The Meizu M6 Note is scheduled for an August 23 launch. That day is important, not only to Meizu but to Samsung as they will launch the Galaxy Note 8.

The Meizu M6 Note isn’t in the same class as the Galaxy Note 8, but it will share one common feature with it, and that is dual rear cameras. A couple of days ago, an image of the M6 was posted showing the dual rear cameras of the phone. More images have surfaced today showing the shell of the phone and revealing an important detail about the cameras.

Unlike the first image that showed a working phone but with the back plate missing, this image shows just the shell without the innards. The key detail we can make out from the new leak is that the cut-out for the dual cameras will have different sizes. Unlike other manufacturers that use the same cut-out size for the two sensors, Meizu is differentiating them. Look well enough and you can see that the top camera is bigger than the lower one.

Another detail the image reveals is the position of the quad LED flash. Just like in the Meizu E2, the LEDs will be placed on the antenna line.

The Meizu M6 Note is expected to launch with a 5.5-inch 1080p display, 4GB RAM and 64GB. There is mention of a 3GB RAM + 32GB model too. The M6 Note has been said to be powered by a Helio P25 but we have also seen another version with the Helio P20.

READ MORE: Meizu’s Uninspiring 2017 Could Be For a Promising 2018

It could be as simple as saying the Helio P25 is for the 4GB RAM variant and the Helio P20 powers the 3GB RAM variant.

The rear cameras in the M6 Note are Sony IMX258 13MP sensors and there is a 4000mAh battery under the hood. Pricing is said to be ¥1599 (~$239) for the 4GB model.

(Source)

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Meizu will be launching the M6 Note on August 23 with press invite already sent out for the event which would be held at the Beijing Performing Arts Centre. Before now, we have seen the specifications of the mid-range smartphone leaked and one of the spectacular features is the presence of an Helio P25 chip (MT6757T) which is in the same mid-range segment as the Snapdragon 630 SoC. But in a surprising twist, a new leak has emerged which suggests that the Meizu M6 Note will feature a MediaTek Helio P20 processor.

The leak comes in form of a screenshot of a device which is said to be the M6 Note running through benchmark app CPU-Z. The leaked screenshot clearly lists the processor under scrutiny as the MediaTek Helio P20 chip (MT6757 with a clock speed of 2.39GHz. Both the Helio P20 and Helio P25 almost feature similar configuration but problem is, while the Helio p25 comes with support for dual cameras, the P20 does not. Recall the Meizu M6 Note is rumoured to sport a dual camera setup at the rear with one of the sensors being a Sony IMX258 sensor. Unfortunately, we can’t see the back of the device to tell if there is a dual camera setup on board or this is the M5 Note being bandied around as the upcoming M6 Note. Even at that, the M5 Note features a Heli P10 Soc and not a P20.

Read More: Meizu M6 Note Details Leaked: Helio P25, Dual Cameras Similar to Redmi Pro’s

Other specifications of the M6 Note includes a  Meizu M6 Note will feature a 5.5-inch IPS LCD display with a resolution of 1920 x 1080 pixels. The device will be powered by one of MediaTek’s latest chip, the Helio P25 (MT6757T) chip which is a 64-bit octa-core processor with Mali-T880 GPU. The processor will be backed by 3GB of RAM on some models while others will have 4GB of RAM. The storage will be either a 32GB and 64GB variant respectively while the device will get its juice from a 4,000mAh battery.We can’t explain this but the device in the leaked photo may likely not be the M6 Note.

(source)

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Earlier this year, images revealing Meizu’s product road-map for 2017 surfaced online. The images showed that most of the phones will be powered by MediaTek processors just like last year, with one or two sporting Qualcomm chipsets.

A supply chain analyst (@Cold begs) has revealed more details about Meizu’s product lineup for the rest of the year. In his Weibo post, he mentions that this year, Meizu will release 10 phones in all and most will feature the Helio P20/P25.

