Flow Computing, a Finnish startup, has introduced a novel chip technology with the potential to boost Central Processing Unit (CPU) performance significantly. Their Parallel Processing Unit (PPU) promises to double a CPU‘s capabilities and, with software adjustments, achieve up to 100x speed improvements – all without increasing power usage or heat generation.

PPU Promises Compatibility and Efficiency

Traditionally, CPUs handle tasks sequentially, one after another. Flow’s PPU acts as a companion chip, optimizing these tasks in real time. This allows the CPU to transition from serial processing to a parallel processing model, significantly streamlining operations. The analogy used by Flow’s CEO, Timo Valtonen, compares this shift to transforming a single-lane road into a multi-lane highway, enabling smoother traffic flow and faster processing speeds.

The PPU achieves this feat by managing tasks at incredibly short nanosecond intervals. By handling numerous processes simultaneously, it bolsters overall throughput without requiring changes to the CPU’s clock speed or underlying architecture.

While the potential benefits are undeniable, Flow acknowledges challenges in adoption. Integration of the PPU necessitates alterations at the chip design stage, potentially disrupting existing manufacturing processes.

Despite these hurdles, Flow has demonstrated the technology’s effectiveness through FPGA-based testing. Additionally, they have secured an initial €4 million in funding from venture capital firms. Currently, the company seeks industry partnerships to further develop and commercialize their solutions.

The success of Flow’s technology hinges on overcoming integration hurdles and demonstrating its effectiveness in real-world applications. If successful, the PPU could represent a major leap forward in CPU performance, impacting various sectors that rely on intensive processing power. From artificial intelligence and scientific computing to edge computing and autonomous systems, the potential applications are vast.

The tech industry will be closely watching Flow’s progress to see if their PPU technology can truly usher in a new era of high-performance, low-power CPUs.

(Via)

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Qualcomm is working on three new mid-range mobile phone processors according to Android Headlines. These processors, identified by model numbers SM4635, SM6650, and SM7635, are expected to fall under the Snapdragon 4, 6, and 7 series respectively based on Qualcomm’s naming conventions.

The Xiaomi Redmi Note 14 Pro will be the first smartphone to sport the SM7635 chipset

The code name for the SM4635 is “pitti,” while both SM6650 and SM7635 share the code name “volcano.” Earlier information from Roland Quandt in February suggests SM4635 is the Snapdragon 4 Gen 3. Back then, he mentioned the “Kalpeni” project testing a memory configuration of 6GB LPDDR4X RAM and 256GB UFS 3.1 storage for this chip. For reference, the previous generations of Snapdragon 4 series processors, the 4 Gen 1 and 4 Gen 2, used model numbers SM4375 and SM4450 respectively.

For the “volcano” processors, SM6650 and SM7635, rumors suggest Qualcomm might be following a similar strategy as with the Snapdragon 6 Gen 1 (SM6450) and 7s Gen 2 (SM7435). These two processors, codenamed “parrot,” shared similar specifications. Here, Android Headlines predicts that the SM7635 might not outperform the Snapdragon 7+ Gen 3 but will still offer significant improvements, strengthening Qualcomm’s position in the mid-range SoC market. The Xiaomi Redmi Note 14 Pro is rumored to be one of the first devices equipped with this processor. While specific details about these processors remain unknown, we can expect more information to surface in the near future.

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AMD just unveiled a game-changer for industrial AI: the Ryzen 8000 series embedded processors. These processors are the first to integrate a Neural Processing Unit (NPU) built on AMD’s XDNA architecture, specifically designed to handle demanding workloads in industrial Artificial Intelligence applications.

The Ryzen 8000 uses Zen 4 CPU, RDNA 3 GPU and a new XDNA Neural Processing Unit.

The Ryzen 8000 series boasts impressive specs. Built on a cutting-edge 4nm process, it combines Zen 4 CPU architecture, RDNA 3 architecture GPU, and the all-new XDNA architecture NPU. This powerhouse delivers a staggering 39 TOPS of AI computing power, with the NPU itself contributing a significant 16 TOPS.

But muscle doesn’t stop at AI. The Ryzen 8000 series packs additional features; 20 lanes of high-speed PCIe Gen 4 connectivity ensures efficient data transfer, and support for dual-channel DDR5 5600 memory with error correction (ECC) keeps things running smoothly. The machines can drive stunning visuals with the ability to power four independent 4K displays. Hardware decoding and encoding for popular video codecs like AV1, H.264, and H.265 makes video processing a breeze.

To cater to diverse needs, the Ryzen 8000 series comes in four distinct models. To foster a strong ecosystem around these processors, AMD is collaborating with embedded Original Design Manufacturer (ODM) partners like Advantech, ASRock, and iBASE. With AI becoming more and more mainstream, research is picking up big-time. That’s why companies like Nvidia and AMD are manufacturing newer AI chips for bigger-scale research.

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While China is a global tech manufacturing leader, domestic processor development lags behind some competitors, particularly the US. However, China is actively closing the gap, with recent advancements like Zhaoxin’s 8-core Kaixian KX-7000 processor demonstrating progress. Here are the details…

Zhaoxin KX-7000 Benchmarks Reveal Performance Boost for Chinese Processor

It has been eight years since Zhaoxin, a company focused on developing domestic X86 processors, introduced its first product, the ZX-C+. The company’s greatest success has been its continued hard work since that time, refusing to rest on its laurels. These efforts have apparently paid off. The domestically produced Zhaoxin KX-7000 processor appeared on Geekbench, demonstrating twice the performance of its predecessor, the KX-U6780A.

In the Geekbench 6 test, the Zhaoxin Kaixian KX-7000 scored 824 in single-core and 3813 in multi-core performance. According to the test details, the KX-7000 processor utilizes the KX700M motherboard and features an 8-core design. It has a base frequency of 2.99GHz, 4MB of L2 cache, and 32MB of L3 cache. The test was conducted on Windows 11 Pro in balanced power mode, and the processor reached a maximum operating frequency of 3293MHz.

At first glance, the processor’s score might seem comparable to an 8th-generation i5, which could appear underwhelming. Especially considering Intel’s release of 8th-generation processors in August 2017. However, remember that Intel debuted its first processor in 1971, while Zhaoxin began in 2013. In this context, a seven-year difference highlights substantial progress.

Geekbench 6 scores on the Linux system show the previous-generation KX-U6780A processor achieved a single-core score of 344 and a multi-core score of 1873. The new KX-7000 offers 2.4 times the single-core performance and double the multi-core performance. Zhaoxin attributes this to the KX-7000’s “Century Avenue” microarchitecture and improved Chiplet design. The KX-7000 also features faster graphics and upgraded I/O interfaces like DDR5, PCIe 4.0, and USB4. Still, the company has a long way to go

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Gamers and Intel fanboys have an extra reason to celebrate today. Intel has unveiled the i9-14900KS, the crown jewel of their 14th generation desktop processor family. This unlocked beast came through the gate swinging, boasting a record-breaking turbo frequency of up to 6.2 GHz. It’s not just setting new records, it’s pushing the boundaries of desktop performance. The launch date of the processor was previously revealed in a report by VideoCardz.

The CPU supports up to 192GB of DDR5 memory & is compatible with Z790 and Z690 motherboards.

“This processor showcases the raw power of our 14th Gen lineup,” says Intel’s Roger Chandler. “Gamers and creators can expect a whole new level of performance, taking their experiences to the next level.”

The i9-14900KS packs a serious punch with 24 cores (8 performance-oriented and 16 efficiency cores), 32 threads, and 36MB of Intel Smart Cache. Official benchmarks claim a 15% gaming performance leap over the previous generation, while content creators will enjoy significant efficiency gains in demanding workflows like 3D rendering.

The i9-14900KS boasts a flagship set of features: a record-breaking 6.2 GHz turbo frequency fueled by Thermal Velocity Boost technology, 24 cores, 32 threads, 150W base power, 36MB Intel Smart Cache, and 20 PCIe lanes (including 16 PCIe 5.0 lanes). Gamers can expect an extra edge with Intel Gaming Optimizer (APO), delivering up to an 11% performance boost in supported titles (currently 14 games). Additionally, it supports up to 192GB of DDR5 memory and is compatible with Z790 and Z690 motherboards.

