Taiwan Semiconductor Manufacturing Company (TSMC) is expected to build at least three new 7nm chipsets for MediaTek. This indicates how determined it is to become the numero uno chipset manufacturing company. As many of its customers such as OPPO, Vivo, Sony, LG and other smartphone makers from emerging nations are getting ready to embrace the upcoming 5G technology, the Taiwan-based chip making company has been actively working on AI enabled chipsets. As mentioned above, the company is heavily pegged to debut new chipsets for flagship phones in second half of this year.

At the beginning of 2017, MediaTek had released Helio X10, Helio X20 and Helio X30 chipsets for high-end smartphones. Even though the Taiwanese firm provided advanced technology at cheaper price compared to rivaling chipset making companies such as Qualcomm, it could not succeed in bagging many customers.

Read More: New Report Tips Apple As Working WIth MediaTek On Modems For 2018 iPhones

The probable reason why it failed to attract major customers like Apple, Samsung, Huawei and Xiaomi is that these companies have been developing their own in-house chipsets for their smartphones. Moreover, most of the leading smartphone vendors are interested in using Qualcomm’s chipsets. This is speculated to be the reason why MediaTek decided to halt the production of its Helio X series chipsets. Also, in order to prevent the gross margins of chipsets from falling down, MediaTek had to stop the related investments in the latter half of last year.

Recent reports have revealed that the upcoming Helio P-series chipsets from MediaTek are the Helio P40 and Helio P70. These 12nm chipsets built by TSMC will be focused on Artificial Intelligence (AI) and facial recognition.

(source)

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We are all eager to see how the Helio X30 performs since its debut in the Meizu Pro 7 and Pro 7 Plus. The first of the benchmark results have been released online by a Weibo user.

The 4GB RAM Helio X30 Pro 7 was benchmarked on AnTuTu and the results are interesting. The device scored 141982 points on the app, putting it just behind the Snapdragon 821-powered Mi Note 2 and Mi MIX; and the Kirin 960 powered Huawei Mate 9.

If  you are looking for the most powerful device out there, then the Meizu Pro 7 isn’t the device you should get but it will be unfair to undermine the work Mediatek has put into this new chip.

If you own a Snapdragon 821 powered-phone or one powered by the Kirin 960, then you will know it is more than sufficient to run any app you throw at it. Seeing Mediatek’s new chip rank among these two SoCs is no small feat.

The Helio X30 is their first truly high-end chip and hopefully subsequent ones will be better. But will they be able to catch up to Qualcomm and Samsung, not likely. Next year, Qualcomm is moving to 7nm chips and Samsung will be jumping to 8nm first before the move to 7nm in H2 2018. If Mediatek is still behind these two with its 10nm chip, it won’t catch up with them with their next generation chip unless a miracle happens.

The Helio X30 will be nice as a chip for high-end mid range phones but not for flagship devices. We expect it to show up in more devices before the year runs out.

READ MORE: Qualcomm, MediaTek, and Spreadtrum to Retain Top Spots in Market in 2017

Built on the 10nm architecture, the Helio X30 has 10-cores. It brings a performance increase of 240% and a decrease in power consumption by 60% compared to last generation chips. It also has an improved graphics performance thanks to its PowerVR GPU.

(Source)

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A few weeks ago, Mediatek confirmed that Meizu will launch the first Helio X30 powered phone. It is no secret that the phone is the Pro7. But since there will be two models, which of the Pro7 will be getting the Helio X30?

A post by Mediatek on Weibo has revealed the processor present in the Meizu Pro7 and Pro7 Plus. Early reports had said the Pro7 will get the Helio X30 while the bigger Pro7 Plus will be powered by Samsung’s Exynos SoC.

A rough translation of the post says “Equipped with Mediatek’s Helio P25 and Helio X30 processor, Meizu’s Smartphone will be officially released on July 26”.

Since the Pro7 and Pro7 Plus are the only Meizu smartphones launching on July 26, this means one of them gets the Helio P25 and the other gets the Helio X30. As it stands, the Pro7 will most likely be the one getting the P25 while the Plus model gets the Helio X30.

We know this will come as a shock to those of you looking forward to trying out the Helio X30. But based on latest development, you will have to shell out more money to get your hands on it.

READ MORE: Mediatek Set To Release 12nm Smartphone Chips This Year

The Meizu Pro7 and Pro7 Plus will launch with dual cameras and dual displays. Apart from the difference in screen sizes (front display only), they will also differ in terms of processor type, storage and RAM configuration.

(Source)

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It is no news anymore that Meizu’s next flagship is the Pro7. We have seen the official invite and even yesterday the official FlymeOS account tweeted about it. Both the invite and the tweet confirm that the Meizu Pro7 will feature a secondary display.

The launch of the Pro7 is scheduled for 7:30PM CST on July 26 at the Zhunai Grand Theatre in China. Ahead of the launch comes new images showing the device in all its glory.

While we won’t pass a final judgement on the Pro7 till we get to see it and touch it, we are not really excited about its looks. We get Meizu is trying for a new design by adding a secondary display at the back but not at the expense of failing in the overall appearance.

Take the front for example. The size of the top and bottom bezels could have been made smaller giving it a more premium look. The back plate is brushed metal but I think glass would have looked much better. The Pro7 will cost at least $400 which is around the same price as the Xiaomi Mi 6. And you will agree that the Mi 6 is a good looking device.

READ MORE: Image of Meizu Flow Headset Leaks, Looks Like The AKG K3003

We also get to see the sides of the Pro7. It doesn’t look bulky, so that is fine. The volume rocker and power button is on the right and the sim tray is on the left.

The Meizu Pro7 will be the first phone to launch with Mediatek’s Helio X30 processor. It has been a long time coming and we hope it is worth the wait.

(source, via)

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Meizu has officially confirmed that its next flagship smartphone, the Meizu Pro 7, will meet us on July 26 at the big event at the Opera House in China. We haven’t seen a high-end product from the company so far in 2017, which makes the Pro 7 an important model.

Thanks to the numerous leaks that have been going around the internet, we already know what’s new on the Meizu Pro 7 — a unique secondary display at the back. But till now, it wasn’t official. This seems to have changed now, as Meizu has released a few teasers for the Pro 7 and each of them seem to highlight the secondary window display on the upcoming flagship, essentially confirming it.