Either of the two chips will be in the M6 Note and the new X series. The recently released Meizu E2 is one of the phones that will have the Helio P20 SoC. Last year, most of the phones released by Meizu were powered by the Helio P10 processor. The M3 Note, M5 Note, and the U20 are examples.

READ MORE: Meizu Flyme 6 Now Available For Third Party Phone Models

He also mentions that the Meizu Pro 7 will be the flagship phone and will join the dual-camera train. The Pro 7 might be equipped with a Samsung or Qualcomm high end chip.

Meizu is one of the major Chinese manufacturers that still relies heavily on Mediatek processors and it doesn’t seem that will be changing soon. A few months ago, there was a rumor that the OEM was working with Texas Instruments to develop its own processor but we haven’t heard anything after that.

(Source)

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Alongside the Xperia XZs, XZs Premium announced at MWC 2017, Sony also released mid-range smartphones the Xperia XA1 and XA1 Ultra. The Xperia XA1 went on sale today in Hong Kong.

The XA1 is a 5-inch phone with a curved HD screen with Gorilla Glass protection, 3GB RAM and 32GB of storage.It is powered by Mediatek’s Helio P20 octa-core processor clocked at 2.3GHz. Sony has been generous with the cameras. There is a f/2.0 23MP sensor with Exmor RS on the rear and an 8MP Exmor R camera with a 23mm wide angle lens in front for selfies.

Android 7.0 Nougat comes bundled with the Xperia XA1 and it is fueled by a 2300mAh battery with Mediatek’s Pump Express+ 2.0 fast charge. There is also NFC on-board and a USB Type-C port at the bottom.

What you’d surely like about the Xperia XA1 is its nearly bezel-less sides. That design is however marred by the huge top and bottom bezels.

READ MORE: Sony Xperia L1 Budget Smartphone Unveiled: Official Images,Specs, Pricing and Availability

The XA1 is priced at HK$2,498 (¥2215/$321) and is available in White, Gold, Black, and Pink. Sony is launching the Xperia XZs in India today but there is no mention of the Xperia XA1 making an appearance.

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Mediatek announced a new chip yesterday, the Helio P25, an upgrade to last year’s Helio P20 processor. Mediatek is selling the Helio P25 as the right processor for phones with dual-cameras which is one of the selling points they used for the P20.

The new chip is built on the same 16nm process as the Helio P20 and has the same number of cores. So what’s the big difference? Should you be on the lookout for Helio P25 phones and discard your current Helio P20 phone? We’ll advice you shouldn’t.

Chip manufacturers want to make money and in other to do so, they release new chips with small improvements in performance over the old ones.

Take the Snapdragon 820 and Snapdragon 821 processor for example. The Snapdragon 821 is better but only offers a 10% increase in performance over the Snapdragon 820. There is an increase in CPU and GPU clock speed, as well as a Snapdragon VR SDK which makes it compatible with Google Daydream. Though we have seen the latter can be pushed out in form of updates. An example is the ZTE Axon 7 which uses a Snapdragon 820 chip and is Daydream compatible when you upgrade to Nougat.

The Helio P25 on the other hand is not a flagship chip but it doesn’t bring much changes either. There is an upgraded CPU clock speed (2.5GHz as against the 2.3GHz in the P20) but there is no upgrade for the GPU. The support for dual-cameras is a feature that they advertised for the Helio P20 but decided not to ‘enable’.

READ MORE: Helio X20 vs Snapdragon 625: Chips Inside the Redmi Note 4 Versions Compared

How many manufacturers will embrace the Helio P25 chip? Probably the same ones that used the Helio P20 which are Meizu (Meizu X), Elephone (Elephone P20) and UMI (Umi Plus E). There is a rumor that Meizu will launch a phone called the Meizu S in July which will sport the Helio P25 chip.