The i9-14900KS will be priced at $689, and it will be available for purchase boxed at retailers or pre-integrated into high-end systems from Intel and its partners.

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Intel has officially launched its latest Intel Core 14th Generation desktop processor family, with the flagship Intel Core i9-14900K leading the pack. This new lineup features six unlocked desktop processors, delivering up to 24 cores, 32 threads, and an impressive frequency of up to 6 GHz straight out of the box.

The i9-14900K has laid claim to the title of the world’s fastest desktop processor, providing gamers with a substantial edge through its 6 GHz speeds from the start. For creators, the Intel Core i7-14700K offers 20 cores and 28 threads, a 25% increase over its predecessor, ensuring significant performance gains in multi-threaded workloads.

Intel introduces the new AI Assist feature in its Extreme Tuning Utility (XTU), offering one-click AI-guided overclocking for select unlocked Intel Core 14th Gen desktop processors. This feature brings simplicity to the overclocking experience, catering to both experts and beginners.

The Intel Core 14th Gen processors leverage Intel’s advanced performance hybrid architecture, prioritizing compute performance for day-to-day workflows. The lineup promises an immersive gaming experience, delivering up to a 23% performance uplift compared to “leading competitor processors”. Enhanced gaming-focused features, including Intel Application Optimization (APO) and Thread Director application thread scheduling, aim to improve application threading. Moreover, these processors support DDR5 XMP speeds well beyond 8,000 megatransfers/second (MT/S).

Intel’s latest desktop processor family comes equipped with integrated support for Wi-Fi 6/6E and Bluetooth 5.3, as well as discrete support for new Wi-Fi 7 and Bluetooth 5.4 wireless technologies. The processors maintain compatibility with both Intel 600 and 700 series chipsets, allowing enthusiasts to easily upgrade existing systems and enjoy the latest-generation gaming and creator performance.

The Intel Core 14th Gen desktop processors are set to hit retail outlets and OEM partner systems starting October 17, 2023.

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Intel is at it again. Not long after the launch of the Core i9-13900KS that stunned with its 6GHz speed, the tech giant has unveiled its 14th-gen desktop CPUs, led by the i9-14900K. The new chip is also capable of hitting the 6GHz mark, thanks to its “Thermal Velocity Boost.” But is this raw power just for show or does it serve a real purpose?

The chip also consumes 253 watts of power, which is a lot

It’s easy to get lured by the flashy 6GHz number, but the i9-14900K’s high speed only lasts for short bursts. These chips may have the upper hand in the Intel vs. AMD performance race, but they’re not for everyone. Intel claims that its 14900K chip is up to 23% faster than AMD’s Ryzen 9 7950X3D when playing games like Starfield in 1080p. It’s worth noting that the comparisons could be skewed, as Intel’s benchmarks involved tasks that work better with its own UHD graphics. This chip guzzles power like it’s going out of style—253 watts, to be exact. That’s not exactly what you’d call efficient.

And speaking of AMD, Intel’s got its rival in the crosshairs. The company claims its flagship chip is up to 23% faster than AMD’s Ryzen 9 7950X3D in gaming benchmarks. But let’s take that with a grain of salt. The tests favored Intel’s own graphics tech, so is it a fair fight? Jury’s still out.

But hey, if the i9-14900K is too rich for your blood at $589, there’s always the more budget-friendly i7-14700K. It’s got a cool 20 cores and tops out at 5.6GHz for a much more palatable $409. Now that’s a deal.

Here’s something intriguing, though. Intel’s throwing in some AI help for the overclocking crowd. Their new XTU AI Assist feature makes it simpler to push your CPU to the edge without frying it. Cool, right? But don’t look for an NPU (neural processing unit) for AI tasks in these new desktop chips; that’s reserved for Intel’s upcoming mobile line-up.

Is Intel’s 14th-gen desktop CPU line-up really the next big thing, or is it just a flashy way to outdo AMD? Bottom line: these chips are powerhouses, no doubt. But unless you’ve got specific, demanding needs (or just love to brag), the i7-14700K might be the more sensible pick. The new CPUs drop on October 17th, but maybe give it a good think before you grab your wallet.

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The Android smartphone processor market has been largely dominated by two brands throughout its entire history, namely Qualcomm and MediaTek. Qualcomm has its Snapdragon chipsets to power Android smartphones, whereas MediaTek provides Android smartphones with its 5G-powered Dimensity chipsets. The Dimensity lineup has proven to be reasonably reliable over the past 3 years because all MediaTek Dimensity processors were manufactured by TSMC’s power-efficient and industry-leading technology.

However, in 2023, MediaTek decided to silently rebrand its Dimensity SoC lineup, which has led to much confusion as to which MediaTek chipset is better, and which processors are a big mistake.

Well in this article today, we will be dissecting and diving into MediaTek’s new naming scheme to inform our readers about which MediaTek processors are worth your attention and give the most bang for buck money can buy. To simplify matters, we’ve separated all Dimensity processors into 3 tiers (Tier A, Tier B, and Tier C), with Tier C being the worst ranked processors, and Tier A being the best ranked processors.

Tier C: Low-Performance Processors
Starting off with Tier C, there are 11 MediaTek Dimensity processors and they are ranked from worst to best in Table 1 below.

As you can see, all the newly rebranded Dimensity 6000 and 7000 series are ranked within Tier C. This is because Tier C chipsets have a very important characteristic that defines them, an octa-core CPU structure with only 2 Performance Cores and 6 Efficiency Cores. With fewer performance cores, the processors cannot run games at higher graphical settings, or tasks on the device may run at slower speeds. 

Generally, Tier C processors have benchmark scores from around 380k to 550k in Antutu, with one exception being the Dimensity 7200 which has achieved an Antutu score of nearly 740k. The reason could be that the processor is manufactured on TSMC’s newer 4nm process whilst also featuring the newer ARM Cortex A715 performance cores to provide more performance at the same power level as the A78 and A76.

Another interesting thing to note is the Dimensity 6080 (formerly known as the Dimensity 810). The Dimensity 6080 processor can be found in the recently-announced Redmi Note 13 this week, however, the same processor could also be found in the Redmi Note 11 (known globally as the Poco M4 Pro 5G) launched almost two years ago in 2021 back in China market. This means that your brand new 2023 budget Android smartphone could be using a budget processor that is almost 2 years old today, and yet the device is selling at a price which is brand new.

To wrap up, most Tier C processors have generally the same slower performance and do not have a high price-to-performance ratio (with a possible exception to the Dimensity 7200). If possible, look for Android smartphones with Tier B or Tier A processors instead.

Tier B: Upper Mid-Range Processors

Tier B is where the processors are fast and smooth enough for everyday tasks whilst still being able to game comfortably on medium graphical settings in your favourite games. There are 4 MediaTek Dimensity processors in this tier and they are listed from worst to best in Table 2 below.

One defining characteristic of Tier B processors is that they use an octa-core SoC structure, with 4 performance cores and 4 efficiency cores. With a balanced (4+4) setup, the SoC is able to handle high-performance tasks more smoothly, whereas for low-demand tasks, the efficiency cores can step up for lower power draw.

Tier B processors have garnered much praise for balancing their performance with their affordability, as these processors are found in budget flagship smartphones like the OnePlus Nord 2T and Xiaomi 11T. 

Tier A: Flagship Processors

Tier A includes MediaTek’s best processors in the Dimensity lineup, as they not only provide great performance, but great power efficiency as well for the smartphones they’re in!

Tier A includes 5 Dimensity processors, and they are listed below in Table 3.

Despite sporting the same processor structure (4+4) as Tier B processors, Tier A processors have one major advantage, which is that Tier A processors are manufactured on TSMC’s more advanced 5nm and 4nm process nodes. This improvement alone managed to boost performance by up to almost 20% whilst keeping power draw low to ensure that the device doesn’t overheat. The GPUs used by Tier A processors are also much more performant, allowing users to game at high or ultra-high graphical settings, which is unachievable on Tier B and C processors.

Tier A processors can be found in devices such as the affordable Redmi K50i, Poco X4 GT and OnePlus 10R, to the flagships such as the Vivo X90, Redmi K60 Ultra, and the upcoming Xiaomi 13T Pro. 