Further, teasers revealed by another official Weibo account of Meizu seems to be hinting at dual cameras on the phone. This means that we know for sure that the Meizu Pro 7 will have a secondary display at the back along with a dual camera setup.

According to previous leaks, the Pro 7’s secondary display will be a 2-inch E-ink screen and will support different modes such as black and white, music mode etc. The screen can reportedly be used even after shutting down the phone. It is further said that users can use the screen for photo previews, playing games etc.

RELATED: Working Meizu Pro 7 Shows Flyme Interface, Selfie Shot on Rear Screen

The usability of the additional screen at the back will decide the fate of the Pro 7. Trying out a unique design is never easy and more often than not, companies pay a heavy price for deviating from the traditional design. We know how LG G5 differentiated itself with a modular design but failed to attract the attention of customers due to the lack of significant practical benefits of the new design. But LG V20‘s secondary screen looked promising and I hope Meizu has enough tricks planned for its secondary screen to make it attractive to customers.

We also have a basic idea about the internal specifications of the Pro 7. The phone is said to feature a 5.2-inch 1080p primary display up front with Helio X30 inside (finally!), 6GB / 8GB RAM options, 128GB storage, 12MP Sony IMX386 + IMX 286 dual camera setup at the back and a 16MP front camera. The price is expected to be 2799 Yuan ($414) and 3299 Yuan ($488) for the two variants of the phone. Note that these specs and pricing details are yet to be confirmed.

Expect more details on the Meizu Pro 7 in the coming days via official teasers. So, stay tuned to Gizmochina for more updates.

Teasers for the Pro 7 below:

(Source 1,2)

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That notwithstanding, the rumour may not have any credibility in it as a Meizu staff has bluntly denied the existence of such configuration on the Pro 7 or Pro 7 Plus. The Meizu staff has taken down the post, by the way, so we couldn’t get a translated screenshot for you but he categorically stated that there is no Exynos 8895 on the Pro 7. The staff hinted that the Pro 7 project had commenced even before the Exynos 8895 chip or the Samsung Galaxy S8 was introduced and the R&D stage could even pre-date that of the Galaxy S8. 

Read Also: Meizu PRO 7 Launch Invitation Confirms July 26 Unveil

It is likely the rumour originated from the internet, particularly from Weibo as you can see from the screenshot above and not from Meizu. Perhaps, the rumours would sound less interesting if the Helio X30 chip has appeared on several benchmarks so we could know how capable it is as a flagship chip. But then, Meizu has released official posters for the launch of the Pro 7 on July 26. We expect some benchmark data to leak before then. Even if it doesn’t, we’ll serve you a detailed review of the device here on Gizmochina as soon as we get our hands on it after the launch.

(source, via)

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The Meizu Pro 7 is becoming more and more interesting by the day, not just because of the powerful dual cameras which it is touted to feature, or the attractive and innovative secondary display but also because it will afford us the opportunity to get a first-hand experience of MediaTek’s Helio X30 chip which it is billed to launch with. MediaTek recently confirmed the Pro 7 will be the first smartphone to pack its deca-core flagship chip and also that the Helio X30 is manufactured specifically for extreme gamers.

Talking about the secondary display, the Pro 7’s display isn’t new to us but all along it is thought to be an e-ink display that would only show notifications and maybe time and date. But recently, leaked photos of the Pro 7 shows that it would like have more features than we were thinking. Once again, it looks like the rear display isn’t likely going to be an e-ink display as a new leaked photo of the Meizu Pro 7 rear screen has appeared online from China’s Weibo. The leaked Pro 7’s rear display again shows the screen can display colors which means it would likely be an LCD panel. 

Read More: Working Meizu Pro 7 Shows Flyme Interface, Selfie Shot on Rear Screen

In addition, the display could be seen to be running a game which looks like the legendary Pac-Man. This points at the strong possibility of the rear display coming with touch input support since the game can only be controlled using the screen. This also lend credence to earlier leak pointing at the presence of Meizu’s Flyme interface on the device. Another thing is that the Pro 7 will likely be available in black and gold, the two colors the leaked model appeared in. It is possible that there will be more than  just two color variants, though.

(source)

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As the days roll towards the launch of the first Helio X30 smartphone, the Meizu Pro7, Mediatek has taken to advertising the key features of its most powerful processor.

A post made via the chip maker’s official Weibo account highlights one major feature of the 10nm SoC which is gaming. According to Mediatek, the Helio X30 supports LPDDR4X RAM.

LPDDR4X allows the use of memories with higher clockspeeds but with better power efficiency. The new memory standard has a 40% voltage reduction (1.1V to 0.6V) allowing data to be sent and received at improved speeds but without draining much power.

The Helio X30 also supports UFS 2.0 and UFS 2.1. Phones with any of these storage types have faster read and write speeds compared to eMMC.

The Helio X30 is a 10nm deca-core chip clocked at 2.5GHz. It supports dual cameras, a feature present in the upcoming Meizu Pro7 and has a PowerVR 7XTP-MT4 as its GPU.

READ MORE: MediaTek And GlobalFoundries Matchup: New Entry-Level 22nm FD-SOI CPU For Low End Phones

Meizu’s official Weibo account quoted the original post with a statement that loosely translates to focus on “game players”. So if you enjoy mobile gaming, you may want to take a look at the Pro7 when it launches.

(Source)

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The rumors of the Meizu Pro 7’s processor have now drawn close to a finish, with confirmation from MediaTek, that Meizu will be forgoing a Samsung Exynos processor and powering the Meizu Pro 7 with the long-awaited MediaTek’s Helio X30.

MediaTek had revealed their June financial report, specifically about the revenue levels. MediaTek is reported to have made a total of NT$21.894 billion, an increase from last month’s (May) NT$18.37 billion. However, directly comparing MediaTek’s June report from last year, the company made less money in June 2017, with June 2016’s NT$24.87 billion a decrease of 11.79%.

Within the revenue report, MediaTek also confirmed that Meizu will be the first company to integrate MediaTek’s latest processor, the Helio X30, into their upcoming flagship smartphone.

MediaTek is betting that the Helio X30 will help increase the market share since the slipping of market power due to Qualcomm’s Snapdragon 835 popularity. According to the MediaTek, they are also keen on releasing another new processor in the second half of the year.

Although MediaTek has announced Meizu will have a device powered by Helio X30 processor, the smartphone company haven’t officially announced the Pro 7.