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Chipmaker MediaTek has announced another chip in its mid-level P-series. The Helio P25 it is called, and it comes as an upgrade over the previous generation Helio P20 chip. The new upgraded chip brings several new features to the table including support for dual cameras.

The MediaTek Helio P25 supports a high level of camera resolution than the P20, up to 24MP single camera sensor, or 13MP + 13MP dual camera setup. The new chip not only supports a dual-lens camera, the chip also brings onboard features such as noise reduction feature, color as well as black and white intelligent dual camera and real-time depth of field (Bokeh) effect. In addition, there is a high dynamic range (HDR) imaging support as well as a higher performance of the automatic shooter. It also brings 3A hardware engine upgrade and reduction in exposure convergence time by 30-55%.

Read More: Qualcomm & Leadcore Said To Join Forces To Make Low-End Chips: MediaTek in trouble?

The Helio P25 uses a 16nm FinFet manufacturing process and brings a reduction in the power consumption by 25% when compared to previous SoCs in the P series. On the specs, the P25 has an octa-core architecture composed of eight Cortex-A53 cores. It has a maximum clock frequency of 2.5GHz and features the same Mali-T880 MP2 GPU as the P20, clocked at 900MHz. The P25 also supports up to 6GB of LPDDR4X memory, another upgrade it has seen. It also comes with a stronger baseband chip to support LTE enhanced upload and a substantial increase in data transmission efficiency, as well as reduced power consumption and heat.

(source)

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There are indications that Sony is working on two new Xperia smartphones that might come powered by the MediaTek Helio P20 MT6757 chipset. The UAProf (User Agent Profile) specifications of both devices were recently outed by Sony giving us a vague idea of what we should expect. In case you don’t know, the UAProf specification is a set of data which captures the capability and preference information for wireless devices, including smartphones.

The devices are identified by the model numbers Sony G3112 (G31XX) and Sony G3211 (G32XX) , and even though they both are listed to have the sam processors, the display resolution is what tells us which among the two is the high-end model. One of the smartphone with model number G3112 features a display with HD resolution (1280 x 720 pixels), while the other model, which is obviously the higher one pack a display with Full HD resolution (aka 1920 x 1080 pixels).

Related: Sony’s New Bravia TV is Designed Like a Desk Photo Frame

The  Helio P20 onboard both smartphones comprise a 2.3GHz quad-core and 1.6GHz quad-core processor. There is also a Mali-T880 GPU onboard. Apart from these, there are no other details revealed on the data but the Xperia smartphones are expected to be released at MWC 2017 sporting a new name and we’ll wait to see how that pans out.

(source)

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Earlier today, Meizu took off the wraps on their new Meizu X phone. The device features a new design that comes as a welcome relief to those who have complained about the old and boring ones of their other phones.

One of the major changes you notice about the design of the Meizu X is the position of the rear camera. Meizu has always been fond of placing their rear cameras in the middle of the phone with the LED flash underneath it. The Meizu X is the first phone to deviate from that design in a long time. Its primary camera is situated in the top left corner with the LED flash flanking it on the right.

The Meizu X also ditches the polycarbonate/metal unibody design but instead has a separate metal frame that runs around it which gives it a premium look.

The back plate also appears to have a refractive design like when light passes through glass. And from the looks of it, it seems you can only see it when you are looking at the phone from a certain angle. Meizu has done a good job with the design and they deserve to be commended.

READ MORE: Meizu M5 Official with Colourful Polycarbonate  Body and 3070mAh Battery

The Meizu X has a 5.5” FHD display, a Helio P20 chip, a 12MP Sony IMX386 camera, a fingerprint scanner, and a 3200mAh battery that supports fast charging. It is available in 3GB RAM + 32GB ROM and 4GB + 64GB variants for ¥1699(~$246) and ¥1999 (~$290) respecctively.

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Meizu has just taken the wraps off the first product at its big event today, the Meizu X. Meizu’s product portfolio this year has been less than impressive, but the company aims to change that with the Meizu X. The phone comes with a totally different design seen as compared to the previous Meizu devices, which I feel is a welcome change.