In conclusion, purchasing a smartphone with a Tier A MediaTek Dimensity processor is the best decision one can make to make their smartphone performance last long-term without much slowdown.

If you would like more content like this on Gizmochina.com about simplifying how to pick the best processor for your smartphone, feel free to let us know in the comments below!

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Qualcomm has announced a new lineup of chips — Qualcomm Snapdragon G-series, which is focused on handheld gaming devices. In the lineup, the company has unveiled three chips — Snapdragon G1 Gen 1, Snapdragon G2 Gen 1, and Snapdragon G3x Gen 2.

These three new processors from the company are intended to work with different form factors and handle specific gaming needs. They differ from each other in terms of power and performance.

Qualcomm Snapdragon G3x Gen 2

This is the flagship offering from the company and is a successor to the Snapdragon G3x Gen 1, which is powering the Razer Edge 5G. It is claimed to offer 30 percent faster CPU performance and twice the GPU performance than its predecessor. The chipset comes with Qualcomm Kryo octa-core CPU and Adreno A32 GPU.

It also supports hardware-accelerated ray tracing as well as game super-resolution, and XR glass tethering. It comes with support for low-latency premium Bluetooth audio and Snapdragon Sound Technology Suite. There’s also Wi-Fi 7 High-Band Simultaneous (HBS) as well as 5G sub-6 and mWaveray tracing.

Qualcomm Snapdragon G2 Gen 1

It has a Qualcomm Kryo octa-core CPU and a gaming-optimized Adreno A21 GPU along with a Snapdragon X62 5G Modem-RF System and 5G and Wi-Fi 6/6E connectivity via Qualcomm FastConnect 6700 Mobile Connectivity System. This chip sits between the G3x Gen 2 and the G1x Gen 1 and is claimed to be capable of full-featured mobile and cloud gaming.

Qualcomm Snapdragon G1 Gen 1

This is the base version in the lineup, offering Qualcomm Kryo octa-core CPU and Areno A11 graphics processor. The company has said that it is a designed for fanless gaming handhelds and is mostly intended to power devices for cloud streaming.

As of now, there’s no information about when devices powered by these chips will hit the market, but the company has revealed that several brands are already collaborating for handheld gaming devices powered by the Snapdragon G-series platforms, including AyaNeo, Thundercomm, and more.

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Exciting news has emerged from Intel, as reports indicate that the tech giant is gearing up to release the highly anticipated Granite Rapids-D peripheral chip in 2024. According to foreign technology media Computer Base, the chip will utilize the cutting-edge Intel Process 3, promising a significant leap in performance and capabilities.

The Granite Rapids-D Chip may be delayed until 2025

Leaked PPT slides of the Granite Rapids-D peripheral chip have provided a sneak peek into what we can expect. These slides reveal that the new chip will serve as the successor to the Xeon D-1700 and D-2700 (Ice Lake-D) models. Leveraging the power of the Intel 3 process, the Granite Rapids-D chip boasts a higher core density compared to its predecessors, promising enhanced processing capabilities and improved efficiency.

While specifics regarding the release date of the new Xeon-D chip (Granite Rapids-D) remain uncertain, reports suggest that Intel plans to launch the Granite Rapids-AP and Granite Rapids-SP server processors by the end of 2024. This leads to speculation that the release of the Granite Rapids-D chip may potentially be delayed until 2025. However, Intel’s commitment to delivering cutting-edge technology ensures that enthusiasts and professionals alike can expect an exceptional product whenever it becomes available.

The Granite Rapids-D chip holds immense promise for a range of applications, from high-performance computing to enterprise-level data centers. With its advanced architecture and increased core density, this chip is poised to revolutionize the computing landscape, delivering faster processing speeds, improved multitasking capabilities, and heightened energy efficiency.

Intel’s continuous innovation and dedication to pushing the boundaries of technology have solidified its position as a leader in the industry. The upcoming Granite Rapids-D chip serves as a testament to Intel’s commitment to delivering groundbreaking solutions that meet the ever-evolving demands of the market.

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It’s been a few years since Apple started using its own Apple Silicon chips for its Mac devices and so far, the company has launched M1- and M2-series of chips in the market.

Now, the Cupertino-based technology giant is working on the third generation of Apple Silicon chips, and as per the latest reports, the Apple M3 Pro chipset could come with 12 CPU cores.

As per the report from Mark Gurman in the Power On newsletter, App Store developer logs show the chip running on an unannounced MacBook Pro laptop with the macOS 14 operating system. He further adds that the chipset is likely the base version of the M3 Pro and is expected to go official next year.

If the reports are to be believed, then the Apple M3-series chips will be manufactured using the 3nm node process from TSMC. For the 12 cores, much higher than the 8-core CPU in M1 Pro, the report indicates that the company is evenly splitting them between high-performance cores and efficiency cores.

Before we see the M3 Pro, there will be a couple of devices powered by the standard M3 chipset. This means that it’s likely that Apple will launch M3-powered Mac devices by the end of this year or early next year, followed by a couple of devices running the M3 Pro chip.

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Samsung has a lineup of its own mobile processors under the Exynos brand. The top-end offering in the lineup is usually powering the flagship smartphones from the brand, along with the Qualcomm Snapdragon chips.

But this time, Samsung decided to skip the Exynos version of the flagship smartphones, and thus, the Galaxy S23 series comes powered by the Qualcomm Snapdragon 8 Gen 2 SoC in all regions.

While it was speculated that the company may be done with the flagship chipset of its own, given the disappointing reasons for the Exynos 2200, it appears that isn’t the case.

As per the latest information, the South Korean technology giant is working on the Samsung Exynos 2500 SoC, which will feature a self-made GPU based on AMD’s technology. However, the specification of the chip remains unknown at this time.

Previously, Samsung was rumored to be working on a custom graphics processor, and this is likely to be the case as the company would take advantage of the license agreement with AMD, which was recently renewed. It remains to be seen if Samsung is looking to ditch Qualcomm in the longer run and rely only on its own chips.

Although the development sounds exciting, it will take some time, at least a couple of years, before the Samsung Exynos 2500 SoC becomes official. There’s a possibility that the chipset may be manufactured using a second-generation 3nm process if everything goes as per the plans and Samsung starts 3nm production next year.

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Taiwan Semiconductor Manufacturing Company, popularly known as TSMC, is setting up a new production plan in Arizona, United States at a cost of around $12 billion.

The plant was originally planned to manufacture 5nm chips but recently it was revealed that the plant will be making 4nm chips. Now, a new report from Taiwanese media claims that the production of 4nm chips in the Arizona plant could start next year.

According to the report from Economic Daily, TSMC’s new plant in Arizona will start producing 4nm chips from 2024. The report further adds that Qualcomm’s Global Senior Vice President and Chief Operating Officer Chen Ruowen said that Qualcomm will be the first customer of TSMC’s US plant’s 4nm chips.

It was earlier reported that AMD and NVIDIA were among the companies that urged TSMC to start making 4nm chips in the US. The development comes at a time when companies are now planning to source chips manufactured in the United States. Further, this new plant should also allow a whole host of new companies and jobs to appear in support of the manufacturing facility.

Apart from Qualcomm, Apple, AMD, and NVIDIA are also expected to place a large order for the chips manufactured by TSMC in the Arizona facility. In the second phase of the upgrade at the Arizona plant, TSMC will upgrade the facility to produce more advanced 3nm chips, which is likely to happen around 2026.

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Samsung is one of the largest companies in the world. While most of us are familiar with their popular consumer electronics products such as smartphones, the South Korean technology giant operates in many other areas. One of these areas is the production of processors. Samsung produces processors for various developers, including Qualcomm. Unfortunately, it appears that there are some issues in this area. Here are the details…

Samsung loses manufacturing contract for one more Qualcomm chip

Samsung has suffered another blow in its contract chip manufacturing business. Qualcomm has chosen to manufacture its latest processor, the Snapdragon 7+ Gen 1, using TSMC’s 4nm process instead of Samsung Foundry’s 4nm LPE process. This decision comes as no surprise as Samsung Foundry has been facing efficiency and yield issues in recent years.