The feature will be a secondary screen at the rear will be expected to be a 2-inch display that will provide notifications and act as a camera timer.

In terms of specifications, the Pro 7 will be expected to use a 5.2-inch screen at a resolution of 1920 x 1080 (FHD). The high-end variant will be accompanied by 8GB RAM and 128GB internal storage. For cameras, the smartphone will have dual camera setup with two 12-megapixel cameras (Sony IMX386 and IMX286) and front 16-megapixel shooter.

The expected cost of the Pro 7 will start at ¥2799 (6GB + 128 GB) and the higher variant ¥3299 (8GB + 128 GB). Furthermore, the Pro 7 Plus will be expected to start at ¥3299 (4GB + 64GB), ¥3599 (6GB + 128GB) and the ¥3799 (8GB + 128GB).

RELATED: Video Render Of Meizu Pro 7 & Pro 7 Plus Leaks Showing All Aspects

What are your thoughts about the Meizu Pro 7 using MediaTek Helio X30? Do you think the X30 will be a competitive alternative to Qualcomm’s Snapdragon 835? Share your comments down below.

(Source)

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The Meizu Pro7 is set for a release soon. We have heard rumors of it launching on July 26 but Meizu hasn’t confirmed it yet. Apart from the secondary display the Pro7 will have, the second biggest feature is its Mediatek Helio X30 chip.

The Helio X30 has been a long time coming and it is said to make its debut in the Pro7. So between now and when Meizu launches its new flagship, there won’t be any other phone launching with the processor.

The Helio X30 is a 10nm chip that is supposed to take on the Snapdragon 835. When it was first unveiled last year, quite a number of people looked forward to seeing its real life performance.

The Helio X30 a.k.a MT6799 is a deca-core processor comprising of two Cortex-A73 cores clocked at 2.5GHz, four Cortex-A53s at 2.2GHz and another four A35s at 1.9GHz. Mediatek has switched to a PowerVR 7XTP-MT4 clocked at 800MHz for the GPU. The chip supports 4K displays, RAM of up to 8GB and UFS 2.1 storage. It will have support for 3x carrier aggregation, LTE cat-10 and Imagiq 2.0.

READ MORE: MediaTek And GlobalFoundries Matchup: New Entry-Level 22nm FD-SOI CPU For Low End Phones

When the Meizu Pro7 finally launches expect lots of comparisons between it and the Snapdragon 835 phones already released. The flagship will have a 5.2” 1080p display, dual rear cameras, and Meizu’s signature mCharge.

(Source)

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Last year, MediaTek announced the Helio X30 as its first 10nm chip. Almost seven months later and we are yet to see a phone powered by the chip.

The Helio X30 is supposed to replace the Helio X20, offering up to 35% increase in performance and a 50% decrease in power consumption. It will also have a better GPU performance as it has ditched the Mali GPU for a PowerVr 7XTP-MT4.

When it was first announced, there were a number of manufacturers said to have signed up for the chip. OPPO, Vivo, Meizu, Xiaomi and LeEco are the big names while smaller companies such as Vernee, Ulefone and Doogee were also mentioned. Of the big names, only Meizu is still associated with the processor and it is expected to power its Pro 7 flagship next month. The others have moved to Qualcomm chips or settled for the older Helio chips.

The smaller companies like Ulefone, Vernee and Doogee have it tough as they rely heavily on MediaTek for their chipsets. Vernee for instance announced their flagship phone, the Apollo 2 at MWC 2017 and scheduled it to launch in May. We are half way through June and nothing has been heard about the phone. These manufacturers will have no choice other than to settle for older processors like the Helio X20 or the more recent Helio X27.

READ MORE: MediaTek And GlobalFoundries Matchup: New Entry-Level 22nm FD-SOI CPU For Low End Phones

Meizu has already ironed out its issues with Qualcomm and it has a good relationship with Samsung. If the Helio X30 fails to impress, it can settle for chipsets from either of them. The Plus variant of the Pro 7 is already even rumored to be powered by the Exynos 8890.

Tec Analyst, Kevin Wang shares his opinion on the matter. A rough translation of his post on Weibo says manufacturers have abandoned the X30 and Meizu which is still hanging on is increasing its use of Samsung and Qualcomm’s mobile platforms. He even goes on to ask if there will be a X series next year. That question is one we can’t answer.

(Source)

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When Meizu’s product roadmap leaked a few months ago, the MX7 was one of the products we saw on the list. We were able to deduce from the leaked info that the Meizu MX7 will launch in September and will be powered by a Helio P30 SoC.

September is still a good five months from now but an alleged live image of the Meizu MX7 just showed up online. Because it is still too early, we advice you to take this with a pinch of salt, although it is possible Meizu might have adjusted its calendar. But even at that, MediaTek still has not announced the Helio P30 processor yet. Heck! We are still even waiting for phones to show up with the Helio P25.

However, there is an explanation for the SoC. According to the source, the Meizu MX7 will launch with the Helio X30 or Snapdragon 660 SoC. These two processors are not yet present in any phone, but at least they have been officially announced.

The Meizu MX7 is expected to feature a 21MP rear camera and a 5MP sensor for selfies. The display will be 5.7-inches with a 2K resolution and it will have a USB Type-C port and 3.5mm audio jack.

READ MORE: Meizu May Split in Two Firms, Namely Meizu and Blue Charm

The design isn’t different from other Meizu phones but the side bezels are pretty thin. It has the signature mBack button at the bottom but also appears to be lacking a light sensor at the top.

(Source)

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This year, news on flagship mobile processors have almost been entirely centred on Qualcomm and the Snapdragon 835 chipset which has even found its way into smartphones. We almost forgot MediaTek has an Helio X30 which have been purportedly announced but is yet to find its way into any smartphone.

MediaTek isn’t going to let Qualcomm grab all th media attention when it is searching for worthy OEMs from its Helio X30 chip. To this end, the company is promoting the Helio X30 features in a video presentation posted on its Weibo account. From what we can gather, the Helio X30 is the world’s first and currently the only mobile chip with a deca-core processor built on the 10nm manufacturing process which means its fire power may likely be superior.

The video reveals the Helio X30 comes with up to 35% increase in performance over the Helio X20. The new chipset also drops power consumption by 50%, that means it runs in a low power state ensuring you get twice the duration of usage which the X20 offered. In addition, the Helio X30 also comes with a new CorePilot verification system, baseband support and lots more.