We are not yet sure of the name, as ideally, Blue Charm devices have the ‘M’ Prefix and this could end up being called as the Meizu MX. But that would be confusing since there’s already an MX series, so for now, we are calling it the Meizu X. 

First up, the Meizu X model comes with 2.5D curved glass with double ceramic crystal coating process. This will make the phone look super premium, especially when it comes in four beautiful colors namely Black, Blue, Gold, and White. Meizu’s devices had started to look more or less the same in the past couple of years, so I feel this design will be welcomed by fans.

The Meizu X comes with a 5.5-inch FHD display from Sharp and uses TDDI display touch technology for better touch accuracy. Further, the phone’s display uses full Incell technology which will make sure that the panel is thin and looks great.

In the hardware department, the Meizu X doesn’t disappoint. As expected, the phone comes with the Helio P20 chipset (MT6757), which will make it the first phone from an established international manufacturer using this processor. The chip is manufactured on a 16nm process and comes with octa-core architecture with max clock speed of 2.3GHz. The chip looks promising as MediaTek has claimed that offers 40% more performance and reduces power consumption by 60%. Further, the phone supports LPDDR4X RAM memory. There’s 3GB + 32GB and 4GB + 64GB storage options. As for software, the phone will come with Android 6 with Flyme 5.2 (a future update will upgrade it to Flyme 6). The new Flyme OS is said to come with over 400 feature additions and One Mind AI Engine.

The phone comes with a 12MP Sony IMX386 sensor at the back with f/2.0 aperture, 6P lens, and PDAF. The company is also using the new ArcSoft beauty algorithm for better camera quality. Clearly, this is a level up for the camera in the budget Blue Charm series.  Up front, there is a 5MP shooter.

There’s a fingerprint sensor up front as well, which unlocks in 0.2s and supports payment platforms like Alipay and WeChat Pay. The battery onboard is decent, measuring 3200mAh and comes with mCharge which fills up the juice up to 40% in 30 minutes, thanks to 18W charging. With the efficient chip on board, the company claims that the phone will last more than a day easily. 

The Meizu X will go on sale for 1699 Yuan~ $246 (3GB + 32GB) and 1999 Yuan ~ $290 (4GB + 64GB). First sale is on December 8.

For full specs of the Meizu X, click here.

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The Meizu X will be unveiled next week and there is a chance it will be the first Meizu phone to run the new Flyme 6 OS. The unique feature of the phone is its Helio P20 processor but that doesn’t seem to be the only thing going for it, as a leaked image of the phone shows that Meizu has also paid attention to its design.

The image was posted on Weibo today and we are shocked to see that the Meizu X sports dual cameras and a rear positioned fingerprint scanner. Those who can easily spot similarities between phones will be quick to notice that it looks so much like the Honor 8.

Left to me, that’s not a bad thing. Quite a number of manufacturers copy each other’s designs and Huawei isn’t left out.

READ MORE: Meizu Pro 7 Concept Design Renders Leak

The Meizu X will launch with Mediatek’s Helio P20 processor clocked at 2.3GHz. It will also feature a Mali-T88o MP2 GPU which offers up to a 20% increase in performance over the Helio P10.

Fact: This is not the first time Meizu will use the ”X” name. Last year, they released a smart bulb called the Meizu X-Light Plus.

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Meizu is set to launch the Helio P20 powered Meizu X on Wednesday, 30th of November. A Meizu official decided to carry out a temperature test on the phone to see how hot it gets when playing games.

The results of the test were posted on Weibo by the engineer who goes by the username @dengdeng. Although its hard to make out the name of the game played during the test, thermal images show that the highest temperature recorded during the hour-long gaming session was just 37.6°C and the lowest temperature recorded was 27°c.

There is a chance the temperature might be even lower since the test was carried out at Guangzhou which is a bit warm at this time of the year.