TSMC’s 4nm process has proven to be more efficient, which means that the Snapdragon 7+ Gen 1 will be more power efficient than its predecessor. The processor is set to be unveiled at Qualcomm’s launch event on March 17, 2023, and is expected to bring faster performance and efficiency.

The chip features one Cortex-X2 CPU core clocked at 2.92GHz, three Cortex-A710 CPU cores clocked at 2.5GHz, and four Cortex-A510 CPU cores running at a maximum frequency of 1.8GHz. It also features the Adreno 725 GPU clocked at 580MHz. The chip is an underclocked version of the popular Snapdragon 8+ Gen 1 processor and is the first time a Cortex-X series CPU is used in a Snapdragon 7 series chip.

Leaked benchmarks reveal that the Snapdragon 7+ Gen 1 scores 1,232 points in Geekbench’s single-core CPU test and 4,095 points in the multi-core CPU test. This is almost as good as the MediaTek Dimensity 9000, which was close to the Snapdragon 8 Gen 1. The new chip is expected to make premium mid-range phones as fast as last year’s flagship phones.

While Samsung’s 4nm and 5nm nodes have faced issues, rumors suggest that its 3nm GAA is much better and could be superior to TSMC’s 3nm process. Some rumors also claim that the Snapdragon 8 Gen 3 will use Samsung Foundry’s 3nm GAA, but this claim should be taken with a grain of salt.

The loss of the manufacturing contract for the Snapdragon 7+ Gen 1 is a significant setback for Samsung’s contract chip manufacturing business. However, the company still has its 3nm GAA process, which could potentially attract future clients. Samsung will need to work on improving its processes and addressing the efficiency and yield issues it has faced to remain competitive in the contract chip manufacturing market.

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(via)

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Last year Galaxy S21 FE failed to make a significant impact in the market. However, recent rumours suggest that Samsung has not given up on its FE lineup just yet, and the Galaxy S23 FE may be in the works, with Twitter leaker OreXDA providing some juicy details.

According to OreXDA, the Galaxy S23 FE will run on the Snapdragon 8+ Gen 1 chipset, last year’s model, to “adjust the unit price.” While this may seem like a step back, the Snapdragon 8+ Gen 1 is still a high-end chip and should offer a flagship-tier experience even a year after its launch. The use of an older chip also allows OEMs to purchase it at a lower price, which could make the Galaxy S23 FE more affordable for consumers.

In addition to the chipset, it is expected that the Galaxy S23 FE will feature a 120 Hz AMOLED screen and some, if not all, of the Galaxy S23 series’ camera sensors. While it is still too early to make any concrete assumptions, these leaks offer a glimpse into what Samsung may have in store for its FE lineup.

The fate of Samsung‘s FE lineup has been uncertain, but the return of the Galaxy S23 FE with a high-end chip from Qualcomm may signal a renewed commitment from the tech giant to its budget-friendly offerings. OreXDA has been a reliable source of leaks in the past, so there may be some truth to these speculations.

If the Galaxy S23 FE does make its way to the market in Q3 or Q4, it will face stiff competition from other mid-range offerings from rival brands. Still, Samsung’s brand recognition and loyal fan base may give it an edge. Only time will tell if the Galaxy S23 FE will be a hit or a miss, but for now, fans of Samsung’s FE lineup can rest assured that it is not dead just yet.

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(Source)

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MediaTek has been expanding its lineup of chipsets, and in line with that, the Taiwan-based company has today announced a new Dimensity series chipset, dubbed MediaTek Dimensity 7200.

The newly announced chipset is a mid-range offering from the company and comes with a focus on gaming and photography, two of the most sought-after features by users.

The MediaTek Dimensity 7200 SoC is built by Taiwan Semiconductor Manufacturing Company (TSMC) using the N4P process, which is the same used in the Dimensity 9200 series as an improvement over the Dimensity 9000.

It features two Cortex-A715 cores with a high frequency of 2.8GHz and six Cortex-A510 cores. There’s also Mali G610 MC4 GPU for handling visuals on the device. It supports a Full HD display of up to 144Hz along with HDR10+, CUVA HDR, and Dolby HDR.

There’s MediaTek HyperEngine 5.0, which allows for AI-based Variable Rate Shading and has UFS 3.1 storage for faster loading and RAM running at up to 6,400Mbps (LPDDR5). For optics, the chipset uses a 14-bit HDR ISP with support for 4K HDR video capture and also supports a main camera of up to 200MP and is capable of taking in two video streams of Full HD resolution each.

It also has APU, allowing for a number of AI-powered camera enhancements, such as Real-Time Portrait Beautification. The chipset also supports 5G sub-6GHz with up to 4.7Gbps downlink, along with 2CC Carrier Aggregation, Dual SIM 5G, triband Wi-Fi 6E, and Bluetooth 5.3.

MediaTek Dimensity 7200 will be available in smartphones launching in the first quarter of this year, but none of the smartphone brands have announced anything related to this. We will have to wait for a couple of more weeks for an announcement from brands about a smartphone powered by this new processor.

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Intel had recently launched its 13th generation Core processors and today, the company has announced a new top-end model in the lineup, dubbed Intel Core i9-13900KS.

It is touted to be the fastest desktop processor to date, with a clock speed of 6.0GHz without overclocking. It is now available for purchase for the price of $699.

The Intel Core i9-13900KS is based on the 13900K chip, which peaked at 5.8GHz turbo frequency. The newly released 13900KS reaches 6GHz without overclocking using Intel’s Thermal Velocity Boost technology. It does it by using more electricity, using 250 watts at the max turbo power instead of the regular 150 watts, and peaks at 320W in a new Extreme Power Delivery Profile.

Apart from the power consumption and turbo frequencies, the Intel Core i9-13900KS is almost similar to the 13900K. The base frequency for the performance core has been increased to 3.2GHz from 3GHz. It comes with 24 cores, which include eight performance cores and 16 efficiency cores.

There are 32 threads, 36MB of Intel Smart Cache, and 20 PCIe lanes, including 16 PCIe 5 and four PCIe 4 lanes. As for compatibility, the Z790 and Z690 motherboards will support this new 13900KS chip with a BIOS update.

The launch of this Intel Core i9-13900KS flagship desktop chipset comes just weeks before AMD is all set to launch the Ryzen 7000 X3D CPUs. AMD has claimed that its flagship Ryzen 9 7950X3D chip will be the ultimate processor for gamers and creators, promising up to 25 percent better performance.

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MediaTek, one of the leading smartphone chips manufacturer, has announced its new MediaTek Genio 700 IoT chip at the Consumer Electronics Show (CES) 2023.

The MediaTek Genio 700 is an octa-core processor which the company says is designed for smart home, smart retail, and industrial IoT products and is focused on power efficiency.

It is manufactured using the N6 (6nm) process and has two ARM Cortex-A78 cores running at 2.2GHz, along with six ARM Cortex A-55 cores running at 2.0GHz while providing 4.0 TOPs AI accelerator.

The chips also come with support for dual displays, as well as an ISP for better images. The company says that it allows makers to customize products using Yocto Linux, Ubuntu, and Android, allowing customers to easily develop their own products with a minimal amount of effort, regardless of application type.

It supports high-speed interfaces, including PCIe 2.0, USB 3.2 Gen1, and MIPI-CSI interface for the camera. Along with dual display support (Full HD at 60Hz and 4K at 60Hz), it also comes with AV1, VP9, H.265, and H.264 (video decode) support. It has ARM SystemReady certification for providing a standard and easy way to integrate the platform and ARM PSA certification for increased security.

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Taiwan Semiconductor Manufacturing Company, aka TSMC, which is the world’s largest foundry, is all set to start the mass production of its 3nm chips this week.

Apple, which is among the top customers for the Taiwan-based company, will be the primary customer for the chips manufactured using this new process and will be a part of the tech giant’s M2 lineup.

As per the report, TSMC will start mass production of 3nm chips on 29th December, Thursday, which is in line with the previous reports, which indicated that the company could start mass production of the 3nm node process by the end of the year.

It is said that TSMC will hold a ceremony at Fab 18 at the Southern Taiwan Science Park (STSP) on December 29 to mark the start of commercial production of chips using 3nm process technology. It will also detail plans to expand 3nm chip production at the fab, according to sources at semiconductor equipment companies.