Read More: MediaTek Helio X30 with Deca-core SoC, PowerVR Graphics Announced to Rival Snapdragon 835, Exynos 8895

Specs wise, the Helio X30 use two 2.5GHz Cortex-A73 cores and four 2.2GHz Cortex-A53 cores and four 1.9GHz Cortex-A35 cores. The highest baseband achievable is Cat. 10. The Helio X30 also comes with the PowerVRXTP-MT4 GPU clocked at 800MHz. The processor supports 4K screen, 8GB RAM, UFS 2.1 flash storage and more. You can watch the video from here.

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They say imitation is the sincerest form of flattery and Doogee’s new phone does exactly that. It is an imitation of the Xiaomi Mi MIX. The phone not only shares a similar design to the triple bezel-less Xiaomi Mi MIX but is actually called the Doogee MIX.

Doogee says the MIX will have a 5.5-inch Super AMOLED display supplied by Samsung. Due to the lack of bezels on three of its sides, it’s overall size will be smaller than that of the Mi MIX but almost the same as that of the iPhone 6. This small size makes the Doogee MIX more comfortable to use.

A real-life leaked image of the Doogee MIX shows us that the phone has a regular earpiece at the top of the display instead of the piezoelectric ceramic driver used in the Mi MIX. The lower bezel houses a physical home button that doubles as a fingerprint scanner and also has a front facing camera sitting at the bottom right corner. Other promotional images reveal a dual-camera setup on the back.

For the rest of the specs, the Doogee MIX is expected to launch with a Helio P25 SoC. There will be 4GB of RAM and 64GB of storage. A higher-end variant will be powered by the Helio X30 and will have 6GB of RAM and 128GB of storage.

READ MORE: Doogee Flagship will sport Helio X30, Dual Front Cameras, and 8GB of RAM

There is no info on battery capacity yet neither is there a possible price or launch date too but it will probably be above the $200 mark. The Doogee MIX will be available in three colors: black, light blue, and a dark blue version that appears to have a reflective back.

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Xiaomi fans are eagerly waiting for the arrival of the Mi 6 flagship phone. New rumors have stated that its launch has been delayed to May. However, the rumor mill is still consistently spilling more details on leaked specs of Xiaomi Mi 6. A leaked photo of the “About Phone” screen has revealed key specs of the phone.

It is a known fact that the Snapdragon 835 chipset would be powering the Xiaomi Mi 6 flagship smartphone. The leaked shot reveals that the smartphone has a quad-core processor under its hood that works at 2.7 GHz. The snapshot does not mention that the smartphone is running on SD 835 chip.

The Snapdragon 835’s official webpage states that the octa-core processor of SD 835 can deliver a maximum clocking speed of up to 2.45 GHz. Some rumors hint that the low-end version of Mi 6 would be featuring Snapdragon 821 chipset that includes a quad-core processor. Its maximum clocking speed is 2.4 GHz. Hence, the Mi 6 in the leaked image could be running on SD 821 SoC.

Leaked information also hint that Xiaomi may be working on a MediaTek Helio X30 chipset variant of Mi 6 smartphone. However, MediaTek does not have a flagship chipset with quad-core processor.  So, the alleged Mi 6 variant in the screenshot is unlikely the rumored model running on Helio X30.

The Mi 6 can be also seen sporting 6 GB of RAM along with a massive internal storage of 256 GB. It is running on Android 7.0 Nougat OS that is customized with Xiaomi’s MIUI 8.3.14 skin.

Related: Xiaomi Mi Pad 3 and Mi Pad 3 Pro Details Revealed: Two of Each

Rumors have it that the Xiaomi Mi 6 may arrive two screen variants, the first variant is expected to come with a 5.15-inch display and the other variant dubbed as Mi 6 Plus is pegged to feature a 5.7-inch screen. The larger Mi 6 model is rumored to arrive with rear-facing dual cameras.

Speculations hint that the Mi 6 would be arriving with a starting price of 1,999 Yuan ($289) and the larger Mi 6 Plus is expected to have a starting cost of 2,499 Yuan ($360). It was previously rumored to launch on April 16, but since the Snapdragon 835 chipset for Mi 6 is reportedly going to be available in April, its unveiling has been pushed to May.

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The battle for top chip manufacturer has been going on for years and this year is no different. All the major players have announced their flagship chips and what is left is to see them make it into phones. However, it seems one player might be dropping out of the race and that is Mediatek’s Helio X30 processor.

Latest report says that the major phone manufacturers that have signed up to use the Helio X30 in their phones have started pulling out. One of such companies is LeEco.

The reasons are that the Helio X30 has performance issues and is also grappling with mass production challenges. Mediatek’s Helio X30 processor is built using the 10nm fabrication process just like its competitor, Qualcomm’s Snapdragon 835.

The Snapdragon 835 might be facing supply issues too, forcing many manufacturers to change the launch dates of their flagship but there has been no report of it having performance troubles. The latter is why we understand a phone manufacturer might be abandoning the Helio X30. No matter how well designed or innovative a phone is, the performance of the processor also goes a long way. The Snapdragon 810’s heating issues is still fresh in our memories.

READ MORE: 7nm Mediatek Flagship Chip Detail Revealed: Will Have 12 Cores

LeEco is still the only manufacturer listed to have left, but the source says there are others too. However, there is no mention of Meizu jumping ship.

(Source)

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Its been a couple of months since Mediatek announced its Helio X30 processor. But just like Qualcomm’s Snapdragon 835, there is still no phone in the market sporting the new chip. However, Doogee has revealed its plans to launch a new flagship and it is touting it as the first “worldwide MTK X30 processor” phone. With no release date at hand, that remains to be seen.

The Doogee flagship packs a number of impressive specifications. It will have a 5.7-inch 2K display, 8GB of RAM and 256GB of storage. Doogee is also going all out with the cameras. There are two 16MP cameras up front and a single 21MP sensor on the rear.

READ MORE: Get the Doogee Y6C for Just $99.99 from Lightinthebox.com

The phone will ship with Android 7.1 Nougat and a 4050mAh battery that we expect should have some of fast charging. There will also be a front facing fingerprint-scanner.

The Doogee 2017 flagship already sounds like an impressive device but how it makes best use of these specs will also determine a lot. The Chinese manufacturer is in Barcelona for MWC but we have no info on if they plan to announce the device there.

What do you think about the phone? Are the specs an overkill or are they perfect?