READ MORE: Meizu Teases Release of Flyme 6 OS on November 30

The Meizu X is expected to be a bit more expensive as there is a high demand for the Helio P20 chip. Sources say it will be available in 2 variants: a 4GB RAM + 64GB ROM variant that costs 1799 yuan ($260) and a 6GB RAM + 128GB ROM variant that costs 1999 yuan ($289).

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Meizu X came out of the blues recently and we almost forgot a Pro 7 flagship is being expected from Meizu. Now, new images of the Meizu Pro 7 have popped up online reminding us of the device and revealing the possibility of the device launching alongside the Meizu X on November 30.

The Meizu Pro 7 is said to feature a curved display and that is likely to be on one version of the device because earlier rumor also hint at the existence of a flat screen version. We had earlier seen renders of the curved display but these renders also show the device from the back view. The Meizu Pro 7 features a unique ring flash at the rear, circling round the 12MP rear camera.

The Pro 7 is also rumored as coming in two versions with one sporting a 4GB RAM + 32GB ROM as well as a high-end versiom with 6GB RAM + 64GB of storage. There is a large 3,500mAh inside the device said to feature wireless charging.

Read more: Meizu Pro 7 with Curved display features in Fresh image leak

The Meizu X is confirmed to launch on November 30 just as it is almost confirmed to pack a Helio P20 chip as well as run on Flyme 6.0 OS. Perhaps Meizu will confirm via another teaser, the launch of the Pro 7 or the X may even just be the Pro 7. We can’t be so sure about that, so we’ll wait till then.

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By now everyone must have read about LeEco’s financial woes. Rumours going round presently are saying the company is having issues with unpaid contractors. Some of those contractors are chip makers, Qualcomm and Mediatek.

The source has said that LeEco’s inability to pay outstanding debts to both companies have led to a suspension of orders for Qualcomm’s Snapdragon 625 chip and Mediatek’s Helio P20 processor.

According to the source, Mediatek’s decision not to supply the Helio P20 processor has deprived LeEco of being the first manufacturer to release a phone sporting the new chip.

An insider at LeEco has however responded to the rumours, saying they have no issues with any of the chip makers and their relationships are not strained in any way. The source also said that they do not plan to launch any phone with a Snapdragon 625 chip neither do they have any Helio P20 device in the pipeline.

READ MORE: Dual Camera LeEco X850 with SD 821 and 5.7” Screen Gets Certification

In addition to the above, the source mentions that LeEco’s sales have reached 17 million units and they expect it to reach 20 million possibly before the year runs out.

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Meizu has again released another poster or press invite for its November 30 conference holding in China. This time around, the press invite contains another teaser and is captioned, “Make 6 Great Again” perhaps referring to its next Flyme 6 OS. This is coming on the heels of the “Make Helio Great Again” campaign first feature in its earlier press invite. We had also seen a teaser that suggested the Meizu X is th main smartphone for release on that day.

The latest “Make 6 Great Again” campaign likely points to the release of a new Flyme 6 operating system on that day, and probably pre-installed on the Meizu X. Recall that the Meizu X is said to be powered by a MediaTek Helio P20 chipset hence the “Make Helio Great again” mantra.

Read More: Meizu Could Release the Mystery Meizu X Flagship with Helio P20 on November 30

Fitting all the pieces together probably give us an idea of some key features of the mysterious Meizu X which include Helio P20 chip and Flyme 6 OS. The new Flyme 6 OS is said to be likely based on Android 6.0 Marshmallow instead of the latest Android 7.0 Nougat. We don’t know for sure, so we’ll wait till November 30 when all the packages would be unveiled.

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A few hours ago, Meizu officially confirmed that it will hold a launch event on November 30. While the company failed to give out a specific device name, media started to speculate that we could meet the rumored Meizu M5 Note at the event. But it looks like, Meizu could release a mystery device at the Nov. 30 event, most likely called as the Meizu X.