For Apple, before the A17 Bionic chip for the upcoming iPhone 15 and iPhone 15 Ultra models, the Cupertino-based company is expected to place orders for the 3nm M2 Pro chip, which will be powering the upcoming MacBook Pro and the Mini Mini. Both these chips, A17 Bionic and M2 Pro, are expected to ship later next year.

Samsung is also able to mass produce 3nm chips using Gate-All-Around (GAA) transistors, allowing more precise control of current flow through each transistor and improved power efficiency. TSMC will be using FinFET transistors for the 3nm node but will adopt GAA transistors for the 2nm chips, which is likely to happen in 2025.

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Samsung has been making Google’s Tensor chips, and now it appears that the South Korean technology giant has increased involvement with Google and will be working on making a new chipset for its upcoming flagship smartphones.

As per the new report from tipster Connor, Samsung is working with Google’s Tensor team and AMD’s graphics team to create a new chipset that will be powering the Samsung Galaxy S-series flagship smartphones, most likely from 2025.

It is being said that the chipset will consist of two high-performance Cortex-X cores, four performance-focused cores running at a lower clock speed, and four energy-efficient cores. The diagram shared indicates that AMD GPU will be included in the chipset for processing grahpic-intensive tasks.

Google and Samsung have already teamed up to produce Google Tensor chips for the Pixel series smartphones. The Tensor and Tensor G2 chips powering the Pixel 6 and the Pixel 7 series smartphones are manufactured by Samsung. They are basically Exynos chips but with AI features on top from Google’s team.

Recent reports indicate that both these companies have already started working on the third-generation Google Tensor SoC, which will be debuting with the Pixel 8 series smartphones next year. The chip is reportedly codenamed “Ripcurrent” and carries model number S5P9865.

Most of the chips for smartphones nowadays are manufactured using the 5nm or 4nm process, but since this new chipset for the future Galaxy S-series phones is expected to go official a couple of years from now, it could be manufactured using a more advanced 3nm process and there’s a high possibility of that happening given that Samsung has already started working on 3nm chips.

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Soon after announcing the Snapdragon 8 Gen 2 flagship smartphone processor, Qualcomm has taken the wraps off yet another chipset, dubbed Qualcomm Snapdragon AR2 Gen 1, which is built for Augmented Reality devices.

The new chip is a part of Qualcomm’s Extended Reality (XR) offerings and is claimed to deliver “groundbreaking AR technology that will unlock a new generation of sleek, highly capable glasses.”

With this new chipset, which is built from the groups up, the company is aiming to revolutionize the head-worn glass form factor and usher in a new era of spatial computing experiences for the real-world/metaverse mix.

It is built on a multi-chip distributed processing architecture combined with customized IP blocks. The company says that the new platform delivers 2.5x better AI performance than the Snapdragon XR2 Gen 1 and consumes 50% less power, making it ideal for AR glasses that consume less than 1W power.

The chipset consists of an AR processor, an AR co-processor, and a connectivity platform. The AR processor is optimized for low motion-to-photon latency while supporting up to nine concurrent cameras for the user and environmental understanding. The AR co-processor aggregates data from connected cameras and sensors, enabling features like eye tracking and iris authentication for foveated rendering.

As for connectivity, the chip uses the FastConnect 7800 system and brings support for the latest Wi-Fi 7 technology with less than 2ms latency between the AR glasses and the smartphone or host device. It is also capable of offloading complex tasks to Snapdragon-powered smartphones, PCs, or other compatible host devices to reduce latency and offer a smoother visual experience.

Qualcomm says it is working with several OEMs, including Lenovo, LG, Oppo, TCL, Xiaomi, Pico, QONOQ, Rokid, Sharp, Tencent, and Vuzix, among others, to bring a new generation of AR smart glasses featuring the Snapdragon AR2 to the market. As of now, details about the availability of any AR devices from these brands aren’t known, but we expect to know more in the coming months.

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Qualcomm, one of the leading smartphone chipset makers, has today officially announced its next-generation Snapdragon series flagship processor for high-end smartphones — Qualcomm Snapdragon 8 Gen 2.

As the name itself indicates, the newly announced Qualcomm Snapdragon 8 Gen 2 is a successor to the last year’s Snapdragon 8 Gen 1 processor, and it comes with a focus on better and more efficient performance, especially when it comes to AI-related tasks.

The Kryo CPU on the Snapdragon 8 Gen 2 includes one prime core based on the ARM Cortex-X3 clocked at 3.2GHz, as well as four performance cores at 2.8GHz and three efficiency cores at 2.0GHz. Compared to last year’s chipset, these are 200MHz to 300MHz faster. The company says the CPU is 35 percent faster than the previous generation and 40 percent more power efficient.

Its latest Adreno GPU is claimed to offer 25 percent higher performance while being 45 percent more power efficient. It also brings support for hardware-accelerated ray tracing to the Snapdragon platform. There’s support for faster memory technologies, including LP-DDR5X RAM at up to 4,200MHz and new UFS 4.0 storage.

Similar to the SD8 Gen 1, the newly announced Qualcomm Snapdragon 8 Gen 2 is built using a 4nm process. As for the display, the chipset comes with support for QHD+ resolution at up to 144Hz or 4K resolution at 60Hz. It also supports external displays up to 4K resolution at 60Hz with a 10-bit Rec. 2020 color gamut, HDR10+, and Dolby Vision.

Coming to the camera department, it has a triple 18-bit ISP that supports up to three 36MP cameras simultaneously or up to 200MP for a single-camera configuration. It also supports 108MP camera sensors with zero shutter lag. The company has also improved support for the latest Sony and Samsung sensors as Sony sensors with DOL-HDR and Samsung’s 200MP HP3 sensors are optimized to work with the ISP on the Snapdragon 8 Gen 2.

Qualcomm says it has made improvements throughout the Hexagon processor for up to 4.35x faster Artificial Intelligence (AI) performance and claims that the chip can handle more complex tasks, like translating a language into multiple languages in real time. It is also the world’s first chip to have support for Wi-Fi 7 technology.

It packs a Qualcomm Snapdragon X70 modem, which was announced earlier this year at the Mobile World Congress. It has its own AI processor for boosting 5G performance and comes with support for dual active 5G SIMs, which means that users can use two different 5G networks simultaneously.

Qualcomm revealed a list of partners for the Snapdragon 8 Gen 2 processor, which includes Motorola, OPPO, and ASUS ROG, among others. However, Samsung is missing from the list, but we are pretty sure the upcoming Samsung Galaxy S23 series flagship smartphones will come powered by the Snapdragon 8 Gen 2 SoC. The company says that smartphones powered by the Snapdragon 8 Gen 2 will start getting launched by the end of this year.

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MediaTek is one of the leading players when it comes to the choice of processors for entry-level Chromebooks. Now, the company is doubling down in this segment with the launch of two new chips — MediaTek Kompanio 520 and MediaTek Kompanio 528.

Both these new chipsets come with improved support for the display, better power management, upgraded imaging capabilities, and a few other things for the Chromebooks.

MediaTek’s Kompanio 520 and 528 chips use two ARM Cortex-A76 cores from eight total cores. The 520 has a clock speed of 2.0GHz, while the 528 has a clock speed of 2.2GHz. Along with that, the chips also come with an upgraded dual-core GPU and integrated APU for improving AI-powered performance.

Coming to the improved display support, the new MediaTek Kompanio 520 and Kompanio 528 have support for Full HD+ display with 2520 x 1080 pixels screen resolution and support to add a secondary Full HD display with 1920 x 1080 pixels screen resolution.

Both processors come with support for LPDDR4x RAM and eMMC 5.1 storage. In the camera department, there’s support for camera sensors up to 32-megapixel with 60fps FHD video recording. It also packs HiFi-5 DSP for improved microphone processing. For connectivity, there’s support for Wi-Fi 6 on both chips.

As for availability, the company has said that the first Chromebooks powered by the Kompanio 520 and 528 will start appearing from the first quarter of the year 2023.

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It has been only a few months since Google launched the Pixel 7 series smartphones, which come powered by the company’s own Tensor G2 processor. Now, reports about the next-generation Tensor processor are getting leaked online.