(Source)

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For a while now, Meizu has been stuck with using MediaTek chip on its smartphones and of late, the Meizu Pro 6 Plus featured a Samsung Exynos 8890 flagship SoC. Unfortunately to the disappointment of not a few persons, Meizu has failed to pack Qualcomm’s chip on its latest gadgets.

A recent Qualcomm press release had stated among other things that China’s top ten phone brands have all got Qualcomm’s patent license. If you talk about the top ten brands in China, Meizu is definite among them.

More revealing is the recent leaked product schedule said to be Meizu’s lineup for 2017. The product schedule outlines the different Meizu smartphones that are likely to be released in 2017 and the month they would drop. According to the poster, Meizu should release the M5S in February using a MT6753, the Meizu Pro 7 uses a Helio X30 chip launching in June. In addition, the Meizu S using an Helio P25 chip is expected in July, while the MX7 with an Helio P30 chip will drop in September. October would see the Meizu Note 6 powered by an Helio P20 SoC.

One notable information outlined on the leaked calendar is the processor the devices would carry on launch date. That would not have gotten us excited if not for the Qualcomm chipset which is listed against a device whose name is obscured on the sheet, perhaps a Meizu M derivative. However, we could see what looks like a Snapdragon 626 chipset listed as featuring on the device.

Read More: Meizu M5S Gets 3C Certification, Sports 4GB RAM and an Octa-Core SoC

Well, don’t get too excited because even if the product schedule turns out to be true, you won’t be seeing the Snapdragon-powered Meizu flagship anytime soon. The device is listed for release in December 2017, one year from now.

source

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MediaTek announced its next generation flagship processor – Helio X30, in September this year and it was unveiled as the world’s first mobile phone processor using TSMC 10nm process. The Helio X30 was also heralded as the first to have a tri-cluster hybrid architectural design.

The Helio X30 was also revealed to come with specification that includs two 2.8GHz Cortex-A73 cores, four 2.3GHz Cortex-A53 cores, four 2.0GHz Cortex-A35 as well as incorporating a quad-core PowerVR 7XTP GPU. The chip also supports four groups of 16-bit LPDDR4X-1866 memory of up to 8GB, UFS 2.1 storage, 28MP camera, Cat. 10 LTE baseband capable of 450Mbps download speed and more.

In addition, the Helio X30 is said to have a higher energy efficiency, greatly improved than its predecessors. Although we had seen a supposed benchmark score of the X30 that was disappointing, the flagship chip is reputed to be as powerful as the Snapdragon 820 or SD 821.

Read Also: 10nm BattleChip: Snapdragon 835 vs Helio X30 vs Kirin 970

According to Taiwan’s Economic Daily, the X30 is scheduled for production in the first quarter of next year and would have power management IC from a subsidiary of Richtek. It is also reported that the first smartphone models packing the Helio X30 chip would hit the market in the second quarter of 2017. This is likely going to be either a Meizu, OPPO or Vivo smartphone, according to previous rumors.

source

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In the race for the top flagship chipset in the market, MediaTek was left behind this year. Processors from Samsung and Qualcomm have really taken performance to a whole new level, which is why 2017 is going to be a very important year for the Taiwanese chipmaker. However, it looks like things haven’t started too well for its flagship chipset, the Helio X30, which was just announced a few weeks back.

According to a well-known tech personality on Weibo, Helio X30’s market reaction hasn’t been very positive so far. In fact, he revealed that the three major smartphone companies in China namely, Huawei, OPPO, and Vivo are not going to use this chipset in 2017. Huawei’s lack of interest in Helio X30 would be understandable, given its increased focus on its own Kirin chipsets, but it’s said that both Vivo and OPPO (the two fast-growing smartphone companies in China today) are not interested in the chip, which is surprising. Even Taiwan’s own HTC isn’t willing to go with this top MediaTek chip. So, MediaTek may eventually have to rely on companies like Xiaomi and Meizu to ship a decent amount of Helio X30 processors. It’s worth noting that an insider has already revealed that Meizu’s flagship of 2017 would be powered by this MTK flagship processor.

On paper, the Helio X30 looks like a powerful chipset. First of all, it is built using the super efficient and the latest 10nm manufacturing node, joining the likes of other top flagship processors of 2017. Thanks to its two Cortex A73 cores for top-end performance, MediaTek claims that the performance increases by up to 43% as compared to its predecessors. Further, the power consumption reduces by as much as 53%.

RELATED: MediaTek Announces Two New High-End Chips: Helio X23 & X27

It looks like Helio X30’s start hasn’t been pretty, with this news and then the recent alleged benchmark of the chipset showing sub-standard scores. While it’s too early to say whether Helio X30 will be successful, what I would like to see is the true performance of the deca-core architecture unleashed. MTK really needs its top flagship processors to perform well in 2017.

What do you think?

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MediaTek announced its next generation Helio X30 flagship chip about four months back but since then nothing has been heard about the processor built on a 10nM manufacturing process. But presently, a pictorial data said to be the Geekbench posting of the MediaTek Helio X30 has surfaced.

The Helio X30 is said to come with a deca-core design and perhaps for the purpose of the test and the machine is it infused into, the chip was clocked at 1.59GHz while providing the interface is Android Nougat 7.0 and there is a 6GB RAM backing the processor.

We are not so sure, though, that this is actually MediaTek’s X30 chip onboard the device as it only managed to pull a single core test score of 1504 points. On the multi-core test, it recorded a score of 4666 points. Now, that is way lower than the scores posted by its contemporaries, talking about the Qualcomm Snapdagon 821 and Huawei’s latest HiSilicon Kirin 960.

If actually, it is indeed an Helio X30 chip onboard, then this isn’t its normal level. When MediaTek announced the flagship chip few months back its configuration include being a deca-core chipset and having the same tri-cluster design in series like Helio X20 and Helio X25. The X30 is manufactured using TSMC’s 10nm FinFET process and talking about cores, there are 4 Cortex-A73 cores clocked at 2.8GHz, which is claimed to maul down heaviest of tasks, 4 Cortex A-53 cores clocked at 2.2GHz, and 2 Cortex A-35 cores clocked at 2GHz. Compared to the Helio X20 is comes with up to 53% improvement in power consumption and 43% performance improvement.