Recently, a couple of images showing off the box of the Meizu X popped up on the social networking website Weibo, revealing the name of the device. The leakster further said that this particular model will be announced on November 30.

Further, a screenshot has also popped up online, which shows Meizu’s VP, Li Nan kind of confirming the name of the upcoming device — Meizu X, adding that more details will be announced tomorrow.

Given that this will be a new product lineup, we can expect some great specs on board. The tagline “Make Helio Great Again” on the invite confirms that the phone will be using a new Helio chipset and there are two possible options, the Helio P20 and the Helio X30. It’s too early for Helio X30 to release in the market, which means, the Meizu X should most likely feature Helio P20 chipset.

To recap, the Helio P20 features 8 x Cortex A53 cores clocked up to 2.3GHz with Mali-T880MP2 GPU and Cat.6 LTE support with dual-carrier aggregation. Performance wise, don’t expect too much improvement, but efficiency should be better since it is built on 16nm process as compared to Helio x20’s 20nm manufacturing node.

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There are indications that the Meizu Pro 6S flagship may likely be released before the end of the year with a refreshing new design and upgraded specs. Recall Meizu VP today lent some credence to rumors that the Meizu M5 would be released on October 31. The VP Li Nan seem to be in the mood of sharing details about upcoming devices today.

The VP has also hinted via a post on Weibo that the Meizu Pro 6S flagshipwould be seeing an upgrade, perhaps released before the year to crown up its year end sales. If not, how then do we explain the teaser? The post was accompanied by a photo containing two smartphones that looks like a black variant of the Meizu Pro 6.

The statement shows an upgrade is likely coming to the Pro 6 and perhaps both in the design and a few specifications. Meizu had earlier been rumored as preparing two flagships dubbed Pro 6S and Pro 6 Plus. The Chinese company was said to be working on redesigning the looks of the devices and is looking to create a design where the antenna bands are completely hidden thus creating a more refined and unified visual effect.

Related: 3C Certification Reveals Details of Meizu Pro 6S

Some details of the expected Pro 6S had earlier appeared via its 3C certification listing and earlier rumors had given the device as coming with the Helio P20 chipset inside. An earlier rumor had also talked on an Exynos 8890-powered flagship but that has been debunked by Meizu’s VP before now.

Yet, a recently leaked benchmark appearance featuring a couple of renders (pictured) of the device had given the Pro 6S as coming with an MT 6796 chip which is a derivative of the Helio X20 thus creating some sort of confusion around the device. Not much else is known for now but we’ll be on the look out and keep you updated as always.

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An image of a certificate issued by China Compulsory Certification reveals the details of the upcoming Meizu flagship, the Pro 6S. The certificate which mentions Meizu Technology Co. Ltd as the applicant and manufacturer also lists the factory handling the production as Langfang Ultrafine Communications Technology Co., Ltd.

The certificate includes a phone with model number M570Q-S. Since the Pro 6’s model number is M570Q, this new device is most probably the Meizu Pro 6S.

The certificate also shows the charge supported by the phone: there’s 5V 2A, 8V 3A, and 12V 2A. This means the Pro 6S will also support Meizu’s mCharge 3.0 (24W) technology.

The Meizu Pro 6S is expected to launch later this month with a Mediatek Helio P20 chip clocked at 2.3GHz, a Mali T880MP2 GPU, and a 5.2 inches display.

READ MORE: Elephone Anycharger Comes with QC 2.0 and High Power Conversion

There is also another device with model number M611A which is presumed to be a new Meizu Blue Charm phone. The phone is reported to have a screen size between 4.7 and 5 inches and will run YunOS when it launches.

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Just a few weeks after the launch of the Xiaomi Mi 5s and Mi 5s Plus, pictures of a new Xiaomi phone have leaked online. The new phone which features an all-metal black body is said to be a new Redmi phone, though some say it might be the Xiaomi Mi 5c.