In the latest development, a report claims that the Tensor G3 processor from Google will stick to Samsung for the manufacturing of the upcoming chipset, and the processor has been codenamed Zuma.

Apart from the codename and manufacturer, some more details have also surfaced online. It is being reported that the Tensor G3 will be an offshoot of the Samsung Exynos 2300. As of now, details about the Tensor G3 processor aren’t known.

On the other hand, Samsung has already started working on its Exynos 2300 chip, even though the company will be ditching its own Exynos chips from the upcoming flagship Galaxy S23 lineup in favor of Qualcomm chips.

The report also points out that the chip codenamed Zuma may be fabricated on the more advanced 3nm process by Samsung. For comparison, the current-gen Tensor G2 is built using the 5nm node. It is also being said that Google will stick with the same modem for the upcoming Tensor processor as the one available in the current chipset.

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Honor has been actively launching new devices in the market as the company is aiming to become a leading brand, at least in its home country China. The company is now gearing up to launch a new flagship smartphone, dubbed Honor Magic 5.

Now, in the latest development, a report from Digital Chat Station reveals that the upcoming flagship smartphone Honor Magic 5 will come powered by the yet unannounced Qualcomm Snapdragon 8 Gen 2 processor.

Qualcomm is set to announce the Snapdragon 8 Gen 2 SoC in a couple of weeks at the company’s annual summit. All the major smartphone makers are expected to bring phones powered by the SD 8 Gen 2 chipset soon after the processor gets launched.

Coming back to the Honor Magic 5, the report also adds that the smartphone will feature a 50-megapixel primary camera sensor with Artificial Intelligence-based ISP tuning for better results. It will be coupled with other camera sensors, but their details are not yet known.

As per the rumors, the smartphone will feature a 6.8-inch display with support for PWM dimming and offer a high refresh rate, most likely 120Hz. It is said to be rated IP68 for water and dust resistance, and the phone’s battery will support 100W wired fast charging and 50W wireless charging.

Apart from the Honor Magic 5, a report claims that the company has a new foldable smartphone in the works, which could also be powered by the Qualcomm Snapdragon 8 Gen 2 SoC. While the phone is expected to launch soon, the launch date is not yet revealed.

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MediaTek, one of the leading chipset makers, has today officially confirmed that the company’s upcoming flagship processor for smartphones, dubbed MediaTek Dimensity 9200 will be officially announced on 8th November.

The teaser posters shared by the company indicate that for the upcoming processor, MediaTek has focused on offering top-class performance and ultra-low power consumption. It also hopes to offer an ultimate gaming experience.

As per the previous reports, the upcoming MediaTek Dimensity 9200 will be based on a 4nm process node by TSMC and will likely use the same Cortex-A710 and Cortex-A510 cores as before. The prototype of this chipset uses triple-cluster CPU architecture featuring 1 x ARM Cortex-X3 prime cores clocked at 3.05GHz along with 2.85GHz performance and 2.0GHz efficient cores.

Recently, the alleged AnTuTu benchmark of the Dimensity 9200 processor got leaked, which revealed that it managed to score 1,266,102, surpassing the performance of all the current-generation smartphones on the AnTuTu leaderboard. While the CPU isn’t showing any major improvements, the GPU has got a major boost.

In GPU benchmarks, the Dimensity 9200 managed to get a score of 328 fps in the GFX 1080p Manhattan 3.0 off-screen test and scored 228 fps in Manhattan 3.1 off-screen tests. For comparison, the Apple A16 Bionic only managed a score of 280 fps and 200 fps on these same tests, respectively.

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Intel recently launched the new 12th generation Intel Core processors that offer a combination of performance cores and efficiency cores. Now, the company has announced the new 13th-generation Raptor Lake processors.

The announcement of the new 13th generation processors from Intel comes at a time when its rival AMD has launched the new Ryzen 7000 processors for desktop devices.

The new chips are built on an upgraded version of the Intel 7 process (which is a 10nm design), featuring a third-generation SuperFin transistor and x86 performance hybrid architecture. It includes Performance cores (P-cores) and Efficient cores (E-cores) that split workloads using Intel’s Thread Director.

The top-end chipset in the new lineup is the Intel Core i9-13900K which packs 24 cores, offering eight performance cores and 16 efficiency cores. It is also said to be able to reach up to 5.8GHz Max Turbo frequency. The company also claims that it is 15 percent faster than its predecessor in single-threaded tasks and 41 percent better in multi-threaded work.

On the other hand, the Intel Core i5-13600K comes with 14 cores which is a combination of six performance cores and eight efficiency cores along with 20 threads. The Intel Core i7-13700K has 16 cores, which include eight performance cores and eight efficiency cores, and comes with 24 threads.

The L3 cache and L2 cache on the chips have been increased. Further, there’s also support for PCIe Gen 5.0 with up to 16 lanes off the processor along with DDR5-5600 and DDR5-5200 support. It is also compatible with DDR4 memory for the motherboard makers that still want to offer DDR4. All Core i5, i7, and i9 chips have a base power of 125 watts, but the Core i7 and Core i9 will both need 253 watts for their max turbo power.

Although Intel had warned about price increases for the flagship chips earlier this year, that is not the case as the pricing of the 13th generation chips are pretty much similar to the pricing of 12th gen processors.

The Intel Core i9-13900K is priced at $589, the same price as the last year’s 12900K chip. On the other hand, the Intel Core i5-13600K is priced at $319, which is a slight increase from the 12th gen’s price of $289. The Intel Core i7-13700K has a price tag of $409. The company says that the new 13th generation chips will start shipping from 20th October along with Z790 motherboards.

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Apple recently announced its second-generation Apple Silicon chips for the Mac devices, dubbed Apple M2, and has also launched a couple of devices powered by the new chip. Now, the company is gearing up to launch upgraded versions of the M2 chip.

Shedding more light on this, a new report from Mark Gurman of Bloomberg claims that the Cupertino-based tech giant is currently developing and testing new MacBook Pro laptops powered by the M2 Pro and M2 Max chips.

The MacBook Pro models that are being developed come in two different screen sizes. One of them has a 14-inch display while the other one features a 16-inch display. The report further adds that there’s a possibility that the devices could go official later this year.

Apple is reportedly planning to launch the new 14-inch and 16-inch MacBook Pro as early as the fall of this year, but because of supply chain issues, the production could face a delay in mass production and the launch may be a bit later than what the company plans.

There were rumors about the upcoming M2 Pro and M2 Max chips being manufactured using the 3nm process, but recent reports have indicated that the company will stick to the 5nm process for the new chips. But, the company is expected to move from the N5 process of the M1 Pro and M1 Max chips to the newer N5P process by TSMC.

As of now, there’s not much information available about the upcoming Pro models of the MacBook, but it’s likely that there won’t be any major changes in terms of design, and we’ll mostly see internal upgrades for better performance.

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Samsung recently announced its latest flagship foldable smartphones in the market, dubbed Galaxy Z Fold 4 and Galaxy Z Flip 4. Now, the company is focusing on the next generation of Galaxt=y S-series phones

It is being reported that the upcoming Samsung Galaxy S23 series smartphones will come powered by the Qualcomm Snapdragon 8 Gen 2 chipset, and this time, the company will be focusing on battery efficiency.

The Snapdragon 8 Gen 1p processor, which is currently found in the Samsung Galaxy S22 series, and its upgraded version named Snapdragon 8+ Gen 1, are powerful processors, but they are also power-hungry and generate a bit of heat. So, for the next-generation chips, Qualcomm will reportedly focus on battery consumption.

Based on the information available so far, the Qualcomm Snapdragon 8 Gen 2, codenamed Kailua, carries model number SM8550 and will be manufactured by TSMC using its second-generation 4nm process.

The chipset will reportedly come with one fast Cortex-X3 core that provides a 25% performance boost over the X1 found in the Snapdragon 8 Gen 1 models, as well as two Cortex-A715, two Cortex-A710, and three Cortex-A510.

A few months ago, it was revealed that the Snapdragon 8 Gen 2 efficiency tests are going well, and the chip has performed better than its direct predecessors. The new chip is likely to be announced in November or December this year, and the Samsung Galaxy S23 series will be officially launched in early 2023.