Read More: Mediatek Helio X30: New Leak Reveals Powerful Deca-Core Setup With PowerVR GPU

In addition, the Helio X30 is touted to support camera sensors up to 40MP and video capture up to 24MP. Further, Helio X30 will support up to 8GB of RAM further supporting LPDDR4 (Package-On-Package) POP 1600MHz channels. It is further equipped with PowerVR 7XT quad-core GPU. This graphic engine will highly enhance the graphic performance and will be perfect for VR as well. The Helio X30 will also support LTE CAT 12.

The chipset isn’t expected to ship until sometime next year and we can expect some devices to show up powered by this chipset in the second half of 2017.  Perhaps when that happens, we’ll get to see the true fire power of the Helio X30 but for now, we’ll take this alleged Geekbench posting with a pinch of salt.

source

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Xiaomi is already working on their flagship for next year which should naturally be called the Xiaomi Mi 6. Xiaomi is known for using Qualcomm processors for their flagships, so its not a surprise to learn that the Mi 6 will launch with the new Snapdragon 835 chip. What is surprising is the fact that it may have variants with different processors.

The news comes from leakster @Kjuma who posted on his Weibo page that the Xiaomi Mi 6 will have three variants with different processors and will be named Mi 6S, 6E, and 6P.

While we advice that you take the info with a pinch of salt until it is confirmed, we shouldn’t rule out the possibility. It will be a deviation from what has become the norm but traditions can be broken. We believe one of the Mi 6 variants may sport the Helio X30 processor and the third variant might have Xiaomi’s in-house processor called Pinecone. That looks like the only plausible way it can happen.

• Xiaomi 6S(napdragon)
• Xiaomi 6P(inecone)
• Xiaomi 6hElio X30

It’s a wild guess from me but it makes sense, right? Because I don’t want to believe the E stands for Exynos.

We also get to see a render of the upcoming phone. The display is curved and the bezels are practically non-existent.

READ MORE: New Xiaomi Mi Notebook Launching December 23

The Xiaomi Mi 6 is expected to launch with 6GB of RAM with 64GB and 128GB storage variants, a 4000mAh battery and 3D touch. It should also launch with MIUI 9 based on Android Nougat 7.1.

Will you be open to a Xiaomi flagship sporting a processor other than one from Qualcomm?

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Meizu’s closest friend at the moment is probably Mediatek. They have worked together on all the Meizu phones released this year and still have two more set to be released before the end of December. First is the dual-camera Meizu X which will launch on November 30 and the second is the Meizu M5 Note scheduled for December 6. And according to an insider, Meizu’s 2017 flagship will be powered by either a Helio X30 or Helio X35.

The news about Meizu using a Mediatek chip for its next flagship isn’t new as a tech analyst already mentioned it a couple of weeks ago. Now that an insider has confirmed it, all we have to do is wait for the device to launch.

Mediatek’s Helio X30 chip is the first 10nm chip to be announced and should start production early next year. The deca-core chip will consist of a tri-cluster of Cortex-A73, Cortex-A53, and Cortex-A35 cores. The new chip promises a lot of improvement in power consumption and performance.

READ MORE: Likely Images of Meizu’s Flyme 6 User Interface Leaks

Mediatek seems to have stepped up their game with the Helio X30 as it has gotten positive comments following its announcement. It might still not be able to compete with Qualcomm in terms of GPU performance but we are sure it will trump it in some other areas.

The Meizu insider in his post also revealed that the Meizu M5 Note which will have a Helio P10m SoC will disrupt the market with its price. The M5 Note is expected to cost just ¥999 ($145).

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Next year is the year of 10nm chips and most of the major chip manufacturers have announced their own 10nm SoCs. Qualcomm already announced its Snapdragon 835 processor which will be manufactured by Samsung. Mediatek has also announced the deca-core Helio X30 which is being manufactured by TSMC, and we have heard rumors of a Kirin 970 chip from Huawei. While it is too early to decide which one is best, there is no harm in doing a comparison with the amount of info already out there.

Number of Cores

Qualcomm is sticking to eight-cores in a 4+4 combination for the Snapdragon 835. Mediatek on the other hand is not new to deca-cores chips; the Helio X20 and Helio X25 both have 10 cores, and the trend is set to continue with the X30. The Helio X30 will consist of four Cortex-A73 cores, four Cortex-A53 cores and two Cortex-A53 cores. The Kirin 970, just like the Kirin 960, is expected to use an 8-core setup (4 x Cortex-A73 cores+4 x Cortex-A53 cores).

Clock Speed

The SD 835 SoC will have a maximum clock speed of 3.0GHz but expect some manufacturers like Xiaomi to lower the clock speed. During the launch of the Helio X30, Mediatek already said the Cortex-A73 cores will be able to reach a clock speed of up to 2.8GHz. The clock speed for Huawei’s Kirin 970 is unknown but we assume it will be between 2.8GHz – 3.0GHz.

LTE Categories

Qualcomm is going all out by using using a combination of Cat. 13 and Cat. 16 for downlink and uplink. Mediatek’s Helio X30 will use a combination of Cat.10 and Cat.12 while the Kirin 970 is expected to use Cat. 12.

READ MORE: Meizu’s Pro 7 Flagship Rumored to Feature Huawei’s Kirin 960 Chip

To sum it up, the Snapdragon 835 will offer a performance increase of 27% over previous generation and Mediatek’s Helio X30 will get a 43% increase in performance. How much performance increase the Kirin 970 will have over the Kirin 960 is not known until there is an official announcement.

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Smartphone chip makers are always on the move, improving their chipset with more powerful offering and reduced size in the face of demands for smartphones that consume less power and are are capable of seamlessly fast performance. Huawei recently released the Kirin 960 flagship processor that benchmark tests have shown to be superior in performance to its present contemporaries, yet the company is rumored to be working on a Kirin 970 chipset.

According to latest media reports in Taiwan, the next generation Kirin 970 will be Huawei’s first to be built on the TSMC 10nm process. The Kirin 970 is said to likely still be on an octa-core architecture but will integrate a baseband with support for Cat. 12 global LTE. The present Kirin 960 chip is composed of a quad-core Cortex-A73 chip, another quad-core Cortex-A53 chip and an octa-core Mali-G71 GPU. The Kirin 960 was however built on TSMC 16nm process and it comes with a wonderful CPU performance but the GPU cannot perform at full capacity.  So a switch to the 10nm process is said to greatly reduce the heat and allow full extraction of the GPU performance.