The front of the phone is fitted with a 2.5D glass and appears to feature the same fingerprint groove as the Mi 5s which means it may come with an ultrasonic fingerprint scanner.

The back has a dual tone black coating with the top part that houses the camera, LED flash, and the antenna; and the lower part, having a darker shade of black compared to the rest of the body. .The camera is placed at the top left corner of the phone beside the flash. The phone keeps the power button and volume rocker on the left like all the new Xiaomi phones.

One of the images leaked includes the about phone section of the phone. There’s 3GB of RAM on board, 64GB of storage, and an octa-core processor clocked at 2.2GHz. It’s also running Android Marshmallow 6.0 based on MIUI 8. The funny thing about the image is the security patch which is dated December 2015 which is pretty old. The page also lists that the phone supports VoLTE.

The images were posted on Weibo by a user whose account name translates to @jumping cute tiger with an accompanying text saying it’s a new Redmi phone with a Mediatek Helio P20 chip and 3GB of RAM priced like the Mi 5s.

The base version of the Xiaomi Mi 5s starts at 1999 Yuan ($300) and features a Snapdragon 821 processor. No one will pick a phone with a Helio P20 phone over a Snapdragon 821 phone selling at the same price. So we want to believe that price is just a wild guess.

READ MORE: Nokia D1C Ran Through Antutu

There are no details on release date yet and there are still a lot of unknown features yet, but once we have more information, we’ll update you.

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The Meizu M3 Max is a large screen phone expected to launch on September 5. The phone is expected to be Meizu’s take on the Xiaomi Mi Max.

Earlier this week, we reported that the Meizu M3 Max is going to be the first phone to launch with a Helio P20 SoC but a benchmarking result of a phone with the Meizu M3 Max name instead shows a MT6755M a.k.a. Helio P10.

While this is surprising, we want to believe that there is still a possibility of the Helio P20 chip showing up in the device. First, this benchmark result shows it was updated on August 22 which is about a week before the P20 news. There might have been a major change within a week with respect to the chip.

Another way to look at it is the fact that there are two versions coming out: a stylus-sporting unit and a base version without the mPen. It is possible that the version with the stylus may be getting the new chip. These are the reasons why we are not ruling out the possibility of the Meizu M3 Max launching with the processor. These are speculations though and we can only hope it turns out to be correct.

READ MORE: Xiaomi Mi Robot Vacuum Unboxing

The geekbench test shows the phone scoring 785 points on the single-core test and 3041 points on the multi-core test. It also indicates that the phone has 3GB of RAM.

The launch of the Meizu M3 Max is said to be in Beijing on the 5th of September.

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Meizu’s upcoming phone, the M3 Max has been revealed to be the first phone in the world to launch with Mediatek’s Helio P20 processor. The processor which was announced at MWC 2016 has support for all networks and is the first 16nm processor from the chip maker.

The Helio P20 is an octa-core processor (8 x Cortex-A53) with a maximum clock speed of 2.3GHz and a 900MHz Mali-T880 MP2 GPU. Mediatek says it offers a 20% upgrade in performance over the Helio P10.

Meizu’s alliance with Mediatek for the M3 Max appears to want to take-on the Xiaomi Mi Max which uses a Snapdragon 650/652 from Qualcomm. If you remember, Qualcomm and Meizu aren’t best of friends at the moment.

It has also been revealed that the Meizu (M3) Max will have a 64GB version with a stylus called the mPen. This new version will cost 1999 Yuan ($299) while the 32GB version which will not have a stylus will retain the 1799 Yuan ($269) price tag. We don’t know how the stylus will work as no further details have been released. So the question is if it be pressure sensitive like that of the Samsung Note series or if it will just be a regular plain stylus?

Xiaomi’s Mi Max is still well priced at 1499 Yuan ($230) for the 3GB + 32GB SD 650 version, 1699 Yuan ($260) for the 3GB + 64GB SD 652 version, and 1999 Yuan ($307) for the 4GB + 128GB version. If the M3 Max wants to take on the Mi Max, Meizu needs to offer a more competitive price.

