomm Snapdragon 8 Gen 2 is built using a 4nm process. As for the display, the chipset comes with support for QHD+ resolution at up to 144Hz or 4K resolution at 60Hz. It also supports external displays up to 4K resolution at 60Hz with a 10-bit Rec. 2020 color gamut, HDR10+, and Dolby Vision.

Coming to the camera department, it has a triple 18-bit ISP that supports up to three 36MP cameras simultaneously or up to 200MP for a single-camera configuration. It also supports 108MP camera sensors with zero shutter lag. The company has also improved support for the latest Sony and Samsung sensors as Sony sensors with DOL-HDR and Samsung’s 200MP HP3 sensors are optimized to work with the ISP on the Snapdragon 8 Gen 2.

Qualcomm says it has made improvements throughout the Hexagon processor for up to 4.35x faster Artificial Intelligence (AI) performance and claims that the chip can handle more complex tasks, like translating a language into multiple languages in real time. It is also the world’s first chip to have support for Wi-Fi 7 technology.

It packs a Qualcomm Snapdragon X70 modem, which was announced earlier this year at the Mobile World Congress. It has its own AI processor for boosting 5G performance and comes with support for dual active 5G SIMs, which means that users can use two different 5G networks simultaneously.

Qualcomm revealed a list of partners for the Snapdragon 8 Gen 2 processor, which includes Motorola, OPPO, and ASUS ROG, among others. However, Samsung is missing from the list, but we are pretty sure the upcoming Samsung Galaxy S23 series flagship smartphones will come powered by the Snapdragon 8 Gen 2 SoC. The company says that smartphones powered by the Snapdragon 8 Gen 2 will start getting launched by the end of this year.

Taiwan May Lose Its Position in Technology Manufacturing

Oğuz Çakır — Tue, 15 Nov 2022 03:39:04 +0000

Tensions between China and the USA continue at full speed. This situation negatively affects the diplomatic relations between the two countries and the commercial relations in the region. According to the statements of MediaTek CEO Rick Tsai, political tensions are pushing some manufacturing companies to talk about expanding some of their supply chains beyond Taiwan.

Rick Tsai: Supply chain are gradually leaving Taiwan

Taiwan is one of the leading technology centers in the world. The headquarters of many important companies, such as Asus, MediaTek and TSMC, are located here. In addition, supply manufacturers, which are very important for technology companies, are also located here. This situation contributes to the development of commercial relations in the region and the development of technology in Asian countries.

However, according to MediaTek CEO Rick Tsai, some of the “very large (equipment manufacturers) will require their chip suppliers to have multiple sources, like from Taiwan and from the U.S., or from Germany or from Europe.” Tsai said that if it continues like this, they need to find different sources for the same chip in the future and underlined that the change is not large-scale.

Will MediaTek shift production out of Taiwan?

While MediaTek’s most advanced smartphone chips are manufactured in Taiwan, the company also has overseas plans. Tsai said some of the older chip models were manufactured by GlobalFoundries Inc, which has factories in places like the US and Singapore. The company is pushing to expand its business in the US and wants to increase sales several fold.

MediaTek will also manufacture at Intel’s Ireland and TSMC‘s Arizona facilities. However, these preparations seem more like being ready for the worst than shifting production. Tsai also said it was unrealistic to move away from Taiwan completely, the world’s most important region for advanced chip manufacturing.

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(Source)

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MediaTek T800 5G modem announced; delivers download speed of 7.9Gbps

Jeet — Fri, 11 Nov 2022 06:51:42 +0000

MediaTek has become one of the leading chipset makers for a wide range of devices, including smartphones, Chromebooks, Smart TVs, IoT devices, and more. The company also has a lineup of 5G modems to offer an alternative to leading modems like Qualcomm and Samsung’s offerings.

Now, along with a few new chips, MediaTek T800 5G modem has also been launched, which promises a speed of up to 7.9Gbps. It is a part of the newly announced MediaTek Dimensity 9200 SoC, but the company says that it can also be used for industrial IoT, M2M, and always-connected PCs.

As the name itself indicates, the newly launched MediaTek T800 is a successor to the T700. It is a fast and efficient modem with support for sub-6GHz and mmWave brands on StandAlone (SA) and Non-StandAlone (NSA) networks.

It also has support for the Dual SIM Dual Standby feature. The modem can deliver download speeds of up to 7.9Gbps and upload speeds of up to 4.2Gbps. The modem fully supports 4GPP Release-16 specification for 5G along with 4CC carrier aggregation. In comparison, Qualcomm’s Snapdragon X70 modem peaks at 10 Gbps download speeds and 3.5 Gbps upload speeds.