Read More: Full Details of Huawei Kirin 960 System-on-Chip

In building the Kirin 970 on the 10nm process, Huawei is following the trend, catching up with would-be early starters like Qualcomm which just announced the Snapdragon 835 processor built on Samsung’s 10nm manufacturing process and to debut in the first quarter of next year on the Galaxy S8. MediaTek is also out with its Helio X30 chip built on TSMC 10nm process and to debut in the first quarter of next year also. MediaTek is also billed to release an Helio X35 chip within the first half of 2017 which would upgrade to provide Cat. 12 LTE band support.

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Quite a number of people are of the opinion that the next Meizu flagship will have a Samsung Exynos processor since their falling out with Qualcomm hasn’t yet been resolved. It appears that won’t be the case as a Weibo post from an industry analyst says otherwise.

The post which was made by @MochaSocialistWorker mentions that Meizu’s next flagship will use a Helio X30 processor. The Helio X30 chip was announced in September, and the deca-core chipset clocked at 2.8GHz is currently the most powerful SoC from the chip manufacturer and the first to be built on a 10nm TSMC process.

Mediatek has worked hard on this chip and ironed out most of the issues that have plagued their previous processors such as the GPU. The new chip will also support up to 8GB of RAM and UFS 2.1 storage.

According to @MochaSocialistWorker, the decision to not use Samsung’s processor is as a result of product schedule delays. The company has also been asked to pay a fine to Qualcomm which will set it back a bit before their working relationship can continue.

READ MORE: Meizu’s Bezel-less Phone Might be The Meizu Pro 7

They have also taken into consideration the supply issues that plagued the Snapdragon 820 this year and will rather settle with Mediatek who don’t seem to have issues with meeting up with orders.

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Mediatek announced a new chip, the Helio X30, back in August. The Helio X30 is the world’s first mobile processor using 10nm fabrication process and will be manufactured by Taiwan Semiconductor Manufacturing Company (TSMC).

New details have been released about the new deca-core chip. We already know it will make use of a tri-cluster design consisting of two cortex A-73 cores clocked at 2.8GHz, four cortex-A53 cores clocked at 2.3GHz, and four Cortex-A35 cores clocked at 2.0GHz.

The A-73 cores are the new high-performance cores taking over from previous generation A-72. They will offer better performance and lower power consumption than the latter.

The A-53 cores are possibly ARM’s most balanced cores when it comes to performance and power efficiency. The A-35 cores are the most power-efficient cores from ARM with power consumption not exceeding 125mW and can even be less than 100mW in some cases.

Mediatek has released a performance sheet that compares the Helio X30 to the Helio X20 but the font is tiny and blurs out when you try to zoom in.

The new tri-cluster architecture offers a 53% increase in power saving and 43% improvement in performance over the Helio X20. The Mali-T880 GPU has also been replaced with a PowerVR 7XT series that provides 2.4 times better performance and a 58% increase in power savings.

READ MORE: NO.1 G6 New Smartwatch Ready to Launch

The Helio X30 also adds 4K VP9 encode support for videos and ups the maximum camera sensor supported to 28MP from 25MP on the X20. Memory support also takes an upgrade. It will now support four 16-bit LPDDR4X (max. 8GB) and UFS 2.1 storage. Connectivity also gets an upgrade from Cat-6 to Cat-10.

If you want more details you can check the image below.

According to Mediatek, mass production should begin early next year.

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Mediatek announced the next generation Helio X30 chipset a couple of weeks back. We also got some important details about the upcoming chipset like its architecture and GPU. Now, Taiwanese media seems to have more details on the new Helio X30 and X35 chipset.

Like expected, the Helio X30 chipset is said to be manufactured on TSMC’s 10nm process. Considering that the Helio X20 was built on 20nm process, this is a much-needed upgrade for the new age chip. It is said that MediaTek first planned on using TSMC’s 16nm manufacturing node for its new chips, but after considering the stiff competition from Qualcomm’s Snapdragon range, it decided to use the much more advanced and efficient 10nm process.

It is also said that the production and design of the new chip is on schedule and the chip should enter mass production sometime by the end of this year / early 2017. So, if you were expecting to meet this new Cortex A73 Artemis powered chipset, then your wait will easily extend to mid-2017.

As for the Helio X35, like this year, expect the difference to be in the maximum frequency. According to the company, the Helio X30 will come with 2 x Cortex A73 Artemis cores clocked at 2.8GHz, 4 x Cortex A53 cores clocked at 2.2GHz and 4 x Cortex A35 Cores clocked at 2.0 GHz. Even the GPU is upgraded, now using PowerVR 7XT quad-core GPU chip. Helio X35 should use the same architecture but clocked at a higher frequency. Now, considering that Helio X30 is already clocked at 2.8GHz, can we expect 3GHz on the X35? Also, it will be built on the same efficient 10nm process as the Helio X30.

There’s still a lot of time for the official launch of an Helio X30 powered smartphone, and things might change to a certain extent during this period. So, stay tuned to gizmochina as more details about these upcoming chips emerge in the next few months.

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Chip-maker MediaTek has confirmed some of the specifications of its expected high-power Helio X30 chipset  which has been making the headlines of late. In an interview with Sun Chanhxu, MediaTek COO Zhu Shangzu threw more light on the Helio X30.

Zhu Shangzu expressed his optimism that this year’s X-series and P-series will significantly improve the consumer perception of the MTK brand, hence the quest to manufacture high-end flagship capable chipsets that could see them being featured in flagship phones.

Also, on the specifications, Zhu Shangzu confirmed that the Helio X30 will be manufactured by TSMC using 10nm manufacturing process. The processor will also provide support for 3 baseband carrier aggregation, Cat. 10 – Cat. 12 network baseband. Also, MediaTek shelved the ARM Mali GPU on this one and instead opted for a PowerVR GPU which the MediaTek says provides better performance and more efficient power consumption.

In summary, the Helio X30 would rank as the latest among MediaTek’s second generation of deca-core processors which consist of a dual-core 2.8GHz A73 next-gen architecture code-named Artemis, 4 x A53(2.2GHz) cores and 4 x A35 (2GHz) cores.

Related: Mediatek Helio X30: New Leak Reveals Powerful Deca-Core Setup With PowerVR GPU

In the aspect of memory, the Helio X30  will support four channels LPDDR4 RAM, up to 8GB RAM storage modules, and support for UFS 2.1 technical standards.