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Apple has already announced the M2 chipset under its Apple Silicon lineup and has also launched the first MacBook powered by the new processor. Now, the company is gearing up to expand the lineup of Mac devices with the M2 series chips.

In line with that, it is being reported that the Cupertino-based technology giant is all set to start the mass production of Apple MacBook Pro 14-inch and MacBook Pro 16-inch models powered by the new chipset sometime in the fourth quarter of this year.

The new report coming from analyst Ming-Chi Kuo also adds that the company won’t be using the 3nm chipset produced by TSMC but will instead stick with the 5nm chip. This contradicts previous reports which claimed that the M2 Pro and Max would be manufactured using TSMC’s 3nm process.

The Apple MacBook Pro 14-inch and MacBook Pro 16-inch models were launched by the company last year, powered by the M1 Pro and M1 Max chips. So, we expect the upcoming refreshed version of the laptop to be powered by the M2 Pro and M2 Max processors.

Whatever the case, it’s almost confirmed that TSMC will soon start manufacturing new chips for Apple based on the 3nm process, and it’s just a matter of time to see which MacBook device ends up being the first to come powered by the 3nm chips.

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Huawei is among the handful of brands that makes its own smartphones as well as processors for the phones. The company has its own processor lineup in the form of HiSilicon Kirin series.

The company isn’t able to make any new processors because of the sanctions imposed by the United States a couple of years back. Since then, Huawei has been using Kirin 9000 series chips on its devices.

Now, the latest report indicates that the upcoming Huawei Mate 50 RS smartphone may not be powered by the Kirin 9000 series processor because the the company has almost run out of the Kirin chips.

There have been reports about the upcoming smartphone from the company to come powered by the Kirin 9000S processor. It is not yet known which processor will power the smartphone if not the company’s own Kirin lineup chip.

The Honor 50 series smartphones are expected to come with new features for the camera department, along with support for Huawei Image XMAGE. The phones are expected to come with upgraded internals compared to their predecessor, but will still be 4G-only.

In line with other smartphones from Huawei, the Huawei Mate 50 series phones will come running the company’s own HarmonyOS 3.0, which is called HongMeng OS in China. This is because Huawei is still banned from using Google’s Android operating system.

It is being said that the Huawei Mate 50 series smartphones may get launched in early September, most likely in the second week. The company will announce three models, dubbed as Huawei Mate 50, Mate 50 Pro, and Mate 50 RS.

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Earlier this year, Samsung launched the highly anticipated Galaxy S22 series of smartphones that debuted with Samsung’s in-house Exynos 2200 chipsets in select regions. The chips feature AMD GPUs and were hyped up quite a bit ahead of launch. However, when the devices finally hit the market, the Exynos 2200 failed to meet the performance expectations of customers.

Currently, Samsung manufactures its Exynos chips to utilize in its own smartphones as well as to sell the chips to other smartphone manufacturers like Google and Xiaomi. However, recent reports have revealed that the company will soon be taking the Apple approach and designing chips exclusively for its own smartphones.

The revamped chips are expected to be ready around 2025. To allegedly help with these efforts, Samsung has appointed ex-Apple employee Kim Woo-pyeong as the director of the recently established Packaging Solution Center which is in the Device Solution America (DSA) headquarters. Kim Woo-pyeong has worked at Texas Instruments and Qualcomm before moving to Apple in 2014 and working there for 9 years.

The report by Business Korea does not specifically mention that Kim will work on the Exynos mobile chipset, however, the report does mention packaging technologies, which are employed by chip makers to overcome SoC integration challenges.

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Qualcomm is one of the leading players in the market when it comes to smartphone processors. The company has also forayed into making chips for wearable devices but hasn’t seen much success in that space.

Now, the company has revamped its wearable chips lineup with the launch of Qualcomm Snapdragon W5 Gen 1 and Snapdragon W5+ Gen 1 chips.

The first major change is that the company has ditched the Snapdragon Wear branding, and the newly announced chips will be a part of the main Snapdragon branding. Although the Wear branding has been removed, the chips are still aimed at wearable devices.

The Snapdragon W5 is aimed at budget or simpler devices like smartwatches aimed at kids, or fitness trackers, the Snapdragon W5 Plus is for more premium wearable devices. The main difference between W5 and W5+ Gen 1 is that the non-Plus model doesn’t come with an AON Co-Processor.

The platform keeps the hybrid architecture that was found in the Snapdragon Wear 3100 and 4100 chips. The new chips feature a main processor that takes care of interactive tasks, and there’s also a co-processor for an always-on display to help save battery life.

The co-processor can handle tasks related to audio, health tracking features, keyword detection for digital assistants, and notifications. It can also support onboard machine learning, but it’s up to the companies to make use of it.

Another major change comes in the form of the manufacturing process for the chips. The W5 and W5+ are manufactured using a 4nm process for the main processor, a huge jump from the 12nm process for the predecessors. The co-processor is made using a 22nm process, which is also an upgrade compared to the 28nm processor in its predecessor.

In comparison, Samsung Exynos W920, which powers the Galaxy Watch 4 series, is made using a 5nm process, while the Apple S7 chip for the Watch Series 7 uses a 7nm process.

Coming to the battery life, the company says that the W5+can provide up to 50% longer battery life by taking up 30% less space than previous generations. Qualcomm has also worked closely with Google to optimize Wear OS for the new SoC.

Qualcomm has revealed that the first smartwatches powered by the Snapdragon W5 will soon be up for sale. OPPO Watch 3 is said to be the first device using this new chips and will launch next month.

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Apple recently announced its new Apple Silicon M2 chipset and launched a couple of MacBooks powered by this new processor. The company is expected to launch a few more devices later this year.

Now, Mark Gurman has revealed in Bloomberg’s Power On newsletter that Apple has already started working on the next-generation M3 chip.

Along with the release timeline for the Apple Silicon M3 processor, he has also said that the new chip will power four Mac devices next year — 13-inch MacBook Air (J513), a 15-inch MacBook Air (J515), and a new iMac (J433). There’s also a 12-inch MacBook but the device is still in early development and not much is known about it.

Before launching the M3 chipset next year, Apple is expected to launch a few more M2-series chips this year, which could include M2 Pro, M2 Max, M2 Ultra, and M2 Extreme.

The company is expected to launch its first AR/MR headset powered by the Apple M2 processor, along with new 14-inch and 16-inch MacBook Pro models powered by the M2 Pro and M2 Max chips. After that, the company could announce a redesigned Mac Pro powered by the M2 Ultra and M2 Extreme chips.

Currently, there’s no information available about the new Apple Silicon M3 processor but it is likely to be manufactured by Taiwan Semiconductor Manufacturing Company (TSMC). The M1 and M2 chips are made using a 5nm process but if the M3 chip is manufactured using the 3nm process, then it could offer significant performance and efficiency boost.

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iQOO, the sub-brand of Vivo, has been actively launching new smartphones and the company is now gearing up to soon launch the next generation of its flagship smartphones under the iQOO 10 series.

Now, a new report from tipster Digital Chat Station claims that the company is currently testing a smartphone in the iQOO 10 series that will be powered by the newly announced MediaTek Dimensity 9000+ chipset.

Earlier, it was reported that the smartphone will come powered by the Qualcomm Snapdragon 8 Plus Gen 1 processor. So, it’s not clear if the device powered by the Dimensity 9000+ SoC is the same one or if it’s another device in the lineup, or if the company plans to offer two different models of the smartphone.

The smartphone is also expected to come with a 2K+ LTPO display that will offer a 120Hz refresh rate and come with support for a large area for the under-display ultrasonic fingerprint sensor. In the camera department, the device is said to have a 50-megapixel primary camera in the triple-camera setup.

It appears that there will be two devices in the lineup — iQOO 10 and iQOO 10 Pro. The Pro model is expected to debut as the world’s first smartphone to have support for 200W fast charging technology which can fully charge the device within 12 minutes. While the launch date is not yet known, the phones are expected to go official in July this year.

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Last year, MediaTek launched its flagship smartphone chipset in the form of MediaTek Dimensity 9000 and now the company has announced an upgraded version of the same, dubbed MediaTek Dimensity 9000+.