The MediaTek T800 5G modem is built on a power-efficient 4nm node and packs 5G UltraSave technology for optimized power consumption. It comes with support for PCIe and USB host interfaces but can be connected to the rest of the machine through other means as well. It offers a fully integrated 3GPP Release-16 5G cellular modem, FR1 Transceivers, an Envelope Tracking (ET) chip, an MLNA (Monolithic Low Noise Amplifier), a GNSS receiver, and associated PMICs.

MediaTek Kompanio 520 and 528 announced for entry-level Chromebooks

Jeet — Fri, 11 Nov 2022 06:28:52 +0000

MediaTek is one of the leading players when it comes to the choice of processors for entry-level Chromebooks. Now, the company is doubling down in this segment with the launch of two new chips — MediaTek Kompanio 520 and MediaTek Kompanio 528.

Both these new chipsets come with improved support for the display, better power management, upgraded imaging capabilities, and a few other things for the Chromebooks.

MediaTek’s Kompanio 520 and 528 chips use two ARM Cortex-A76 cores from eight total cores. The 520 has a clock speed of 2.0GHz, while the 528 has a clock speed of 2.2GHz. Along with that, the chips also come with an upgraded dual-core GPU and integrated APU for improving AI-powered performance.

Coming to the improved display support, the new MediaTek Kompanio 520 and Kompanio 528 have support for Full HD+ display with 2520 x 1080 pixels screen resolution and support to add a secondary Full HD display with 1920 x 1080 pixels screen resolution.

Both processors come with support for LPDDR4x RAM and eMMC 5.1 storage. In the camera department, there’s support for camera sensors up to 32-megapixel with 60fps FHD video recording. It also packs HiFi-5 DSP for improved microphone processing. For connectivity, there’s support for Wi-Fi 6 on both chips.

As for availability, the company has said that the first Chromebooks powered by the Kompanio 520 and 528 will start appearing from the first quarter of the year 2023.

Google’s upcoming Tensor G3 processor to reportedly be made by Samsung

Jeet — Wed, 09 Nov 2022 05:09:04 +0000

It has been only a few months since Google launched the Pixel 7 series smartphones, which come powered by the company’s own Tensor G2 processor. Now, reports about the next-generation Tensor processor are getting leaked online.

In the latest development, a report claims that the Tensor G3 processor from Google will stick to Samsung for the manufacturing of the upcoming chipset, and the processor has been codenamed Zuma.

Apart from the codename and manufacturer, some more details have also surfaced online. It is being reported that the Tensor G3 will be an offshoot of the Samsung Exynos 2300. As of now, details about the Tensor G3 processor aren’t known.

On the other hand, Samsung has already started working on its Exynos 2300 chip, even though the company will be ditching its own Exynos chips from the upcoming flagship Galaxy S23 lineup in favor of Qualcomm chips.

The report also points out that the chip codenamed Zuma may be fabricated on the more advanced 3nm process by Samsung. For comparison, the current-gen Tensor G2 is built using the 5nm node. It is also being said that Google will stick with the same modem for the upcoming Tensor processor as the one available in the current chipset.

MediaTek T830 chipset announced for routers and mobile hotspot devices

Jeet — Thu, 18 Aug 2022 01:55:17 +0000

MediaTek is among the leading chipset maker for smartphones, and the company has also expanded its portfolio to other devices, including Smart TVs and IoT products. Now, the company has launched a new chipset for routers, dubbed MediaTek T830.

The newly announced MediaTek T830 chipset is aimed at Wi-Fi routers as well mobile hotspot devices and comes with support for 5G connectivity.

The MediaTek T830 5G chip uses the company’s own M80 modem with support for the sub-6GHz band for global 5G connectivity. It has a quad-core ARM Cortex-A55 CPU which is paired with a 3GPP Release-16 cellular modem.

It also comes with a Network Processing Unit (NPU) that supports 20Gbps speed through 5G cellular to ethernet or Wi-Fi connections that too without the need for CPU involvement.

JC Hsu, Corporate Vice President and General Manager of MediaTek’s Wireless Communications Business, said, “As the leader in 5G CPE solutions, MediaTek is working with Tier-1 operators around the world to bring fast, reliable connectivity to consumers and businesses. This highly integrated platform represents the latest advancements in both 5G and Wi-Fi connectivity and enables our customers to build extremely high-performance multi-gigabit 5G CPE products in the smallest form factors possible.”

The MediaTek T830 5G chip can be paired with the company’s Filogic Wi-Fi connectivity solutions. For 5G FWA routers, the T830 can be combined with the Filogic 680 (Tri-band 4×4 Wi-Fi 7), and for 5G Mobile hotspots, the T830 can be paired with the Filogic 380 (dual-band 2×2 Wi-Fi 7). It also comes with capabilities for new Wi-Fi 7 features such as MLO (Multi-Link Operation) and support for 320MHz wide channels.