We won’t be seeing the Helio X30-powered smartphones very soon as MediaTek has scheduled November for mass production of the Helio P20, its latest addition in the lower P-Series and also MediaTek’s first chip using 16nm process announced in February. Thus considering the available time frame, the  Helio X30 isn’t expected to feature in smartphones until sometime around the middle of next year.

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So, let’s see what Mediatek could have in store for us for 2016. According to the analyst, the Helio X30 chip will come with the same deca-core architecture as the X20 and X25 chips. It will be built on the 10nm manufacturing node from TSMC. But the cores will be slightly different. The chip will be a combination of the new ARM Artemis cores, Cortex A53 and Cortex A35 cores. However, the source didn’t reveal the exact number of each cores. For GPU, MediaTek Helio X30 could use PowerVR graphics which would be a good upgrade from the Mali chips. The chip would also support 8GB RAM modules revealed the source. Other possible specs include upgraded video and audio features. Finally, he revealed that the chip should score around 160,000 on the AnTuTu benchmark.

Adding to this information, Black Digital released more details on Weibo. He said that the Helio X30 should also come with quad channel LPDDR4 RAM with support for up to 8GB memory. Plus, the storage would be super fast as the chip would support UFS 2.1 standard.

Helio X20 and X25 chips were left out from the pack of Samsung, Qualcomm and even Huawei flagship chips because they supported UFS 2.0. On the other hand, MTK chips only supported eMMC storage standard, which was clearly a let down. Looks like MTK is going to fix this issue with the new generation Helio X30.

Like mentioned above, this is not the first time we are hearing about the Helio X30. Lots of details were leaked about a month ago, and you can check out the info from our previous coverage.

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We have seen some pretty good chipsets from Mediatek in the past few years. This year, there is the Helio X20 chip, the world’s first deca-core processor for the upper mid-range market. Then there’s the Helio P10 and P20 for the mid-range market and Helio X10, MT6753 and MT6735 for the lower segments.

While these processors are quite powerful for their respective segments, when it comes to the GPU performance, Mediatek uses Mali GPUs which usually lag behind Snapdragon’s own Adreno GPUs. Even in the case of its best chipset, the Helio X20, the GPU performance isn’t that great. However, with the upcoming Helio X30 flagship chipset, things couldbe different.

According to the noted analyst, Pan Jiutang from China, there are rumors going around that Mediatek will use Imagination’s PowerVR graphics processor for its next generation Helio X30 chipset. However, he failed to mention a possible GPU model from the PowerVR family. Despite the unknown model, if the company has decided to shift to PowerVR GPU, we hope that it’s a powerful version that can complement the CPU performance.

As for the CPU specs, the company will reportedly continue with its deca-core architecture built on the 16nm process on the upcoming chip. The possible architecture of the Helio X30 could be 2 x 1GHz Cortex A53 + 2 x 1.5GHz Cortex A53 + 2 x 2GHz Cortex A72 and 4 X 2.5GHz Cortex A72 cores. Note here that there are four different clusters, instead of the tri-cluster architecture found inside the Helio X20.

We still don’t know the release for the new Helio X30 chipset, but considering the company announced the X20 quite early last year, we could see an announcement soon. Stay tuned for more details.

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Mediatek has come a long way from being a local Chinese chipmaker. Last year, the company upped its game with its new range of 64-bit chips and managed to take on the US-based Qualcomm to some extent. The company’s advantage has always been its low cost pricing, which has driven the adoption of MTK chips inside low-cost smartphones.

However, when it comes to the high-end segment, Mediatek still has a long way to go. The initial benchmark results of the Helio X20 chip, the world’s first deca-core processor show that its targeted at the upper mid-range market, scoring about 85K on AnTuTu. On the other hand, the top-end Snapdragon 820 chip can score as much as 133K on the same benchmarking test.

So, even this year, Mediatek has not really caught up with Qualcomm’s Snapdragon in the high-end segment. But the company seems to have high hopes for its upcoming Helio X30 chipset, which is said to take on the big guns in the industry next year. Zhu Shangzu, the COO of Mediatek, recent said that the Helio X30 chip is going to be a power house which can take on premium chipmakers like Qualcomm and Samsung.

The company will reportedly continue with its deca-core architecture built on the 16nm process on its upcoming top-end chip. The possible architecture of the Helio X30 could be 2 x 1GHz Cortex A53 + 2 x 1.5GHz Cortex A53 + 2 x 2GHz Cortex A72 and 4 X 2.5GHz Cortex A72 cores. We still don’t know what GPU will be inside the new chip, but we sure hope that it’s powerful enough to take on the GPUs used in Samsung and Qualcomm SoCs. So, let’s hope that company does not continue with its tradition of using powerful CPU’s but crappy GPUs inside its high-end lineup.

We still have no word on the release date of the chip, but considering that Mediatek announced the Helio X20 quite early last year, we may see an announcement of the X30 sometime in the next few months.

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Mediatek reshuffled its lineup earlier this year, by launching a brand new SoC series for the high-end segment called as the Helio series. We have already seen the Helio X10 chipset which powers a lot of mid-range and high-end devices and we will soon meet the Helio X20, the world’s first deca-core smartphone CPU.

But it looks like even before the mass release of the Helio X20 CPU, details about its next generation version, the Helio X30 chip has leaked out. According to the latest report, the Helio X30 will feature a similar cluster design as the X20, but with new CPU cores.

According to this new leak, the Helio X30 chip will feature quad Cortex A72 cores clocked at 2.5GHz, dual Cortex A72 cores clocked at 2.0GHz, dual Cortex A53 Cores clocked at 1.5GHz and dual Cortex A35 Cores clocked at 1.0 GHz. So, end of the day, the upcoming chip is also expected to feature deca-core setup like X20.

This comes at a time when we are increasingly seeing chip makers reduce the cores on their SoCs. For example, Qualcomm has reduced the number of cores from eight-cores in Snapdragon 810 to quad-cores in the latest Snapdragon 820 chip. Even Apple’s A9X chip is just a dual-core SoC. But looks like Mediatek will continue using its special cluster design for its upcoming chips.

We have not yet seen the Helio X20 chip in action yet. Its the world’s first chip with a tri-cluster design and it will be interesting to see how well it performs in real life. Whether the use of three different cores, totaling to 10 cores helps it beat rivals like Exynos is something we will have to wait and watch.

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