This newly announced smartphone chip is essentially the same as the Dimensity 9000 but comes with some key improvements. It supports a 144Hz refresh rate for WQHD+ resolution and up to 180Hz refresh rate for Full HD+ displays.

In terms of performance, the company claims that the MediaTek Dimensity 9000+ comes with a 5 percent improvement in CPU and about 10 percent faster GPU. It integrates ARM’s v9 CPU architecture with a 4nm process.

It packs one ultra-Cortex-X2 core clocked at 3.2GHz, three super Cortex-A710 cores, and four efficiency Cortex-A510 cores. As for the graphics processing, there’s a built-in ARM Mali-G710 MAC10 GPU.

The chip comes with an improved Image Signal Processor (ISP). It has Imagiq 790 ISP that supports 18-bit HDR video recording from three cameras at the same time and up to 320-megapixel sensor support for 4K HDR and AI noise reduction.

The network modem has also been updated and now it supports up to 7Gbps downlink. It also has support for 5G/4G Dual SIM Dual Active, enabling users to use both networks at once. It also has Bluetooth 5.3, Wi-Fi 6E, and the latest GNSS standard.

MediaTek Dimensity 9000+ will be released in the third quarter of this year but as of now, the company has not revealed which devices will be among the first ones to come powered by this new processor.

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Last month, Qualcomm announced the upgraded version of the Snapdragon 8 Gen 1 processor, dubbed Snapdragon 8 Plus Gen 1, which will be powering most of the flagship smartphones getting launched this year.

The company is also gearing up to launch the next-generation flagship processor towards the end of this year, which is likely to be called Qualcomm Snapdragon 8 Gen 2, and details about the chipset have started surfacing online.

As per the latest report from Digital Chat Station, it is claimed that the upcoming Snapdragon 8 Gen 2 processor, which apparently has the SM8550 Kailua model number and codename, will come with a completely different cluster configuration.

The chipset, which will be manufactured by Taiwan Semiconductor Manufacturing Company (TSMC) based on its 4nm process, will reportedly have a 1+2+2+3 configuration instead of the usual 1+3+4 configuration.

The current Snapdragon 8 Gen 1 comes with one common big ARM core, three medium cores, and four low-power cores, a cluster design that is now being used by most chip makers for their high-end processors.

As per the report, the upcoming Snapdragon 8 Gen 2 will have one Makalu generation core, another cluster with two Makalu generation cores, followed by two Matterhorn cores, and three Klein R1 cores. ARM’s Matterhorn generation refers to its 2021 Cortex CPUs, whereas Makalu is meant for 2022 phones.

This means that the Qualcomm Snapdragon 8 Gen 2 could have one Cortex-X3 core, which has not been announced yet, two Cortex-A720 cores, two Cortex-A710 cores, and three older Cortex-A510 cores, likely to be coupled with the Adreno 740 GPU.

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Apple has officially announced its new M2 chipset at the company’s annual developers’ conference named Worldwide Developers Conference (WWDC). The introduction of the M2 chip marks the debut of the second-generation Apple Silicon processors.

As the name itself indicates, Apple M2 is a successor to the M1 chipset announced a couple of months ago and comes with a promise of major performance improvements.

The new Apple M2 chip is using Apple’s custom ARM silicon and is built using the 5nm process with 20 billion transistors, which the company says is 25 percent more than the original M1 processor.

The company is also promising an 18 percent faster CPU and a 35 percent faster GPU compared to the M1. Apple also says that the performance is about 1.9x faster than the “latest 10-core PC laptop chip” but hasn’t directly named the competition.

Apple is also using new performance and efficiency cores on the M2. There are four high-performance cores, with four high-efficiency cores on the M2, with a shared 16MB cache on the performance cores, and a shared 4MB cache on the efficiency ones.

Coming to the GPU, there are now up to 10 cores, two more than the original M1. It also boosts graphics performance through a larger cache and higher memory bandwidth. Apple is promising up to 35 percent better performance compared to its predecessor.

It also comes with 100Gbps of memory bandwidth and 24GB of unified memory, which is 50 percent more bandwidth than the predecessor. The chip also features a next-generation secure enclave and neural engine. It also has an updated media engine that supports 8K H.264 and HEVC video. This means that it will be able to play multiple streams of 4K and 8K video simultaneously.

The new Apple MacBook Air and MacBook Pro are the first devices from the company to come powered by the new Apple M2 chipset. Similar to its predecessor, we expect Apple to launch a few more variants of this new chip in the coming months.

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At Computex Taipei 2022, AMD had revealed that the company will be launching its entry-level Ryzen and Athlon 7000 series mobile processors, codenamed “Mendocino”, that are aimed towards the Chromebooks and affordable Windows devices crowd.

And according to several reports online (via ITHome and wccftech), we have gathered several leaks and rumours that we know about AMD’s “Mendocino” processors so far.

AMD’s upcoming “Mendocino” 7000 series mobile entry-level APU family will be consisting of 3 members – the AMD Ryzen 3 7420U, AMD Athlon Gold 7220U and the AMD Athlon Silver 7020U.

Not much is known about the Athlon 7000 series mobile APUs, but recently ITHome reported that the news organisation had gathered info that the highest-end among the “Mendocino” processors – the Ryzen 3 7420U, will be sporting a quad-core CPU setup with 8 threads. All 4 CPU cores will be built on AMD’s older Zen 2 architecture, which turns 3 years old in 2022.

GPU-wise, The integrated graphics of the Ryzen 3 7420U APU will be featuring 1 WGP (2 CUs) of RDNA2 Graphics.

However, compared to its predecessor – the Ryzen 3 5400U, the upcoming Ryzen 3 7420U APU seems rather underwhelming. For comparison, the Ryzen 3 5400U also has a 4 core 8 thread CPU, but the cores are built on newer Zen 3 architecture. Meanwhile, the GPU on the Ryzen 5400U is a 6 CUs Vega Integrated Graphics.

As revealed earlier in leaks online, the AMD “Mendocino” APUs will be supporting dual-channel x32 LPDDR5 RAM, which can go up to 32GB, and the APUs will support VP9 and AV1 video encoding as well.

In Computex, AMD announced that “Mendocino” APUs will be launched in Q4 2022 and arrive in markets by the end of the year. The company expects “Mendocino” APUs to be available in mainstream notebooks priced from US$ 399 to US$699. 

In addition to the improved APU design, “Mendocino” is also manufactured on TSMC’s 6nm process, which translates to better power efficiency. AMD had announced that it believes that with Mendocino, Windows laptops can deliver more than 10 hours of battery life. On stage at Computex 2022, AMD revealed that Lenovo’s upcoming 2022 IdeaPad 1 series of entry-level laptops will be among the first to feature the APU.

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(Via 1, Via 2)

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MediaTek has been gaining market share thanks to its Dimensity series processors, and now the Taiwanese company has expanded its portfolio with the launch of another chipset, dubbed MediaTek Dimensity 1050.

The chipset is basically a lower specced version of the Dimensity 1100 SoC, but it is also the company’s first processor to come with dual mmWave and sub-6GHz 5G connectivity.

The MediaTek Dimensity 1050 is an octa-core processor built using a 6nm process and has two ARM Cortex-A78 performance cores clocked at 2.5GHz. While the company hasn’t mentioned efficiency cores, they are likely to be six ARM Cortex-A55.

It also packs ARM Mali-G610 for graphics processing and has support for MediaTek’s HyperEngine 5.0 suite for providing additional optimization tools and features for better gaming performance.

The processor comes with support for Full HD+ resolution screens with up to 144Hz refresh rate along with support for hardware-accelerated AV1 video decoding, HDR10+ playback, and Dolby Vision.

It offers 3CC carrier aggregation on the sub-6GHz (FR1) spectrum and 4CC carrier aggregation on the mmWave (FR2) spectrum, and is claimed to deliver up to 53% faster downlink speeds compared to LTE + mmWave aggregation. It also supports Wi-Fi 6E and 2×2 MIMO antenna for superfast Wi-Fi connectivity.

The company has not revealed more information about this processor but has said that devices powered by the MediaTek Dimensity 1050 will be available in the market sometime between July and September this year.

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