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Qualcomm has always taken the lead in chip shipment in the Chinese mainland market, but analyst Pan Jiutang posted on his Weibo page that for the second quarter of this year Mediatek has claimed the top spot thanks to the success of the Helio series (save for the weak performance of the Helio  P20 which has  cost them OPPO and Vivo’s order) and more sales from online and offline brands.

But the increase in shipments is not being celebrated as the company’s gross margin has dropped to its lowest level (35%) in a decade. The company is still facing issues with regards to performance, process, and average selling price. They are also still dealing with supply issues which will still show up in the second half of the year.

RELATED: Mediatek’s COO Confirms Helio X30 Specs

Mediatek also needs to make sure they have a major breakthrough in the high-end market come 2017 or else that share of the market will be fully owned by Qualcomm.

The post Mediatek’s 4G Chips Shipments Increases, But It’s Not All Good News appeared first on Gizmochina.

Looks like a new smartphone will soon roll out from Coolpad because the device was spotted today on GFXBench listed as Coolpad A9S-9. That is not the big news though, the big news is that in the device, we’ll get to feel the all new, latest MediaTek Helio P20 processor announced by MediaTek early this year as the latest in the P series of its processors.

MediaTek unveiled the Helio P20 processor as a successor to last year’s Helio P10 spec and also announced that the Helio P20 should be expected in devices in the second half of 2016.

On first sight of the specs, you might confuse the P20 with the Helio X20 that uses a deca-core design, but the difference is the P20 is an octa-core product. The one listed as being on the CoolPad A9S-9 is listed as a 2.3GHz octa-core MT6757 processor which is the specs of the Helio P20.

MediaTek upgraded the frequency of the processor on the Helio P20 from 2GHz found on the Helio 10 to 2.3GHz and the graphics processing unit (GPU) from Mali-T860 MP2 700MHz to Mali-T880 MP2 900MHz. These are the two major overhauls on the P20 from P10, other aspects of the upgrade are really not obvious.

Since it packs a more powerful GPU and more frequency band, the Helio P20 is expected to offer a more seamless and faster performance than the P10, which isn’t a bad one either.

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Mediatek will be unveiling its brand new Helio P20 SoC later this year and details about the chip have already leaked out. According to the leak, the Helio P20 will be the first Mediatek chip to use TSMC’s 16nm process. Up till now, the semiconductor company used TSMC’s 28nm and 20nm processes for its mid-range and high-end chipsets. Even the world’s first deca-core CPU, Helio X20 uses a 20nm process. So, this will be the first time the company is moving forward to the much more efficient 16nm process.

Unlike previous rumors, which stated that the Helio P20 will come with a 10-core architecture, the new leak reveals an octa-core Cortex A53 design. The cores will be clocked at 2.3GHz instead of 2.0GHz on the Helio P10. The Helio P20 will support FHD 1920 x 1080 pixel resolution screens, 24MP cameras and Cat. 6 LTE networks.

Further, the image reveals that the new chip will enhance CPU performance by up to 15 percent and GPU performance up to an impressive 50 percent. Also, the power consumption will be down by 25 percent, which is logical given that the chip is manufactured using a more efficient process. This means that the chip will bring higher performance with reduced power consumption on mid-range phones launching in the coming months.

Given that rumors about the Helio X20 overheating blame TSMC’s 20nm process for the issue, it’s good to see that MTK is finally moving on to a much smaller node. Both Samsung and Qualcomm had moved to the 14nm manufacturing process for its top chipsets last year when Mediatek decided to stick with the 20nm process even for its deca-core chip.

As for the release, the image shows that the Helio P20 will be released sometime in the Q3 2016 period. So, hopefully, we will be able to see smartphones powered by this chip before the end of 2016.

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